FAIRCHILD FCD380N60E

FCD380N60E
N-Channel SuperFET® II MOSFET
600 V, 10.2 A, 380 mΩ
Description
Features
®
®
SuperFET II MOSFET is Fairchild Semiconductor ’s first generation of high voltage super-junction (SJ) MOSFET family that is
utilizing charge balance technology for outstanding low on-resistance and lower gate charge performance.This advanced technology is tailored to minimize conduction loss, provide superior
switching performance, and withstand extreme dv/dt rate and
higher avalanche energy. Consequently, SuperFETII MOSFET is
suitable for various AC/DC power conversion for system miniaturization and higher efficiency.
• 650 V @TJ = 150°C
• Max. RDS(on) = 380 mΩ
• Ultra Low Gate Charge (Typ. Qg = 34 nC)
• Low Effective Output Capacitance (Typ. Coss.eff = 97 pF)
• 100% Avalanche Tested
D
D
G
G
S
D-PAK
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted
Symbol
VDSS
Drain to Source Voltage
Parameter
VGSS
Gate to Source Voltage
- DC
- AC
(f > 1 Hz)
FCD380N60E
600
Unit
V
±20
V
±30
V
-Continuous (TC = 25oC)
10.2
6.4
ID
Drain Current
-Continuous (TC = 100oC)
- Pulsed
A
IDM
Drain Current
EAS
Single Pulsed Avalanche Energy
IAR
Avalanche Current
(Note 1)
2.3
A
EAR
Repetitive Avalanche Energy
(Note 1)
1.06
mJ
Peak Diode Recovery dv/dt
(Note 3)
dv/dt
MOSFET dv/dt
30.6
A
(Note 2)
211.6
mJ
20
V/ns
100
(TC = 25oC)
106
W
- Derate above 25oC
0.85
W/oC
PD
Power Dissipation
TJ, TSTG
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
TL
(Note 1)
-55 to +150
o
C
300
o
C
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
FCD380N60E
RθJC
Thermal Resistance, Junction to Case
1.18
RθJA
Thermal Resistance, Junction to Ambient
100
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
1
Unit
oC/W
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
March 2013
Device Marking
FCD380N60E
Device
FCD380N60E
Package
D-PAK
Reel Size
380 mm
Tape Width
16 mm
Quantity
2500
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
VGS = 0 V, ID = 10 mA, TJ = 25°C
600
-
-
V
VGS = 0 V, ID = 10 mA, TJ = 150°C
650
-
-
V
-
0.67
-
V/oC
-
700
-
V
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ΔBVDSS
ΔTJ
BVDS
Breakdown Voltage Temperature
Coefficient
Drain-Source Avalanche Breakdown
Voltage
IDSS
Zero Gate Voltage Drain Current
VDS = 480 V, VGS = 0 V
-
-
5
VDS = 480 V, TC = 125oC
-
-
20
IGSS
Gate to Body Leakage Current
VGS = ±20 V, VDS = 0 V
-
-
±100
2.5
-
3.5
V
-
0.32
0.38
Ω
-
10
-
S
ID = 10 mA, Referenced to
25oC
VGS = 0 V, ID = 10 A
μA
nA
On Characteristics
VGS(th)
RDS(on)
Gate Threshold Voltage
VGS = VDS, ID = 250 μA
Static Drain to Source On Resistance
gFS
Forward Transconductance
VGS = 10 V, ID = 5 A
VDS = 20 V, ID = 5 A
Dynamic Characteristics
-
1330
1770
pF
-
945
1260
pF
-
60
90
pF
-
25
-
pF
VDS = 0 V to 480 V, VGS = 0 V
-
97
-
pF
-
34
45
nC
VDS = 380 V, ID = 5 A
VGS = 10 V
-
5.3
-
nC
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Coss
Output Capacitance
VDS = 380 V, VGS = 0V, f = 1.0 MHz
Coss eff.
