TEMIC DG213

DG213
Quad Complementary CMOS Analog Switch
Features
Benefits
Applications
22-V Supply Voltage Rating
TTL and CMOS Compatible Logic
Low On-Resistance—rDS(on): 45 Low Leakage—ID(on): 20 pA
Single Supply Operation Possible
Extended Temperature Range
Fast Switching—tON: 85 ns
Low Charge Injection—Q: 1 pC
Wide Analog Signal Range
Simple Logic Interface
Higher Accuracy
Minimum Transients
Reduced Power Consumption
Low Cost
Industrial Instrumentation
Test Equipment
Communications Systems
Computer Peripherals
Portable Instruments
Sample-and-Hold Circuits
Description
The versatile DG213 analog switch has two NC and two NO
switches. It can be used in various configurations, including
four single-pole single-throw (SPST), two single-pole
double-throw (SPDT), one “T” switch, one DPDT, etc. This
device is fabricated in a Siliconix’ proprietary high-voltage
silicon gate CMOS process, resulting in lower on-resistance,
lower leakage, higher speed, and lower power consumption.
This analog switch was designed for a wide variety of
general purpose applications in telecommunications,
instrumentation, process control, computer peripherals, etc.
An improved charge injection compensation design
minimizes switching transients. These switches can
handle up to 22 V, and have an improved continuous
current rating of 30 mA. An epitaxial layer prevents
latchup.
All switches feature true bi-directional performance in
the on condition, and will block signals to the supply
levels in the off condition.
For additional information, please refer to Application
Note AN208.
Functional Block Diagram and Pin Configuration
IN1
16
1
0
OFF
ON
1
ON
OFF
IN2
D1
2
15
D2
S1
3
14
S2
V–
4
13
V+
GND
5
12
VL
S4
6
11
S3
D4
7
10
D3
IN4
8
9
IN3
Logic “0” 0.8 V
Logic “1” 2.4 V
Ordering Information
Temp Range
–40 to 85C
Package
Part Number
16-Pin Plastic DIP
DG213DJ
16-Pin Narrow SOIC
DG213DY
16-Pin TSSOP
DG213DQ
Top View
Updates to this data sheet may be obtained via facsimile by calling Siliconix FaxBack, 1-408-970-5600. Please request FaxBack document #70662.
Applications information may also be obtained via FaxBack, request document #70606.
Siliconix
S-56461—Rev. C, 29-Dec-97
1
DG213
Absolute Maximum Ratings
Voltages Referenced to V–
V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 V
GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V
Digital Inputsa VS, VD . . . . . . . . . . . . . . . . . . (V–) –2 V to (V+) +2 V
or 30 mA, whichever occurs first
Current, Any Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% duty cycle max) . . . . . . . . . . . . . . . . . . . 100 mA
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . –65 to 125C
Power Dissipation (Package)b
16-Pin Plastic DIPc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 470 mW
16-Pin Narrow SOICd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640 mW
16-Pin TSSOPd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
Notes:
a. Signals on SX, DX, or INX exceeding V+ or V– will be clamped
by internal diodes. Limit forward diode current to maximum
current ratings.
b. All leads welded or soldered to PC Board.
