DATA SHEET MOS INTEGRATED CIRCUIT µPD160061A 384-OUTPUT TFT-LCD SOURCE DRIVER (COMPATIBLE WITH 64-GRAY SCALES) DESCRIPTION The µPD160061A is a source driver for TFT-LCDs capable of dealing with displays with 64-gray scales. Data input is based on digital input configured as 6 bits by 6 dots (2 pixels), which can realize a full-color display of 260,000 colors by output of 64 values γ -corrected by an internal D/A converter and 5-by-2 external power modules. Because the output dynamic range is as large as VSS2 + 0.2 V to VDD2 – 0.2 V, level inversion operation of the LCD’s common electrode is rendered unnecessary. Also, to be able to deal with dot-line inversion, n-line inversion and column line inversion when mounted on a single side, this source driver is equipped with a built-in 6-bit D/A converter circuit whose odd output pins and even output pins respectively output gray scale voltages of differing polarity. Assuring a maximum clock frequency of 65 MHz when driving at 2.7 V, this driver is applicable to XGA-standard TFT-LCD panels and SXGA TFT-LCD panels. FEATURES • • • • • • • • • • • • • CMOS level input (2.3 to 3.6 V) 384 outputs Input of 6 bits (gray-scale data) by 6 dots Capable of outputting 64 values by means of 5-by-2 external power modules (10 units) and a D/A converter (R-DAC) Logic power supply voltage (VDD1): 2.3 to 3.6 V Driver power supply voltage (VDD2): 7.5 to 9.5 V High-speed data transfer: fCLK = 65 MHz MAX. (internal data transfer speed when operating at VDD1 = 2.7 V) 40 MHz MAX. (internal data transfer speed when operating at VDD1 = 2.3 V) Output dynamic range: VSS2 + 0.2 V to VDD2 – 0.2 V Apply for dot-line inversion, n-line inversion and column line inversion Output voltage polarity inversion function (POL) Input data inversion function (capable of controlling by each input port) (POL21, POL22) Apply for heavy load, light load Semi slim-chip shaped ORDERING INFORMATION Part Number Package µPD160061AN-xxx TCP (TAB package) µPD160061ANL-xxx COF (COF package) Remark The TCP’s external shape is customized. To order the required shape, so please contact one of our sales representatives. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. S16041EJ2V0DS00 (2nd edition) Date Published July 2003 NS CP (K) Printed in Japan The mark ★ shows major revised points. 2003 µPD160061A 1. BLOCK DIAGRAM STHR R,/L CLK STB STHL VDD1 VSS1 64-bit bidirectional shift register C1 C 2 C 3 - - - - - - - - - - - - - - - - - - - - - - C63 C64 D00 to D05 D10 to D15 D20 to D25 D30 to D35 D40 to D45 D50 to D55 POL21 POL22 SRC LPC HPC Data register POL Latch VDD2 Level shifter VSS2 V0 to V9 D/A converter Voltage follower output -------------------------------S1 S2 S3 S384 Remark /xxx indicates active low signal. 