NELLSEMI 1T06E-D

RoHS
1T Series RoHS
SEMICONDUCTOR
Standard TRIACs, 1A
FEATURES
On-state RMS current, l T(RMS) =1A
Repetitive peak off-state voltage,
V DRM /V RRM = 600 or 800V
Triggering gate current, l GT (Q1) 3 to 25 mA
APPLICATIONS
The 1T series is suitable for general purpose
AC switching applications. These devices are
typically used in applications such as home
appliances (electrovalve, pump, door lock, small
lamp control), fan speed controllers,...
A2
TO-92
(1TxxE)
A1
G
Different gate current sensitivities are available,
allowing optimized performance when driven
directly through microcontrollers
MAIN FEATURES
SYMBOL
VALUE
UNIT
I T(RMS)
1
A
V DRM /V RRM
600 to 800
V
I GT(Q1)
3 to 25
mA
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RMS on-state current (full sine wave)
Non repetitive surge peak on-state
current (full cycle, T j initial = 25°C)
SYMBOL
IT(RMS)
ITSM
TEST CONDITIONS
TO-92
Tc = 110ºC
F =50 Hz
t = 20 ms
F =60 Hz
t = 16.7 ms
VALUE
UNIT
1
A
16
17.6
I t
2
t p = 10 ms
Critical rate of rise of on-state current
l G = 2xl GT , t r≤100ns
dI/dt
F =100 Hz
Peak gate current
IGM
T p =20 µs
PG(AV)
T j =125ºC
1
Peak gate power dissipation
PGM
T j =125ºC
5
Stroage temperature range
Tstg
- 40 to + 150
Tj
- 40 to + 125
l 2 t Value for fusing
Average gate power dissipation
A
1.28
A2s
T j =125ºC
50
A/µs
T j =125ºC
1
A
W
ºC
Operating junction temperature range
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Page 1 of 5
RoHS
1T Series RoHS
SEMICONDUCTOR
ELECTRICAL CHARACTERISTICS (TJ= 25 ºC unless otherwise specified)
Standard (4 quadrants)
1Txxxx
TEST CONDITIONS
SYMBOL
QUADRANT
I - II - III
IGT(1)
V D = 12 V, R L = 30Ω
IV
VGT
VGD
V D = V DRM , R L = 3.3KΩ, T j = 125°C
IH(2)
I T = 50 mA
IL
I G = 1.2 I GT
dV/dt(2)
(dV/dt)c(2)
MAX.
UNIT
T
D
S
A
3
5
10
25
5
10
10
25
mA
ALL
1.3
V
ALL
0.2
V
MAX.
I - III - IV
II
MAX.
7
10
10
25
7
10
15
25
15
20
25
50
mA
mA
V D = 67% V DRM , gate open, T j = 110°C
MIN.
10
20
50
100
V/µs
(dI/dt)c = 0.44 A/ms, T j = 110°C
MIN.
0.5
1
2
5
V/µs
STATIC CHARACTERISTICS
SYMBOL
TEST CONDITIONS
VALUE
VTM(2)
I TM = 2A, t P = 380 µs
T j = 25°C
MAX.
1.50
VTO(2)
Threshold voltage
T j = 125°C
MAX.
0.95
RD(2)
Dynamic resistance
T j = 125°C
MAX.
400
IDRM
IRRM
VD = VDRM
VR = VRRM
T j = 25°C
UNIT
V
mΩ
5
µA
MAX.
T j = 125°C
500
Note 1: Minimum lGT is guaranted at 5% of lGT max.
Note 2: For both polarities of A2 referenced to A1.
THERMAL RESISTANCE
VALUE
SYMBOL
Rth(j-c)
Junction to case (AC)
Rth(j-a)
Junction to ambient
60
TO-92
TO-92
150
UNIT
°C/W
PRODUCT SELECTOR
VOLTAGE (x x)
PART NUMBER
SENSITIVITY
TYPE
PACKAGE
V
3 mA
Standard
TO-92
V
V
5 mA
Standard
TO-92
V
V
V
10 mA
Standard
TO-92
V
V
V
25 mA
Standard
TO-92
600 V
800 V
1000 V
1TxxE-T
V
V
1TxxE-D
V
1TxxE-S
1TxxE-A
ORDERING INFORMATION
ORDERING TYPE
MARKING
PACKAGE
WEIGHT
BASE Q,TY
DELIVERY MODE
1TxxE-y
1TxxE-y
TO-92
0.2g
500
Bag
Note: xx = voltage, y = sensitivity
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Page 2 of 5
RoHS
1T Series RoHS
SEMICONDUCTOR
ORDERING INFORMATION SCHEME
E -
T 06
1
D
Current
1 = 1A
Triac series
Voltage
06 = 600V
08 = 800V
Package type
E = TO-92
IGT Sensitivity
T = 3mA Standard
D = 5mA Standard
S = 10mA Standard
A = 25mA Standard
Fig.2 On-state RMS current versus lead
(TO-92) or tab (SOT-223, SMBflat-3L)
temperature (full cycle)
Fig.1 Maximum power dissipation versus
on-state RMS current (full cycle)
P (W)
IT(RMS) (A)
1.50
1.2
1.25
1.0
1.00
0.8
0.75
0.6
TO-92
0.4
0.50
180°
I T(RMS) (A)
0.25
α
0.2
T l or T tab (°C)
α
0.00
0.0
0.0
0.1
0.2
0.3
0.5
0.4
0.6
0.7
0.8
0.9
1.0
0
Fig.3 On-state RMS current versus ambient
temperature (free air convection full cycle)
25
75
50
100
125
Fig.4 Relative variation of thermal impedance
versus pulse duration (Z th(j-a) ).
