LINER LT5527EUF-PBF

LT5527
400MHz to 3.7GHz
5V High Signal Level
Downconverting Mixer
DESCRIPTION
FEATURES
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50Ω Single-Ended RF and LO Ports
Wide RF Frequency Range: 400MHz to 3.7GHz*
High Input IP3: 24.5dBm at 900MHz
23.5dBm at 1900MHz
Conversion Gain: 3.2dB at 900MHz
2.3dB at 1900MHz
Integrated LO Buffer: Low LO Drive Level
High LO-RF and LO-IF Isolation
Low Noise Figure: 11.6dB at 900MHz
12.5dB at 1900MHz
Very Few External Components
Enable Function
4.5V to 5.25V Supply Voltage Range
16-Lead (4mm × 4mm) QFN Package
The LT®5527 active mixer is optimized for high linearity,
wide dynamic range downconverter applications. The
IC includes a high speed differential LO buffer amplifier
driving a double-balanced mixer. Broadband, integrated
transformers on the RF and LO inputs provide single-ended
50Ω interfaces. The differential IF output allows convenient
interfacing to differential IF filters and amplifiers, or is
easily matched to drive 50Ω single-ended, with or without
an external transformer.
The RF input is internally matched to 50Ω from 1.7GHz
to 3GHz, and the LO input is internally matched to 50Ω
from 1.2GHz to 5GHz. The frequency range of both ports
is easily extended with simple external matching. The IF
output is partially matched and usable for IF frequencies
up to 600MHz.
APPLICATIONS
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The LT5527’s high level of integration minimizes the total
solution cost, board space and system-level variation.
Cellular, WCDMA, TD-SCDMA and UMTS
Infrastructure
GSM900/GSM1800/GSM1900 Infrastructure
900MHz/2.4GHz/3.5GHz WLAN
MMDS, WiMAX
High Linearity Downmixer Applications
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
*Operation over a wider frequency range is possible with reduced performance. Consult factory
for information and assistance.
TYPICAL APPLICATION
High Signal Level Downmixer for Multi-Carrier Wireless Infrastructure
LO INPUT
–3dBm (TYP)
1.9GHz Conversion Gain, IIP3, SSB NF and
LO-RF Leakage vs LO Power
100nH
IF+
1nF
220nH
RF
INPUT
RF
IF–
BIAS
GND
EN
4.7pF
VCC2 VCC1
100nH
5V
1nF
IF
OUTPUT
240MHz
–20
22 IIP3
–25
20
–30
IF = 240MHz
LOW SIDE LO –35
TA = 25°C
–40
VCC = 5V
–45
18
16
14
12 SSB NF
–50
10
–55
8
–60
LO-RF
6
–65
4 G
C
2
–9
–70
LO-RF LEAKAGE (dBm)
4.7pF
GC, SSB NF (dB), IIP3 (dBm)
LT5527
24
–75
–7
–5
–3
–1
LO POWER (dBm)
1
3
5527 TA01b
1μF
5527 TA01a
5527fa
1
LT5527
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Note 1)
NC
NC
NC
LO
TOP VIEW
Supply Voltage (VCC1, VCC2, IF+, IF–) .......................5.5V
Enable Voltage ................................ –0.3V to VCC + 0.3V
LO Input Power (380MHz to 4GHz)......................10dBm
LO Input DC Voltage ..............................–1V to VCC + 1V
Continuous RF Input Power
(400MHz to 4GHz) ...............................................12dBm
RF Input Power (400MHz to 4GHz) ......................15dBm
RF Input DC Voltage ...............................................±0.1V
Operating Temperature Range ................ –40°C to 85°C
Storage Temperature Range................... –65°C to 125°C
Junction Temperature (TJ) ................................... 125°C
16 15 14 13
NC 1
12 GND
NC 2
11 IF+
17
RF 3
10 IF–
9 GND
5
6
7
8
EN
VCC2
VCC1
NC
NC 4
UF PACKAGE
16-LEAD (4mm s 4mm) PLASTIC QFN
TJMAX = 125°C, θJA = 37°C/W
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT5527EUF#PBF
LT5527EUF#TRPBF
5527
16-Lead (4mm × 4mm) Plastic QFN
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
DC ELECTRICAL CHARACTERISTICS
circuit shown in Figure 1. (Note 3)
PARAMETER
VCC = 5V, EN = High, TA = 25°C, unless otherwise specified. Test
CONDITIONS
MIN
TYP
MAX
UNITS
4.5
5
5.25
VDC
60
88
mA
mA
mA
mA
Power Supply Requirements (VCC)
Supply Voltage
Supply Current
VCC1 (Pin 7)
VCC2 (Pin 6)
IF+ + IF– (Pin 11 + Pin 10)
Total Supply Current
23.2
2.8
52
78
Enable (EN) Low = Off, High = On
Shutdown Current
EN = Low
100
Input High Voltage (On)
3
Input Low Voltage (Off)
EN Pin Input Current
μA
VDC
EN = 5VDC
50
0.3
VDC
90
μA
Turn-ON Time
3
μs
Turn-OFF Time
3
μs
AC ELECTRICAL CHARACTERISTICS
Test circuit shown in Figure 1. (Notes 2, 3)
PARAMETER
CONDITIONS
MIN
RF Input Frequency Range
No External Matching (Midband)
With External Matching (Low Band or High Band)
400
No External Matching
With External Matching
380
LO Input Frequency Range
IF Output Frequency Range
Requires Appropriate IF Matching
TYP
MAX
UNITS
3700
MHz
MHz
1700 to 3000
1200 to 3500
0.1 to 600
MHz
MHz
MHz
5527fa
2
LT5527
AC ELECTRICAL CHARACTERISTICS
Test circuit shown in Figure 1. (Notes 2, 3)
PARAMETER
CONDITIONS
RF Input Return Loss
ZO = 50Ω, 1700MHz to 3000MHz
MIN
LO Input Return Loss
ZO = 50Ω, 1200MHz to 3400MHz
IF Output Impedance
Differential at 240MHz
LO Input Power
1200MHz to 3500MHz
380MHz to 1200MHz
TYP
MAX
>10
–8