2. RELATIONSHIP BETWEEN OUTPUT CIRCUIT AND D/A CONVERTER S1 V0 : V4 V5 : V9 S2 S383 5 MultiPlexer 6-bit D/A converter 5 POL 2 Data Sheet S16041EJ2V0DS S384 µPD160061A 3. PIN CONFIGURATION (Copper foil surface: Face-up) (µPD160061AN-xxx: TCP (TAB package) / µPD160061ANL-xxx: COF (COF package)) STHL D55 D54 D53 D52 D51 D50 D45 D44 D43 D42 D41 D40 D35 D34 D33 D32 D31 D30 VDD1 LPC R,/L V9 V8 V7 V6 V5 VDD2 VSS2 V4 V3 V2 V1 V0 HPC VSS1 SRC CLK STB POL POL21 POL22 D25 D24 D23 D22 D21 D20 D15 D14 D13 D12 D11 D10 D05 D04 D03 D02 D01 D00 STHR S384 S383 S382 S381 IC Pad Surface S4 S3 S2 S1 Remark This figure does not specify the TCP or COF package. Data Sheet S16041EJ2V0DS 3 µPD160061A 4. PIN FUNCTIONS (1/2) Pin Symbol Pin Name S1 to S384 Driver output D00 to D05 Display data input I/O Description Output The D/A converted 64-gray-scale analog voltage is output. Input The display data is input with a width of 36 bits, viz., the gray scale data (6 bits) by 6 dots (2 D10 to D15 pixels). D20 to D25 DX0: LSB, DX5: MSB D30 to D35 D40 to D45 D50 to D55 R,/L Shift direction control Input These refer to the start pulse I/O pins when driver ICs are connected in cascade. Fetching of display data starts when H is read at the rising edge of CLK. R,/L = H (right shift): STHR input, S1→S384, STHL output R,/L = L (left shift): STHL input, S384→S1, STHR output STHR Right shift start pulse I/O input/output These refer to the start pulse I/O pins when driver ICs are connected in cascade. Fetching of display data starts when H is read at the rising edge of CLK. When right shift: STHR input, STHL output STHL Left shift start pulse When left shift: STHL input, STHR output input/output A high level should be input as the pulse of one cycle of the clock signal. If the start pulse input is more than 2CLK, the first 1CLK of the high-level input is valid. CLK Shift clock input Input Refers to the shift register’s shift clock input. The display data is incorporated into the data register at the rising edge. At the rising edge of the 64th after the start pulse input, the start pulse output reaches the high level, thus becoming the start pulse of the next-level driver. If 66th clock pulses are input after input of the start pulse, input of display data is halted automatically. The contents of the shift register are cleared at the STB’s rising edge. STB Latch input Input The contents of the data register are transferred to the latch circuit at the rising edge. And, at the falling edge of the STB, the gray scale voltage is supplied to the driver. When STB = H period, driver output level is Hi-Z (High impedance). It is necessary to ensure input of one pulse per horizontal period. POL Polarity input Input POL = L: The S2n–1 output uses V0 to V4 as the reference supply. The S2n output uses V5 to V9 as the reference supply. POL = H: The S2n–1 output uses V5 to V9 as the reference supply. The S2n output uses V0 to V4 as the reference supply. S2n−1 indicates the odd output, and S2n indicates the even output. Input of the POL signal is allowed the setup time (tPOL-STB) with respect to STB’s rising edge. POL21, Data inversion input Input Data inversion can invert when display data is loaded. POL21: D00 to D05, D10 to D15, D20 to D25, data inversion can invert display data POL22 POL22: D30 to D35, D40 to D45, D50 to D55, data inversion can invert display data POL21, POL22 = H: Data inversion loads display data after inverting it. POL21, POL22 = L: Data inversion does not invert input data. LPC, Bias current control HPC input Input Please refer to panel loads and driver power supply voltage (VDD2), when set up these pins. Refer to 10. BIAS CURRENT CONTROL BY LPC AND HPC. LPC pin is pulled down to the VSS1 inside the IC, HPC pin is pulled up to the VDD1 inside the IC. 4 Data Sheet S16041EJ2V0DS µPD160061A (2/2) Pin Symbol SRC Pin Name High driving time I/O Description Input This pin is set up to high drive time of the output amplifier. Please decide the pin setting refer to panel loads and one horizontal period. SRC pin is pulled up to the VDD1 inside the IC. control SRC = H or open: High drive time 64 CLK (Normally period mode) SRC = L: High drive time 128 CLK (Long time mode) Refer to 9. SRC AND HIGH DRIVE TIME. V0 to V9 γ -corrected power − supplies Input the γ -corrected power supplies from outside by using operational amplifier. Make sure to maintain the following relationships. During the gray scale voltage output, be sure to keep the gray scale level power supply at a constant level. VDD2 − 0.2 V ≥ V0 > V1 > V2 > V3 > V4 ≥ 0.5 VDD2 VDD2 − 0.3 V ≥ > V5 > V6 > V7 > V8 > V9 ≥ VSS2 + 0.2 V VDD1 Logic power supply − 2.3 to 3.6 V VDD2 Driver power supply − 7.5 to 9.5 V VSS1 Logic ground − Grounding VSS2 Driver ground − Grounding Cautions 1. The power start sequence must be VDD1, logic input, and VDD2 & V0 to V9 in that order. Reverse this sequence to shut down. 2. To stabilize the supply voltage, please be sure to insert a 0.1 µF bypass capacitor between VDD1 to VSS1 and VDD2 to VSS2. Furthermore, for increased precision of the D/A converter, insertion of a bypass capacitor of about 0.01 µF is also recommended between the γ -corrected power supply terminals (V0, V1, V2,....., V9) and VSS. Data Sheet S16041EJ2V0DS 5 µPD160061A 5. RELATIONSHIP BETWEEN INPUT DATA AND OUTPUT VOLTAGE VALUE The µPD160061A incorporates a 6-bit D/A converter whose odd output pins and even output pins output respectively gray scale voltages of differing polarity with respect to the LCD’s counter electrode voltage. The D/A converter consists of ladder resistors and switches. The ladder resistors (r0 to r62) are designed so that the ratio of LCD panel γ-compensated voltages to V0’ to V63’ and V0” to V63” is almost equivalent, resistor ratio is shown in Figure 5−2. For the 2 sets of five γ-compensated power supplies, V0 to V4 and V5 to V9, respectively, input gray scale voltages of the same polarity with respect to the common voltage. When fine-gray scale voltage precision is not necessary, there is no need to connect a voltage follower circuit to the γcompensated power supplies V1 to V3 and V6 to V8. Figure 5–1 shows the relationship between the driving voltages such as liquid-crystal driving voltages VDD2 and VSS2, common electrode potential VCOM, and γ -corrected voltages V0 to V9 and the input data. Be sure to maintain the voltage relationships of below. VDD2 – 0.2 V ≥ V0 > V1 > V2 > V3 > V4 ≥ 0.5 VDD2 0.5 VDD2 – 0.3 V ≥ V5 > V6 > V7 > V8 > V9 > VSS2 + 0.2 V