CED85A3/CEU85A3 N-Channel Enhancement Mode Field Effect Transistor FEATURES 25V, 80A, RDS(ON) = 6mΩ @VGS = 10V. RDS(ON) = 9mΩ @VGS = 4.5V. Super high dense cell design for extremely low RDS(ON). High power and current handing capability. D Lead free product is acquired. TO-251 & TO-252 package. G D G S CEU SERIES TO-252(D-PAK) ABSOLUTE MAXIMUM RATINGS Parameter G D S CED SERIES TO-251(I-PAK) Tc = 25 C unless otherwise noted Symbol Limit 25 Units V VGS ±20 V ID 80 A IDM 320 A 70 W Drain-Source Voltage VDS Gate-Source Voltage Drain Current-Continuous Drain Current-Pulsed S a Maximum Power Dissipation @ TC = 25 C PD - Derate above 25 C 0.56 W/ C Single Pulsed Avalanche Energy d EAS 75 mJ Single Pulsed Avalanche Current d IAS 12.3 A TJ,Tstg -55 to 150 C Symbol Limit Units Thermal Resistance, Junction-to-Case RθJC 1.8 C/W Thermal Resistance, Junction-to-Ambient RθJA 50 C/W Operating and Store Temperature Range Thermal Characteristics Parameter Rev 3. 2008.Jan. http://www.cetsemi.com Details are subject to change without notice . 1 CED85A3/CEU85A3 Electrical Characteristics Parameter Tc = 25 C unless otherwise noted Symbol Test Condition Min Drain-Source Breakdown Voltage BVDSS VGS = 0V, ID = 250µA 25 Zero Gate Voltage Drain Current IDSS Gate Body Leakage Current, Forward Gate Body Leakage Current, Reverse Typ Max Units VDS = 25V, VGS = 0V 1 µA IGSSF VGS = 20V, VDS = 0V 100 nA IGSSR VGS = -20V, VDS = 0V -100 nA Off Characteristics V On Characteristics b Gate Threshold Voltage Static Drain-Source On-Resistance Dynamic Characteristics c VGS(th) RDS(on) Input Capacitance Ciss Output Capacitance Coss Reverse Transfer Capacitance Crss VGS = VDS, ID = 250µA 3 V VGS = 10V, ID = 30A 5.0 6.0 mΩ VGS = 4.5V, ID = 30A 7.5 9.0 mΩ VDS = 15V, VGS = 0V, f = 1.0 MHz 1 2325 pF 330 pF 175 pF Switching Characteristics c Turn-On Delay Time td(on) Turn-On Rise Time tr Turn-Off Delay Time td(off) VDD = 15V, ID = 1A, VGS = 10V, RGEN = 6Ω 15 30 ns 4 10 ns ns 45 90 Turn-Off Fall Time tf 8 20 ns Total Gate Charge Qg 17 22 nC Gate-Source Charge Qgs Gate-Drain Charge Qgd VDS = 15V, ID = 16A, VGS = 5V 6 nC 5 nC Drain-Source Diode Characteristics and Maximun Ratings Drain-Source Diode Forward Current IS Drain-Source Diode Forward Voltage b VSD VGS = 0V, IS = 20A Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%. c.Guaranteed by design, not subject to production testing. d.L = 1mH, IAS = 12.3, VDD = 50V, RG = 25Ω, Starting TJ = 25 C 2 0.82 80 A 1.2 V 6 CED85A3/CEU85A3 100 100 80 ID, Drain Current (A) ID, Drain Current (A) VGS=10,8,6,4V 60 VGS=3V 40 20 80 60 40 25 C 20 TJ=125 C 0 0 1 2 3 4 0 RDS(ON), Normalized RDS(ON), On-Resistance(Ohms) C, Capacitance (pF) 1500 1000 Coss 500 Crss 0 5 10 15 20 25 5 2.2 1.9 ID=30A VGS=10V 1.6 1.3 1.0 0.7 0.4 -100 -50 0 50 100 150 200 VDS, Drain-to-Source Voltage (V) TJ, Junction Temperature( C) Figure 3. Capacitance Figure 4. On-Resistance Variation with Temperature VDS=VGS IS, Source-drain current (A) VTH, Normalized Gate-Source Threshold Voltage 4 Figure 2. Transfer Characteristics Ciss ID=250µA 1.1 1.0 0.9 0.8 0.7 0.6 -50 3 Figure 1. Output Characteristics 2000 1.2 2 VGS, Gate-to-Source Voltage (V) 2500 1.3 1 VDS, Drain-to-Source Voltage (V) 3000 0 -55 C 0 VGS=0V 10 10 10 -25 0 25 50 75 100 125 2 1 0 0.4 150 0.6 0.8 1.0 1.2 1.4 TJ, Junction Temperature( C) VSD, Body Diode Forward Voltage (V) Figure 5. Gate Threshold Variation with Temperature Figure 6. Body Diode Forward Voltage Variation with Source Current 3 10 10 VDS=15V ID=16A 6 4 2 0 0 3 RDS(ON)Limit 8 ID, Drain Current (A) VGS, Gate to Source Voltage (V) CED85A3/CEU85A3 6 12 18 24 10 1ms 10ms 10 10 30 100µs 2 DC 1 6 TC=25 C TJ=150 C Single Pulse 0 10 -1 10 0 10 1 10 Qg, Total Gate Charge (nC) VDS, Drain-Source Voltage (V) Figure 7. Gate Charge Figure 8. Maximum Safe Operating Area VDD t on RL V IN D td(off) tf 90% 90% VOUT VOUT VGS RGEN toff tr td(on) 10% INVERTED 10% G 90% S VIN 50% 50% 10% PULSE WIDTH Figure 10. Switching Waveforms r(t),Normalized Effective Transient Thermal Impedance Figure 9. Switching Test Circuit 10 0 D=0.5 0.2 10 -1 PDM 0.1 t1 0.05 t2 0.02 0.01 Single Pulse 10 1. RθJC (t)=r (t) * RθJC 2. RθJC=See Datasheet 3. TJM-TC = P* RθJC (t) 4. Duty Cycle, D=t1/t2 -2 10 -5 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (sec) Figure 11. Normalized Thermal Transient Impedance Curve 4 10 0 10 1 2