750 MHz to 1160 MHz Rx Mixer with Integrated Fractional-N PLL and VCO ADRF6601 The PLL reference input can support input frequencies from 12 MHz to 160 MHz. The PFD output controls a charge pump whose output drives an off-chip loop filter. FEATURES Rx mixer with integrated fractional-N PLL RF input frequency range: 300 MHz to 2500 MHz Internal LO frequency range: 750 MHz to 1160 MHz Input P1dB: 14.2 dBm Input IP3: 30.0 dBm IIP3 optimization via external pin SSB noise figure IP3SET pin open: 13.0 dB IP3SET pin at 3.3 V: 13.8 dB Voltage conversion gain: 6.7 dB Matched 200 Ω IF output impedance IF 3 dB bandwidth: 500 MHz Programmable via 3-wire SPI interface 40-lead, 6 mm × 6 mm LFCSP The loop filter output is then applied to an integrated VCO. The VCO output at 2 × fLO is applied to an LO divider, as well as to a programmable PLL divider. The programmable PLL divider is controlled by a Σ-Δ modulator (SDM). The modulus of the SDM can be programmed from 1 to 2047. The active mixer converts the single-ended 50 Ω RF input to a 200 Ω differential IF output. The IF output can operate up to 500 MHz. The ADRF6601 is fabricated using an advanced silicon-germanium BiCMOS process. It is available in a 40-lead, RoHS-compliant, 6 mm × 6 mm LFCSP with an exposed paddle. Performance is specified over the −40°C to +85°C temperature range. APPLICATIONS Cellular base stations Table 1. GENERAL DESCRIPTION Part No. ADRF6601 The ADRF6601 is a high dynamic range active mixer with an integrated fractional-N phase-locked loop (PLL) and a voltagecontrolled oscillator (VCO) for internal mixer LO generation. ADRF6602 Along with the ADRF6602 and the ADRF6603, the ADRF6601 forms a family of integrated PLL/mixers. The ADRF6601 covers the frequency range of 750 MHz to 1160 MHz. ADRF6603 Internal LO Range 750 MHz to 1160 MHz 1550 MHz to 2150 MHz 2100 MHz to 2600 MHz ±3 dB RF Input Balun Range 300 MHz to 2500 MHz 1000 MHz to 3100 MHz 1100 MHz to 3200 MHz ±1 dB RF Input Balun Range 450 MHz to 1600 MHz 1350 MHz to 2750 MHz 1450 MHz to 2850 MHz FUNCTIONAL BLOCK DIAGRAM VCC1 VCC2 VCC_LO VCC_MIX VCC_V2I VCC_LO 1 10 17 22 27 34 NC NC 32 ADRF6601 LODRV_EN 36 LON 37 BUFFER INTERNAL LO RANGE 750MHz TO 1160MHz LOP 38 BUFFER PLL_EN 16 CLK 13 LE 14 FRACTION MODULUS REG SPI INTERFACE 2:1 MUX INTEGER REG THIRD-ORDER FRACTIONAL INTERPOLATOR ×2 REF_IN 6 ÷2 ÷4 N COUNTER 21 TO 123 MUX TEMP SENSOR 7 VCO CORE PRESCALER ÷2 2 DECL3P3 2.5V LDO 9 DECL2P5 VCO LDO 40 DECLVCO 26 RFIN 29 IP3SET CHARGE PUMP 250µA, 500µA (DEFAULT), 750µA, 1000µA – PHASE + FREQUENCY DETECTOR MUXOUT 8 4 DIV BY 4, 2, 1 3.3V LDO 11 15 20 21 23 24 25 28 30 31 35 5 RSET GND 3 39 18 19 CP VTUNE IFP IFN 08546-001 DATA 12 33 Figure 1. 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ADRF6601 TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagram .............................................................. 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 Register 4—PLL Charge Pump, PFD, and Reference Path Control (Default: 0x0AA7E4)................................................... 13 Register 5—PLL Enable and LO Path Control (Default: 0x0000E5) .................................................................................... 14 Register 6—VCO Control and VCO Enable (Default: 0x1E2106) .................................................................................... 14 RF Specifications .......................................................................... 3 Register 7—Mixer Bias Enable and External VCO Enable (Default: 0x000007).................................................................... 14 Synthesizer/PLL Specifications ................................................... 4 Theory of Operation ...................................................................... 15 Logic Input and Power Specifications ....................................... 5 Programming the ADRF6601................................................... 15 Timing Characteristics ................................................................ 5 Initialization Sequence .............................................................. 15 Absolute Maximum Ratings............................................................ 6 LO Selection Logic ..................................................................... 16 ESD Caution .................................................................................. 6 Applications Information .............................................................. 17 Pin Configuration and Function Descriptions ............................. 7 Basic Connections for Operation ............................................. 17 Typical Performance Characteristics ............................................. 9 Evaluation Board ............................................................................ 18 Register Structure ........................................................................... 11 Evaluation Board Control Software ......................................... 18 Register 0—Integer Divide Control (Default: 0x0001C0)..... 11 Schematics and Artwork ........................................................... 20 Register 1—Modulus Divide Control (Default: 0x003001) .. 11 Evaluation Board Configuration Options ............................... 