Figures 5–2 indicates γ -corrected voltages and ladder resistors ratio. Figures 5–3 indicates the relationship between the input data and output voltage. Figure 5–1. Relationship between Input Data and γ - corrected Power Supplies VDD2 0.2 V V0 16 V1 16 V2 16 V3 16 V4 0.5 VDD2 Split interval 0.3 V V5 16 V6 16 V7 16 V8 16 V9 0.2 V VSS2 00 6 10 20 Input data (HEX.) Data Sheet S16041EJ2V0DS 30 3F µPD160061A Figure 5–2. γ - corrected Voltages and Ladder Resistors Ratio V0 V0’ V5 r0 V63’’ r62 V1’ V62’’ r61 r1 V61’’ V2’ r60 r2 V60’’ V3’ r59 r3 r49 r14 V15’ V49’’ r48 r15 V16’ V1 V48’’ V6 r47 r16 V17’ V47’’ r46 r17 r46 r17 V47’ V17’’ r47 r16 V48’ V3 V16’’ V8 r48 r15 V49’ V15’’ r49 r14 r2 r60 V2’’ V61’ r1 r61 V62’ V1’’ r0 r62 V4 V63’ V9 rn r0 r1 r2 r3 r4 r5 r6 r7 r8 r9 r10 r11 r12 r13 r14 r15 r16 r17 r18 r19 r20 r21 r22 r23 r24 r25 r26 r27 r28 r29 r30 r31 r32 r33 r34 r35 r36 r37 r38 r39 r40 r41 r42 r43 r44 r45 r46 r47 r48 r49 r50 r51 r52 r53 r54 r55 r56 r57 r58 r59 r60 r61 r62 Ratio 11.77 4.91 3.77 3.39 2.64 2.27 1.89 1.89 1.51 1.51 1.13 1.13 1.13 1.13 1.13 1.13 1.01 1.01 1.01 1.01 1.02 1.01 1.01 1.00 1.00 1.00 1.00 1.01 1.01 1.01 1.01 1.01 1.04 1.04 1.04 1.04 1.04 1.04 1.04 1.04 1.04 1.04 1.04 1.05 1.05 1.05 1.05 1.04 1.17 1.17 1.17 1.17 1.17 1.55 1.55 1.55 1.55 1.93 2.30 2.68 2.68 3.06 5.81 Value (TYP.) 1766 736 566 509 396 340 283 283 226 226 170 170 170 170 170 170 152 152 152 152 153 152 152 150 150 150 150 152 152 152 152 152 156 156 156 156 156 156 156 156 156 156 156 157 157 157 157 156 175 175 175 175 176 232 232 232 232 289 345 402 402 459 872 V0’’ Cautions1. There is no connection between V4 and V5 terminal in the IC. 2. The resistance ratio is a relative ratio in the case of setting the resistance minimum value to 1. Data Sheet S16041EJ2V0DS 7 µPD160061A Figure 5–3. Relationship between Input Data and Output Voltage (POL21, POL22 = L) Output Voltage 1: VDD2 – 0.2 V ≥ V0 > V1 > V2 > V3 > V4 ≥ 0.5 VDD2 Output Voltage 2: 0.5 VDD2 – 0.3 V ≥ V5 > V6 > V7 > V8 > V9 ≥ VSS2 + 0.2 V Input 00H 01H 02H 03H 04H 05H 06H 07H 08H 09H 0AH 0BH 0CH 0DH 0EH 0FH 10H 11H 12H 13H 14H 15H 16H 17H 18H 19H 1AH 1BH 1CH 1DH 1EH 1FH 20H 21H 22H 23H 24H 25H 26H 27H 28H 29H 2AH 2BH 2CH 2DH 2EH 2FH 30H 31H 32H 33H 34H 35H 36H 37H 38H 39H 3AH 3BH 3CH 3DH 3EH 3FH 8 V0' V1' V2' V3' V4' V5' V6' V7' V8' V9' V10' V11' V12' V13' V14' V15' V16' V17' V18' V19' V20' V21' V22' V23' V24' V25' V26' V27' V28' V29' V30' V31' V32' V33' V34' V35' V36' V37' V38' V39' V40' V41' V42' V43' V44' V45' V46' V47' V48' V49' V50' V51' V52' V53' V54' V55' V56' V57' V58' V59' V60' V61' V62' V63' Output Voltage 1 V0 V1+(V0-V1)× 4585 V1+(V0-V1)× 3849 V1+(V0-V1)× 3283 V1+(V0-V1)× 2774 V1+(V0-V1)× 2378 V1+(V0-V1)× 2038 V1+(V0-V1)× 1755 V1+(V0-V1)× 1472 V1+(V0-V1)× 1246 V1+(V0-V1)× 1020 V1+(V0-V1)× 850 V1+(V0-V1)× 680 V1+(V0-V1)× 510 V1+(V0-V1)× 340 V1+(V0-V1)× 170 V1 V2+(V1-V2)× 2273 V2+(V1-V2)× 2121 V2+(V1-V2)× 1969 V2+(V1-V2)× 1817 V2+(V1-V2)× 1664 V2+(V1-V2)× 1512 V2+(V1-V2)× 1360 V2+(V1-V2)× 1210 V2+(V1-V2)× 1060 V2+(V1-V2)× 910 V2+(V1-V2)× 760 V2+(V1-V2)× 608 V2+(V1-V2)× 456 V2+(V1-V2)× 304 V2+(V1-V2)× 152 V2 V3+(V2-V3)× 2344 V3+(V2-V3)× 2188 V3+(V2-V3)× 2032 V3+(V2-V3)× 1876 V3+(V2-V3)× 1720 V3+(V2-V3)× 1564 V3+(V2-V3)× 1408 V3+(V2-V3)× 1252 V3+(V2-V3)× 1096 V3+(V2-V3)× 940 V3+(V2-V3)× 784 V3+(V2-V3)× 627 V3+(V2-V3)× 470 V3+(V2-V3)× 313 V3+(V2-V3)× 156 V3 V4+(V3-V4)× 4398 V4+(V3-V4)× 4223 V4+(V3-V4)× 4048 V4+(V3-V4)× 3873 V4+(V3-V4)× 3697 V4+(V3-V4)× 3465 V4+(V3-V4)× 3233 V4+(V3-V4)× 3001 V4+(V3-V4)× 2769 V4+(V3-V4)× 2480 V4+(V3-V4)× 2135 V4+(V3-V4)× 1733 V4+(V3-V4)× 1331 V4+(V3-V4)× 872 V4 / / / / / / / / / / / / / / / 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 / / / / / / / / / / / / / / / 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 / / / / / / / / / / / / / / / 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 / / / / / / / / / / / / / / 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 V0'' V1'' V2'' V3'' V4'' V5'' V6'' V7'' V8'' V9'' V10'' V11'' V12'' V13'' V14'' V15'' V16'' V17'' V18'' V19'' V20'' V21'' V22'' V23'' V24'' V25'' V26'' V27'' V28'' V29'' V30'' V31'' V32'' V33'' V34'' V35'' V36'' V37'' V38'' V39'' V40'' V41'' V42'' V43'' V44'' V45'' V46'' V47'' V48'' V49'' V50'' V51'' V52'' V53'' V54'' V55'' V56'' V57'' V58'' V59'' V60'' V61'' V62'' V63'' Data Sheet S16041EJ2V0DS Output Voltage 2 V9 V9+(V8-V9)× 1766 V9+(V8-V9)× 2502 V9+(V8-V9)× 3068 V9+(V8-V9)× 3577 V9+(V8-V9)× 3973 V9+(V8-V9)× 4313 V9+(V8-V9)× 4596 V9+(V8-V9)× 4879 V9+(V8-V9)× 5105 V9+(V8-V9)× 5331 V9+(V8-V9)× 5501 V9+(V8-V9)× 5671 V9+(V8-V9)× 5841 V9+(V8-V9)× 6011 V9+(V8-V9)× 6181 V8 V8+(V7-V8)× 152 V8+(V7-V8)× 304 V8+(V7-V8)× 456 V8+(V7-V8)× 608 V8+(V7-V8)× 761 V8+(V7-V8)× 913 V8+(V7-V8)× 1065 V8+(V7-V8)× 1215 V8+(V7-V8)× 1365 V8+(V7-V8)× 1515 V8+(V7-V8)× 1665 V8+(V7-V8)× 1817 V8+(V7-V8)× 1969 V8+(V7-V8)× 2121 V8+(V7-V8)× 2273 V7 V7+(V6-V7)× 156 V7+(V6-V7)× 312 V7+(V6-V7)× 468 V7+(V6-V7)× 624 V7+(V6-V7)× 780 V7+(V6-V7)× 936 V7+(V6-V7)× 1092 V7+(V6-V7)× 1248 V7+(V6-V7)× 1404 V7+(V6-V7)× 1560 V7+(V6-V7)× 1716 V7+(V6-V7)× 1873 V7+(V6-V7)× 2030 V7+(V6-V7)× 2187 V7+(V6-V7)× 2344 V6 V6+(V5-V6)× 175 V6+(V5-V6)× 350 V6+(V5-V6)× 525 V6+(V5-V6)× 700 V6+(V5-V6)× 876 V6+(V5-V6)× 1108 V6+(V5-V6)× 1340 V6+(V5-V6)× 1572 V6+(V5-V6)× 1804 V6+(V5-V6)× 2093 V6+(V5-V6)× 2438 V6+(V5-V6)× 2840 V6+(V5-V6)× 3242 V6+(V5-V6)× 3701 V5 / / / / / / / / / / / / / / / 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 6351 / / / / / / / / / / / / / / / 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 2425 / / / / / / / / / / / / / / / 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 2500 / / / / / / / / / / / / / / 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 4573 µPD160061A 6. RELATIONSHIP BETWEEN INPUT DATA AND OUTPUT PIN Data format : 6 bits x 2 RGBs (6 dots) Input width : 36 bits (2-pixel data) (1) R,/L = H (Right shift) Output S1 S2 S3 S4 ... S527 S384 Data D00 to D05 D10 to D15 D20 to D25 D30 to D35 ... D40 to D45 D50 to D55 (2) R,/L = L (Left shift) Output S1 S2 S3 S4 ... S527 S384 Data D00 to D05 D10 to D15 D20 to D25 D30 to D35 ... D40 to D45 D50 to D55 Note Note S2n–1 S2n L V0 to V4 V5 to V9 H V5 to V9 V0 to V4 POL