–5
UNITS
dB
>12
dB
407Ω||2.5pF
R||C
–3
0
2
5
dBm
dBm
Standard Downmixer Application: VCC = 5V, EN = High, TA = 25°C, PRF = –5dBm (–5dBm/tone for 2-tone IIP3 tests, Δf = 1MHz), fLO = fRF
– fIF, PLO = –3dBm (0dBm for 450MHz and 900MHz tests), IF output measured at 240MHz, unless otherwise noted. Test circuit shown
in Figure 1. (Notes 2, 3, 4)
PARAMETER
CONDITIONS
MIN
Conversion Gain
RF = 450MHz, IF = 140MHz, High Side LO
RF = 900MHz, IF = 140MHz
RF = 1700MHz
RF = 1900MHz
RF = 2200MHz
RF = 2650MHz
RF = 3500MHz, IF = 380MHz
Conversion Gain vs Temperature
TA = –40°C to 85°C, RF = 1900MHz
Input 3rd Order Intercept
TYP
2.5
3.4
2.3
2.3
2.0
1.8
0.3
MAX
UNITS
dB
dB
dB
dB
dB
dB
dB
–0.018
dB/°C
RF = 450MHz, IF = 140MHz, High Side LO
RF = 900MHz, IF = 140MHz
RF = 1700MHz
RF = 1900MHz
RF = 2200MHz
RF = 2650MHz
RF = 3500MHz, IF = 380MHz
23.2
24.5
24.2
23.5
22.7
20.8
18.2
dBm
dBm
dBm
dBm
dBm
dBm
dBm
Single-Sideband Noise Figure
RF = 450MHz, IF = 140MHz, High Side LO
RF = 900MHz, IF = 140MHz
RF = 1700MHz
RF = 1900MHz
RF = 2200MHz
RF = 2650MHz
RF = 3500MHz, IF = 380MHz
13.3
11.6
12.1
12.5
13.2
13.9
16.1
dB
dB
dB
dB
dB
dB
dB
LO to RF Leakage
fLO = 400MHz to 2100MHz
fLO = 2100MHz to 3200MHz
≤–44
≤–36
dBm
dBm
LO to IF Leakage
fLO = 400MHz to 700MHz
fLO = 700MHz to 3200MHz
≤–40
≤–50
dBm
dBm
RF to LO Isolation
fRF = 400MHz to 2200MHz
fRF = 2200MHz to 3700MHz
>43
>38
dB
dB
RF to IF Isolation
fRF = 400MHz to 800MHz
fRF = 800MHz to 3700MHz
>42
>54
dB
dB
2RF-2LO Output Spurious Product
(fRF = fLO + fIF/2)
900MHz: fRF = 830MHz at –5dBm, fIF = 140MHz
1900MHz: fRF = 1780MHz at –5dBm, fIF = 240MHz
–60
–65
dBc
dBc
3RF-3LO Output Spurious Product
(fRF = fLO + fIF/3)
900MHz: fRF = 806.67MHz at –5dBm, fIF = 140MHz
1900MHz: fRF = 1740MHz at –5dBm, fIF = 240MHz
–73
–63
dBc
dBc
Input 1dB Compression
RF = 450MHz, IF = 140MHz, High Side
LO RF = 900MHz, IF = 140MHz
RF = 1900MHz
9.5
8.9
9.0
dBm
dBm
dBm
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: 450MHz, 900MHz and 3500MHz performance measured with
external LO and RF matching. See Figure 1 and Applications Information.
Note 3: Specifications over the –40°C to 85°C temperature range are
assured by design, characterization and correlation with statistical process
controls.
Note 4: SSB Noise Figure measurements performed with a small-signal
noise source and bandpass filter on RF input, and no other RF signal
applied.
5527fa
3
LT5527
TYPICAL AC PERFORMANCE CHARACTERISTICS
Midband (No external RF/LO matching)
VCC = 5V, EN = High, PRF = –5dBm (–5dBm/tone for 2-tone IIP3 tests, Δf = 1MHz), PLO = –3dBm, IF output measured at 240MHz, unless
otherwise noted. Test circuit shown in Figure 1.
Conversion Gain, IIP3 and NF
vs RF Frequency
LO Leakage vs LO Frequency
IIP3
–35
20
–40
18
–45
SSB NF
14
12
TA = 25°C
IF = 240MHz
LOW SIDE LO
HIGH SIDE LO
10
8
6
4
GC
2
0
1700
1900
2300
2500
2100
RF FREQUENCY (MHz)
TA = 25°C
PLO = –3dBm
–40
–45
LO-RF
–50
–55
–60
LO-IF
–65
–70
–85
–85
1800 2100 2400 2700
LO FREQUENCY (MHz)
23
8
23
8
22
7
22
7
21
6
21
4
IIP3 (dBm)
9
3
GC
15
–50
–25
19
2
17
1
16
–25
25
50
0
TEMPERATURE (°C)
22
13
SSB NF
LOW SIDE LO
IF = 240MHz
–40°C
25°C
85°C
GC, SSB NF (dB), IIP3 (dBm)
GC, SSB NF (dB), IIP3 (dBm)
24
15
11
9
7
5
3
1
20
–7
–5
–3
–1
LO INPUT POWER (dBm)
1
12
SSB NF
10
8
6
GC
2
0
4.5
5
4.75
5.25
SUPPLY VOLTAGE (V)
5.5
5527 G06
16
14
3
5527 G07
2200MHz Conversion Gain, IIP3
and NF vs LO Power
24
IIP3
18
SSB NF
22
LOW SIDE LO
IF = 240MHz
–40°C
25°C
85°C
12
10
8
6
4
GC
–9
14
1900MHz Conversion Gain, IIP3
and NF vs LO Power
23
17
LOW SIDE LO
IF = 240MHz
–40°C
25°C
85°C
18
16
4
1
0
100
75
IIP3
20
5527 G05
25
19
2
GC
15
–50
1700MHz Conversion Gain, IIP3
and NF vs LO Power
IIP3
4
3
5527 G04
21
5
18
0
100
75
25
50
0
TEMPERATURE (°C)
6
IF = 240MHz
1700MHz
1900MHz
2200MHz
20
GC, SSB NF (dB), IIP3 (dBm)
17
24
22
10
IIP3
GC (dB)
IIP3 (dBm)
24
GC (dB)
25
5
2700
1900MHz Conversion Gain, IIP3
and NF vs Supply Voltage
9
18
2300
2500
2100
RF FREQUENCY (MHz)
5527 G03
10
IF = 240MHz
1700MHz
1900MHz
2200MHz
1900
5527 G02
Conversion Gain and IIP3
vs Temperature (High Side LO)
IIP3
16
RF-IF
–90
1700
3000
24
19
–65
–70
–75
Conversion Gain and IIP3
vs Temperature (Low Side LO)
20
–60
–80
1500
RF-LO
–55
–75
5527 G01
25
–50
–80
–90
1200
2700
TA = 25°C
–35
GC, SSB NF (dB), IIP3 (dBm)
16
LO LEAKAGE (dBm)
GC, SSB NF (dB), IIP3 (dBm)
22
RF Isolation vs RF Frequency
–30
ISOLATION (dB)
–30
24
GC
20 IIP3
18
16
14
12
8
6
4 GC
2
2
0
–7
–5
–3
–1
LO INPUT POWER (dBm)
1
3
5527 G08
LOW SIDE LO
IF = 240MHz
–40°C
25°C
85°C
10
0
–9
SSB NF
–9
–7
–5
–3
–1
LO INPUT POWER (dBm)
1
3
5527 G09
5527fa
4
LT5527
TYPICAL AC PERFORMANCE CHARACTERISTICS
Midband (No external RF/LO matching)
VCC = 5V, EN = High, PRF = –5dBm (–5dBm/tone for 2-tone IIP3 tests, Δf = 1MHz), PLO = –3dBm, IF output measured at 240MHz, unless
otherwise noted. Test circuit shown in Figure 1.
