PANASONIC CNZ1105

Transmissive Photosensors (Photo lnterrupters)
CNZ1105 (ON1105)
Unit: mm
Photo Interrupter
14.3±0.3
Mark for Indicating
LED side
2.5±0.2
7.0 min.
CNZ1105 is a photocoupler in which a high efficiency GaAs
infrared light emitting diode is used as the light emitting element,
and a high sensitivity phototransistor is used as the light detecting
element. The two elements are arranged so as to face each other,
and objects passing between them are detected.
3.0±0.3
10.0±0.2
■ Overview
4-0.45±0.2
(3)
Rating
Unit
VR
3
V
emitting diode) Forward current
IF
50
mA
PD
75
mW
Output (Photo Collector-emitter voltage
(Base open)
transistor)
VCEO
30
V
Emitter-collector voltage
(Base open)
VECO
5
V
Input (Light
Power dissipation *1
Temperature
Collector current
IC
20
mA
Collector power dissipation *2
PC
100
mW
Operating ambient temperature
T opr
−25 to +85
°C
Storage temperature
Tstg
−30 to +100
°C
(4)
19.0±0.2
(1)
25.0±0.35
1: Anode
2: Cathode
3: Collector
4: Emitter
PISTR104-007 Package
■ Absolute Maximum Ratings Ta = 25°C
Symbol
2-φ3.2±0.2
6.2±0.2
• Highly precise position detection: 0.3 mm
• Fast response tr , tf = 6 µs (typ.)
• Small output current variation against change in temperature
Reverse voltage
(2.54)
(10.0)
(2)
■ Features
Parameter
0.5±0.1
3.0±0.2
3.0±0.2
For contactless SW, object detection
Internal Connection
2
3
1
4
Note) *1: Input power derating ratio is 1.0 mW/°C at
Ta ≥ 25°C.
*2: Output power derating ratio is 1.34 mW/°C
at Ta ≥ 25°C.
■ Electrical-Optical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Forward voltage
VF
IF = 50 mA
characteristics Reverse current
IR
VR = 3 V
Ct
VR = 0 V, f = 1 MHz
Input
Terminal capacitance
Output
Collector-emitter cutoff current
characteristics (Base open)
Transfer
ICEO
CC
VCE = 0 V, f = 1 MHz
Collector current
IC
VCE = 10 V, IF = 20 mA
Rise time
*
Fall time *
Note) 1. Input and output are practiced
by electricity.
2. This device is designed be disregarded radiation.
tr
Typ
Max
1.2
1.5
V
10
µA
200
nA
50
5
pF
0.3
mA
IF = 50 mA, IC = 0.1 mA
0.3
VCC = 10 V, IC = 1 mA, RL = 100 Ω
tf
Unit
pF
VCE = 10 V
Collector-emitter capacitance
characteristics Collector-emitter saturation voltage VCE(sat)
Min
V
6.0
µs
6.0
µs
3. *: Switching time measurement circuit
Sig. in
VCC
(Input pulse)
Sig. out
50 Ω
RL
(Output pulse)
90%
10%
td
tr
td: Delay time
tr: Rise time
tf: Fall time
tf
Note) The part number in the parenthesis shows conventional part number.
Publication date: April 2004
SHG00028BED
1
CNZ1105
IF , I C  T a
IF  V F
60
IF
30
IC
40
30
20
20
40
60
80
0
100
0
0.4
VF  T a
1.6
0.4
0
40
2.0
10−2
∆IC  Ta
1
10−1
1
120
80
40
Collector-emitter voltage VCE (V)
0
tr  IC
Rise time tr (µs)
RL = 1 kΩ
500 Ω
100 Ω
1
10−3
80
Ambient temperature Ta (°C )
10−1
10−2
100
VCC = 10V
Ta = 25°C
10
10−1
1
Collector current IC (mA)
SHG00028BED
80
∆IC  d
10 2
10 V
40
Ambient temperature Ta (°C )
1
40
VCE = 10 V
IF = 20 mA
0
−40
10 2
10
10 3
10−1
10 2
10
160
10
ICEO  Ta
0
1
Forward current IF (mA)
VCC = 5 V
Ta = 25°C
10−2
10−1
80
10
VCE = 24 V
10−3
10−1
2.4
Relative collector current ∆IC (%)
10 mA
Collector current IC (mA)
Forward voltage VF (V)
IF = 50 mA
0.8
10−4
−40
10−1
IC  VCE
Ambient temperature Ta (°C )
Collector-emitter cutoff current (Base open) ICEO (µA)
1.2
10 2
1.2
10−2
1
Forward voltage VF (V)
1.6
2
0.8
Relative collector current ∆IC (%)
0
Ambient temperature Ta (°C )
0
−40
VCE = 10 V
Ta = 25°C
10
10
0
−25
Ta = 25°C
50
40
20
IC  I F
10
Collector current IC (mA)
50
Forward current IF (mA)
Forward current IF , Collector current IC (mA)
60
10
Criterion
0
d
80
60
40
20
0
0
1
2
3
4
Distance d (mm)
5
6
Caution for Safety
■ This product contains Gallium Arsenide (GaAs).
DANGER
GaAs powder and vapor are hazardous to human health if inhaled or
ingested. Do not burn, destroy, cut, cleave off, or chemically dissolve the product. Follow related laws and ordinances for disposal.
The product should be excluded form general industrial waste or
household garbage.
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP