ETC BCR5AS-8

To all our customers
Regarding the change of names mentioned in the document, such as Mitsubishi
Electric and Mitsubishi XX, to Renesas Technology Corp.
The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi
Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names
have in fact all been changed to Renesas Technology Corp. Thank you for your understanding.
Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been
made to the contents of the document, and these changes do not constitute any alteration to the
contents of the document itself.
Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices
and power devices.
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
Refer to the page 6 as to the product guaranteed
maximum junction temperature 150°C
MEDIUM POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
BCR5AS
OUTLINE DRAWING
Dimensions
in mm
6.5
∗
2.3 MIN
1.0 MAX
0.9 MAX
5.5±0.2
TYPE
NAME
1.0
2.3
10 MAX
4
VOLTAGE
CLASS
0.5±0.1
1.5±0.2
5.0±0.2
0.5±0.2
2.3
0.8
2.3
∗ Measurement point of
case temperature
1
2
3
24
• IT (RMS) ........................................................................ 5A
• VDRM ....................................................................... 600V
• IFGT !, IRGT !, IRGT # ............................................ 30mA
1
1
2
33
4
T1 TERMINAL
T2 TERMINAL
GATE TERMINAL
T2 TERMINAL
MP-3
APPLICATION
Hybrid IC, solid state relay, switching mode power supply, light dimmer,
electric fan, electric blankets,
control of household equipment such as washing machine,
other general purpose control applications
MAXIMUM RATINGS
Symbol
Voltage class
Parameter
Unit
12
VDRM
Repetitive peak off-state voltage ✽1
600
V
VDSM
Non-repetitive peak off-state voltage ✽1
720
V
Symbol
Parameter
Conditions
Ratings
Unit
IT (RMS)
RMS on-state current
Commercial frequency, sine full wave 360° conduction, Tc=103°C✽3
ITSM
Surge on-state current
60Hz sinewave 1 full cycle, peak value, non-repetitive
I2t
I2t for fusing
Value corresponding to 1 cycle of half wave 60Hz, surge on-state
current
PGM
Peak gate power dissipation
3
W
PG (AV)
Average gate power dissipation
0.3
W
VGM
Peak gate voltage
10
V
IGM
Peak gate current
2
Tj
Junction temperature
Tstg
Storage temperature
—
Weight
Typical value
5
A
50
A
10.4
A2s
A
–40 ~ +125
°C
–40 ~ +125
°C
0.26
g
✽1. Gate open.
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
MEDIUM POWER USE
Refer to the page 6 as to the product guaranteed
maximum junction temperature 150°C
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
ELECTRICAL CHARACTERISTICS
Limits
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IDRM
Repetitive peak off-state current
Tj=125°C, VDRM applied
—
—
2.0
mA
VTM
On-state voltage
Tc=25°C, ITM=7A, Instantaneous measurement
—
—
1.8
V
—
—
1.5
V
—
—
1.5
V
!
VFGT !
VRGT !
Gate trigger voltage ✽2
@
Tj=25°C, VD=6V, RL=6Ω, RG=330Ω
VRGT #
#
—
—
1.5
V
IFGT !
!
—
—
30
mA
—
—
30
mA
—
—
30
mA
IRGT !
Gate trigger current ✽2
@
Tj=25°C, VD=6V, RL=6Ω, RG=330Ω
#
IRGT #
VGD
Gate non-trigger voltage
Tj=125°C, VD=1/2VDRM
0.2
—
—
V
Rth (j-c)
Thermal resistance
Junction to case ✽3
—
—
3.0
°C/ W
(dv/dt)c
Critical-rate of rise of off-state
commutating voltage
Tj=125°C
5
—
—
V/µs
✽4
✽2. Measurement using the gate trigger characteristics measurement circuit.
✽3. Case temperature is measured on the T2 terminal.
✽4. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below.
Commutating voltage and current waveforms
(inductive load)
Test conditions
SUPPLY
VOLTAGE
1. Junction temperature
Tj=125°C
MAIN CURRENT
2. Rate of decay of on-state commutating current
(di/dt)c=–2.5A/ms
TIME
(di/dt)c
TIME
MAIN
VOLTAGE
3. Peak off-state voltage
VD=400V
TIME
(dv/dt)c
VD
PERFORMANCE CURVES
RATED SURGE ON-STATE CURRENT
MAXIMUM ON-STATE CHARACTERISTICS
100
7
5
3
2
Tj = 125°C
101
7
5
3
2
Tj = 25°C
100
7
5
3
2
10–1
0.6
SURGE ON-STATE CURRENT (A)
ON-STATE CURRENT (A)
102
1.4
2.2
3.0
3.8
ON-STATE VOLTAGE (V)
4.6
90
80
70
60
50
40
30
20
10
0
100
2 3 4 5 7 101
2 3 4 5 7 102
CONDUCTION TIME
(CYCLES AT 60Hz)
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
MEDIUM POWER USE
Refer to the page 6 as to the product guaranteed
maximum junction temperature 150°C
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
102
7
5
3
2 VGM = 10V
101
7
5
3 VGT = 1.5V
2
100
7
5
3
2
PGM = 3W
PGM =
0.3W
IGM = 2A
IFGT I
IRGT I
IRGT III
103
7
5
4
3
2
IRGT I
102
IFGT I
7
5
4
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140
GATE TRIGGER VOLTAGE VS.
JUNCTION TEMPERATURE
MAXIMUM TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(JUNCTION TO CASE)
TYPICAL EXAMPLE
102
7
5
4
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
10–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
JUNCTION TEMPERATURE (°C)
CONDUCTION TIME
(CYCLES AT 60Hz)
MAXIMUM ON-STATE POWER
DISSIPATION
ALLOWABLE CASE TEMPERATURE
VS. RMS ON-STATE CURRENT
8
160
7
140
6 360°
CONDUCTION
5 RESISTIVE,
INDUCTIVE
4 LOADS
3
2
1
0
IRGT III
JUNCTION TEMPERATURE (°C)
103
7
5
4
3
2
0
TYPICAL EXAMPLE
GATE CURRENT (mA)
CASE TEMPERATURE (°C)
ON-STATE POWER DISSIPATION (W)
GATE TRIGGER VOLTAGE (Tj = t°C)
GATE TRIGGER VOLTAGE (Tj = 25°C)
100 (%)
VGD = 0.2V
10–1
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
GATE TRIGGER CURRENT (Tj = t°C)
GATE TRIGGER CURRENT (Tj = 25°C)
100 (%)
GATE TRIGGER CURRENT VS.
JUNCTION TEMPERATURE
TRANSIENT THERMAL IMPEDANCE (°C/W)
GATE VOLTAGE (V)
GATE CHARACTERISTICS
(Ι, ΙΙ AND ΙΙΙ)
1
2
3
4
5
6
7
RMS ON-STATE CURRENT (A)
8
CURVES APPLY REGARDLESS
OF CONDUCTION ANGLE
120
100
80
60
40
360° CONDUCTION
20 RESISTIVE,
INDUCTIVE LOADS
0
0
1
2
3
4
5
6
7
8
RMS ON-STATE CURRENT (A)
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
120
100
140 140 t2.3
80 80 t2.3
80
60
NATURAL
40 CONVECTION
CURVES APPLY
RESISTIVE
20 REGARDLESS OF
INDUCTIVE,
CONDUCTION ANGLE LOADS
0
0
8
1
2
3
4
5
6
7
20
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
HOLDING CURRENT VS.
JUNCTION TEMPERATURE
TYPICAL EXAMPLE
102
7
5
4
3
2
VD = 12V
DISTRIBUTION
TYPICAL
EXAMPLE
101
7
5
4
3
2
100
–60 –40 –20 0 20 40 60 80 100 120 140
102
–60 –40 –20 0 20 40 60 80 100 120 140
7
5
3
2
40
REPETITIVE PEAK OFF-STATE
CURRENT VS. JUNCTION
TEMPERATURE
103
7
5
3
2
102
60
RMS ON-STATE CURRENT (A)
104
7
5
3
2
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
LACHING CURRENT VS.
JUNCTION TEMPERATURE
BREAKOVER VOLTAGE VS.
JUNCTION TEMPERATURE
T2+, G+  TYPICAL

T2– , G–  EXAMPLE
DISTRIBUTION
T2+, G–
TYPICAL
EXAMPLE
101
7
5
3
2
100
100 (%)
103
7
5
3
2
80
RMS ON-STATE CURRENT (A)
HOLDING CURRENT (mA)
105
7
5
3
2
ALLOWABLE AMBIENT TEMPERATURE
VS. RMS ON-STATE CURRENT
160
NATURAL CONVECTION
NO FINS
140
CURVES APPLY REGARDLESS
OF CONDUCTION ANGLE
120
RESISTIVE, INDUCTIVE LOADS
100
0
BREAKOVER VOLTAGE (Tj = t°C)
BREAKOVER VOLTAGE (Tj = 25°C)
REPETITIVE PEAK OFF-STATE CURRENT (Tj = t°C)
REPETITIVE PEAK OFF-STATE CURRENT (Tj = 25°C)
LACHING CURRENT (mA)
170 170 t2.3
MEDIUM POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
AMBIENT TEMPERATURE (°C)
ALLOWABLE AMBIENT TEMPERATURE
VS. RMS ON-STATE CURRENT
160
ALL FINS ARE ALUMINUM
140
100 (%)
AMBIENT TEMPERATURE (°C)
Refer to the page 6 as to the product guaranteed
maximum junction temperature 150°C
160
TYPICAL EXAMPLE
140
120
100
80
60
40
20
–60 –40 –20 0 20 40 60 80 100 120 140
0
–60 –40 –20 0 20 40 60 80 100120 140
JUNCTION TEMPERATURE (°C)
JUNCTION TEMPERATURE (°C)
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
BREAKOVER VOLTAGE VS.
RATE OF RISE OF
OFF-STATE VOLTAGE
160
TYPICAL EXAMPLE
Tj = 125°C
BREAKOVER VOLTAGE (dv/dt = xV/µs )
BREAKOVER VOLTAGE (dv/dt = 1V/µs )
140
120
III QUADRANT
100
80
60
I QUADRANT
40
20
0
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
MEDIUM POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
CRITICAL RATE OF RISE OF OFF-STATE
COMMUTATING VOLTAGE (V/µs)
100 (%)
Refer to the page 6 as to the product guaranteed
maximum junction temperature 150°C
COMMUTATION CHARACTERISTICS
7
5
4
3
2
100 (%)
GATE TRIGGER CURRENT (tw)
GATE TRIGGER CURRENT (DC)
103
7
5
4
3
2
MAIN
VOLTAGE
(dv/dt)c
TIME
VD
I QUADRANT
III QUADRANT
2 3 4 5 7 101
2 3 4 5 7 102
RATE OF DECAY OF ON-STATE
COMMUTATING CURRENT (A/ms)
GATE TRIGGER CHARACTERISTICS TEST CIRCUITS
6Ω
6Ω
TYPICAL EXAMPLE
IRGT III
A
6V
IRGT I
102
7
5
4
3
2
TEST PROCEDURE 1
IFGT I
A
6V
RG
V
V
RG
TEST PROCEDURE 2
6Ω
A
6V
101
(di/dt)c
TIME
MINIMUM
CHARACTERISTICS
VALUE
100
7 0
10
TYPICAL
EXAMPLE
Tj = 125°C
IT = 4A
τ = 500µs
VD = 200V
f = 3Hz
TIME
MAIN CURRENT
101
7
5
4
3
2
RATE OF RISE OF OFF-STATE VOLTAGE (V/µs)
GATE TRIGGER CURRENT VS.
GATE CURRENT PULSE WIDTH
SUPPLY
VOLTAGE
100
2 3 4 5 7 101
2 3 4 5 7 102
GATE CURRENT PULSE WIDTH (µs)
V
RG
TEST PROCEDURE 3
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
The product guaranteed maximum junction
temperature 150°C (See warning.)
MEDIUM POWER USE
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
BCR5AS
OUTLINE DRAWING
Dimensions
in mm
6.5
∗
2.3 MIN
1.0 MAX
0.9 MAX
5.5±0.2
TYPE
NAME
1.0
2.3
10 MAX
4
VOLTAGE
CLASS
0.5±0.1
1.5±0.2
5.0±0.2
0.5±0.2
2.3
0.8
2.3
∗ Measurement point of
case temperature
1
2
3
24
• IT (RMS) ........................................................................ 5A
• VDRM ....................................................................... 600V
• IFGT !, IRGT !, IRGT # ............................................ 30mA
1
1
2
33
4
T1 TERMINAL
T2 TERMINAL
GATE TERMINAL
T2 TERMINAL
MP-3
APPLICATION
Hybrid IC, solid state relay, switching mode power supply, light dimmer,
electric fan, electric blankets,
control of household equipment such as washing machine,
other general purpose control applications
(Warning)