IFOUT, 2 × 2 and 3 × 3 Spurs
vs RF Input Power (Single Tone)
IF Output Power, IM3 and IM5 vs
RF Input Power (2 Input Tones)
10
15
IFOUT
–10
–20
–40
–50
TA = 25°C
RF1 = 1899.5MHz
RF2 = 1900.5MHz
LO = 1660MHz
–60
–70
IM3
–80
–90
–100
–21
–15
–50
–55
IFOUT
(RF = 1900MHz)
RELATIVE SPUR LEVEL (dBc)
TA = 25°C
5 LO = 1660MHz
–5 IF = 240MHz
OUTPUT POWER (dBm)
OUTPUT POWER/TONE (dBm)
0
–30
2 × 2 and 3 × 3 Spurs
vs LO Power (Single Tone)
–25
–35
–45
3RF-3LO
(RF = 1740MHz)
–55
–65
2RF-2LO
(RF = 1780MHz)
–75
2RF-2LO
(RF = 1780MHz)
–70
–75
–80
–85
TA = 25°C
LO = 1660MHz
IF = 240MHz
PRF = –5dBm
–90
–100
–95
–18 –15 –12 –9 –6 –3 0 3 6
RF INPUT POWER (dBm)
0
–6
–3
–18 –15 –12 –9
RF INPUT POWER (dBm/TONE) 5527 G10
–65
–95
–85
IM5
3RF-3LO
(RF = 1740MHz)
–60
9
12
–9
–7
5527 G11
3
1
–3
–1
–5
LO INPUT POWER (dBm)
5527 G12
High Band (3500MHz application with external RF matching) VCC = 5V, EN = High, PRF = –5dBm (–5dBm/tone for 2-tone IIP3 tests,
Δf = 1MHz), low side LO, PLO = –3dBm, IF output measured at 380MHz, unless otherwise noted. Test circuit shown in Figure 1.
Conversion Gain, IIP3 and SSB
NF vs RF Frequency
3500MHz Conversion Gain, IIP3
and SSB NF vs LO Power
20
19
SSB NF
12
LOW SIDE LO
IF = 380MHz
TA = 25°C
10
8
6
4
2
GC, SSB NF (dB), IIP3 (dBm)
16
14
–30
13
11
LOW SIDE LO
IF = 380MHz
TA = 25°C
9
7
5
3
3700
–40
–7
5527 G13
–3
–1
–5
LO INPUT POWER (dBm)
3
1
RF-LO
40
30
–50
–60
–9
50
LO-RF
GC
–1
3500
3400
3600
RF FREQUENCY (MHz)
60
SSB NF
15
1
GC
0
3300
–20
IIP3
17
LO LEAKAGE (dBm)
IIP3
20
LO-IF
–70
3000
3400
3200
3600
LO/RF FREQUENCY (MHz)
5527 G14
RF-LO ISOLATION (dB)
GC, SSB NF (dB), IIP3 (dBm)
18
LO Leakage and RF-LO Isolation
vs LO and RF Frequency
10
3800
5527 G15
Low Band (450MHz application with external RF/LO matching) VCC = 5V, EN = High, PRF = –5dBm (–5dBm/tone for 2-tone IIP3 tests,
Δf = 1MHz), PLO = 0dBm, IF output measured at 140MHz, unless otherwise noted. Test circuit shown in Figure 1.
Conversion Gain, IIP3 and NF
vs RF Frequency
18
16
14
IIP3
22
HIGH SIDE LO
TA = 25°C
IF = 140MHz
SSB NF
12
10
8
6
20
16
14
8
6
2
0
5527 G18
GC
–6
TA = 25°C
PLO = 0dBm
–30
10
4
500
SSB NF
HIGH SIDE LO
IF = 140MHz
–40°C
25°C
85°C
12
2
450
425
475
RF FREQUENCY (MHz)
IIP3
18
4
GC
0
400
–20
LO LEAKAGE (dBm)
20
LO Leakage vs LO Frequency
24
GC, SSB NF (dB), IIP3 (dBm)
GC, SSB NF (dB), IIP3 (dBm)
24
22
450MHz Conversion Gain,
IIP3 and NF vs LO Power
LO-IF
(450MHz APP)
–40
–50
LO-RF
(900MHz APP)
LO-RF
(450MHz APP)
–60
LO-IF
(900MHz APP)
–70
–4
–2
0
2
LO INPUT POWER (dBm)
4
6
5527 G19
–80
400
600
800
1000
LO FREQUENCY (MHz)
1200
5527 G20
5527fa
5
LT5527
TYPICAL AC PERFORMANCE CHARACTERISTICS
Low Band (900MHz application with external
RF/LO matching) VCC = 5V, EN = High, PRF = –5dBm (–5dBm/tone for 2-tone IIP3 tests, Δf = 1MHz), PLO = 0dBm, IF output measured at
140MHz, unless otherwise noted. Test circuit shown in Figure 1.
