JFW HS2N60IA

HS2N60IA
N channel 600V MOSFET
1. Description
The HS2N60IA N-Channel enhancement mode silicon gate power MOSFET is
designed for high voltage, high speed power switching applications such as switching
regulators, switching converters, solenoid, motor drivers, relay drivers.
2. Feature
● RDS(ON)≦4.4Ω@VGS=10V
● Low gate charge ( typical 9.0nC)
● Fast switching capability
● Avalanche energy specified
● Improved dv/dt capability
VDS
600
V
RDS(on)
4.4
Ω
ID
2
A
3. Pin configuration
Order Number
Package
HS2N60IA
TO-251
Oct,2012-Ver1.0
1/5
HS2N60IA
N channel 600V MOSFET
4. Absolute maximum ratings (T C=25℃ Unless Otherwise Noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDSS
600
V
Gate-Source Voltage
VGSS
±30
V
2
A
1.5
A
8
A
Tc=25℃
Continuous Drain Current
ID
TC=70℃
Pulsed Drain Current
IDM
35
TC=25℃
Power Dissipation
PD
Derate above 25°C
Operating Junction and Storage Temperature Range
W
0.28
TJ, Tstg
-55~+150
℃
Symbol
Ratings
Units
Thermal resistance, case to sink typ.
RthCS
0.5
°C/W
Thermal resistance junction to case.
RthJC
3
°C/W
Thermal resistance junction to ambient.
RthJA
110
°C/W
5. Thermal characteristics
Parameter
Oct,2012-Ver1.0
2/5
HS2N60IA
N channel 600V MOSFET
6. Electrical characteristics (T A =25℃ Unless Otherwise Specified)
Symbol Parameter
Limit
Min
Typ
Max Unit
600
--
--
V
STATIC
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250μA
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250μA
2
--
4
V
IGSS
Gate-Body Leakage
VDS=0V, VGS=±30V
--
--
±100
nA
IDSS
Zero Gate Voltage Drain Current
VDS=600V, VGS=0V
--
--
1
μA
VGS=10V, ID=1A
--
--
4.4
Ω
IS=2A, VGS=0V
--
--
1.4
V
--
9
--
--
1.5
--
RDS(ON) Drain-Source On-Resistance
VSD
Diode Forward Voltage
DYNAMIC
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
--
4.2
--
Ciss
Input Capacitance
--
280
--
Coss
Output Capacitance
--
40
--
Crss
Reverse Transfer Capacitance
--
5
--
td(on)
Turn-On Delay Time
--
10
--
tr
Turn-On Rise Time
--
25
--
td(off)
Turn-Off Delay Time
--
20
--
tf
Turn-Off Fall Time
--
25
--
ISD
Continuous drain-source current
--
--
2
A
ISM
Pulsed drain-source current
--
--
8
A
VDD=480V, VGS=10V, ID=2A
VDS=25V, VGS=0V, f=1MHz
VDD=30V, RG=25Ω,ID=2A
nC
pF
ns
Notes :a. pulse test:pulse width 300 us,duty cycle 2% ,Guaranteed by design,not subject to
production testing.
b. HOMSEMI reserves the right to improve product design,functions and reliability without
notice.
Oct,2012-Ver1.0
3/5
HS2N60IA
N channel 600V MOSFET
7. Typical Characteristics (TJ =25℃ Noted)
Transfer Characteristics
Drain Current,ID(A)
Drain Current,ID(A)
On-Region Characteristics
On-Resistance Variation vs.Drain Current and
Gate Voltage
Body Diode Forward Voltage Variation
vs.Source Current and Temperature
Reverse Drain Current,IDR(A)
Gate-Source Voltage,VGS(V)
Source-Drain Voltage,VSD(V)
Capacitance Characteristics
Gate Charge vs.Gate-to-Source Voltage
Gate-Source Voltage,VGS(V)
Drain Current,ID(A)
Capacitance(pF)
Drain-Source On-Resistance,RDS(on)(Ω)
Drain-Source Voltage,VDS(V)
Drain Source Voltage V (V)
Oct,2012-Ver1.0
Total Gate Charge,QG(nC)
4/5
HS2N60IA
N channel 600V MOSFET
8.Package Information:
Unit:mm
TO-251
Oct,2012-Ver1.0
5/5