LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 LM1085 3A Low Dropout Positive Regulators Check for Samples: LM1085 FEATURES DESCRIPTION • The LM1085 is a series of low dropout positive voltage regulators with a maximum dropout of 1.5V at 3A of load current. It has the same pin-out as TI's industry standard LM317. 1 2 • • • • Available in 3.3V, 5.0V, 12V and Adjustable Versions Current Limiting and Thermal Protection Output Current 3A Line Regulation 0.015% (typical) Load Regulation 0.1% (typical) APPLICATIONS • • • • • High Efficiency Linear Regulators Battery Charger Post Regulation for Switching Supplies Constant Current Regulator Microprocessor Supply The LM1085 is available in an adjustable version, which can set the output voltage with only two external resistors. It is also available in three fixed voltages: 3.3V, 5.0V and 12.0V. The fixed versions integrate the adjust resistors. The LM1085 circuit includes a zener trimmed bandgap reference, current limiting and thermal shutdown. The LM1085 series is available in TO-220 and DDPAK/TO-263 packages. Refer to the LM1084 for the 5A version, and the LM1086 for the 1.5A version. Connection Diagram Figure 1. TO-220 Top View Figure 2. DDPAK/TO-263 Top View Figure 3. Basic Functional Diagram, Adjustable Version Figure 4. Application Circuit 1.2V to 15V Adjustable Regulator 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM1085 SNVS038G – JULY 1999 – REVISED MARCH 2013 www.ti.com Simplified Schematic Figure 5. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Maximum Input to Output Voltage Differential LM1085-ADJ 29V LM1085-12 18V LM1085-3.3 27V LM1085-5.0 25V (3) Power Dissipation Internally Limited Junction Temperature (TJ) (4) 150°C Storage Temperature Range -65°C to 150°C Lead Temperature 260°C, to 10 sec (5) 2000V ESD Tolerance (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes. The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations in the Application Notes. For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF. Operating Ratings (1) Junction Temperature (TJ) (2) (1) (2) −40°C to 125°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations in the Application Notes. Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Symbol VREF VOUT (1) (2) (3) Min Typ Max (1) Units LM1085-ADJ IOUT = 10mA, VIN−VOUT = 3V 10mA ≤IOUT ≤ IFULL LOAD,1.5V ≤ (VIN−VOUT) ≤ 15V 1.238 1.225 1.250 1.250 1.262 1.270 V LM1085-3.3 IOUT = 0mA, VIN = 5V 0 ≤ IOUT ≤IFULL LOAD, 4.8V≤ VIN ≤15V 3.270 3.235 3.300 3.300 3.330 3.365 V LM1085-5.0 IOUT = 0mA, VIN = 8V 0 ≤ IOUT ≤ IFULL LOAD, 6.5V ≤ VIN ≤ 20V 4.950 4.900 5.000 5.000 5.050 5.100 V LM1085-12 IOUT = 0mA, VIN = 15V 0 ≤ IOUT ≤ IFULL LOAD, 13.5V ≤ VIN ≤ 25V 11.880 11.760 12.000 12.000 12.120 12.240 V Parameter Reference Voltage (3) Output Voltage (3) Conditions (1) (2) All limits are specified by testing or statistical analysis. Typical Values represent the most likely parametric norm. IFULL LOAD is defined in the current limit curves. The IFULL LOAD Curve defines the current limit as a function of input-to-output voltage. Note that 30W power dissipation for the LM1085 is only achievable over a limited range of input-to-output voltage. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 3 LM1085 SNVS038G – JULY 1999 – REVISED MARCH 2013 www.ti.com Electrical Characteristics (continued) Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Symbol Typ Max (1) Units 0.015 0.035 0.2 0.2 % LM1085-3.3, IOUT = 0mA, 4.8V ≤ VIN ≤ 15V 0.5 1.0 6 6 mV LM1085-5.0, IOUT = 0mA, 6.5V ≤ VIN ≤ 20V 0.5 1.0 10 10 mV LM1085-12, I OUT =0mA, 13.5V ≤ VIN ≤ 25V 1.0 2.0 25 25 mV LM1085-ADJ, (VIN-V OUT) = 3V, 10mA ≤ IOUT ≤ IFULL 0.1 0.2 0.3 0.4 % LM1085-3.3, VIN = 5V, 0 ≤ IOUT ≤ IFULL LOAD 3 7 15 20 mV LM1085-5.0, VIN = 8V, 0 ≤ IOUT ≤ IFULL LOAD 5 10 20 35 mV LM1085-12, VIN = 15V, 0 ≤ IOUT ≤ IFULL LOAD 12 24 36 72 mV LM1085-ADJ, 3.3, 5, 12 ΔVREF, ΔVOUT = 1%, IOUT = 3A 1.3 1.5 Parameter Conditions Min (1) LM1085-ADJ, IOUT =10mA, 1.5V≤ (VIN-VOUT) ≤ 15V Line Regulation ΔVOUT (4) LOAD Load Regulation ΔVOUT (4) VDO Dropout Voltage ILIMIT (5) Current Limit Minimum Load Current (6) IGND Quiescent Current Thermal Regulation (2) V LM1085-ADJ, VIN−VOUT = 5V 3.2 5.5 LM1085-ADJ, VIN−VOUT = 25V 0.2 0.5 LM1085-3.3, VIN = 8.0V 3.2 5.5 A LM1085-5.0, VIN = 10V 3.2 5.5 A LM1085-12, VIN = 17V 3.2 5.5 A A LM1085-ADJ, VIN −VOUT = 25V 5.0 10.0 mA LM1085-3.3, VIN ≤ 18V 5.0 10.0 mA LM1085-5.0, VIN ≤ 20V 5.0 10.0 mA LM1085-12, VIN ≤ 25V 5.0 10.0 mA TA = 25°C, 30ms Pulse .004 0.02 %/W fRIPPLE = 120Hz, COUT = 25µF Tantalum, IOUT = 3A Ripple Rejection LM1085-ADJ CADJ = 25µF, (VIN−VO) = 3V 60 75 dB LM1085-3.3, VIN = 6.3V 60 72 dB LM1085-5.0, VIN = 8.0V 60 68 dB LM1085-12, VIN = 15V 54 60 Adjust Pin Current LM1085–ADJ 55 120 µA ΔIADJ Adjust Pin Current Change LM1085–ADJ 10mA ≤ IOUT ≤ IFULL LOAD, 1.5V ≤ VIN−VOUT ≤ 25V 0.2 5 µA Temperature Stability θJC (4) (5) (6) 4 dB IADJ 0.5 Long Term Stability TA= 125°C, 1000 Hrs RMS Output Noise (% of VOUT) 10Hz ≤ f ≤ 10 kHz Thermal Resistance (Junction-to-Case) 0.3 % 1.0 0.003 % % 3-Lead DDPAK/TO-263 - 0.7 - 3-Lead TO-220 - 0.7 - °C/W Load and line regulation are measured at constant junction temperature, and are ensured up to the maximum power dissipation of 30W. Power dissipation is determined by the input/output differential and the output current. Ensured maximum power dissipation will not be available over the full input/output range. Dropout voltage is specified over the full output current range of the device. The minimum output current required to maintain regulation. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 Typical Performance Characteristics Dropout Voltage vs. Output Current Short-Circuit Current vs. Input/Output Difference Figure 6. Figure 7. Percent Change in Output Voltage vs. Temperature Adjust Pin Current vs. Temperature Figure 8. Figure 9. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 5 LM1085 SNVS038G – JULY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Maximum Power Dissipation vs. Temperature Ripple Rejection vs. Frequency (LM1085-Adj.) Figure 10. Figure 11. Ripple Rejection vs. Output Current (LM1085-Adj.) Line Transient Response Figure 12. Figure 13. Load Transient Response Figure 14. 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 APPLICATION NOTE GENERAL Figure 15 shows a basic functional diagram for the LM1085-Adj (excluding protection circuitry) . The topology is basically that of the LM317 except for the pass transistor. Instead of a Darlingtion NPN with its two diode voltage drop, the LM1085 uses a single NPN. This results in a lower dropout voltage. The structure of the pass transistor is also known as a quasi LDO. The advantage a quasi LDO over a PNP LDO is its inherently lower quiescent current. The LM1085 is ensured to provide a minimum dropout voltage 1.5V over temperature, at full load. Figure 15. Basic Functional Diagram for the LM1085, excluding Protection circuitry OUTPUT VOLTAGE The LM1085 adjustable version develops at 1.25V reference voltage, (VREF), between the output and the adjust terminal. As shown in figure 2, this voltage is applied across resistor R1 to generate a constant current I1. This constant current then flows through R2. The resulting voltage drop across R2 adds to the reference voltage to sets the desired output voltage. The current IADJ from the adjustment terminal introduces an output error . But since it is small (120uA max), it becomes negligible when R1 is in the 100Ω range. For fixed voltage devices, R1 and R2 are integrated inside the devices. Figure 16. Basic Adjustable Regulator STABILITY CONSIDERATION Stability consideration primarily concern the phase response of the feedback loop. In order for stable operation, the loop must maintain negative feedback. The LM1085 requires a certain amount series resistance with capacitive loads. This series resistance introduces a zero within the loop to increase phase margin and thus increase stability. The equivalent series resistance (ESR) of solid tantalum or aluminum electrolytic capacitors is used to provide the appropriate zero (approximately 500 kHz). The Aluminum electrolytic are less expensive than tantalums, but their ESR varies exponentially at cold temperatures; therefore requiring close examination when choosing the desired transient response over temperature. Tantalums are a convenient choice because their ESR varies less than 2:1 over temperature. The recommended load/decoupling capacitance is a 10uF tantalum or a 50uF aluminum. These values will assure stability for the majority of applications. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 7 LM1085 SNVS038G – JULY 1999 – REVISED MARCH 2013 www.ti.com The adjustable versions allows an additional capacitor to be used at the ADJ pin to increase ripple rejection. If this is done the output capacitor should be increased to 22uF for tantalums or to 150uF for aluminum. Capacitors other than tantalum or aluminum can be used at the adjust pin and the input pin. A 10uF capacitor is a reasonable value at the input. See RIPPLE REJECTION section regarding the value for the adjust pin capacitor. It is desirable to have large output capacitance for applications that entail large changes in load current (microprocessors for example). The higher the capacitance, the larger the available charge per demand. It is also desirable to provide low ESR to reduce the change in output voltage: V = ΔI x ESR It is common practice to use several tantalum and ceramic capacitors in parallel to reduce this change in the output voltage by reducing the overall ESR. Output capacitance can be increased indefinitely to improve transient response and stability. RIPPLE REJECTION Ripple rejection is a function of the open loop gain within the feed-back loop (refer to Figure 15 and Figure 16). The LM1085 exhibits 75dB of ripple rejection (typ.). When adjusted for voltages higher than VREF, the ripple rejection decreases as function of adjustment gain: (1+R1/R2) or VO/VREF. Therefore a 5V adjustment decreases ripple rejection by a factor of four (−12dB); Output ripple increases as adjustment voltage increases. However, the adjustable version allows this degradation of ripple rejection to be compensated. The adjust terminal can be bypassed to ground with a capacitor (CADJ). The impedance of the CADJ should be equal to or less than R1 at the desired ripple frequency. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. 1/(2π*fRIPPLE*CADJ) ≤ R1 LOAD REGULATION The LM1085 regulates the voltage that appears between its output and ground pins, or between its output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. Figure 17 shows a typical application using a fixed output regulator. Rt1 and Rt2 are the line resistances. VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side. Figure 17. Typical Application using Fixed Output Regulator When the adjustable regulator is used (Figure 18), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with 0.05Ω resistance between the regulator and load will have a load regulation due to line resistance of 0.05Ω x IL. If R1 (= 125Ω) is connected near the load the effective line resistance will be 0.05Ω (1 + R2/R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation. 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 Figure 18. Best Load Regulation using Adjustable Output Regulator PROTECTION DIODES Under normal operation, the LM1085 regulator does not need any protection diode. With the adjustable device, the internal resistance between the adjustment and output terminals limits the current. No diode is needed to divert the current around the regulator even with a capacitor on the adjustment terminal. The adjust pin can take a transient signal of ±25V with respect to the output voltage without damaging the device. When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LM1085 regulator, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large output capacitor (≥1000 µf), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, shown in Figure 19. Figure 19. Regulator with Protection Diode OVERLOAD RECOVERY Overload recovery refers to regulator's ability to recover from a short circuited output. A key factor in the recovery process is the current limiting used to protect the output from drawing too much power. The current limiting circuit reduces the output current as the input to output differential increases. Refer to short circuit curve in the Typical Performance Characteristics section. During normal start-up, the input