ETC STW44NM60

STW44NM60
N-CHANNEL 600V - 0.09Ω - 44A TO-247
MDmesh Power MOSFET
TARGET DATA
TYPE
STW44NM60
■
■
■
■
■
■
VDSS
RDS(on)
ID
600V
< 0.11Ω
44 A
TYPICAL RDS(on) = 0.09Ω
HIGH dv/dt AND AVALANCHE CAPABILITIES
100% AVALANCHE TESTED
LOW INPUT CAPACITANCE AND GATE
CHARGE
LOW GATE INPUT RESISTANCE
TIGHT PROCESS CONTROL AND HIGH
MANUFACTURING YIELDS
DESCRIPTION
The MDmesh is a new revolutionary MOSFET
technology that associates the Multiple Drain process with the Company’s PowerMESH horizontal
layout. The resulting product has an outstanding low
on-resistance, impressively high dv/dt and excellent
avalanche characteristics. The adoption of the
Company’s proprietary strip technique yields overall
dynamic performance that is significantly better than
that of similar competition’s products.
3
2
1
TO-247
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
The MDmesh family is very suitable for increasing
power density of high voltage converters allowing
system miniaturization and higher efficiencies.
ABSOLUTE MAXIMUM RATINGS
Symbol
Value
Unit
Drain-source Voltage (VGS = 0)
600
V
Drain-gate Voltage (RGS = 20 kΩ)
600
V
Gate- source Voltage
±30
V
ID
Drain Current (continuos) at TC = 25°C
44
A
ID
Drain Current (continuos) at TC = 100°C
28
A
IDM (●)
Drain Current (pulsed)
176
A
PTOT
Total Dissipation at TC = 25°C
260
W
Derating Factor
2.08
W/°C
6
V/ns
–65 to 150
°C
150
°C
VDS
VDGR
VGS
Parameter
dv/dt
Peak Diode Recovery voltage slope
Tstg
Storage Temperature
Tj
Max. Operating Junction Temperature
(•)Pulse width limited by safe operating area
April 2001
1/6
STW44NM60
THERMAL DATA
Rthj-case
Thermal Resistance Junction-case
Max
0.48
°C/W
Rthj-amb
Thermal Resistance Junction-ambient
Max
30
°C/W
0.1
°C/W
300
°C
Rthc-sink
Tl
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
AVALANCHE CHARACTERISTICS
Symbol
Parameter
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
EAS
Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 35 V)
Max Value
Unit
20
A
TBD
mJ
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
V(BR)DSS
IDSS
IGSS
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
Zero Gate Voltage
Drain Current (V GS = 0)
VDS = Max Rating
10
µA
VDS = Max Rating, TC = 125 °C
100
µA
Gate-body Leakage
Current (VDS = 0)
VGS = ±30V
±100
nA
600
V
ON (1)
Symbol
Parameter
Test Conditions
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
R DS(on)
Static Drain-source On
Resistance
VGS = 10V, ID = 22A
ID(on)
On State Drain Current
VDS > ID(on) x RDS(on)max,
VGS = 10V
Min.
Typ.
Max.
Unit
3
4
5
V
0.09
0.11
Ω
44
A
DYNAMIC
Symbol
gfs (1)
Parameter
Test Conditions
Typ.
Max.
Unit
VDS > ID(on) x RDS(on)max,
ID = 22A
TBD
S
C iss
Input Capacitance
VDS = 25V, f = 1 MHz, VGS = 0
TBD
pF
Coss
Output Capacitance
TBD
pF
Crss
Reverse Transfer
Capacitance
TBD
pF
RG
Gate Input Resistance
TBD
Ω
f=1 MHz Gate DC Bias = 0
Test Signal Level = 20mV
Open Drain
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2/6
Min.
Forward Transconductance
STW44NM60
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol
td(on)
tr
Parameter
Turn-on Delay Time
Rise Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Q gd
Gate-Drain Charge
Test Conditions
Min.
VDD = 250V, I D = 22A
RG = 4.7Ω VGS = 10V
(see test circuit, Figure 3)
VDD = 400V, I D = 44A,
VGS = 10V
Typ.
Max.
Unit
TBD
ns
TBD
ns
TBD
nC
TBD
nC
TBD
nC
SWITCHING OFF
Symbol
tr(Voff)
Parameter
Off-voltage Rise Time
tf
Fall Time
tc
Cross-over Time
Test Conditions
Min.
VDD = 400V, I D = 44A,
R G = 4.7Ω, VGS = 10V
(see test circuit, Figure 5)
Typ.
Max.
Unit
TBD
ns
TBD
ns
TBD
ns
SOURCE DRAIN DIODE
Symbol
Max.
Unit
Source-drain Current
44
A
ISDM (2)
Source-drain Current (pulsed)
176
A
VSD (1)
Forward On Voltage
ISD = 44A, VGS = 0
1.5
V
ISD = 44A, di/dt = 100A/µs,
VDD = 60V, Tj = 150°C
(see test circuit, Figure 5)
ISD
Parameter
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
Test Conditions
Min.
Typ.
TBD
ns
TBD
µC
TBD
A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3/6
STW44NM60
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
4/6
STW44NM60
TO-247 MECHANICAL DATA
DIM.
mm.
MIN.
TYP
inch
MAX.
MIN.
A
4.85
5.15
0.19
TYP.
0.20
D
2.20
2.60
0.08
0.10
E
0.40
0.80
0.015
0.03
F
1
1.40
0.04
0.05
F1
3
0.11
F2
2
0.07
MAX.
F3
2
2.40
0.07
0.09
F4
3
3.40
0.11
0.13
G
10.90
0.43
H
15.45
15.75
0.60
0.62
L
19.85
20.15
0.78
0.79
L1
3.70
4.30
0.14
L2
L3
18.50
14.20
0.17
0.72
14.80
0.56
0.58
L4
34.60
1.36
L5
5.50
0.21
M
2
3
0.07
0.11
V
5º
5º
V2
60º
60º
Dia
3.55
3.65
0.14
0.143
5/6
STW44NM60
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granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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