ONSEMI MC34271FB

MC34271
Liquid Crystal Display and
Backlight Integrated
Controller
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32
1
QFP–32
FB SUFFIX
CASE 873
t
31
30
29
28
27
26
25
Sync
RT
Gnd
VA
Vref
EN1
EN2
1 DS1
DS2 24
2 Ref1
Ref2 23
4 Comp1
5 SS1
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ÁÁÁ
SS2 20
V2
V1
V0
8 Drv1
V3
D2 18
V4
7 D1
VDD
S2 19
Mode
6 S1
9
10
11
12
13
14
15
16
VB 17
(Top View)
MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.)
Rating
Comp2 21
ELD
Negative Supply Voltages
Logic Enable Allows Microprocessor Control of All Outputs
Synchronizable to External Clock
Mode Commandable for ELD and LCD Interface
Frequency Synchronizable
Auxiliary Output Bias Voltages Enable Load Control via N–Channel
FETs
FB2 22
MC34271
3 FB1
• Low Standby Bias Current of 5.0 µA
• Uncommitted Switching Regulators Allow Both Positive and
•
•
•
•
•
32
AWLYYWW
MC34271 Features:
PIN CONNECTIONS AND
MARKING DIAGRAM
SW1
The MC34271 is a low power dual switching voltage regulator,
specifically designed for handheld and laptop applications, to provide
several regulated output voltages using a minimum of external parts.
Two uncommitted switching regulators feature a very low standby
bias current of 5.0 µA, and an operating current of 7.0 mA capable of
supplying output currents in excess of 200 mA.
Both devices have three additional features. The first is an ELD
Output that can be used to drive a backlight or a liquid crystal display.
The ELD output frequency is the clock divided by 256. The second
feature allows four additional output bias voltages, in specific
proportions to VB, one of the switching regulated output voltages. It
allows use of mixed logic circuitry and provides a voltage bias for
N–Channel load control MOSFETs . The third feature is an Enable
input that allows a logic level signal to turn–“off” or turn–“on” both
switching regulators.
Due to the low bias current specifications, this device is ideally
suited for battery powered computer, consumer, and industrial
equipment where an extension of useful battery life is desirable.
A
WL
YY
WW
= Assembly Location
= Wafer Lot
= Year
= Work Week
Symbol
Value
Unit
Input Voltage
VDD
16
Vdc
Power Dissipation and
Thermal Characteristics
Maximum Power Dissipation – Case 873
Thermal Resistance, Junction–to–Ambient
Thermal Resistance, Junction–to–Case
PD
RθJA
RθJC
1.43
100
60
W
°C/W
°C/W
ISL & ISB
500
mA
Device
Package
Shipping
Output #1 and #2 “Off”–State Voltage
VSL
60
Vdc
MC34271FB
QFP–32
250 Units / Tray
Feedback Enable MOSFETs
“Off”–State Voltage
VLF
20
Vdc
TJ
125
°C
TA
0 to +70
°C
Tstg
– 55 to +150
°C
Output #1 and #2 Switch Current
Operating Junction Temperature
Operating Ambient Temperature
Storage Temperature Range
 Semiconductor Components Industries, LLC, 2000
April, 2000 – Rev. 0
1
ORDERING INFORMATION
Publication Order Number:
MC34271/D
MC34271
Representative Block Diagram
Vin
SW1
VDD
32
EL
Panel
On/Off
EL
Control
EN1
D1
Circuit #1
PWM
7
S1
26
6
ELD
Drv1
9
8
Sync 31
÷2
OSC
ELD
EN
27
Ref1
FB1
VDD
11
Vin
Mode
10
RT 30
VRef
VDD
D2
Vref
1.25 V
Circuit #2
PWM
2
18
S2
19
3
Comp1
VB
4
µP Control
17
EN2
25
V0
From DAC
VB
VB
16
Ref2
FB2 23
V1
22
Comp2
15
V0
V1
21
V2
V2
14
BIAS Output
Buffers
VA = 5.0 V
28
BIAS
V3
13
V4
Gnd
29
12
This device contains 350 active transistors.