22 Register 2—Fractional Divide Control (Default: 0x001802) 12 Outline Dimensions ....................................................................... 23 Register 3—Σ-Δ Modulator Dither Control (Default: 0x10000B) .................................................................................... 12 Ordering Guide .......................................................................... 23 REVISION HISTORY 4/10—Revision 0: Initial Version Rev. 0 | Page 2 of 24 ADRF6601 SPECIFICATIONS RF SPECIFICATIONS VCCx = 5 V; ambient temperature (TA) = 25°C; fREF = 38.4 MHz; fPFD = 38.4 MHz; high-side LO injection; fIF = 140 MHz; IIP3 optimized using CDAC = 0x1 and IP3SET = 3.3 V, unless otherwise noted. Table 2. Parameter INTERNAL LO FREQUENCY RANGE RF INPUT FREQUENCY RANGE RF INPUT AT 610 MHz Input Return Loss Input P1dB Second-Order Intercept (IIP2) Third-Order Intercept (IIP3) Single-Side Band Noise Figure LO-to-IF Leakage RF INPUT AT 910 MHz Input Return Loss Input P1dB Second-Order Intercept (IIP2) Third-Order Intercept (IIP3) Single-Side Band Noise Figure LO-to-IF Leakage RF INPUT AT 1020 MHz Input Return Loss Input P1dB Second-Order Intercept (IIP2) Third-Order Intercept (IIP3) Single-Side Band Noise Figure LO-to-IF Leakage IF OUTPUT Voltage Conversion Gain IF Bandwidth Output Common-Mode Voltage Gain Flatness Gain Variation Output Swing Output Return Loss LO INPUT/OUTPUT (LOP, LON) Frequency Range Output Level (LO as Output) Input Level (LO as Input) Input Impedance Test Conditions/Comments ±3 dB RF input range Min 750 300 Relative to 50 Ω (can be improved with external match) −5 dBm each tone (10 MHz spacing between tones) −5 dBm each tone (10 MHz spacing between tones) IP3SET = 3.3 V IP3SET = open At 1× LO frequency, 50 Ω termination at the RF port Relative to 50 Ω (can be improved with external match) −5 dBm each tone (10 MHz spacing between tones) −5 dBm each tone (10 MHz spacing between tones) IP3SET = 3.3 V IP3SET = open At 1× LO frequency, 50 Ω termination at the RF port Low-side injection Relative to 50 Ω (can be improved with external match) −5 dBm each tone (10 MHz spacing between tones) −5 dBm each tone (10 MHz spacing between tones) IP3SET = 3.3 V IP3SET = open At 1× LO frequency, 50 Ω termination at the RF port Differential 200 Ω load Small-signal 3 dB bandwidth External pull-up balun or inductors required Over frequency range, any 5 MHz/50 MHz Over full temperature range Differential 200 Ω load Relative to 200 Ω Externally applied 1× LO input, internal PLL disabled Typ Rev. 0 | Page 3 of 24 Unit MHz MHz −14 14.3 62 32.5 13.0 12.2 −51 dB dBm dBm dBm dB dB dBm −18 14.3 59 31.0 14.0 13.1 −51 dB dBm dBm dBm dB dB dBm −16 14.3 64 31.5 14.5 13.5 −45 dB dBm dBm dBm dB dB dBm 6.7 500 5 0.2/1.0 1.0 2 −15 dB MHz V dB dB V p-p dB 250 1× LO into a 50 Ω load, LO output buffer enabled Max 1160 2500 6000 −5.5 ±6 50 MHz dBm dBm Ω ADRF6601 SYNTHESIZER/PLL SPECIFICATIONS VCCx = 5 V; ambient temperature (TA) = 25°C; fREF = 153.6 MHz; fREF power = 4 dBm; fPFD = 38.4 MHz; high-side LO injection; fIF = 140 MHz; IIP3 optimized using CDAC = 0x1 and IP3SET = 3.3 V, unless otherwise noted. Table 3. Parameter SYNTHESIZER SPECIFICATIONS Frequency Range Figure of Merit 1 Reference Spurs PHASE NOISE Integrated Phase Noise PFD Frequency REFERENCE CHARACTERISTICS REF_IN Input Frequency REF_IN Input Capacitance MUXOUT Output Level MUXOUT Duty Cycle CHARGE PUMP Pump Current Output Compliance Range 1 Test Conditions/Comments Synthesizer specifications referenced to 1× LO Internally generated LO fREF power = 0 dBm fREF = 153.6 MHz fREF/4 fREF/2 fREF > fREF fLO = 750 MHz to 1160 MHz, fPFD = 38.4 MHz 1 kHz to 10 kHz offset 100 kHz offset 500 kHz offset 1 MHz offset 5 MHz offset 10 MHz offset 20 MHz offset 1 kHz to 40 MHz integration bandwidth Min Typ Max Unit 1160 −221.4 MHz dBc/Hz −107 −107 −84 −88 dBc dBc dBc dBc −102 −108.6 −127 −135 −147 −151 −153 0.13 dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz °rms MHz 750 20 40 REF_IN, MUXOUT pins 12 160 4 VOL (lock detect output selected) VOH (lock detect output selected) 0.25 2.7 50 Programmable to 250 μA, 500 μA, 750 μA, 1 mA 500 1 2.8 MHz pF V V % μA V The figure of merit (FOM) is computed as phase noise (dBc/Hz) – 10log10(fPFD) – 20log10(fLO/fPFD). The FOM was measured across the full LO range, with fREF = 80 MHz, fREF power = 10 dBm (500 V/μs slew rate) with a 40 MHz fPFD. The FOM was computed at 50 kHz offset. Rev. 0 | Page 4 of 24 ADRF6601 LOGIC INPUT AND POWER SPECIFICATIONS VCCx = 5 V; ambient temperature (TA) = 25°C; fREF = 38.4 MHz; fPFD = 38.4 MHz; high-side LO injection; fIF = 140 MHz; IIP3 optimized using CDAC = 0x1 and IP3SET = 3.3 V, unless otherwise noted. Table 4. Parameter LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINH/IINL Input Capacitance, CIN POWER SUPPLIES Voltage Range Supply Current Test Conditions/Comments CLK, DATA, LE Min Typ 1.4 0 Max Unit 3.3 0.7 V V μA pF 5.25 V mA mA 0.1 5 VCC1, VCC2, VCC_LO, VCC_MIX, and VCC_V2I pins 4.75 PLL only External LO mode (internal PLL disabled, IP3SET pin = 3.3 V) Internal LO mode (internal PLL enabled, IP3SET pin = 3.3 V) Power-down mode 5 101 179 280 mA 30 mA TIMING CHARACTERISTICS VCC2 = 5 V ± 5%. Table 5. Parameter t1 t2 t3 t4 t5 t6 t7 Limit 20 10 10 25 25 10 20 Unit ns min ns min ns min ns min ns min ns min ns min Description LE setup time DATA to CLK setup time DATA to CLK hold time CLK high duration CLK low duration CLK to