1. Refer to the recommended circuit values around the triac before using.
2. Be sure to exchange the specification before using. If not exchanged, general triacs will be supplied.
MAXIMUM RATINGS
Symbol
Voltage class
Parameter
Unit
12
VDRM
Repetitive peak off-state voltage ✽1
600
V
VDSM
Non-repetitive peak off-state voltage ✽1
720
V
Symbol
Parameter
Conditions
Ratings
Unit
IT (RMS)
RMS on-state current
Commercial frequency, sine full wave 360° conduction, Tc=128°C✽3
ITSM
Surge on-state current
60Hz sinewave 1 full cycle, peak value, non-repetitive
I2t
I2t for fusing
Value corresponding to 1 cycle of half wave 60Hz, surge on-state
current
PGM
Peak gate power dissipation
3
W
PG (AV)
Average gate power dissipation
0.3
W
VGM
Peak gate voltage
10
V
IGM
Peak gate current
2
Tj
Junction temperature
Tstg
Storage temperature
—
Weight
Typical value
5
A
50
A
10.4
A2s
A
–40 ~ +150
°C
–40 ~ +150
°C
0.26
g
✽1. Gate open.
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
MEDIUM POWER USE
The product guaranteed maximum junction
temperature 150°C (See warning.)
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
ELECTRICAL CHARACTERISTICS
Limits
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IDRM
Repetitive peak off-state current
Tj=150°C, VDRM applied
—
—
2.0
mA
VTM
On-state voltage
Tc=25°C, ITM=7A, Instantaneous measurement
—
—
1.8
V
—
—
1.5
V
—
—
1.5
V
!
VFGT !
VRGT !
Gate trigger voltage ✽2
@
Tj=25°C, VD=6V, RL=6Ω, RG=330Ω
VRGT #
#
—
—
1.5
V
IFGT !
!
—
—
30
mA
—
—
30
mA
—
—
30
mA
0.2/0.1
—
—
V
IRGT !
Gate trigger current ✽2
@
Tj=25°C, VD=6V, RL=6Ω, RG=330Ω
#
IRGT #
VGD
Gate non-trigger voltage
Tj=125°C/150°C, VD=1/2VDRM
Rth (j-c)
Thermal resistance
Junction to case ✽3
—
—
3.0
°C/ W
(dv/dt)c
Critical-rate of rise of off-state
commutating voltage
Tj=125°/150°C
5/1
—
—
V/µs
✽4
✽2. Measurement using the gate trigger characteristics measurement circuit.
✽3. Case temperature is measured on the T2 terminal.
✽4. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below.
Commutating voltage and current waveforms
(inductive load)
Test conditions
SUPPLY
VOLTAGE
1. Junction temperature
Tj=125°C/150°C
MAIN CURRENT
2. Rate of decay of on-state commutating current
(di/dt)c=–2.5A/ms
TIME
(di/dt)c
TIME
MAIN
VOLTAGE
3. Peak off-state voltage
VD=400V
TIME
(dv/dt)c
VD
PERFORMANCE CURVES
RATED SURGE ON-STATE CURRENT
MAXIMUM ON-STATE CHARACTERISTICS
102
100
SURGE ON-STATE CURRENT (A)
ON-STATE CURRENT (A)
7
5
3
2
101
Tj = 150°C
7
5
3
2
100
7
5
3
2
10–1
0.5
Tj = 25°C
1.0
1.5
2.0
2.5
3.0
3.5
ON-STATE VOLTAGE (V)
4.0
90
80
70
60
50
40
30
20
10
0
100
2 3 4 5 7 101
2 3 4 5 7 102
CONDUCTION TIME
(CYCLES AT 60Hz)
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
MEDIUM POWER USE
The product guaranteed maximum junction
temperature 150°C (See warning.)
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
GATE TRIGGER CURRENT VS.
JUNCTION TEMPERATURE
101
7
5
3 VGT = 1.5V
2
100
7
5
3
2
PGM = 3W
PGM =
0.3W
IGM = 2A
IFGT I
IRGT I
IRGT III
103
7
5
3
2
IRGT I
102
7
5
3
2
IFGT I
101
7
5
3
2
100
–60 –40 –20 0 20 40 60 80 100 120 140 160
GATE TRIGGER VOLTAGE VS.