Conversion Gain, IIP3 and NF vs
RF Frequency (900MHz Low Side
Application)
25
21
LOW SIDE LO
TA = 25°C
IF = 140MHz
19
17
15
13
11
9
SSB NF
7
5
3
IIP3
21
17
15
SSB NF
13
11
9
7
800
1000
850
900
950
RF FREQUENCY (MHz)
1050
23
21
HIGH SIDE LO
TA = 25°C
IF = 140MHz
19
17
15
13
SSB NF
7
GC, SSB NF (dB), IIP3 (dBm)
GC, SSB NF (dB), IIP3 (dBm)
25
–6
800
850
900
950
1000
RF FREQUENCY (MHz)
1050
2RF-2LO
(RF = 830MHz)
–70
3RF-3LO
(RF = 806.67MHz)
–4
–2
0
2
LO INPUT POWER (dBm)
4
6
–100
–18 –15 –12 –9 –6 –3 0 3 6
RF INPUT POWER (dBm)
–45
HIGH SIDE LO
IF = 140MHz
–40°C
25°C
85°C
19
17
15
13 SSB NF
11
9
7
GC
–50
–65
–70
–75
–85
5527 G24
4
6
3RF-3LO
(RF = 806.67MHz)
–80
–90
–2
0
2
LO INPUT POWER (dBm)
2RF-2LO
(RF = 830MHz)
–60
3
–4
TA = 25°C
LO = 760MHz
IF = 140MHz
PRF = –5dBm
–55
1
–6
–6
–4
5527 G25
TYPICAL DC PERFORMANCE CHARACTERISTICS
Supply Current vs Supply Voltage
12
2 × 2 and 3 × 3 Spurs
vs LO Power (Single Tone)
IIP3
21
9
5527 G23
–40
5
GC
1
750
–50
–60
900MHz Conversion Gain, IIP3 and
NF vs LO Power (High Side LO)
23 IIP3
3
–40
–80
5527 G22
25
5
–30
–90
Conversion Gain, IIP3 and NF vs
RF Frequency (900MHz High Side
Application)
9
–20
3
1
IFOUT
(RF = 900MHz)
–10
GC
5527 G21
11
TA = 25°C
10 LO = 760MHz
0 IF = 140MHz
LOW SIDE LO
IF = 140MHz
–40°C
25°C
85°C
19
5
GC
1
750
20
23
OUTPUT POWER (dBm)
IIP3
RELATIVE SPUR LEVEL (dBc)
GC, SSB NF (dB), IIP3 (dBm)
23
GC, SSB NF (dB), IIP3 (dBm)
25
IFOUT, 2 × 2 and 3 × 3 Spurs
vs RF Input Power (Single Tone)
900MHz Conversion Gain, IIP3 and
NF vs LO Power (Low Side LO)
0
2
–2
LO INPUT POWER (dBm)
4
6
5527 G26
Test circuit shown in Figure 1.
Shutdown Current vs Supply Voltage
82
100
81
SHUTDOWN CURRENT (μA)
SUPPLY CURRENT (mA)
80
85°C
79
60°C
78
25°C
76
0°C
–40°C
75
74
73
10
85°C
1
72
71
4.5
5
4.75
5.25
SUPPLY VOLTAGE (V)
5.5
5527 G16
60°C
25°C
–40°C
0°C
0.1
4.5
4.75
5
5.25
SUPPLY VOLTAGE (V)
5.5
5527 G17
5527fa
6
LT5527
PIN FUNCTIONS
NC (Pins 1, 2, 4, 8, 13, 14, 16): Not Connected Internally.
These pins should be grounded on the circuit board for
improved LO-to-RF and LO-to-IF isolation.
be externally connected to the VCC2 pin and decoupled
with 1000pF and 1μF capacitors.
GND (Pins 9, 12): Ground. These pins are internally
connected to the backside ground for improved isolation. They should be connected to the RF ground on the
circuit board, although they are not intended to replace
the primary grounding through the backside contact of
the package.
RF (Pin 3): Single-Ended Input for the RF Signal. This pin
is internally connected to the primary side of the RF input
transformer, which has low DC resistance to ground. If
the RF source is not DC blocked, then a series blocking
capacitor must be used. The RF input is internally matched
from 1.7GHz to 3GHz. Operation down to 400MHz or up
to 3700MHz is possible with simple external matching.
IF–, IF + (Pins 10, 11): Differential Outputs for the IF
Signal. An impedance transformation may be required to
match the outputs. These pins must be connected to VCC
through impedance matching inductors, RF chokes or a
transformer center tap.
EN (Pin 5): Enable Pin. When the input enable voltage is
higher than 3V, the mixer circuits supplied through Pins 6,
7, 10 and 11 are enabled. When the input voltage is less
than 0.3V, all circuits are disabled. Typical input current
is 50μA for EN = 5V and 0μA when EN = 0V. The EN pin
should not be left floating. Under no conditions should the
EN pin voltage exceed VCC + 0.3V, even at start-up.
LO (Pin 15): Single-Ended Input for the Local Oscillator
Signal. This pin is internally connected to the primary side
of the LO transformer, which is internally DC blocked. An
external blocking capacitor is not required. The LO input is
internally matched from 1.2GHz to 5GHz. Operation down
to 380MHz is possible with simple external matching.
VCC2 (Pin 6): Power Supply Pin for the Bias Circuits.
Typical current consumption is 2.8mA. This pin should
be externally connected to the VCC1 pin and decoupled
with 1000pF and 1μF capacitors.
Exposed Pad (Pin 17): Circuit Ground Return for the
Entire IC. This must be soldered to the printed circuit
board ground plane.
VCC1 (Pin 7): Power Supply Pin for the LO Buffer Circuits.
Typical current consumption is 23.2mA. This pin should
BLOCK DIAGRAM
15
LO
REGULATOR
LIMITING
AMPLIFIERS
VCC1
GND 12
LINEAR
AMPLIFIER
3
EXPOSED
17
PAD
IF+
IF–
RF
DOUBLE-BALANCED
MIXER
11
10
GND 9
BIAS
EN
5
VCC1
VCC2
6
7
5527 BD
5527fa
7
LT5527
TEST CIRCUITS
LOIN
L4
C4
0.062"
16
EXTERNAL MATCHING
FOR LOW FREQUENCY
LO ONLY
2
ZO
50Ω
L (mm)
C5
LO
14
NC
13
NC
GND
NC
IF
T1
L1
+ 11
3
C3
•
4
5
L2
IFOUT
240MHz
VCC2 VCC1 NC
5
EN
1
9
GND
NC
•
2
10
IF–
RF
4
GND
12
LT5527
3
BIAS
0.018"
NC
EN
EXTERNAL MATCHING
FOR LOW BAND OR
HIGH BAND ONLY
15
NC
1
RFIN
RF
GND
ER = 4.4
0.018"
6
7
8
VCC
APPLICATION
LO MATCH
C2
C1
RF MATCH
GND
RF
LO
L4
C4
L
C5
450MHz
High Side
6.8nH
10pF
4.5mm
12pF
900MHz
Low Side
3.9nH
5.6pF
1.3mm
3.9pF
900MHz
High Side
—
2.7pF
1.3mm
3.9pF
3500MHz
Low Side
—
—
4.5mm
0.5pF
5527 F01
REF DES
VALUE
SIZE
PART NUMBER
REF DES
C1
1000pF
0402
AVX 04025C102JAT
L4, C4, C5
VALUE
C2
1μF
0603
AVX 0603ZD105KAT
L1, L2
C3
2.7pF
0402
AVX 04025A2R7CAT
T1
82nH
SIZE
PART NUMBER
0402
See Applications Information
0603
Toko LLQ1608-A82N
4:1
M/A-Com ETC4-1-2 (2MHz to 800MHz)
Figure 1. Downmixer Test Schematic—Standard IF Matching (240MHz IF)
LOIN
L4
DISCRETE
IF BALUN
C4
16
EXTERNAL MATCHING
FOR LOW FREQUENCY
LO ONLY
1
2
ZO
50Ω
RFIN
L (mm)
C5
EXTERNAL MATCHING
FOR LOW BAND OR
HIGH BAND ONLY
NC
15
LO
14
NC
13
NC
NC
GND
IF
NC
12
4
RF
GND
NC
5
7
IFOUT
240MHz
9
L2
VCC2 VCC1 NC
6
C3
C7
10
IF–
EN
EN
L1
L3
LT5527
3
C6
+ 11
8
VCC
C1
C2
GND
5527 F02
REF DES
VALUE
SIZE
PART NUMBER
REF DES
C1, C3
1000pF
0402
AVX 04025C102JAT
L4, C4, C5
1μF
0603
AVX 0603ZD105KAT
L1, L2
4.7pF
0402
AVX 04025A4R7CAT
L3
C2
C6, C7
VALUE
SIZE
PART NUMBER
0402
See Applications Information
100nH
0603
Toko LLQ1608-AR10
220nH
0603
Toko LLQ1608-AR22
Figure 2. Downmixer Test Schematic—Discrete IF Balun Matching (240MHz IF)
5527fa
8
LT5527
APPLICATIONS INFORMATION
The LT5527 consists of a high linearity double-balanced
mixer, RF buffer amplifier, high speed limiting LO buffer
amplifier and bias/enable circuits. The RF and LO inputs
are both single ended. The IF output is differential. Low
side or high side LO injection can be used.
Two evaluation circuits are available. The standard evaluation circuit, shown in Figure 1, incorporates transformerbased IF matching and is intended for applications that
require the lowest LO-IF leakage levels and the widest
IF bandwidth. The second evaluation circuit, shown in
Figure 2, replaces the IF transformer with a discrete IF
balun for reduced solution cost and size. The discrete
IF balun delivers comparable noise figure and linearity,
higher conversion gain, but degraded LO-IF leakage and
reduced IF bandwidth.
RF Input Port
The mixer’s RF input, shown in Figure 3, consists of an
integrated transformer and a high linearity differential
amplifier. The primary terminals of the transformer are
connected to the RF input pin (Pin 3) and ground. The
secondary side of the transformer is internally connected
to the amplifier’s differential inputs.
at Pin 3, which improves the 1.7GHz return loss to greater
than 20dB. Likewise, the 2.7GHz match can be improved
to greater than 30dB with a series 1.5nH inductor. A series
1.5nH/2.7pF network will simultaneously optimize the lower
and upper band edges and expand the RF input bandwidth
to 1.1GHz-3.3GHz. Measured RF input return losses for
these three cases are also plotted in Figure 4a.
Alternatively, the input match can be shifted down, as low
as 400MHz or up to 3700MHz, by adding a shunt capacitor
(C5) to the RF input. A 450MHz input match is realized with
C5 = 12pF, located 4.5mm away from Pin 3 on the evaluation
board’s 50Ω input transmission line. A 900MHz input match
requires C5 = 3.9pF, located at 1.3mm. A 3500MHz input
match is realized with C5 = 0.5pF, located at 4.5mm. This
0
RF PORT RETURN LOSS (dB)
Introduction
RFIN
–15
–20
SERIES 1.5nH
ZO = 50Ω
L = L (mm)
3
RF
0.7
1.2
1.7 2.2 2.7 3.2
FREQUENCY (GHz)
3.7
4.2
5527 F04a
(4a) Series Reactance Matching
0
–5
–10
–15
NO EXTERNAL
MATCHING
–20
–25
TO
MIXER
SERIES 1.5nH
SERIES 2.7pF
SERIES 2.7pF
–30
0.2
RF PORT RETURN LOSS (dB)
EXTERNAL MATCHING
FOR LOW BAND OR
HIGH BAND ONLY
–10
–25
One terminal of the transformer’s primary is internally
grounded. If the RF source has DC voltage present, then
a coupling capacitor must be used in series with the RF
input pin.
The RF input is internally matched from 1.7GHz to 3GHz,
requiring no external components over this frequency
range. The input return loss, shown in Figure 4a, is typically 10dB at the band edges. The input match at the lower
band edge can be optimized with a series 2.7pF capacitor
NO EXTERNAL
MATCHING
–5
450MHz
C5 = 12pF
L = 4.5mm
–30
0.2
0.7
900MHz
C5 = 3.9pF
L = 1.3mm
3.5GHz
C5 = 0.5pF
L = 4.5mm
1.2 1.7 2.2 2.7 3.2
RF FREQUENCY (GHz)
3.7
4.2
5527 F04b
C5
5527 F03
Figure 3. RF Input Schematic
(4b) Series Shunt Matching
Figure 4. RF Input Return Loss With
and Without External Matching
5527fa
9
LT5527
APPLICATIONS INFORMATION
Input return loss for these three cases (450MHz, 900MHz
and 3500MHz) are plotted in Figure 4b. The input return
loss with no external matching is repeated in Figure 4b
for comparison.
RF input impedance and S11 versus frequency (with no
external matching) is listed in Table 1 and referenced to
Pin 3. The S11 data can be used with a microwave circuit
simulator to design custom matching networks and simulate board-level interfacing to the RF input filter.