LE setup time LE pulse width Timing Diagram t4 t5 CLK t2 DATA DB23 (MSB) t3 DB22 DB2 (CONTROL BIT C3) DB1 (CONTROL BIT C2) t1 DB0 (LSB) (CONTROL BIT C1) t7 08546-002 t6 LE Figure 2. Timing Diagram Rev. 0 | Page 5 of 24 ADRF6601 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Supply Voltage, VCC1, VCC2, VCC_LO, VCC_MIX, VCC_V2I Digital I/O, CLK, DATA, LE IFP, IFN RFIN θJA (Exposed Paddle Soldered Down) Maximum Junction Temperature Operating Temperature Range Storage Temperature Range Rating −0.5 V to +5.5 V −0.3 V to +3.6 V −0.3 V to VCC_V2I + 0.3 V 18 dBm 35°C/W 150°C −40°C to +85°C −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION Rev. 0 | Page 6 of 24 ADRF6601 40 39 38 37 36 35 34 33 32 31 DECLVCO VTUNE LOP LON LODRV_EN GND VCC_LO NC NC GND PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 9 10 PIN 1 INDICATOR ADRF6601 TOP VIEW (Not to Scale) 30 29 28 27 26 25 24 23 22 21 GND IP3SET GND VCC_V2I RFIN GND GND GND VCC_MIX GND NOTES 1. NC = NO CONNECT. 2. THE EXPOSED PADDLE SHOULD BE SOLDERED TO A LOW IMPEDANCE GROUND PLANE. 08546-003 GND DATA CLK LE GND PLL_EN VCC_LO IFP IFN GND 11 12 13 14 15 16 17 18 19 20 VCC1 DECL3P3 CP GND RSET REF_IN GND MUXOUT DECL2P5 VCC2 Figure 3. Pin Configuration Table 7. Pin Function Descriptions Pin No. 1 Mnemonic VCC1 2 3 4, 7, 11, 15, 20, 21, 23, 24, 25, 28, 30, 31, 35 5 DECL3P3 CP GND RSET Description Power Supply for the 3.3 V LDO. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin. Decoupling Node for the 3.3 V LDO. Connect a 0.1 μF capacitor between this pin and ground. Charge Pump Output Pin. Connect to VTUNE through the loop filter. Ground. Connect these pins to a low impedance ground plane. Charge Pump Current. The nominal charge pump current can be set to 250 μA, 500 μA, 750 μA, or 1 mA using Bits[DB11:DB10] in Register 4 and by setting Bit DB18 to 0 (internal reference current). In this mode, no external RSET is required. If Bit DB18 is set to 1, the four nominal charge pump currents (INOMINAL) can be externally adjusted according to the following equation: ⎛ 217.4 × I CP R SET = ⎜⎜ ⎝ I NOMINAL 6 8 REF_IN MUXOUT 9 10 DECL2P5 VCC2 12 13 DATA CLK 14 LE 16 PLL_EN 17, 34 VCC_LO 18, 19 22 IFP, IFN VCC_MIX 26 RFIN ⎞ ⎟ − 37.8 Ω ⎟ ⎠ Reference Input. Nominal input level is 1 V p-p. Input range is 12 MHz to 160 MHz. Multiplexer Output. This output can be programmed to provide the reference output signal or the lock detect signal. The output is selected by programming Bits[DB23:DB21] in Register 4. Decoupling Node for the 2.5 V LDO. Connect a 0.1 μF capacitor between this pin and ground. Power Supply for the 2.5 V LDO. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin. Serial Data Input. The serial data input is loaded MSB first; the three LSBs are the control bits. Serial Clock Input. The serial clock input is used to clock in the serial data to the registers. The data is latched into the 24-bit shift register on the CLK rising edge. Maximum clock frequency is 20 MHz. Load Enable. When the LE input pin goes high, the data stored in the shift registers is loaded into one of the eight registers. The relevant latch is selected by the three control bits of the 24-bit word. PLL Enable. Switch between internal PLL and external LO input. When this pin is logic high, the mixer LO is automatically switched to the internal PLL and the internal PLL is powered up. When this pin is logic low, the internal PLL is powered down and the external LO input is routed to the mixer LO inputs. The SPI can also be used to switch modes. Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin. Mixer IF Outputs. These outputs should be pulled to VCC with RF chokes. Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin. RF Input (Single-Ended, 50 Ω). Rev. 0 | Page 7 of 24 ADRF6601 Pin No. 27 Mnemonic VCC_V2I 29 32, 33 36 IP3SET NC LODRV_EN 37, 38 LON, LOP 39 VTUNE 40 DECLVCO EP EPAD Description Power Supply. Power supply voltage range is 4.75 V to 5.25 V. Each power supply pin should be decoupled with a 100 pF capacitor and a 0.1 μF capacitor located close to the pin. Connect a resistor from this pin to a +5 V supply to adjust IIP3. Normally leave open. No Connection. LO Driver Enable. Together with Pin 16 (PLL_EN), this digital input pin determines whether the LOP and LON pins operate as inputs or outputs. LOP and LON become inputs if the PLL_EN pin is low or if the PLL_EN pin is set high with the PLEN bit (DB6 in Register 5) set to 0. LOP and LON become outputs if either the LODRV_EN pin or the LDRV bit (DB3 in Register 5) is set to 1 while the PLL_EN pin is set high. The external LO drive frequency must be 1× LO. This pin should not be left floating. Local Oscillator Input/Output. The internally generated 1× LO is available on these pins. When internal LO generation is disabled, an external 1× LO can be applied to these pins. VCO Control Voltage Input. This pin is driven by the output of the loop filter. The nominal input voltage range on this pin is 1.5 V to 2.5 V. Decoupling Node for the VCO LDO. Connect a 100 pF capacitor and a 10 μF capacitor between this pin and ground. Exposed Paddle. The exposed paddle should be soldered to a low impedance ground plane. Rev. 0 | Page 8 of 24 ADRF6601 TYPICAL PERFORMANCE CHARACTERISTICS CDAC = 0x1, IP3SET = 3.3 V, internally generated LO, RFIN = −10 dBm, fIF = 140 MHz, unless otherwise noted. 5 4 45 –40°C +25°C +85°C 40 3 –40°C +25°C +85°C 35 INPUT IP3 (dBm) GAIN (dB) 2 1 0 –1 30 25 20 –2 15 –3 900 950 1000 1050 1100 1150 LO FREQUENCY (MHz) 5 750 900 950 1000 1050 1150 1100 1150 1100 1150 1100 Figure 7. IIP3 vs. LO Frequency, RFIN = −5 dBm 20 –40°C +25°C +85°C 18 –40°C +25°C +85°C 16 70 INPUT P1dB (dBm) INPUT IP2 (dBm) 80 850 LO FREQUENCY (MHz) Figure 4. Gain vs. LO Frequency 90 800 08546-017 850 08546-018 800 08546-014 –5 750 08546-019 10 –4 60 50 14 12 10 8 6 4 40 2 800 850 900 950 1000 1050 1100 1150 LO FREQUENCY (MHz) 0 750 08546-015 30 750 800 19 950 1000 1050 Figure 8. IP1dB vs. LO Frequency 0 –40°C +25°C +85°C –10 LO-TO-IF LEAKAGE (dBm) 18 17 16 15 14 13 12 –40°C +25°C +85°C –20 –30 –40 –50 11 10 750 800 850 900 950 1000 1050 LO FREQUENCY (MHz) 1100 1150 –60 750 08546-016 NOISE FIGURE (dB) 900 LO FREQUENCY (MHz) Figure 5. IIP2 vs. LO Frequency, RFIN = −5 dBm 20 850 800 850 900 950 1000 LO FREQUENCY (MHz) Figure 6. Noise Figure vs. LO Frequency 1050 Figure 9. LO-to-IF Leakage vs. LO Frequency, LO Output Turned Off, 50 Ω Termination at RF Port Rev. 0 | Page 9 of 24 ADRF6601 Phase noise measurements made at IF output, unless otherwise noted. 1.0 1kHz OFFSET 0.9 0.6 –120 0.5 10kHz OFFSET –130 0.4 1MHz OFFSET 0.3 10MHz OFFSET –150 0.2 –160 INTERGRATED PHASE NOISE –170 750 800 850 900 950 1000 1050 1100 PHASE NOISE (dBc/Hz) 0.7 INTEGRATED PHASE NOISE (°rms) 0.8 –110 –90 2× PFD OFFSET 4× PFD OFFSET –110 750 800 850 900 950 1000 1050 1100 LO FREQUENCY (MHz) 1150 08546-021 0.25× AND 0.5× PFD OFFSET –105 –140 10k 100k 1M 10M 100M OFFSET FREQUENCY (Hz) Figure 12. Phase Noise vs. Offset Frequency and LO Frequency (LO Frequency Varies from 750 MHz to 1160 MHz) 1× PFD OFFSET –100 –130 –160 1k –80 –95 –120 0 1150 = 752MHz = 848MHz = 953.6MHz = 1049.6MHz = 1155.2MHz –110 –150 Figure 10. PLL Spot Phase Noise at Various Offsets and Integrated Phase Noise vs. LO Frequency –85 –100 0.1 LO FREQUENCY (MHz) SPURS LEVEL (dBc) SPOT PHASE NOISE (dBc/Hz) 100kHz OFFSET –100 LO LO LO LO LO –90 08546-020 –90 –140 –80 Figure 11. PLL Reference Spurs vs. LO Frequency Rev. 0 | Page 10 of 24 08546-022 –80 ADRF6601 REGISTER STRUCTURE This section provides the register maps for the ADRF6601. The three LSBs determine the register that is programmed. REGISTER 0—INTEGER DIVIDE CONTROL (DEFAULT: 0x0001C0) DIVIDE MODE DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 0 0 0 0 0 0 0 0 0 0 0 INTEGER DIVIDE RATIO CONTROL BITS DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DM ID6 ID5 ID4 ID3 ID2 ID1 ID0 C3(0) C2(0) C1(0) 0 0 DM DIVIDE MODE 0 FRACTIONAL (DEFAULT) 1 INTEGER DB1 ID6 ID5 ID4 ID3 ID2 ID1 ID0 INTEGER DIVIDE RATIO 0 0 1 0 1 0 1 21 (INTEGER MODE ONLY) 0 0 1 0 1 1 0 22 (INTEGER MODE ONLY) 0 0 1 0 1 1 1 23 (INTEGER MODE ONLY) 0 0 1 1 0 0 0 24 ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 0 1 1 1 0 0 0 56 (DEFAULT) ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 1 1 1 0 1 1 1 119 1 1 1 1 0 0 0 120 (INTEGER MODE ONLY) 1 1 1 1 0 0 1 121 (INTEGER MODE ONLY) 1 1 1 1 0 1 0 122 (INTEGER MODE ONLY) 1 1 1 1 0 1 1 123 (INTEGER MODE ONLY) DB0 08546-004 RESERVED Figure 13. Register 0—Integer Divide Control Register Map REGISTER 1—MODULUS DIVIDE CONTROL (DEFAULT: 0x003001) MODULUS VALUE 0 0 0 0 0 0 0 0 0 0 MD10 CONTROL BITS DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 MD9 MD6 MD5 MD4 MD3 MD2 MD1 MD0 C3(0) C2(0) C1(1) MD8 MD7 DB1 DB0 MD10 MD9 MD8 MD7 MD6 MD5 MD4 MD3 MD2 MD1 MD0 MODULUS VALUE 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 1 0 2 ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 1 1 0 0 0 0 0 0 0 0 0 1536 (DEFAULT) ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 1 1 1 1 1 1 1 1 1 1 1 2047 Figure 14. Register 1—Modulus Divide Control Register Map Rev. 0 | Page 11 of 24 08546-005 RESERVED DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 ADRF6601 REGISTER 2—FRACTIONAL DIVIDE CONTROL (DEFAULT: 0x001802) RESERVED 0 0 0 0 0 0 0 0 0 FD10 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 FD9 FD6 FD5 FD4 FD3 FD2 FD1 FD0 FD8 FD7 DB2 DB1 DB0 C3(0) C2(1) C1(0) FD10 FD9 FD8 FD7 FD6 FD5 FD4 FD3 FD2 FD1 FD0 FRACTIONAL VALUE 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 0 1 1 0 0 0 0 0 0 0 0 768 (DEFAULT) ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... ... 08546-006 0 CONTROL BITS FRACTIONAL VALUE DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 <MDR FRACTIONAL VALUE MUST BE LESS THAN MODULUS Figure 15. Register 2—Fractional Divide Control Register Map REGISTER 3—Σ-Δ MODULATOR DITHER CONTROL (DEFAULT: 0x10000B) DITHER MAGNITUDE DB22 DB21 DITH1 DITH0 DITHER DITHER RESTART VALUE CONTROL BITS ENABLE DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 DEN DV16 DV15 DV14 DV13 DV12 DV11 DV10 DV9 DV8 DV7 DV6 DV5 DV4 DV3 DV2 DV1 DV0 C3(0) C2(1) C1(1) DITH1 0 0 DITH0 0 1 DITHER MAGNITUDE 15 (DEFAULT) 7 1 0 3 1 1 1 (RECOMMENDED) DEN 0 1 DITHER ENABLE DISABLE ENABLE (DEFAULT, RECOMMENDED) DV16 DV15 DV14 DV13 DV12 DV11 DV10 DV9 DV8 DV7 DV6 DV5 DV4 DV3 DV2 DV1 DV0 DITHER RESTART VALUE 0 ... ... 1 0 ... ... 1 0x00001 (DEFAULT) ... ... 0x1FFFF 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 0 ... ... 1 Figure 16. Register 3—Σ-Δ Modulator Dither Control Register Map Rev. 0 | Page 12 of 24 0 ... ... 1 0 ... ... 1 1 ... ... 