Power Transistors 2SD1250, 2SD1250A Silicon NPN triple diffusion planar type ● ● ● High forward current transfer ratio hFE which has satisfactory linearity Low collector to emitter saturation voltage VCE(sat) N type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment. Unit: mm 1.0±0.1 1.5±0.1 10.0±0.3 6.0±0.5 1.5max. 1.1max. 2.0 ■ Features 3.4±0.3 8.5±0.2 10.5min. For power amplification For TV vartical deflection output Complementary to 2SB0928 (2SB928) and 2SB0928A (2SB928A) 0.8±0.1 0.5max. 2.54±0.3 5.08±0.5 V 180 Emitter to base voltage VEBO 6 V Peak collector current ICP 3 A Collector current IC 2 A 3.4±0.3 6.0±0.3 1.0±0.1 0.8±0.1 R0.5 R0.5 0 to 0.4 2.54±0.3 Collector power TC=25°C dissipation Junction temperature Tj Storage temperature Tstg ■ Electrical Characteristics Parameter 1.1 max. 30 PC Ta=25°C 14.7±0.5 150 8.5±0.2 +0.4 200 VCEO emitter voltage 2SD1250A Unit: mm V 3.0–0.2 2SD1250 VCBO +0 2SD1250A Collector to Unit 200 1.5–0.4 base voltage Ratings 1:Base 2:Collector 3:Emitter N Type Package 3 10.0±0.3 2SD1250 2 2.0 Symbol Collector to 1 4.4±0.5 Parameter (TC=25˚C) 4.4±0.5 ■ Absolute Maximum Ratings 5.08±0.5 W 1.3 150 ˚C –55 to +150 ˚C 1 2 1:Base 2:Collector 3:Emitter N Type Package (DS) 3 (TC=25˚C) Symbol Conditions min typ max Unit Collector cutoff current ICBO VCB = 200V, IE = 0 50 µA Emitter cutoff current IEBO VEB = 4V, IC = 0 50 µA VCBO IC = 500µA, IE = 0 Collector to base voltage Collector to emitter 2SD1250 voltage 2SD1250A Emitter to base voltage IC = 5mA, IB = 0 VEBO IE = 500µA, IC = 0 6 * V 150 VCEO hFE1 Forward current transfer ratio 200 V 180 VCE = 10V, IC = 150mA 60 hFE2 VCE = 10V, IC = 400mA 50 V 240 Base to emitter voltage VBE VCE = 10V, IC = 400mA 1 V Collector to emitter saturation voltage VCE(sat) IC = 500mA, IB = 50mA 1 V Transition frequency fT VCE = 10V, IC = 0.5A, f = 1MHz *h FE1 20 MHz Rank classification Rank Q P hFE1 60 to 140 100 to 240 Note)The part numbers in the parenthesis show conventional part number. 1 Power Transistors 2SD1250, 2SD1250A PC — Ta IC — VCE IC — VBE 1.2 40 (1) 30 20 1.2 TC=25˚C IB=7mA 1.0 10 0.8 5mA 4mA 0.6 3mA 0.4 2mA 0.2 TC=100˚C –25˚C 0.8 0.6 0.4 0.2 1mA (2) 25˚C 1.0 6mA Collector current IC (A) (1) TC=Ta (2) With a 50 × 50 × 2mm Al heat sink (3) Without heat sink (PC=1.3W) Collector current IC (A) Collector power dissipation PC (W) 50 (3) 0 0 20 40 60 80 100 120 140 160 0 0 Ambient temperature Ta (˚C) 4 8 16 20 3 TC=100˚C 0.3 25˚C –25˚C 0.1 0.03 0.01 0.01 0.03 0.1 0.3 3000 300 TC=100˚C 25˚C 100 –25˚C 30 10 3 5ms 1ms 0.3 1s 0.1 0.03 0.003 0.001 1 3 10 30 100 2SD1250A 2SD1250 0.01 300 Collector to emitter voltage VCE 1000 0.1 0.3 1 3 100 30 10 3 1 0.1 0.01 0.03 10 (V) 0.1 0.3 1 3 Collector current IC (A) Rth(t) — t 103 (1) Without heat sink (2) With a 50 × 50 × 2mm Al heat sink (1) 102 (2) 10 1 10–1 10–2 10–4 1.2 VCE=10V f=1MHz TC=25˚C 300 Collector current IC (A) t=0.5ms 1.0 0.3 1 0.01 0.03 1 Thermal resistance Rth(t) (˚C/W) IC 1 0.8 VCE=10V Non repetitive pulse TC=25˚C ICP 0.6 fT — IC Area of safe operation (ASO) 3 0.4 1000 1000 1 0.2 Base to emitter voltage VBE (V) 10000 Forward current transfer ratio hFE IC/IB=10 10 Collector current IC (A) 0 hFE — IC 10 Collector current IC (A) 2 24 Collector to emitter voltage VCE (V) VCE(sat) — IC Collector to emitter saturation voltage VCE(sat) (V) 12 Transition frequency fT (MHz) 0 10–3 10–2 10–1 1 Time t (s) 10 102 103 104 10 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR