ETC RMWL38001

RMWL38001
37-40 GHz Low Noise Amplifier MMIC
PRODUCT INFORMATION
Description
Features
The RMWL38001 is a 4-stage GaAs MMIC amplifier designed as a 37 to 40 GHz Low Noise Amplifier for use in
point to point radios, point to multi-point communications, LMDS, and other millimeter wave applications. In
conjunction with other Raytheon amplifiers, multipliers and mixers it forms part of a complete 38 GHz
transmit/receive chipset. The RMWL38001 utilizes Raytheon’s 0.25µm power PHEMT process and is sufficiently
versatile to serve in a variety of low noise amplifier applications.
4 mil substrate
Noise figure 2.7 dB (typ.)
Small-signal gain 22 dB (typ.)
1dB compressed Pout 13.5 dBm (typ.)
Chip size 2.9 mm x 1.25 mm
Absolute
Maximum
Ratings
Parameter
Positive DC voltage (+4 V Typical)
Negative DC voltage
Simultaneous (Vd - Vg)
Positive DC current
RF Input Power (from 50 Ω source)
Operating Baseplate Temperature
Storage Temperature Range
Thermal Resistance
(Channel to Backside)
Electrical
Characteristics
(At 25°C),
50 Ω system,
Vd=+4 V,
Quiescent Current
Idq=50 mA
Parameter
Frequency Range
Gate Supply Voltage (Vg)1
Noise Figure
Gain Small Signal at
Pin=-20 dBm
Gain Variation vs.
Frequency
Gain at 1dB Compression
Power Output at 1dB
Compression
Min
37
Typ
-0.5
2.7
Max
40
4.0
Unit
GHz
V
dB
22
dB
1.5
21
dB
dB
13.5
dBm
Symbol
Value
Unit
Vd
Vg
Vdg
ID
PIN
TC
Tstg
RJC
+6
-2
8
75
+6
-30 to +85
-55 to +125
169
Volts
Volts
Volts
mA
dBm
°C
°C
°C/W
Parameter
Power Output Saturated
Drain Current at
Pin=-20 dBm
Drain Current at
1dB Compression
Input Return Loss
(Pin=-15 dBm)
Output Return Loss
(Pin=-15 dBm)
OIP3
Min
Typ
15
Max
Unit
dBm
50
mA
55
mA
12
dB
13
23
dB
dBm
Note:
1. Typical range of negative gate voltage is -0.9 to -0.1 V to set typical Idq of 50 mA.
Characteristic performance data and specifications are subject to change without notice.
www.raytheon.com/micro
Revised March 14 2001
Page 1
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
RMWL38001
37-40 GHz Low Noise Amplifier MMIC
PRODUCT INFORMATION
Application
Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high thermal
conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat,
plated with gold over nickel and should be capable of withstanding 325°C for 15 minutes.
Die attachment should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for
PHEMT devices. Note that the backside of the chip is gold plated and is used as RF and DC ground.
These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination
of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including
the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent
static discharges through the device.
Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical
allowing for appropriate stress relief. The RF input and output bonds should be typically 0.012” long corresponding
to a typically 2 mil between the chip and the substrate material.
Drain
Supply
Vd1
Figure 1
Functional Block
Diagram
Drain
Supply
Vd2
Drain
Supply
Vd3
Drain
Supply
Vd4
MMIC Chip
RF IN
RF OUT
Ground
(Back of Chip)
Figure 2
Chip Layout and Bond
Pad Locations
Gate Supply
Vg1
Gate Supply
Vg2
Dimensions in mm
0.0
Chip Size is 2.9 mm x
1.25 mm x 100 µm.
Back of chip is RF and
DC ground
0.293
1.476
1.7375
2.013
2.9
1.25
1.25
0.774
0.775
0.6245
0.6255
0.475
0.476
0.0
0.0
0.0
0.645
0.895
1.895
2.645
2.9
Characteristic performance data and specifications are subject to change without notice.
www.raytheon.com/micro
Revised March 14 2001
Page 2
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
RMWL38001
37-40 GHz Low Noise Amplifier MMIC
PRODUCT INFORMATION
Figure 3
Recommended
Application Schematic
Circuit Diagram
Drain Supply
Vd=+4 V
10,000pF
L
100pF L
100pF L
L
L = Bond Wire Inductance
L
10,000pF
L 100pF
L
L
L
MMIC Chip
RF IN
RF OUT
L 100pF
L 100pF
Ground
(Back of Chip)
L
L
Gate Supply
Vg
Vdd
(Positive)
Figure 4
Recommended
Assembly Diagram
10,000pF
100pF
100pF
10,000pF
100pF
5mil Thick
Alumina
50-Ohm
Die-Attach
80Au/20Sn
5 mil Thick
Alumina
50-Ohm
RF
Output
RF
Input
100pF
100pF
2 mil Gap
Vg
(Negative)
L< 0.015”
(4 Places)
Note:
Use 0.003” by 0.0005” Gold Ribbon for bonding. RF input and output bonds should be less than 0.015” long with stress relief.
Characteristic performance data and specifications are subject to change without notice.
www.raytheon.com/micro
Revised March 14 2001
Page 3
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
RMWL38001
37-40 GHz Low Noise Amplifier MMIC
PRODUCT INFORMATION
Recommended
Procedure
for Biasing and
Operation
CAUTION: LOSS OF GATE VOLTAGE (VG) WHILE DRAIN VOLTAGE (VDS) IS PRESENT MAY DAMAGE THE
AMPLIFIER CHIP.
The following sequence of steps must be followed to properly test the amplifier:
Step 5: After the bias condition is established, RF input
signal may now be applied at the appropriate
frequency band.
Step 1: Turn off RF input power.
Step 2: Connect the DC supply grounds to the
grounds of the chip carrier.
Slowly apply negative gate bias supply voltage
of -1.5 V to Vg.
Step 6: Follow turn-off sequence of:
(i) Turn off RF input power,
(ii) Turn down and off drain voltage (Vd),
(iii) Turn down and off gate bias voltage (Vg).
Step 3: Slowly apply positive drain bias supply voltage
of +4 V to Vd.
Step 4: Adjust gate bias voltage to set the quiescent
current of Idq=50 mA.
Performance
Data
RMWL38001, 37-40GHz Low-Noise Amplifier, Typical Performance,
Vd=4V, Idq=50mA, Chip Bonded into 50 ohm Test Fixture
30
S21
20
S21 (dB)
10
0
S11
-10
S22
-20
-30
0
10
20
30
40
50
Frequency (GHz)
Characteristic performance data and specifications are subject to change without notice.
www.raytheon.com/micro
Revised March 14 2001
Page 4
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
RMWL38001
37-40 GHz Low Noise Amplifier MMIC
PRODUCT INFORMATION
Performance
Data
RMWL38001, 37-40GHz Low-Noise Amplifier, Typical Performance,
On-Wafer Measurements, Vd=4V, Idq=50mA
4
Noise Figure (dB)
3
2
1
0
37
37.5
38
38.5
39
39.5
40
Frequency (GHz)
RMWL38001, 37-40GHz Low-Noise Amplifier, Typical Noise Figure,
Vd=4V, Idq=50mA and 65mA, Chip Bonded into 50 ohm Test Fixture
4
Noise Figure (dB)
3.5
3
65mA
2.5
50mA
2
35
36
37
38
39
40
Frequency (GHz)
Characteristic performance data and specifications are subject to change without notice.
www.raytheon.com/micro
Revised March 14 2001
Page 5
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
RMWL38001
37-40 GHz Low Noise Amplifier MMIC
PRODUCT INFORMATION
Performance
Data
RMWL38001, 37-40GHz Low-Noise Amplifier, Typical Performance,
Vd=4V, Idq=50mA and 65mA, Chip Bonded into 50 ohm Test Fixture
26
25
65mA
Gain (dB)
24
23
50mA
22
21
20
35
36
37
38
39
40
Frequency (GHz)
RMWL38001, 37-40GHz Low-Noise Amplifier, Typical Power Performance,
On-Wafer Measurements, Vd=4V, Idq=50mA
20
Output Power (dBm)
18
16
3dB compressed
14
1dB compressed
12
10
37
37.5
38
38.5
39
39.5
40
Frequency (GHz)
Characteristic performance data and specifications are subject to change without notice.
www.raytheon.com/micro
Revised March 14 2001
Page 6
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
Worldwide Sales
Representatives
PRODUCT INFORMATION
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Distribution
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Sales Office
Headquarters
Customer
Support
www.raytheon.com/micro
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(East Coast)
Raytheon
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Andover, MA 01810
978-684-8628
fax: 978-684-8646
Walter Shelmet
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rrfc.raytheon.com
United States
(West Coast)
Raytheon
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Characteristic performance data and specifications are subject to change without notice.
Revised March 14 2001
Page 7
Raytheon RF Components
362 Lowell Street
Andover, MA 01810