1 08546-007 RES DB23 0 ADRF6601 REGISTER 4—PLL CHARGE PUMP, PFD, AND REFERENCE PATH CONTROL (DEFAULT: 0x0AA7E4) REF OUTPUT MUX SELECT DB23 DB22 CP INPUT REF CURRENT REF PATH SOURCE DB21 DB20 DB19 RMS2 RMS1 RMS0 RS1 RS0 PFD PHASE OFFSET MULTIPLIER PFD POL CP CURRENT CP CP SRC CONTROL DB8 PFD ANTIBACKLASH DELAY PFD EDGE DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB7 DB6 DB5 CPM CPBD CPB4 CPB3 CPB2 CPB1 CPB0 CPP1 CPP0 CPS CPC1 CPC0 PE1 PE0 DB4 DB3 CONTROL BITS DB2 DB1 DB0 PAB1 PAB0 C3(1) C2(0) C1(0) PAB0 PAB1 PFD ANTIBACKLASH DELAY 0 0 0ns (DEFAULT) 0 1 0.5ns 1 0 0.75ns 1 1 0.9ns PE1 0 1 PE0 REFERENCE PATH EDGE SENSITIVITY 0 1 FALLING EDGE RISING EDGE (DEFAULT) DIVIDER PATH EDGE SENSITIVITY FALLING EDGE RISING EDGE (DEFAULT) CPC1 CPC0 CHARGE PUMP CONTROL 0 0 1 1 0 1 0 1 BOTH ON PUMP DOWN PUMP UP TRISTATE (DEFAULT) CPS CHARGE PUMP CONTROL SOURCE 0 1 CONTROL BASED ON STATE OF DB7/DB8 (CP CONTROL) CONTROL FROM PFD (DEFAULT) CPP1 CPP0 CHARGE PUMP CURRENT 0 0 1 1 0 1 0 1 250µA 500µA (DEFAULT) 750µA 1000µA CPB4 CPB3 CPB2 CPB1 CPB0 PFD PHASE OFFSET MULTIPLIER 0 0 0 0 1 1 CPM 0 1 0 0 0 1 0 1 0 0 1 0 0 1 0 0 1 1 0 1 0 1 0 0 0 1 CPBD PFD PHASE OFFSET POLARITY 0 1 NEGATIVE POSITIVE (DEFAULT) 0 × 22.5°/ICPMULT 1 × 22.5°/ICPMULT 6 × 22.5°/ICPMULT (RECOMMENDED) 10 × 22.5°/ICPMULT (DEFAULT) 16 × 22.5°/ICPMULT 31 × 22.5°/ICPMULT CHARGE PUMP CURRENT REFERENCE SOURCE INTERNAL (DEFAULT) EXTERNAL RS1 INPUT REFERENCE RS0 PATH SOURCE 0 0 1 1 0 1 0 1 2 × REF_IN REF_IN (DEFAULT) 0.5 × REF_IN 0.25 × REF_IN RMS2 RMS1 RMS0 REF OUTPUT MUX SELECT 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 LOCK DETECT (DEFAULT) VPTAT REF_IN (BUFFERED) 0.5 × REF_IN (BUFFERED) 2 × REF_IN (BUFFERED) TRISTATE RESERVED RESERVED 08546-008 0 0 0 0 1 1 1 1 Figure 17. Register 4—PLL Charge Pump, PFD, and Reference Path Control Register Map Rev. 0 | Page 13 of 24 ADRF6601 REGISTER 5—PLL ENABLE AND LO PATH CONTROL (DEFAULT: 0x0000E5) CAP DAC RESERVED DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 0 0 0 0 0 0 0 0 0 0 0 CD3 0 CD2 CD1 CD0 RES PLL EN LO DIV1 LO EXT LO DRV DB7 DB6 DB5 DB4 DB3 0 PLEN LDV1 LXL CONTROL BITS DB2 DB1 DB0 LDRV C3(1) C2(0) C1(1) CD3 CD2 CD1 CD0 CAPACITOR DAC CONTROL FOR IIP3 OPTIMIZATION LO OUTPUT DRIVER LDRV ENABLE 0 1 0 1 0 1 0 1 MIN MAX 0 1 DRIVER OFF (DEFAULT) DRIVER ON EXTERNAL LO DRIVE LXL ENABLE (PIN 37, PIN 38) INTERNAL LO OUTPUT (DEFAULT) EXTERNAL LO INPUT 0 1 DIVIDE-BY-2 IN LO CHAIN ENABLE 0 1 DIVIDE BY 1 DIVIDE BY 2 (DEFAULT) PLEN PLL ENABLE 0 1 DISABLE ENABLE (DEFAULT) 08546-009 LDV1 Figure 18. Register 5—PLL Enable and LO Path Control Register Map REGISTER 6—VCO CONTROL AND VCO ENABLE (DEFAULT: 0x1E2106) CHARGE 3.3V VCO PUMP LDO VCO LDO VCO ENABLE ENABLE ENABLE ENABLE SWITCH DB23 DB22 DB21 0 0 0 DB20 CPEN DB19 L3EN DB18 LVEN VCO AMPLITUDE DISABLE ENABLE (DEFAULT) L3EN 3.3V LDO ENABLE 0 1 DISABLE ENABLE (DEFAULT) LVEN VCO LDO ENABLE 0 1 DISABLE ENABLE (DEFAULT) VCO BAND SELECT FROM SPI CONTROL BITS DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 VCO EN VCO SW VC5 VC4 VC3 VC2 VC1 VC0 VBSRC VBS5 VBS4 VBS3 VBS2 VBS1 VBS0 C3(1) C2(1) C1(0) CPEN CHARGE PUMP ENABLE 0 1 VCO BW SW CTRL VC[5:0] VCO AMPLITUDE VBS[5:0] VCO BAND SELECT FROM SPI 0x00 …. 0x18 …. 0x2B …. 0x3F 0x00 0x01 …. 0x3F DEFAULT 0x20 0 …. 24 (DEFAULT) …. 43 …. 63 (RECOMMENDED) VCO SW VCO SWITCH CONTROL FROM SPI 0 1 REGULAR (DEFAULT) BAND CAL VCO EN VCO ENABLE 0 1 DISABLE ENABLE (DEFAULT) VBSRC VCO BW CAL AND SW SOURCE CONTROL 0 1 BAND CAL (DEFAULT) SPI 08546-010 RESERVED Figure 19. Register 6—VCO Control and VCO Enable Register Map REGISTER 7—MIXER BIAS ENABLE AND EXTERNAL VCO ENABLE (DEFAULT: 0x000007) RES MIXER XVCO B_EN RESERVED DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 0 XVCO MBE 0 0 0 0 0 0 0 0 0 0 0 0 0 CONTROL BITS DB7 DB6 DB5 0 0 0 DB4 DB3 DB2 DB1 DB0 0 0 C3(1) C2(1) C1(1) MBE MIXER BIAS ENABLE DISABLE 0 ENABLE (DEFAULT) 1 EXTERNAL VCO INTERNAL VCO (DEFAULT) EXTERNAL VCO 08546-011 XVCO 0 1 Figure 20. Register 7—Mixer Bias Enable and External VCO Enable Register Map Rev. 0 | Page 14 of 24 ADRF6601 THEORY OF OPERATION The ADRF6601 integrates a high performance downconverting mixer with a state-of-the-art fractional-N PLL. The PLL also integrates a low noise VCO. The SPI port allows the user to control the fractional-N PLL functions and the mixer optimization functions, as well as allowing for an externally applied LO or VCO. The mixer core within the ADRF6601 is the next generation of an industry leading family of mixers from Analog Devices, Inc. The RF input is converted to a current and then mixed down to IF using high performance NPN transistors. The mixer output currents are transformed to a differential output voltage. The high performance active mixer core results in an exceptional IIP3 and IP1dB, with a very low output noise floor for excellent dynamic range. Over the specified frequency range, the ADRF6601 typically provides an IF input P1dB of 14.3 dBm and an IIP3 of 31 dBm. Improved performance at specific frequencies can be achieved with the use of the internal capacitor DAC (CDAC), which is programmable via the SPI port, and through the use of a resistor to a 5 V supply from the IP3SET pin (Pin 29). Adjustment of the capacitor DAC allows increments in phase shift at internal nodes in the ADRF6601, thus allowing cancellation of thirdorder distortion with no change in supply current. Connecting a resistor to a 5 V supply from the IP3SET pin