Table 1. RF Input Impedance vs Frequency
FREQUENCY
(MHz)
S11
INPUT
IMPEDANCE
MAG
ANGLE
50
4.8 + j2.6
0.825
173.9
300
9.0 + j11.9
0.708
152.5
450
11.9 + j15.3
0.644
144.3
600
14.3 + j18.2
0.600
137.2
900
19.4 + j23.8
0.529
123.2
1200
26.1 + j29.8
0.467
107.4
1500
37.3 + j33.9
0.386
89.3
1850
57.4 + j29.7
0.275
60.6
2150
71.3 + j10.1
0.193
20.6
2450
64.6 – j13.9
0.175
–36.8
2650
53.0 – j21.8
0.209
–70.3
3000
35.0 – j21.2
0.297
–111.2
3500
20.7 – j9.0
0.431
–155.8
4000
14.2 + j6.2
0.564
164.8
5000
10.4 + j31.9
0.745
113.3
LO Input Port
The mixer’s LO input, shown in Figure 5, consists of an
integrated transformer and high speed limiting differential
amplifiers. The amplifiers are designed to precisely drive
the mixer for the highest linearity and the lowest noise
figure. An internal DC blocking capacitor in series with the
transformer’s primary eliminates the need for an external
blocking capacitor.
The LO input is internally matched from 1.2GHz to 5GHz, although the maximum useful frequency is limited to 3.5GHz
by the internal amplifiers. The input match can be shifted
down, as low as 750MHz, with a single shunt capacitor
(C4) on Pin 15. One example is plotted in Figure 6 where
C4 = 2.7pF produces an 850MHz to 1.2GHz match.
LO input matching below 750MHz requires the series inductor (L4)/shunt capacitor (C4) network shown in Figure 5.
Two examples are plotted in Figure 6 where L4 = 3.9nH/C4
= 5.6pF produces a 650MHz to 830MHz match and L4 =
6.8nH/C4 = 10pF produces a 540MHz to 640MHz match.
The evaluation boards do not include pads for L4, so the
circuit trace needs to be cut near Pin 15 to insert L4. A low
cost multilayer chip inductor is adequate for L4.
The optimum LO drive is –3dBm for LO frequencies above
1.2GHz, although the amplifiers are designed to accommodate several dB of LO input power variation without
significant mixer performance variation. Below 1.2GHz,
EXTERNAL
MATCHING
FOR LOW BAND
ONLY
LOIN
TO
MIXER
L4
15
LO
C4
VBIAS
LIMITER
VCC2
5527 F05
Figure 5. LO Input Schematic
0
–5
LO PORT RETURN LOSS (dB)
series transmission line/shunt capacitor matching topology allows the LT5527 to be used for multiple frequency
standards without circuit board layout modifications. The
series transmission line can also be replaced with a series
chip inductor for a more compact layout.
L4 = 6.8nH
C4 = 10pF
L4 = 0nH
C4 = 2.7pF
–10
NO
EXTERNAL
MATCHING
–15
L4 = 3.9nH
C4 = 5.6pF
–20
–25
–30
0.1
1
LO FREQUENCY (GHz)
5
5527 F06
Figure 6. LO Input Return Loss
5527fa
10
LT5527
APPLICATIONS INFORMATION
0dBm LO drive is recommended for optimum noise figure,
although –3dBm will still deliver good conversion gain
and linearity.
Custom matching networks can be designed using the port
impedance data listed in Table 2. This data is referenced
to the LO pin with no external matching.
8. Frequency-dependent differential IF output impedance
is listed in Table 3. This data is referenced to the package
pins (with no external components) and includes the effects of IC and package parasitics. The IF output can be
matched for IF frequencies as low as several kHz or as
high as 600MHz.
Table 3. IF Output Impedance vs Frequency
Table 2. LO Input Impedance vs Frequency
S11
FREQUENCY (MHz)
DIFFERENTIAL OUTPUT
IMPEDANCE (RIF || XIF)
1
415||-j64k
10
415||-j6.4k
FREQUENCY
(MHz)
INPUT
IMPEDANCE
MAG
ANGLE
50
30.4 – j355.7
0.977
–15.9
300
8.7 – j52.2
0.847
–86.7
450
9.4 – j25.4
0.740
–124.8
600
11.5 – j8.9
0.635
–158.7
900
19.7 + j12.8
0.463
146.7
1200
34.3 + j24.3
0.330
106.9
1500
49.8 + j21.3
0.209
78.5
1850
53.8 + j8.9
0.093
61.7
2150
50.4 + j3.2
0.032
80.5
2450
45.1 + j0.3
0.052
176.5
2650
41.1 + j2.4
0.101
163.1
3000
41.9 + j8.1
0.124
129.8
3500
49.0 + j12.0
0.120
87.9
• Direct 8:1 transformer
4000
55.4 + j8.6
0.096
53.2
• Lowpass matching + 4:1 transformer
5000
33.2 + j8.7
0.226
146.7
70
415||-j909
140
413||-j453
240
407||-j264
300
403||-j211
380
395||-j165
450
387||-j138
500
381||-j124
The following three methods of differential to single-ended
IF matching will be described:
• Discrete IF balun
IF Output Port
The IF outputs, IF+ and IF–, are internally connected to the
collectors of the mixer switching transistors (see Figure 7).
Both pins must be biased at the supply voltage, which
can be applied through the center tap of a transformer or
through matching inductors. Each IF pin draws 26mA of
supply current (52mA total). For optimum single-ended
performance, these differential outputs should be combined externally through an IF transformer or a discrete IF
balun circuit. The standard evaluation board (see Figure
1) includes an IF transformer for impedance transformation and differential to single-ended transformation. A
second evaluation board (see Figure 2) realizes the same
functionality with a discrete IF balun circuit.