to output differential is small since the output follows the input. But, if the output is shorted, then the recovery involves a large input to output differential. Sometimes during this condition the current limiting circuit is slow in recovering. If the limited current is too low to develop a voltage at the output, the voltage will stabilize at a lower level. Under these conditions it may be necessary to recycle the power of the regulator in order to get the smaller differential voltage and thus adequate start up conditions. Refer to Typical Performance Characteristics section for the short circuit current vs. input differential voltage. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 9 LM1085 SNVS038G – JULY 1999 – REVISED MARCH 2013 www.ti.com THERMAL CONSIDERATIONS FOR THE TO-220 PACKAGE ICs heats up when in operation, and power consumption is one factor in how hot it gets. The other factor is how well the heat is dissipated. Heat dissipation is predictable by knowing the thermal resistance between the IC and ambient (θJA). Thermal resistance has units of temperature per power (°C/W). The higher the thermal resistance, the hotter the IC. The LM1085 specifies the thermal resistance for the TO-220 package as Junction to Case (θJC). In order to get the total resistance to ambient (θJA), two other thermal resistances must be added, one for case to heat-sink (θCH) and one for heatsink to ambient (θHA). The junction temperature can be predicted as follows: TJ = TA + (PD x (θJC + θCH + θHA)) TJ = TA + (PD x θJA) (1) (2) where TJ is junction temperature, TA is ambient temperature, and PD is the power dissipation of the device. Device power dissipation is calculated as follows: PD = OUTPUT Section Dissipation + CONTROL Section Dissipation PD = ( (VIN - VOUT) x ILOAD) + ( (VIN - VOUT) x IGND) (3) (4) Figure 20 shows the voltages and currents which are present in the circuit. Figure 20. Power Dissipation Diagram Once the devices power is determined, the maximum allowable (θJA(max)) is calculated as: θJA(MAX) = TR(MAX) / PD θJA(MAX)= TJ(MAX) - TA(MAX)) / PD (5) (6) The required heat sink is determined by calculating its required thermal resistance (θHA(MAX)). θHA(MAX) = θJA(MAX) − (θJC + θCH) (7) If thermal compound is used, θCH can be estimated at 0.2 C/W. If the case is soldered to the heat sink, then a θCH can be estimated as 0 C/W. If PC board copper is going to be used as a heat sink, then Figure 21 can be used to determine the appropriate area (size) of copper foil required. 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 Figure 21. Heat sink thermal Resistance vs Area THERMAL CONSIDERATION FOR THE DDPAK/TO-263 PACKAGE Unlike the TO-220 package, the TO-263 package uses the printed circuit board as the heat sink to remove heat from the device. The device dissipation is: PD = OUTPUT Section Dissipation + CONTROL Section Dissipation (8) For the LM1085IS-x.x pre-set voltage versions, the dissipation can be calculated using: PD = ( (VIN - VOUT) x ILOAD) + ( (VIN- VOUT) x IGND) (9) The LM1085IS-ADJ adjustable voltage version, the dissipation can be calculated using: PD = ( (VIN - VOUT) x ILOAD) + ( (VIN - VOUT) x (VREF / R1)) (10) Current through the ADJ pin is sufficiently small such that any contribution to the device dissipation is so low that it can safely be ignored. Maximum power dissipation of the LM1085IS depends on the total thermal resistance from the silicon junction through the package TAB (θJC), into the PC board, copper traces, and other materials, and then into the surrounding air (θJA), the maximum allowed operating junction temperature (TJ(MAX)) of 125°C, and the maximum ambient temperature (TA(MAX)). The maximum power dissipation in the device is: PD(MAX) = (TJ(MAX) - TA(MAX)) / (θJA (11) For the LM1085IS in the DDPAK/TO-263 3-pin package, the junction-to-case thermal rating, θJC, is 0.7°C/W, where the case is the bottom of the package at the center of the TAB. Typical junction-to-ambient thermal performance for the LM1085IS, using the JESD51 standards, is summarized in the following table: BOARD TYPE THERMAL VIAS θJA JEDEC 2-Layer (per JESD 51-3) None 81 °C/W 0 59 °C/W 2 31 °C/W 4 27 °C/W 8 24 °C/W 12 23 °C/W JEDEC 4-Layer (per JESD 51-7) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 11 LM1085 SNVS038G – JULY 1999 – REVISED MARCH 2013 www.ti.com For more information refer to : “Application Note 1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages”, TI Literature Number: SNVA183 It is important to remember that the TAB of the LM1085IS package is internally conntected to device pin 2 (OUTPUT), so the copper area connected to the TAB must be isolated from all other potentials, including ground. The copper area connected to the TAB can be left floating, used as the primary VOUT connection, or connected to device pin 2 (OUTPUT) . Typical Applications 12 Figure 22. 5V to 3.3V, 1.5A Regulator Figure 23. Adjustable @ 5V Figure 24. 1.2V to 15V Adjustable Regulator Figure 25. 5V Regulator with Shutdown Figure 26. Battery Charger Figure 27. Adjustable Fixed Regulator Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 Figure 28. Regulator with Reference Figure 29. High Current Lamp Driver Protection Figure 30. Battery Backup Regulated Supply Figure 31. Ripple Rejection Enhancement Figure 32. Automatic Light control Figure 33. Generating Negative Supply voltage Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 13 LM1085 SNVS038G – JULY 1999 – REVISED MARCH 2013 www.ti.com Figure 34. Remote Sensing 14 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 LM1085 www.ti.com SNVS038G – JULY 1999 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision F (March 2013) to Revision G • Page Deleted layout of National Data Sheet to TI format ............................................................................................................ 14 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM1085 15 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM1085IS-12/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1085 IS-12 LM1085IS-3.3 ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM1085 IS-3.3 LM1085IS-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1085 IS-3.3 LM1085IS-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1085 IS-5.0 LM1085IS-ADJ ACTIVE DDPAK/ TO-263 KTT 3 45 TBD Call TI Call TI LM1085IS-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 45 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR LM1085ISX-3.3 ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI LM1085ISX-3.3/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1085 IS-3.3 LM1085ISX-5.0/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1085 IS-5.0 LM1085ISX-ADJ ACTIVE DDPAK/ TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM1085 IS-ADJ LM1085ISX-ADJ/NOPB ACTIVE DDPAK/ TO-263 KTT 3 500 Pb-Free (RoHS Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM1085 IS-ADJ LM1085IT-12/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1085 IT-12 LM1085IT-3.3/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1085 IT-3.3 LM1085IT-5.0 ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI LM1085IT-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1085 IT-5.0 LM1085IT-ADJ ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM1085 IT-ADJ LM1085IT-ADJ/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM1085 IT-ADJ Addendum-Page 1 LM1085 IS-ADJ -40 to 125 LM1085 IS-ADJ LM1085 IS-3.3 LM1085 IT-5.0 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM1085ISX-3.3 DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1085ISX-3.3/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1085ISX-5.0/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1085ISX-ADJ DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 LM1085ISX-ADJ/NOPB DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM1085ISX-3.3 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1085ISX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1085ISX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1085ISX-ADJ DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 LM1085ISX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA NDE0003B www.ti.com MECHANICAL DATA KTT0003B TS3B (Rev F) BOTTOM SIDE OF PACKAGE www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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