increases the internal mixer core current, thereby improving overall IIP2 and IIP3, as well as IP1dB. Using the IP3SET pin for this purpose increases the overall supply current. The fractional divide function of the PLL allows the frequency multiplication value from REF_IN to LO output to be a fractional value rather than be restricted to an integer value as in traditional PLLs. In operation, this multiplication value is INT + (FRAC/MOD) PROGRAMMING THE ADRF6601 The ADRF6601 is programmed via a 3-pin SPI port. The timing requirements for the SPI port are shown in Figure 2. Eight programmable registers, each with 24 bits, control the operation of the device. The register functions are listed in Table 8. Table 8. ADRF6601 Register Functions Register Register 0 Register 1 Register 2 Register 3 Register 4 Register 5 Register 6 Register 7 Function Integer divide control for the PLL Modulus divide control for the PLL Fractional divide control for the PLL Σ-Δ modulator dither control PLL charge pump, PFD, reference path control PLL enable and LO path control VCO control and VCO enable Mixer bias enable and external VCO enable Note that internal calibration for the PLL must be run when the ADRF6601 is initialized at a given frequency. This calibration is run automatically whenever Register 0, Register 1, or Register 2 is programmed. Because the other registers affect PLL performance, Register 0, Register 1, and Register 2 should always be programmed in the order specified in the Initialization Sequence section. To program the frequency of the ADRF6601, the user typically programs only Register 0, Register 1, and Register 2. However, if registers other than these are programmed first, a short delay should be inserted before programming Register 0. This delay ensures that the VCO band calibration has sufficient time to complete before the final band calibration for Register 0 is initiated. Software is available on the ADRF6601 product page of the Analog Devices website (www.analog.com) that allows easy programming from a PC running Windows XP or Vista. INITIALIZATION SEQUENCE where: INT is the integer value. FRAC is the fractional value. MOD is the modulus value. To ensure proper power-up of the ADRF6601, it is important to reset the PLL circuitry after the VCC supply rail settles to 5 V ± 0.25 V. Resetting the PLL ensures that the internal bias cells are properly configured, even under poor supply start-up conditions. The INT, FRAC, and MOD values are all programmable via the SPI port. To ensure that the PLL is reset after power-up, follow these steps: In other fractional-N PLL designs, fractional multiplication is achieved by periodically changing the fractional value in a deterministic way. The disadvantage of this approach is often spurious components close to the fundamental signal. In the ADRF6601, a Σ-Δ modulator is used to distribute the fractional value randomly, thus significantly reducing the spurious content due to the fractional function. 1. 2. Disable the PLL by setting the PLEN bit to 0 (Register 5, Bit DB6). After a delay of >100 ms, set the PLEN bit to 1. After this procedure is followed, the other registers should be programmed in this order: Register 7, Register 6, Register 4, Register 3, Register 2, Register 1. Then, after a delay of >100 ms, Register 0 should be programmed. Rev. 0 | Page 15 of 24 ADRF6601 LO SELECTION LOGIC The downconverting mixer in the ADRF6601 can be used without the internal PLL by applying an external differential LO to Pin 37 and Pin 38 (LON and LOP). In addition, when using an LO generated by the internal PLL, the LO signal can be accessed directly at these same pins. This function can be used for debugging purposes, or the internally generated LO can be used as the LO for a separate mixer. The operation of the LO generation and whether LOP and LON are inputs or outputs are determined by the logic levels applied at Pin 16 (PLL_EN) and Pin 36 (LODRV_EN), as well as Bit DB3 (LDRV) and Bit DB6 (PLEN) in Register 5. The combination of externally applied logic and internal bits required for particular LO functions is given in Table 9. Table 9. LO Selection Logic Pin 16 (PLL_EN) 0 0 1 1 1 1 1 Pins1 Pin 36 (LODRV_EN) X X X 0 X 1 Register 5 Bits1 Bit DB6 (PLEN) Bit DB3 (LDRV) 0 X 1 X 0 X 1 0 1 1 1 X X = don’t care. Rev. 0 | Page 16 of 24 Output Buffer Disabled Disabled Disabled Disabled Enabled Enabled Outputs LO External External External Internal Internal Internal ADRF6601 APPLICATIONS INFORMATION shown in Figure 21. The reference signal, or a divided-down version of the reference signal, can be brought back off chip at the multiplexer output pin (MUXOUT). A lock detect signal and a voltage proportional to the ambient temperature can also be selected on the multiplexer output pin. BASIC CONNECTIONS FOR OPERATION Figure 21 shows the basic connections for the ADRF6601. The six power supply pins should be individually decoupled using 100 pF and 0.1 μF capacitors located as close as possible to the device. In addition, the internal decoupling nodes (DECL3P3, DECL2P5, and DECLVCO) should be decoupled with the capacitor values shown in Figure 21. The loop filter is connected between the CP and VTUNE pins. When connected in this way, the internal VCO is operational. For information about the loop filter components, see the Evaluation Board