c. Derate 6.5 mW/C above 75C
d. Derate 7.6 mW/C above 75C
Specifications
Test Conditions
Unless Otherwise Specified
Parameter
Symbol
V = 15 V,
V+
V V–
V = –15
15 V
VL = 5 V, VIN = 2.4 V, 0.8 Ve
D Suffix
–40 to 85C
Tempa
Minc
Full
V–
Typb
Maxc
Unit
V+
V
Analog Switch
Analog Signal Ranged
Drain-Source On-Resistance
rDS(on) Match
VANALOG
rDS(on)
VD = 10 V,, IS = 1 mA
DrDS(on)
Room
Full
45
60
85
Room
1
2
Source Off Leakage Current
IS(off)
VS = 14 V, VD = 14 V
Room
Full
–0.5
–5
0.01
0.5
5
Drain Off Leakage Current
ID(off)
VD = 14 V, VS = 14 V
Room
Full
–0.5
–5
0.01
0.5
5
Drain On Leakage Current
ID(on)
VS = VD = 14 V
Room
Full
–0.5
–10
0.02
0.5
10
2.4
W
nA
Digital Control
Input Voltage High
VINH
Full
Input Voltage Low
VINL
Full
Input Current
Input Capacitance
IINH or IINL
VINH or VINL
CIN
Full
0.8
–1
1
Room
5
VS = 2 V
See Fi
Figure 2
S
Room
85
130
Room
55
100
V
mA
pF
Dynamic Characteristics
Turn-On Time
tON
Turn-Off Time
tOFF
Break-Before-Make Time Delay
tD
VS = 10 V, See Figure 3
Room
Charge Injection
Q
CL = 1000 pF, Vg= 0 V, Rg = 0 W
Room
1
Room
5
Room
5
VD = VS = 0 V, f = 1 MHz
Room
16
CL = 15 pF,
p , RL = 50 W
VS = 1 VRMS, f = 100 kHz
kH
Room
90
Room
95
Source-Off Capacitance
CS(off)
Drain-Off Capacitance
CD(off)
Channel On Capacitance
CD(on)
Off Isolation
OIRR
Channel-to-Channel Crosstalk
XTALK
2
VS = 0 V
V, f = 1 MHz
20
ns
25
pC
pF
dB
Siliconix
S-56461—Rev. C, 29-Dec-97
DG213
Specifications
Test Conditions
Unless Otherwise Specified
Parameter
Symbol
V = 15 V,
V V–
V = –15
15 V
V+
VL = 5 V, VIN = 2.4 V, 0.8 Ve
D Suffix
–40 to 85C
Tempa
Minc
Typb
Maxc
Unit
Power Supply
Room
Full
Positive Supply Current
I+
Negative Supply Current
I–
Room
Full
Logic Supply Current
IL
Room
Full
VOP
Full
VIN = 0 or 5 V
Power Supply Range for
Continuous Operation
1
5
–1
–5
mA
1
5
3
22
V
Maxc
Unit
V+
V
W
Specifications for Unipolar Supply
Test Conditions
Unless Otherwise Specified
Parameter
Symbol
V = 12 V,
V+
V V–
V =0V
VL = 5 V, VIN = 2.4 V, 0.8 Ve
D Suffix
–40 to 85C
Tempa
Minc
Full
V–
Typb
Analog Switch
Analog Signal Ranged
VANALOG
Drain-Source On-Resistance
Room
Full
90
110
140
VS = 8 V
See Fi
S
Figure 2
Room
125
200
Room
45
100
rDS(on)
VD = 3 V, 8 V, IS = 1 mA
Turn-On Time
tON
Turn-Off Time
tOFF
Dynamic Characteristics
Break-Before-Make Time Delay
tD
DG213 Only, See Figure 3
Room
Charge Injection
Q
CL = 1 nF, Vgen= 6 V, Rgen = 0 W
Room
50
ns
80
4
pC
Power Supply
Room
Full
Positive Supply Current
I+
Negative Supply Current
I–
Room
Full
Logic Supply Current
IL
Room
Full
VOP
Full
VIN = 0 or 5 V
Power Supply Range for
Continuous Operation
1
5
–1
–5
mA
1
5
3
V
Notes:
a. Room = 25C, Full = as determined by the operating temperature suffix.
b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
c. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
d. Guaranteed by design, not subject to production test.
e. VIN = input voltage to perform proper function.