The IF output impedance can be modeled as 415Ω in parallel
with 2.5pF at low frequencies. An equivalent small-signal
model (including bondwire inductance) is shown in Figure
IF+
L1
4:1
11
C3
IF–
IFOUT
50Ω
VCC
10
L2
VCC
5527 F07
Figure 7. IF Output with External Matching
0.7nH
RS
415Ω
IF+
11
2.5pF
IF–
10
0.7nH
5527 F08
Figure 8. IF Output Small-Signal Model
5527fa
11
LT5527
APPLICATIONS INFORMATION
Direct 8:1 IF Transformer Matching
Table 4. IF Matching Element Values
PLOT
IF FREQUENCY
(MHz)
L1, L2
(nH)
C3
(pF)
IF
TRANSFORMER
1
1 to 100
Short
—
TC8-1 (8:1)
—
ETC4-1-2 (4:1)
2
140
120
25
3
190
110
2.7
ETC4-1-2 (4:1)
23
4
240
82
2.7
ETC4-1-2 (4:1)
5
380
56
2.2
ETC4-1-2 (4:1)
6
450
43
2.2
ETC4-1-2 (4:1)
IIP3
21
19
17
15
SSB NF
13
RF = 900MHz
HIGH SIDE LO AT 0dBm
VCC = 5V DC
TA = 25°C
C4 = 2.7pF, C5 = 3.9pF
0
11
9
–5
7
GC
5
3
1
10
20
30 40 50 60 70 80 90 100
IF OUTPUT FREQUENCY (MHz)
5527 F09
Figure 9. Typical Conversion Gain, IIP3 and
SSB NF Using an 8:1 IF Transformer
Lowpass + 4:1 IF Transformer Matching
The lowest LO-IF leakage and wide IF bandwidth are realized by using the simple, three element lowpass matching
network shown in Figure 7. Matching elements C3, L1 and
L2, in conjunction with the internal 2.5pF capacitance,
form a 400Ω to 200Ω lowpass matching network which
is tuned to the desired IF frequency. The 4:1 transformer
then transforms the 200Ω differential output to a 50Ω
single-ended output.
This matching network is most suitable for IF frequencies
above 40MHz or so. Below 40MHz, the value of the series
inductors (L1 and L2) becomes unreasonably high, and
could cause stability problems, depending on the inductor value and parasitics. Therefore, the 8:1 transformer
technique is recommended for low IF frequencies.
Suggested lowpass matching element values for several IF
IF PORT RETURN LOSS (dB)
GC (dB), IIP3 (dBm), SSB NF (dB)
For IF frequencies below 100MHz, the simplest IF matching
technique is an 8:1 transformer connected across the IF
pins. The transformer will perform impedance transformation and provide a single-ended 50Ω output. No other
matching is required. Measured performance using this
technique is shown in Figure 9. This matching is easily
implemented on the standard evaluation board by shorting across the pads for L1 and L2 and replacing the 4:1
transformer with an 8:1 (C3 not installed).
frequencies are listed in Table 4. High-Q wire-wound chip
inductors (L1 and L2) improve the mixer’s conversion gain
by a few tenths of a dB, but have little effect on linearity.
Measured output return losses for each case are plotted
in Figure 10 for the simple 8:1 transformer method and
for the lowpass/4:1 transformer method.
–10
–15
–20
2
–25
4
5
6
1
–30
0
3
50 100 150 200 250 300 350 400 450 500
IF FREQUENCY (MHz)
5527 F10
Figure 10. IF Output Return Losses
with Lowpass/Transformer Matching
Discrete IF Balun Matching
For many applications, it is possible to replace the IF
transformer with the discrete IF balun shown in Figure 2.
The values of L1, L2, C6 and C7 are calculated to realize
a 180 degree phase shift at the desired IF frequency and
provide a 50Ω single-ended output, using the equations
listed below. Inductor L3 is calculated to cancel the internal 2.5pF capacitance. L3 also supplies bias voltage
to the IF+ pin. Low cost multilayer chip inductors are
adequate for L1 and L2. A high Q wire-wound chip inductor is recommended for L3 to maximize conversion gain
and minimize DC voltage drop to the IF+ pin. C3 is a DC
blocking capacitor.
5527fa
12
LT5527
APPLICATIONS INFORMATION
0
R •R
L1, L2 = IF OUT
ωIF
IF PORT RETURN LOSS (dB)
1
ωIF • RIF • ROUT
XIF
L3 =
ωIF
–10
–15
190MHz
–20
240MHz
Table 5. Discrete IF Balun Element Values (ROUT = 50Ω)
IF FREQUENCY
(MHz)
L1, L2
(nH)
C6, C7
(pF)
L3
(nH)
190
120
6.8
220
240
100
4.7
220
380
56
3
68
450
47
2.7
47
For fully differential IF architectures, the IF transformer can
be eliminated. An example is shown in Figure 14, where
the mixer’s IF output is matched directly into a SAW filter.
Supply voltage to the mixer’s IF pins is applied through
50 100 150 200 250 300 350 400 450 500 550
IF FREQUENCY (MHz)
5527 F11
Figure 11. IF Output Return Losses with Discrete Balun Matching
26
0
24
22
IIP3
–10
20
GC (dB), IIP3 (dBm)
Discrete IF balun element values for four common IF frequencies are listed in Table 5. The corresponding measured
IF output return losses are shown in Figure 11. The values
listed in Table 5 differ from the calculated values slightly
due to circuit board and component parasitics. Typical
conversion gain, IIP3 and LO-IF leakage, versus RF input
frequency, for all four IF frequency examples is shown in
Figure 12. Typical conversion gain, IIP3 and noise figure
versus IF output frequency for the same circuits are shown
in Figure 13.
–30
190IF
240IF
380IF
450IF
18
16
14
LOW SIDE LO (–3dBm)
–20
TA = 25°C
–30
12
10
LO-IF
8
6
4
–50
GC
2
1700
–40
LO-IF LEAKAGE (dBm)
Compared to the lowpass/4:1 transformer matching technique, this network delivers approximately 0.8dB higher
conversion gain (since the IF transformer loss is eliminated) and comparable noise figure and IIP3. At a ±15%
offset from the IF center frequency, conversion gain and
noise figure degrade about 1dB. Beyond ±15%, conversion gain decreases gradually but noise figure increases
rapidly. IIP3 is less sensitive to bandwidth. Other than IF
bandwidth, the most significant difference is LO-IF leakage,
which degrades to approximately –38dBm compared to
the superior performance realized with the lowpass/4:1
transformer matching.
380MHz
450MHz
–25
1900
2300
2500
2100
RF INPUT FREQUENCY (MHz)
–60
2700
5527 F12
Figure 12. Conversion Gain, IIP3 and LO-IF Leakage vs RF Input
Frequency Using Discrete IF Balun Matching
GC, SSB NF (dB), IIP3 (dBm)
C6,C7 =
–5
26
24
22
IIP3
20
LOW SIDE LO (–3dBm)
TA = 25°C
18
16
14
12
SSB NF
190IF
10
240IF
8
380IF
6
450IF
GC
4
2
0
150 200 250 300 350 400 450 500 550
IF OUTPUT FREQUENCY (MHz)
5527 F13
Figure 13. Conversion Gain, IIP3 and SSB NF vs IF Output
Frequency Using Discrete IF Balun Matching
5527fa
13
LT5527
APPLICATIONS INFORMATION
matching inductors in a band-pass IF matching network.