Configuration Options section. The RF input is internally ac-coupled and needs no external bias. The IF outputs are open collector, and a bias inductor is required from these outputs to VCC. Operation with an external VCO is also possible. In this case, the loop filter components should be referred to ground. The output of the loop filter is connected to the input voltage pin of the external VCO. The output of the VCO is brought back into the device on the LOP and LON pins, using a balun if necessary. The reference frequency for the PLL should be from 12 MHz to 160 MHz and should be applied to the REF_IN pin, which should be ac-coupled and terminated with a 50 Ω resistor, as 1 2 3 4 5 6 VCC S2 LO IN/OUT LON 4 3 C19 0.1µF (0402) C9 0.1µF (0402) C33 OPEN (0402) R51 OPEN (0402) R6 0Ω (0402) C8 100pF (0402) R26 0Ω (0402) C24 100pF (0402) R25 0Ω (0402) C22 100pF (0402) R24 0Ω (0402) C21 100pF (0402) R17 0Ω (0402) C18 100pF (0402) R7 0Ω (0402) C10 100pF (0402) C32 OPEN (0402) R50 OPEN (0402) VCC_MIX 27 VCC_LO 22 VCC2 17 VCC1 10 1 T8 TC1-1-13+ REFIN R70 49.9Ω (0402) REFOUT 13 12 14 DECL2P5 9 C16 R18 100pF 0Ω (0402) (0402) C17 0.1µF (0402) C42 10µF (0603) DECL3P3 C12 R8 100pF 0Ω (0402) (0402) C11 0.1µF (0402) C41 OPEN (0603) SPI INTERFACE 37 DIVIDER ÷2 BUFFER BUFFER FRACTION REG ADRF6601 MODULUS THIRD-ORDER FRACTIONAL INTERPOLATOR ×2 6 ÷2 TEMP SENSOR 26 N COUNTER 21 TO 123 CHARGE PUMP 250µA, 500µA (DEFAULT), 750µA, 1000µA – PHASE + FREQUENCY DETECTOR 7 11 15 20 21 23 24 25 28 30 31 35 RSET R2 R37 OPEN 0Ω (0402) (0402) CP TEST POINT (ORANGE) R38 0Ω (0402) C14 22pF (0603) 29 3 39 CP R10 3.0kΩ (0603) C15 2.7nF (1206) C2 OPEN (0402) 40 18 C13 6.8pF (0603) R1 0Ω (0402) VTUNE C40 22pF (0603) R63 OPEN (0402) RFIN IP3SET R27 0Ω (0402) IFN VCC +5V C27 0.1µF (0402) 1 2 R59 0Ω 3 (0402) 4 R43 0Ω 5 (0402) RFOUT C29 0.1µF (0402) R12 0Ω (0402) C1 100pF (0402) Figure 21. Basic Connections for Operation of the ADRF6601 Rev. 0 | Page 17 of 24 R28 0Ω (0402) 19 VTUNE DECLVCO IFP R62 0Ω (0402) R9 10kΩ R65 10kΩ (0402) (0402) R11 OPEN (0402) C43 10µF (0603) 5 RFIN VCO CORE PRESCALER ÷2 8 4 2 DIV BY 4, 2, 1 2:1 MUX INTEGER REG MUX ÷4 MUXOUT R16 0Ω (0402) 16 36 C6 1nF (0402) C31 1nF (0402) REF_IN CLK VCC_V2I LE C20 0.1µF (0402) DATA C23 0.1µF (0402) C5 1nF LOP 38 1 (0402) 5 R52 OPEN (0402) C25 0.1µF (0402) 34 LODRV_EN C34 OPEN (0402) C7 0.1µF (0402) PLL_EN VCC_LO R56 0Ω (0402) P1 9-PIN DSUB 9 R53 10kΩ (0402) VCC RED +5V VCC1 RED R55 OPEN (0402) S1 OPEN 8 R36 0Ω R30 (0402) 0Ω (0402) R57 0Ω (0402) R35 0Ω (0402) R19 0Ω R20 (0402) 0Ω (0402) R54 10kΩ (0402) 7 08546-024 A peak-to-peak differential swing on RFIN of 1 V (0.353 V rms for a sine wave input) results in an IF output power of 4.7 dBm. ADRF6601 EVALUATION BOARD Figure 24 shows the schematic of the RoHS-compliant evaluation board for the ADRF6601. This board has four layers and was designed using Rogers 4350 hybrid material to minimize high frequency losses. FR4 material is also adequate if the design can accept the slightly higher trace loss of this material. The evaluation board is designed to operate using the internal VCO of the device (the default configuration) or with an external VCO. To use an external VCO, R62 and R12 should be removed. Place 0 Ω resistors in R63 and R11. The input of the external VCO should be connected to the VTUNE SMA connector, and the external VCO output should be connected to the LO IN/OUT SMA connector. In addition to these hardware changes, internal register settings must also be changed to enable operation with an external VCO (see the Register 6— VCO Control and VCO Enable (Default: 0x1E2106) section). To connect the evaluation board to a USB port, a USB adapter board (Part No. EVAL-ADF4XXXZ-USB) must be purchased from www.analog.com. This board connects to the PC using a standard USB cable with USB mini-connector at one end. An additional 25-pin male to 9-pin female adapter is required to mate the EVAL-ADF4XXXZ-USB board to the 9-pin D-Sub connector on the ADRF6601 evaluation board. Additional configuration options for the evaluation board are described in Table 10. EVALUATION BOARD CONTROL SOFTWARE 08546-025 Software to program the ADRF6601 is available for download from the ADRF6601 product page at www.analog.com. To install the software, download and extract the zip file. Then run the following installation file: Figure 22. Control Software Opening Menu ADRF6x0x_3p0p0_XP_install.exe The evaluation board can be connected to the PC using a PC parallel port or a USB port. These options are selectable from the opening menu of the software interface (see Figure 22). The evaluation board is shipped with a 25-pin parallel port cable for connection to the PC parallel port. Figure 23 shows the main window of the control software with the default settings displayed. Rev. 0 | Page 18 of 24 08546-026 ADRF6601 Figure 23. Main Window of the ADRF6601 Evaluation Board Software Rev. 0 | Page 19 of 24 3P3V_LDO AG N D REFIN OSC_3P3V AG ND R70 49.9 AG ND 1 1000PF C31 10PF C3 22000PF C4 0 R15 AG ND AG N D AG ND 100PF 0.1UF OSC_3P3V C12 C11 0 R8 10UF 1 3P3V1 AG ND 100PF 0.1UF AG ND C10 C9 0 R7 C41 VCC 1 R37 AGN D 0 DNI R49 2P5V_LDO REFOUT R11 VCO_LDO 22PF C14 DNI 0 R16 AGN D 1 AG ND 0.1UF C2 VCO_LDO R10 0 R1 2.7NF C15 C42 10UF AG N D 10K P1-1 10UF C43 VCC R71 3K TBD VCC4 0 R12 1 C18 100PF AG N D C19 0.1UF AG ND 0 AG