Effective Output Capacitance
Qg(tot)
Total Gate Charge at 10V
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller” Charge
ESR
Equivalent Series Resistance
VDS = 25 V, VGS = 0 V
f = 1 MHz
(Note 4)
Drain open
-
13
-
nC
-
6
-
Ω
-
17
44
ns
-
9
28
ns
-
64
138
ns
-
10
30
ns
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
VDD = 380 V, ID = 5 A
VGS = 10 V, RG = 4.7 Ω
(Note 4)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
10.2
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
30.6
A
VSD
Drain to Source Diode Forward Voltage
VGS = 0V, ISD = 5 A
-
-
1.2
V
trr
Reverse Recovery Time
240
-
ns
Qrr
Reverse Recovery Charge
VGS = 0V, ISD = 5 A
dIF/dt = 100 A/μs
-
3
-
μC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. IAS = 2.3 A, VDD = 50 V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 5.1 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Essentially Independent of Operating Temperature Typical Characteristics
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
2
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
Package Marking and Ordering Information
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
100
VGS = 15.0V
10.0V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
10
ID, Drain Current[A]
ID, Drain Current[A]
100
1
10
o
150 C
o
25 C
1
o
-55 C
*Notes:
1. 250μs Pulse Test
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
o
2. TC = 25 C
0.1
0.1
1
VDS, Drain-Source Voltage[V]
10
0.1
20
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
4
6
8
VGS, Gate-Source Voltage[V]
100
IS, Reverse Drain Current [A]
0.7
0.6
0.5
VGS = 10V
0.4
VGS = 20V
0.3
o
150 C
10
o
25 C
*Notes:
1. VGS = 0V
o
0.2
*Note: TC = 25 C
0
5
10
15
20
ID, Drain Current [A]
25
1
0.2
30
Figure 5. Capacitance Characteristics
2. 250μs Pulse Test
0.4
0.6
0.8
1.0
1.2
1.4
VSD, Body Diode Forward Voltage [V]
1.6
Figure 6. Gate Charge Characteristics
10
VGS, Gate-Source Voltage [V]
10000
Ciss
1000
Capacitances [pF]
10
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
0.8
RDS(ON) [Ω],
Drain-Source On-Resistance
2
100
Coss
*Note:
1. VGS = 0V
2. f = 1MHz
10
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
1
0.5
0.1
6
4
2
Crss
*Note: ID = 5A
0
1
10
100
VDS, Drain-Source Voltage [V]
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
VDS = 120V
VDS = 300V
VDS = 480V
8
600
3
0
5
10
15
20
25
30
Qg, Total Gate Charge [nC]
35
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
Typical Performance Characteristics
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
2.8
1.12
RDS(on), [Normalized]
Drain-Source On-Resistance
BVDSS, [Normalized]
Drain-Source Breakdown Voltage
1.16
1.08
1.04
1.00
0.96
*Notes:
1. VGS = 0V
2. ID = 10mA
0.92
0.88
-80
-40
0
40
80
120
o
TJ, Junction Temperature [ C]
1.2
*Notes:
1. VGS = 10V
2. ID = 5A
0.8
-40
0
40
80
120
o
TJ, Junction Temperature [ C]
160
12
10μs
10
100μs
1ms
10
ID, Drain Current [A]
ID, Drain Current [A]
1.6
Figure 10. Maximum Drain Current
100
10ms
1
DC
Operation in This Area
is Limited by R DS(on)
*Notes:
8
6
4
o
1. TC = 25 C
2
o
0.01
0.1
2.0
0.4
-80
160
Figure 9. Maximum Safe Operating Area
vs. Case Temperature
0.1
2.4
2. TJ = 150 C
3. Single Pulse
1
10
100
VDS, Drain-Source Voltage [V]
0
25
1000
50
75
100
125
o
TC, Case Temperature [ C]
150
Figure 11. Eoss vs. Drain to Source Voltage Switching Capability
6
5
EOSS, [μJ]
4
3
2
1
0
0
100
200
300
400
500
VDS, Drain to Source Voltage [V]
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
600
4
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
Typical Performance Characteristics (Continued)
FCD380N60E N-Channel MOSFET
Typical Performance Characteristics (Continued)
Figure 12. Transient Thermal Response Curve
Thermal Response [ZθJC]
2
1
0.5
0.2
PDM
0.1
0.1
0.05
-5
10
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
t1
*Notes:
t2
o
1. ZθJC(t) = 1.18 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.05
0.02
0.01
Single pulse
-4
10
-3
-2
10
10
Rectangular Pulse Duration [sec]
5
-1
10
0
10
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
6
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VDD
VSD
Body Diode
Forward Voltage Drop
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
7
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
Mechanical Dimensions
D-PAK
Dimensions in Millimeters
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
8
www.fairchildsemi.com
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I61
©2012 Fairchild Semiconductor Corporation
FCD380N60E Rev. C1
9
www.fairchildsemi.com
FCD380N60E N-Channel MOSFET
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