The values of L1, L2 and C3 are calculated to resonate at
the desired IF frequency with a quality factor that satisfies
the required IF bandwidth. The L and C values are then
adjusted to account for the mixer’s internal 2.5pF capacitance and the SAW filter’s input capacitance. In this case,
the differential IF output impedance is 400Ω since the
bandpass network does not transform the impedance.
L1
+
IF
SAW
FILTER
IF
AMP
C3
IF–
SUPPLY
DECOUPLING
L2
5527 F14
VCC
Additional matching elements may be required if the SAW
filter’s input impedance is less than or greater than 400Ω.
Contact the factory for application assistance.
Figure 14. Bandpass IF Matching for Differential IF Architectures
Standard Evaluation Board Layout
Discrete IF Evaluation Board Layout
5527fa
14
LT5527
PACKAGE DESCRIPTION
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
0.72 ±0.05
4.35 ± 0.05
2.15 ± 0.05
2.90 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.30 ±0.05
0.65 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
BOTTOM VIEW—EXPOSED PAD
4.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.115
TYP
15
PIN 1 NOTCH R = 0.20 TYP
OR 0.35 × 45° CHAMFER
16
0.55 ± 0.20
PIN 1
TOP MARK
(NOTE 6)
1
2.15 ± 0.10
(4-SIDES)
2
(UF16) QFN 10-04
0.200 REF
0.00 – 0.05
0.30 ± 0.05
0.65 BSC
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
5527fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LT5527
RELATED PARTS
PART NUMBER DESCRIPTION
COMMENTS
Infrastructure
LT5511
High Linearity Upconverting Mixer
RF Output to 3GHz, 17dBm IIP3, Integrated LO Buffer
LT5512
1kHz to 3GHz High Signal Level Active Mixer
Optimized for HF/VHF/UHF Applications, 20dBm IIP3 11dB NF
LT5514
Ultralow Distortion, IF Amplifier/ADC Driver with
Digitally Controlled Gain
850MHz Bandwidth, 47dBm OIP3 at 100MHz, 10.5dB to 33dB Gain Control Range
LT5515
1.5GHz to 2.5GHz Direct Conversion Quadrature
Demodulator
20dBm IIP3, Integrated LO Quadrature Generator
LT5516
0.8GHz to 1.5GHz Direct Conversion Quadrature
Demodulator
21.5dBm IIP3, Integrated LO Quadrature Generator
LT5517
40MHz to 900MHz Quadrature Demodulator
21dBm IIP3, Integrated LO Quadrature Generator
LT5519
0.7GHz to 1.4GHz High Linearity Upconverting Mixer 17.1dBm IIP3 at 1GHz, Integrated RF Output Transformer with 50Ω Matching,
Single-Ended LO and RF Ports Operation
LT5520
1.3GHz to 2.3GHz High Linearity Upconverting Mixer 15.9dBm IIP3 at 1.9GHz, Integrated RF Output Transformer with 50Ω Matching,
Single-Ended LO and RF Ports Operation
LT5521
10MHz to 3700MHz High Linearity
Upconverting Mixer
24.2dBm IIP3 at 1.95GHz, NF = 12.5dB, 3.15V to 5.25V Supply, Single-Ended
LO Port Operation
LT5522
400MHz to 2.7GHz High Signal Level
Downconverting Mixer
4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz, NF = 12.5dB, 50Ω Single-Ended RF
and LO Ports
LT5524
Low Power, Low Distortion ADC Driver with Digitally 450MHz Bandwidth, 40dBm OIP3, 4.5dB to 27dB Gain Control
Programmable Gain
LT5525
High Linearity, Low Power Downconverting Mixer
Single-Ended 50Ω RF and LO Ports, 17.6dBm IIP3 at 1900MHz, ICC = 28mA
LT5526
High Linearity, Low Power Downconverting Mixer
3V to 5.3V Supply, 16.5dBm IIP3, 100kHz to 2GHz RF, NF = 11dB, ICC = 28mA,
–65dBm LO-RF Leakage
LT5557
400MHz to 3.8GHz, 3.3V High Signal Level
Downconverting Mixer
Single-Ended RF and LO Ports, 24.7dBm IIP3 at 1950MHz, NF = 11.7dB
RF Power Detectors
LT5504
800MHz to 2.7GHz RF Measuring Receiver
80dB Dynamic Range, Temperature Compensated, 2.7V to 5.25V Supply
LTC®5505
RF Power Detectors with >40dB Dynamic Range
300MHz to 3GHz, Temperature Compensated, 2.7V to 6V Supply
LTC5507
100kHz to 1000MHz RF Power Detector
100kHz to 1GHz, Temperature Compensated, 2.7V to 6V Supply
LTC5508
300MHz to 7GHz RF Power Detector
44dB Dynamic Range, Temperature Compensated, SC70 Package
LTC5509
300MHz to 3GHz RF Power Detector
36dB Dynamic Range, Low Power Consumption, SC70 Package
LTC5530
300MHz to 7GHz Precision RF Power Detector
Precision VOUT Offset Control, Shutdown, Adjustable Gain
LTC5531
300MHz to 7GHz Precision RF Power Detector
Precision VOUT Offset Control, Shutdown, Adjustable Offset
LTC5532
300MHz to 7GHz Precision RF Power Detector
Precision VOUT Offset Control, Adjustable Gain and Offset
LT5534
50MHz to 3GHz RF Power Detector with 60dB
Dynamic Range
±1dB Output Variation over Temperature, 38ns Response Time
LTC5536
Precision 600MHz to 7GHz RF Detector with Fast
Compatator Output
25ns Response Time, Comparator Reference Input, Latch Enable Input,
–26dBm to +12dBm Input Range
Low Voltage RF Building Block
LT5546
500MHz Quadrature Demodulator with VGA and
17MHz Baseband Bandwidth
17MHz Baseband Bandwidth, 40MHz to 500MHz IF, 1.8V to 5.25V Supply,
–7dB to 56dB Linear Power Gain
Wide Bandwidth ADCs
LTC1749
12-Bit, 80Msps
500MHz BW S/H, 71.8dB SNR
LTC1750
14-Bit, 80Msps
500MHz BW S/H, 75.5dB SNR
5527fa
16 Linear Technology Corporation
LT 1108 REV A • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2005