Note S2n–1 (Odd output), S2n (Even output) Data Sheet S16041EJ2V0DS 9 µPD160061A 7. RELATIONSHIP BETWEEN STB CLK AND OUTPUT WAVEFORM Figure 7–1. Input Circuit Block Diagram Output AMP. - DAC + SW1 Sn (VX) VAMP(IN) Figure 7–2. Output Circuit Timing Waveform [1] [1'] CLK tSTB-CLK STB SW1: OFF VAMP(IN) Sn(VX) Hi-Z STB = H is loaded with the rising edge of CLK[1]. However, when not satisfying the specification of fSTB-CLK, STB = H is loaded with the rising edge of the next CLK[1′]. Latch operation of display data is completed with the falling edge of the next CLK which loaded STB = H. Therefore, in order to complete latch operation of display data, it is necessary to input at least 2 CLK in STB = H period. Besides, after loading STB=H to the timing of [1], it is necessary to continue inputting CLK. 10 Data Sheet S16041EJ2V0DS µPD160061A 8. RELATIONSHIP BETWEEN STB, POL AND OUTPUT WAVEFORM When the STB is high level, all outputs became Hi-Z and the gray-scale voltage is output to the LCD in synchronization with the falling edge of STB. Therefore, high drive time of the output amplifier as below is determined by the CLK number of the required SRC pin setting. Be sure to avoid using such as extremely changing the CLK frequency (ex. CLK stop). STB High drive time Inside bias current High drive time High drive time POL V0 - V 4 V5 - V 9 V5 - V9 V5 - V 9 V0 - V 4 V0 - V4 Vx (odd output) Vx (even output) Hi-Z Hi-Z Hi-Z 9. SRC AND HIGH DRIVE TIME The µPD160061A can control high drive time of the output amplifier by SRC pin logic (refer to below figure). SRC = H or open (high drive time: standard mode): High drive time (PWhp) of the output amplifier is in 64 CLK period from falling edge of the STB. SRC = L (high drive time: long-term mode): High drive time (PWhp) of the output amplifier is in 128 CLK period from falling edge of the STB. STB CLK PWhp Inside bias current We recommend a thorough simulation of the output amplifier in advance when set the SRC pin. Data Sheet S16041EJ2V0DS 11 µPD160061A 10. BIAS CURRENT CONTROL BY LPC AND HPC The µPD160061A can control the bias current of the output amplifier in high drive period and low drive period. Bias Current LPC HPC High H L Middle H or open L Normal L or open H or open Low H H or open Panel Load Heavy Light We recommend a thorough simulation of the output amplifier in advance, when set the LPC and HPC pins. Refer to the table below for the example of the combination of setting level and panel load, with driver part supply voltage. Example of Condition Example 1 Example 2 Example 3 12 LPC HPC Load: RL = 5 kΩ, CL = 75 pF L or open L Driver part supply voltage: VDD2 = 7.5 V Bias current mode: Middle Load: RL = 5 kΩ, CL = 75 pF L or open Driver part supply voltage: VDD2 = 9.0 V Bias current mode: Normal H or open Load: RL = 40 kΩ, CL = 80 pF H Driver part supply voltage: VDD2 = 9.0 V Bias current mode: High Data Sheet S16041EJ2V0DS L SRC H or open H or open L µPD160061A 11. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25°C, VSS1 = VSS2 = 0 V) Parameter Symbol Rating Unit Logic Part Supply Voltage VDD1 –0.5 to +4.0 V Driver Part Supply Voltage VDD2 –0.5 to +10.0 V Logic Part Input Voltage VI1 –0.5 to VDD1 + 0.5 V Driver Part Input Voltage VI2 –0.5 to VDD2 + 0.5 V Logic Part Output Voltage VO1 –0.5 to VDD1 + 0.5 V Driver Part Output Voltage VO2 –0.5 to VDD2 + 0.5 V Operating Ambient Temperature TA –10 to +75 °C Storage Temperature Tstg –55 to +125 °C Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Recommended Operating Range (TA = –10 to +75°C, VSS1 = VSS2 = 0 V) Parameter Symbol Condition MIN. TYP. MAX. Unit 3.6 V 9.5 V Logic Part Supply Voltage VDD1 2.3 Driver Part Supply Voltage VDD2 7.5 High-Level Input Voltage VIH 0.7 VDD1 VDD1 V Low-Level Input Voltage VIL 0 0.3 VDD1 V γ -Corrected Voltage V0 to V4 7.5 V ≤ VDD1 ≤ 9.5 V 0.5 VDD2 VDD2 – 0.2 V V5 to V9 7.5 V ≤ VDD1 < 8.5 V 0.2 0.5 VDD2 – 0.3 V 8.5 V ≤ VDD1 ≤ 9.5 V 0.2 0.5 VDD2 V 0.2 VDD2 – 0.2 V 2.3 V ≤ VDD1 < 2.7 V 40 MHz 2.7 V ≤ VDD1 ≤ 3.6 V 65 MHz Driver Part Output Voltage VO Clock Frequency fCLK Data Sheet S16041EJ2V0DS 8.5 13 µPD160061A ★ Electrical Characteristics (TA = –10 to +75°C, VDD1 = 2.3 to 3.6 V, VDD2 = 7.5 to 9.5 V, VSS1 = VSS2 = 0 V) Parameter Symbol Input Leak Current IIL MAX. Unit Except LPC, HPC, SRC Condition MIN. ±1.0 µA LPC, HPC, SRC ±150 µA 0.1 V High-Level Output Voltage VOH STHR (STHL), IOH = 0 mA Low-Level Output Voltage VOL STHR (STHL), IOL = 0 mA γ -Corrected Resistance Rγ V0 to V4 = V5 to V9 = 4.0 V, VDD2 = 8.5 V Driver Output Current IVOH VDD2 = 8.0 V, VX = 7.0 V, VOUT = 6.5 V Note1 Note1 TYP. VDD1 – 0.1 7.9 V 15.8 23.7 kΩ – 20 µA µA IVOL VDD2 = 8.0 V, VX = 1.0 V, VOUT = 1.5 V Output Voltage Deviation ∆VO TA = 25°C, ±10 ±20 mV Output Swing Difference ∆VP–P VDD1 = 3.3 V, VDD2 = 8.5 V, ±3 ±15 mV IDD1 VDD1 4 12 mA IDD22 VDD2, with no load 3.5 8 mA Deviation Logic Part Dynamic Current Consumption VOUT = 2.0 V, 4.25 V, 6.5 V Note2, 3, 4 Driver Part Dynamic Current Consumption 20 Note2, 4 Notes1. VX refers to the output voltage of analog output pins S1 to S384. VOUT refers to the voltage applied to analog output pins S1 to S384. 2. Specified at fSTB = 65 kHz and fCLK = 54 MHz. 3. The TYP. values refer to an all black or all white input pattern. The MAX. value refers to the measured values in the dot checkerboard input pattern. 4. Refers to the current consumption per driver when cascades are connected under the assumption of XGA single-sided mounting (8 units). Switching Characteristics (TA = –10 to +75°C, VDD1 = 2.3 to 3.6 V, VDD2 = 7.5 to 9.5 V, VSS1 = VSS2 = 0 V) Parameter Symbol Start Pulse Delay Time tPLH1 tPLH1 Driver Output Delay Time Input Capacitance Condition MIN. TYP. MAX. Unit ns CL = 15 pF, 2.3 V ≤ VDD1 < 2.7 V 20 CL = 10 pF, 2.7 V ≤ VDD1 ≤ 3.6 V 10.5 ns CL = 10 pF, 2.3 V ≤ VDD1 < 2.7 V 20 ns CL = 10 pF, 2.7 V ≤ VDD1 ≤ 3.6 V 10.5 ns tPLH2 CL = 75 pF, RL = 5 kΩ, 5 µs tPLH3 LPC = L or open, 8 µs tPHL2 HPC = H or open, 5 µs tPHL3 SRC = H or open 8 µs CI1 Logic input of exclude STHR (STHL), 10 pF 5 pF TA = 25°C STHR (STHL), TA = 25°C CI2 <Measurement condition> RLn = 1 kΩ, CLn = 15 pF The measurement point RL1 RL2 RL3 RL4 RL5 