K=[Zth(j-a)/Rth(j-a)]
IT(RMS) (A)
1.2
1.00
1.0
0.8
TO-92
R th(j-a) = 150°C/W
(TO-92)
0.6
0.10
0.4
0.2
0.0
Tamb(°C)
0
25
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50
75
100
125
Page 3 of 5
0.01
1E-3
t P (s)
1E-2
1E-1
1E+0
1E+1
1E+2 1E+3
RoHS
1T Series RoHS
SEMICONDUCTOR
Fig.5 Relative variation of holding current and
latching current versus junction temperature
(typ. values)
Fig.6 Relative variation of gate trigger current (l GT )
and voltage(V GT ) versus junction temperature
l H ,l L [T j ] / l H ,l L [T j =25°C]
2.5
l GT ,V GT [T j ] / l GT ,V GT [T j =25°C]
3.0
l GT Q1-Q2
2.5
2.0
l GT Q3
2.0
1.5
l GT Q4
1.5
1.0
0.5
T j (°C)
0.0
-50
-25
0
25
50
lL
1.0
lH
0.5
V GT Q1-Q2-Q3-Q4
75
100
0.0
-50
125
Fig.7 Surge peak on-state current versus
number of cycles
25
0
50
100
75
125
Fig.8 Non-repetitive surge peak on-state current
and corresponding value of l 2 t sinusoidal
pulse width
l TSM (A)
9
-25
l TSM (A), l 2 t(A 2 s)
100
T j initial = 25°C
8
dl/dt limitation:
20A/µs
t=20ms
7
One cycle
Non repetitive
Tj initial=25°C
6
l TSM
20
5
4
Repetitive
Tamb=95°C
3
10
2
1
Number of cycles
0
10
1
100
1000
Fig.9 On-state characteristics (maximum values)
(l TM = f(V TM ))
l 2t
t P (ms)
1
0.01
0.10
1.00
10.00
Fig.10 Relative variation of critical rate of decrease
of main current versus (dV/dt)c
l TM (A)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.6
10.0
2.4
2.2
2.0
1.8
1.6
1.4
T j = T j max.
1.0
1.2
1.0
T j = 25°C
V TM (V)
0.1
0.0
0.5
1.0
1.5
2.0
2.5
0.8
T j = max.
V to = 0.95V
R d = 400mΩ
3.0
3.5
4.0
4.5
0.6
D
0.2
5.0
Fig.11 Relative variation of critical rate of decrease
of main current (dl/dt) versus junction
temperature
A
(dV/dt)c (V/µs)
0.0
0.1
1.0
10.0
100.0
Fig.12 Relative variation of static dV/dt immunity
versus junction temperature (gate open)
(dl/dt)c [T j ] / (dl/dt)c [T j Specified]
(dV/dt)c [T j ] / (dV/dt)c [T j = 125°C]
6
6
5
5
4
4
3
3
2
2
1
V D =V R =402V
1
T j (°C)
0
S
T
0.4
0
25
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50
T j (°C)
75
100
125
Page 4 of 5
0
25
50
75
100
125
RoHS
1T Series RoHS
SEMICONDUCTOR
Case Style
RoHS
TO-92
Ø
5.20(0.205)
4.45(0.175)
5.33(0.210)
4.58(0.180)
1
2
3
0.50(0.020)
0.40(0.016)
12.70(0.500)Min.
0.50(0.020)
0.40(0.016)
0.50(0.020)
0.40(0.016)
1.40(0.055)
1.14(0.045)
1.40(0.055)
1.14(0.045)
4.20(0.165)
3.20(0.126)
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Page 5 of 5