N D AG ND R17 100PF 0.1UF 0 R18 C16 AG N D 10K C17 VCC2 1 2P5V AG ND AG N D 100PF C1 6.8PF C13 0 R65 AG ND 22PF C40 DNI R2 AMP745781-4 9 8 7 6 5 4 3 2 1 P1 1K DNI CLK DNI 1 R72 R62 9 8 7 6 5 4 P1-6 R36 R57 R30 0 0 0 11 1 R51 DIG_GND 0 R19 1K DNI R52 1K DNI AGN D 100PF DNI C32 VCC2 DECL2P5 MUXOUT GND REF_IN RSET GND CP DECL3P3 2 3 VCC1 10 P1-1 R50 0 0 1 40 DECLVCO GND 39 12 38 37 1 Z1 AGN D R53 10K 15 35 AGN D 1 17 R54 10K 1 VCC VCC5 16 34 AGN D AGN D 3 1 LO_EXTERN P3-T7 P3-T7 33 R56 10K P3-T7 P4-T7 3 LE 14 36 VCC S2 AGN D 100PF DNI C34 AGN D 100PF DNI C33 DATA 13 1 VCC1 R55 10K C5 1NF C6 1NF 3 R9 VTUNE DATA 2 R38 1 AGN D VCC_LO R63 100K LE R33 NC 18 IFP CP 1 Y1 R14 AG ND PLL_EN P1-T7 32 5 5A 4 4A 2 2A 3 3A 21 22 23 AGN D AG ND C20 0.1UF 1 VCC_LO1 C21 0 R24 VCC_LO TBD VCC_RF R25 AGN D VCC_BB1 VCC_BB AGN D C25 1 VCC_RF 0.1UF 0 R26 VCC_BB IP3SET OUTPUT_EN VCC_LO C24 AGN D 0.1UF C27 AGN D 0 100PF TBD R27 R29 LO R31 DNI R58 VCC VCC AGN D TBD L2 TBD AGN D C23 0.1UF L1 0 C22 100PF 1 DNI C36 DNI C35 0 R48 0 R47 0 AGN D 1 R60 VCC_LO IP3SET 0 R69 VCC_BB R28 100PF AGN D IP3SET AGN D 0.1UF C7 1 VCC_LO P1-T7 AG N D 0 24 AG N D 0 R6 4 2 5 P4-T7 P4-T7 AGN D R32 25 26 27 28 29 30 E-PAD PAD GND VCC_MIX GND GND GND RF IN VCC_V2I GND IP3SET GND AG N D AG N D 100PF C8 NC 6A 1A T8 6 20 OUTPUT_EN 19 31 GND GND 0 NC IFN T7 10UF AGN D AG ND C28 IFN IFP 0 R67 0 DNI R68 VCC_RF AG N D VCC 1 AG ND RFIN SNS SNS1 VCC_SENSE VCC AGND AGND 3P3V_LDO 2P5V_LDO LO_EXTERN VCO_LDO VCC_SENSE T3 AG ND OUT 1 1 AGN D GND1 GND C29 DNI R44 AG N D 0.1UF VCC 0 R59 J1 1 J1 2 J1 3 J1 4 J1 5 J1 6 J1 7 J1 8 J1 9 J1 10 1 GND2 TC4-1W VCC R66 1 R43 VTUNE CLK 1 2 S1 LODRV_EN GND 4 1 P1-6 LOP R35 LON 0 VCC_LO 0 GND R20 Rev. 0 | Page 20 of 24 0 Figure 24. Evaluation Board Schematic R34 6 3 P1-T7 AGND ADRF6601 SCHEMATICS AND ARTWORK 2 08546-023 0 0 0 Figure 25. Evaluation Board Layout (Bottom) 08546-012 08546-013 ADRF6601 Figure 26. Evaluation Board Layout (Top) Rev. 0 | Page 21 of 24 ADRF6601 EVALUATION BOARD CONFIGURATION OPTIONS Table 10. Component S1, R55, R56, R33 Description LO select. Switch and resistors to ground the LODRV_EN pin. The LODRV_EN pin setting, in combination with internal register settings, determines whether the LOP and LON pins function as inputs or outputs (see the LO Selection Logic section for more information). LO IN/OUT SMA connector REFIN SMA connector REFOUT SMA connector LO input/output. An external 1× LO or 2× LO frequency can be applied to this single-ended input connector. Reference input. The input reference frequency for the PLL is applied to this connector. Input impedance is 50 Ω. Multiplexer output. The REFOUT connector connects directly to the MUXOUT pin. The on-board multiplexer can be programmed to bring out the following signals: REF_IN, 2 × REF_IN, 0.5 × REF_IN, 0.25 × REF_IN. Temperature sensor output voltage. Lock detect indicator. Charge pump test point. The unfiltered charge pump signal can be probed at this test point. Note that the CP pin should not be probed during critical measurements such as phase noise. Loop filter. Loop filter components. CP test point R37, C14, R9, R10, C15, C13, R65, C40 R11, R12 R62, R63, VTUNE SMA connector R2 RFIN SMA connector T3 Loop filter return. When the internal VCO is used, the loop filter components should be returned to Pin 40 (DECLVCO) by installing a 0 Ω resistor in R12. When an external VCO is used, the loop filter components can be returned to ground by installing a 0 Ω resistor in R11. Internal vs. external VCO. When the internal VCO is enabled, the loop filter components are connected directly to the VTUNE pin (Pin 39) by installing a 0 Ω resistor in R62. To use an external VCO, R62 should be left open. A 0 Ω resistor should be installed in R63, and the voltage input of the VCO should be connected to the VTUNE SMA connector. The output of the VCO is brought back into the PLL via the LO IN/OUT SMA connector. RSET pin. This pin is unused and should be left open. RF input. The RF input signal should be applied to the RFIN SMA connector. The RF input of the ADRF6601 is ac-coupled; therefore, no bias is necessary. IF output. The differential IF output signals from the ADRF6601 (IFP and IFN) are converted to a single-ended signal by T3. Rev. 0 | Page 22 of 24 Default Condition/ Option Settings S1 = R55 = open (not installed) R56 = R33 = 0 Ω LODRV_EN = 0 V LO input Lock detect R12 = 0 Ω (0402) R11 = open (0402) R62 = 0 Ω (0402) R63 = open (0402) R2 = open (0402) ADRF6601 OUTLINE DIMENSIONS 6.00 BSC SQ 0.60 MAX 0.60 MAX TOP VIEW 0.50 BSC 5.75 BSC SQ 0.50 0.40 0.30 12° MAX 0.80 MAX 0.65 TYP 0.30 0.23 0.18 1 4.25 4.10 SQ 3.95 EXPOSED PAD (BOT TOM VIEW) 21 20 11 10 0.25 MIN 4.50 REF 0.05 MAX 0.02 NOM SEATING PLANE 40 0.20 REF COPLANARITY 0.08 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2 072108-A PIN 1 INDICATOR 1.00 0.85 0.80 PIN 1 INDICATOR 31 30 Figure 27. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 6 mm × 6 mm Body, Very Thin Quad (CP-40-1) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADRF6601ACPZ-R7 ADRF6601-EVALZ 1 Temperature Range −40°C to +85°C Package Description 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board Z = RoHS Compliant Part. Rev. 0 | Page 23 of 24 Package Option CP-40-1 ADRF6601 NOTES ©2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08546-0-4/10(0) Rev. 0 | Page 24 of 24