Output CL1 CL2 CL3 GND 14 Data Sheet S16041EJ2V0DS CL4 CL5 µPD160061A Timing Requirements (TA = –10 to +75°C, VDD1 = 2.3 to 3.6 V, VSS1 = 0 V, tr = tf = 5.0 ns) Parameter Clock Pulse Width Clock Pulse High Period Clock Pulse Low Period Symbol PWCLK PWCLK(H) PWCLK(L) Condition MIN. TYP. MAX. Unit 2.3 V ≤ VDD1 < 2.7 V 25 ns 2.7 V ≤ VDD1 ≤ 3.6 V 15 ns 2.3 V ≤ VDD1 < 2.7 V 6 ns 2.7 V ≤ VDD1 ≤ 3.6 V 4 ns 2.3 V ≤ VDD1 < 2.7 V 6 ns 2.7 V ≤ VDD1 ≤ 3.6 V 4 ns Data Setup Time tSETUP1 4 ns Data Hold Time tHOLD1 0 ns Start Pulse Setup Time tSETUP2 4 ns Start Pulse Hold Time tHOLD2 0 ns POL21, POL22 Setup Time tSETUP3 4 ns POL21, POL22 Hold Time tHOLD3 0 ns STB Pulse Width PWSTB 2 CLK Last Data Timing tLDT 2 CLK STB-CLK Time tSTB -CLK 9 ns Time Between STB and Start Pulse tSTB-STH STB ↑ → STHR(STHL) ↑ 2 CLK POL-STB Time tPOL-STB POL ↑ or ↓ → STB ↑ –5 ns STB-POL Time tSTB-POL STB ↓ → POL ↓ or ↑ 6 ns STB ↑→ CLK ↑ Remark Unless otherwise specified, the input level is defined to be VIH = 0.7 VDD1, VIL = 0.3 VDD1. Data Sheet S16041EJ2V0DS 15 16 INVALID POL21/22 Data Sheet S16041EJ2V0DS Sn (VX) POL STB STHL (1st Dr.) INVALID t SETUP2 D n0 to D n5 STHR (1st Dr.) CLK t SETUP1 2 PWCLK t HOLD1 3 PW CLK(H) t SETUP3 t HOLD3 D1 to D6 D7 to D12 t HOLD2 1 PW CLK(L) tPLH1 D373 to D378 64 D 379 to D384 65 D385 to D390 66 Last Data t POL-STB t LDT Hi-Z PW STB t STB-CLK t PHL3 t PHL2 t PLH2 t PLH3 t STB-POL INVALID INVALID t STB-STH 90% 10% tr tf D1 to D6 D 7 to D12 2 V SS1 V DD1 V SS1 V DD1 V SS1 V DD1 V SS1 V DD1 V SS1 V DD1 V SS1 V DD1 V SS1 V DD1 Target Voltage: + − 2% Target Voltage: + − 10% 1 µPD160061A SWITCHING CHARACTERISTICS WAVEFORM (R,/L= H) Unless otherwise specified, the input level is defined to be VIH = 0.7 VDD1, VIL = 0.3 VDD1. µPD160061A 12. RECOMMENDED MOUNTING CONDITIONS The following conditions must be met for mounting conditions of the µPD160061A. For more details, refer to the Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html). Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under different conditions. µ PD160061AN - ×××: TCP (TAB package) Mounting Condition Thermocompression Mounting Method Soldering Condition Heating tool 300 to 350°C, heating for 2 to 3 seconds, pressure 100 g (per solder) 2 ACF Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm , time 3 to 5 (Adhesive Conductive seconds. Film) Real bonding 165 to 180°C, pressure 25 to 45 kg/cm , time 30 to 40 2 seconds. (When using the anisotropy conductive film SUMIZAC1003 of Sumitomo Bakelite, Ltd.) Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF manufacturing company. Be sure to avoid using two or more mounting methods at a time. Data Sheet S16041EJ2V0DS 17 µPD160061A NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. 18 Data Sheet S16041EJ2V0DS µPD160061A Reference Documents NEC Semiconductor Device Reliability/Quality Control System (C10983E) Quality Grades On NEC Semiconductor Devices (C11531E) • The information in this document is current as of July, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. 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