Siliconix
S-56461—Rev. C, 29-Dec-97
3
DG213
Typical Characteristics
rDS(on) vs. VD and Power Supply Voltages
rDS(on) vs. VD and Temperature
100
rDS(on) – Drain-Source On-Resistance ( )
rDS(on) – Drain-Source On-Resistance ( )
110
100
90
5 V
80
70
10 V
60
15 V
50
40
20 V
30
20
–4
0
4
8
12
16
80
70
60
125C
50
85C
40
25C
30
–55C
20
10
0
–15
10
–20 –16 –12 –8
V+ = 15 V
V– = –15 V
90
20
–10
250
10 V
12 V
20
ID(on)
10
IS(off), ID(off)
0
–10
–20
50
–30
0
0
2
4
6
8
10
–40
–20
12
–15
VD – Drain Voltage (V)
–10
–5
0
5
10
15
20
VANALOG – Analog Voltage (V)
Leakage Current vs. Temperature
30
1 nA
V+ = 15 V
V– = –15 V
VS, VD = 14 V
QS, QD – Charge Injection vs. Analog Voltage
20
Q – Charge (pC)
I S, I D – Current
15
V+ = 22 V
V– = –22 V
TA = 25C
30
7V
100
10
Leakage Currents vs. Analog Voltage
V– = 0 V
VL = 5 V
200
150
5
40
I S, I D – Current (pA)
rDS(on) – Drain-Source On-Resistance ( )
rDS(on) vs. VD and Single Power Supply Voltages
5V
0
VD – Drain Voltage (V)
VD – Drain Voltage (V)
300
–5
100 pA
IS(off), ID(off)
10 pA
10
0
V+ = 15 V
V– = –15 V
V+ = 12 V
V– = 0 V
–10
–20
1 pA
–55 –35
–15
5
25
45
65
Temperature (C)
4
85
105 125
–30
–15
–10
–5
0
5
10
15
VANALOG – Analog Voltage (V)
Siliconix
S-56461—Rev. C, 29-Dec-97
DG213
Typical Characteristics (Cont’d)
Off Isolation vs. Frequency
120
V+ = +15 V
V– = –15 V
110
OIRR (dB)
100
90
RL = 50 80
70
60
50
40
10 k
100 k
1M
10 M
f – Frequency (Hz)
Schematic Diagram (Typical Channel)
V+
SX
VL
Level
Shift/
Drive
V–
V+
INX
DX
GND
V–
Figure 1.
Test Circuits
+15 V
V+
VS = +2 V
S
D
VO
Logic
Input
3V
tr <20 ns
tf <20 ns
50%
0V
tOFF
IN
3V
GND
V–
RL
300 k
CL
35 pF
90%
Switch
Output
–15 V
VO = VS
RL
VO
tON
RL + rDS(on)
Figure 2. Switching Time
Siliconix
S-56461—Rev. C, 29-Dec-97
5
DG213
Test Circuits (Cont’d)
+5 V
+15 V
3V
Logic
Input
VL
V+
D1
S1
VS1
IN1
S2
VS2
50%
0V
VS1
VO1
VO1
VO2
D2
Switch
Output
IN2
RL1
1 kW
GND
V–
RL2
300 kW
0V
VS2
VO2
CL1
35 pF
CL2
35 pF
90%
90%
0V
Switch
Output
tD
tD
–15 V
CL (includes fixture and stray capacitance)
Figure 3. Break-Before-Make
C
+15 V
+15 V
C
V+
S1
VS
V+
S
VS
VO
D
D1
Rg = 50 W
50 W
IN1
Rg = 50 W
0V, 2.4 V
RL
IN
0V, 2.4 V
S2
NC
GND
V–
C
RL
IN2
0V, 2.4 V
GND
Off Isolation = 20 log
XTALK Isolation = 20 log
VO
Figure 4. Off Isolation
DVO
VO
D
IN
Vg
3V
GND
–15 V
Figure 5. Channel-to-Channel Crosstalk
V+
S
C
VS
VO
+15 V
Rg
V–
C = RF bypass
–15 V
VS
VO
D2
V–
–15 V
VO
CL
1000 pF
INX
ON
OFF
ON
DVO = measured voltage error due to charge injection
The charge injection in coulombs is Q = CL x DVO
Figure 6. Charge Injection
6
Siliconix
S-56461—Rev. C, 29-Dec-97
DG213
Applications
+15 V
+5 V
–15 V
VIN1
VOUT
VIN2
CMOS Logic
Input Select
High = VIN1
Low = VIN2
–15 V
CMOS Logic
Gain Select
High = 10x
Low = 1 x
1x
10x
DG213
GND
20 k
180 k
–15 V
Figure 7. Low Power Non-Inverting Amplifier with Digitally Selectable Inputs and Gain
Siliconix
S-56461—Rev. C, 29-Dec-97
7