JUNCTION TEMPERATURE
MAXIMUM TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(JUNCTION TO CASE)
TYPICAL EXAMPLE
102
7
5
4
3
2
101
–60 –40 –20 0 20 40 60 80 100 120 140 160
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
10–1 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
JUNCTION TEMPERATURE (°C)
CONDUCTION TIME
(CYCLES AT 60Hz)
MAXIMUM ON-STATE POWER
DISSIPATION
ALLOWABLE CASE TEMPERATURE
VS. RMS ON-STATE CURRENT
8
160
7
140
6 360°
CONDUCTION
5 RESISTIVE,
INDUCTIVE
4 LOADS
3
2
1
0
IRGT III
JUNCTION TEMPERATURE (°C)
103
7
5
4
3
2
0
TYPICAL EXAMPLE
GATE CURRENT (mA)
CASE TEMPERATURE (°C)
ON-STATE POWER DISSIPATION (W)
GATE TRIGGER VOLTAGE (Tj = t°C)
GATE TRIGGER VOLTAGE (Tj = 25°C)
100 (%)
VGD = 0.1V
10–1
7
5
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
TRANSIENT THERMAL IMPEDANCE (°C/W)
GATE VOLTAGE (V)
5
3
2 VGM = 10V
GATE TRIGGER CURRENT (Tj = t°C)
GATE TRIGGER CURRENT (Tj = 25°C)
100 (%)
GATE CHARACTERISTICS
(Ι, ΙΙ AND ΙΙΙ)
1
2
3
4
5
6
7
RMS ON-STATE CURRENT (A)
8
CURVES APPLY REGARDLESS
OF CONDUCTION
ANGLE
120
100
80
60
360°
40 CONDUCTION
RESISTIVE,
20 INDUCTIVE
LOADS
0
2
0
1
3
4
5
6
7
8
RMS ON-STATE CURRENT (A)
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
MEDIUM POWER USE
100
80 80 t2.3
80
60
NATURAL
40 CONVECTION
RESISTIVE
CURVES APPLY
20 REGARDLESS OF
INDUCTIVE,
CONDUCTION ANGLE LOADS
0
1
2
3
4
5
6
7
0
8
AMBIENT TEMPERATURE (°C)
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
ALLOWABLE AMBIENT TEMPERATURE
VS. RMS ON-STATE CURRENT
160
ALL FINS ARE ALUMINUM
140
170 170 t2.3
120
140 140 t2.3
100 (%)
AMBIENT TEMPERATURE (°C)
The product guaranteed maximum junction
temperature 150°C (See warning.)
HOLDING CURRENT (mA)
TYPICAL EXAMPLE
103
7
5
3
2
102
–60 –40 –20 0 20 40 60 80 100 120 140 160
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
102
7
5
4
3
2
VD = 12V
DISTRIBUTION
TYPICAL
EXAMPLE
101
7
5
4
3
2
100
–60 –40 –20 0 20 40 60 80 100 120 140 160
JUNCTION TEMPERATURE (°C)
LACHING CURRENT VS.
JUNCTION TEMPERATURE
BREAKOVER VOLTAGE VS.
JUNCTION TEMPERATURE
T2+, G+  TYPICAL

T2– , G–  EXAMPLE
DISTRIBUTION
T2+, G–
TYPICAL
EXAMPLE
101
7
5
3
2
100
–60 –40 –20 0 20 40 60 80 100 120 140 160
JUNCTION TEMPERATURE (°C)
100 (%)
JUNCTION TEMPERATURE (°C)
BREAKOVER VOLTAGE (Tj = t°C)
BREAKOVER VOLTAGE (Tj = 25°C)
REPETITIVE PEAK OFF-STATE CURRENT (Tj = t°C)
REPETITIVE PEAK OFF-STATE CURRENT (Tj = 25°C)
LACHING CURRENT (mA)
0
HOLDING CURRENT VS.
JUNCTION TEMPERATURE
7
5
3
2
7
5
3
2
20
REPETITIVE PEAK OFF-STATE
CURRENT VS. JUNCTION
TEMPERATURE
104
102
40
RMS ON-STATE CURRENT (A)
7
5
3
2
7
5
3
2
60
RMS ON-STATE CURRENT (A)
105
103
80
0
106
7
5
3
2
ALLOWABLE AMBIENT TEMPERATURE
VS. RMS ON-STATE CURRENT
160
NATURAL CONVECTION
NO FINS, CURVES
140
APPLY REGARDLESS
OF CONDUCTION ANGLE
120
RESISTIVE, INDUCTIVE
100
LOADS
160
TYPICAL EXAMPLE
140
120
100
80
60
40
20
0
–60 –40 –20 0 20 40 60 80 100 120 140 160
JUNCTION TEMPERATURE (°C)
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
MEDIUM POWER USE
TYPICAL EXAMPLE
Tj = 125°C
BREAKOVER VOLTAGE (dv/dt = xV/µs )
BREAKOVER VOLTAGE (dv/dt = 1V/µs )
120
III QUADRANT
100
80
60
40
I QUADRANT
20
0
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
100 (%)
160
BREAKOVER VOLTAGE VS.
RATE OF RISE OF
OFF-STATE VOLTAGE (Tj = 150°C)
160
TYPICAL EXAMPLE
Tj = 150°C
140
BREAKOVER VOLTAGE (dv/dt = xV/µs )
BREAKOVER VOLTAGE (dv/dt = 1V/µs )
BREAKOVER VOLTAGE VS.
RATE OF RISE OF
OFF-STATE VOLTAGE (Tj = 125°C)
140
CRITICAL RATE OF RISE OF OFF-STATE
COMMUTATING VOLTAGE (V/µs)
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
120
III QUADRANT
100
80
60
40
I QUADRANT
20
0
101 2 3 5 7 102 2 3 5 7 103 2 3 5 7 104
RATE OF RISE OF OFF-STATE VOLTAGE (V/µ s)
RATE OF RISE OF OFF-STATE VOLTAGE (V/µ s)
COMMUTATION CHARACTERISTICS
(Tj = 125°C)
COMMUTATION CHARACTERISTICS
(Tj = 150°C)
7
5
3
2
SUPPLY
VOLTAGE
TYPICAL
EXAMPLE
Tj = 125°C
IT = 4A
τ = 500µs
VD = 200V
f = 3Hz
TIME
(di/dt)c
TIME
MAIN CURRENT
MAIN
VOLTAGE
(dv/dt)c
TIME
VD
101
7
5
I QUADRANT
MINIMUM
CHARACTERISTICS
VALUE
3
2
100
7 0
10
III QUADRANT
2 3
5 7 101
2 3
5 7 102
RATE OF DECAY OF ON-STATE
COMMUTATING CURRENT (A /ms)
CRITICAL RATE OF RISE OF OFF-STATE
COMMUTATING VOLTAGE (V/µs)
100 (%)
The product guaranteed maximum junction
temperature 150°C (See warning.)
7
5
3
2
SUPPLY
VOLTAGE
TIME
MAIN CURRENT
MAIN
VOLTAGE
(dv/dt)c
101
7
5
(di/dt)c
TIME
TIME
VD
TYPICAL
EXAMPLE
Tj = 150°C
IT = 4A
τ = 500µs
VD = 200V
f = 3Hz
I QUADRANT
III QUADRANT
3
2
100
7 0
10
MINIMUM
CHARACTERISTICS
VALUE
2 3
5 7 101
2 3
5 7 102
RATE OF DECAY OF ON-STATE
COMMUTATING CURRENT (A /ms)
GATE TRIGGER CURRENT (tw)
GATE TRIGGER CURRENT (DC)
100 (%)
GATE TRIGGER CURRENT VS.
GATE CURRENT PULSE WIDTH
103
7
5
4
3
2
TYPICAL EXAMPLE
IRGT III
IRGT I
102
7
5
4
3
2
IFGT I
101 0
10
2 3 4 5 7 101
2 3 4 5 7 102
GATE CURRENT PULSE WIDTH (µ s)
Mar. 2002
MITSUBISHI SEMICONDUCTOR 〈TRIAC〉
BCR5AS
MEDIUM POWER USE
The product guaranteed maximum junction
temperature 150°C (See warning.)
NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
GATE TRIGGER CHARACTERISTICS TEST CIRCUITS
6Ω
RECOMMENDED CIRCUIT VALUES
AROUND THE TRIAC
6Ω
LOAD
A
6V
6V
RG
V
A
V
C1
RG
R1
TEST PROCEDURE 1
C1 = 0.1~0.47µ F
R1 = 47~100Ω
6Ω
C0
R0
TEST PROCEDURE 2
C0 = 0.1µ F
R0 = 100Ω
A
6V
V
RG
TEST PROCEDURE 3
Mar. 2002