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2
V3
V4
MC34271
ELECTRICAL CHARACTERISTICS (VDD = 6.0 V, for typical values TA = Low to High [Note 1], for min/max values TA is
the operating ambient temperature range that applies, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Vref
1.225
1.250
1.275
V
Line Regulation (VDD = 5.0 V to 12.5 V)
Regline
–
2.0
10
mV
Load Regulation (IO = 0 to 120 µA)
Regload
–
2.0
10
mV
Vref
1.215
–
1.285
V
Input Offset Voltage (VCM = 1.25 V)
VIO
–
1.0
10
mV
Input Bias Current (VCM = 1.25 V)
IIB
–
120
600
nA
Open Loop Voltage Gain (VCM = 1.25 V, VCOMP = 2.0 V)
AVOL
80
100
–
dB
Output Voltage Swing
High State (IOH = –100 µA)
Low State (IOL = 100 µA)
VeOH
VeOL
VA–1.5
0
4.0
–
5.5
1.0
VA
4.6
5.0
5.4
90
115
140
REFERENCE SECTION
Reference Voltage (TJ = 25°C)
Total Variation (Line, Load and Temperature)
ERROR AMPLIFIERS
V
BIAS VOLTAGE
Voltage (VDD = 5.0 V to 12.5 V, IO = 0)
V
OSCILLATOR AND PWM SECTIONS
Total Frequency Variation Over Line and Temperature
VDD = 5.0 V to 10 V, TA = 0° to 70°C, RT = 169 k
fOSC
kHz
Duty Cycle at Each Output
Maximum
Minimum
DCmax
DCmin
92
–
95
–
–
0
%
Sync Input
Input Resistance (Vsync = 3.5 V)
Minimum Sync Pulse Width
Rsync
Tp
25
–
50
1.0
100
–
kΩ
µs
Output Voltage – “On”–State (Isink = 200 mA)
VOL
–
150
250
mV
Output Current – “Off”–State (VOH = 40 V)
IOH
–
0.1
1.0
µA
Rise and Fall Times
tr, tf
–
50
–
ns
Output Voltage – “On”–State (Isink = 100 µA)
VOL
–
30
100
mV
Output Voltage – “On”–State (Isink = 50 mA)
VOL
–
2.0
2.5
V
Output Voltage – “Off”–State (Isource = –100 µA)
VOH
VDD–0.5
5.9
–
V
Output Voltage – “Off”–State (Isource = – 50 mA)
VOH
VDD–3.5
3.3
–
V
Output Voltage – “Low”–State (Isink = 1.0 mA)
VfeOL
–
10
100
mV
Output Current – “Off”–State (VOH = 12.5 V)
IfeOH
–
0.6
1.0
µA
VswOH
VswOL
5.5
0
5.9
0.1
6.0
0.2
Rds
Ilkg
V0
R0
0
0
29.5
20
2.0
0.1
29.9
40
10
2.0
30
60
OUTPUT MOSFETs
EL DISCHARGE OUTPUT (ELD) AND DRV1
FEEDBACK ENABLE SWITCHES (DS1, DS2)
SWITCHED VDD OUTPUT (SW1)
Output Voltage
Switch “On” (EN1 = 1, Isource = 100 µA)
Switch “Off” (EN1 = 0, Isink = 100 µA)
V
AUXILIARY VOLTAGE OUTPUTS
V0 Enable Switch
“On”–Resistance: VB to V0
“Off”–State Leakage Current (VB = 10 V)
V0 Voltage (VB = 30 V, Isource = 0 mA)
V0 Resistance (Isource = 4.0 mA)
NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
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Ω
µA
V
Ω
MC34271
ELECTRICAL CHARACTERISTICS (continued) (VDD = 6.0 V, for typical values TA = Low to High [Note 1], for min/max values TA is
the operating ambient temperature range that applies, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Ro
Iss
0.0500
0.1010
0.1010
0.0500
20
5.0
0.0520
0.1035
0.1035
0.0520
40
10
0.0535
0.1065
0.1065
0.0535
60
20
Ω
mA
Input Low State
VIL
0
–
0.8
V
Input High State
VIH
2.0
–
6.0
V
Input Impedance
Rin
25
50
100
kΩ
Ichg
0.5
1.0
2.5
µA
Idschg
250
650
–
µA
ICC
–
–
2.0
3.0
5.0
15
µA
VDD Current
Backlight “On” (EN1 = 1; EN2 = 0)
ICC
–
0.7
3.0
mA
VDD Current
LCD “On” (No Inductor) (EN1 = 0; EN2 = 1)
ICC
–
0.9
2.0
mA
IO
–
1.2
3.0
mA
AUXILIARY VOLTAGE OUTPUTS
V1, V2, V3, V4 Outputs
1–V1/V0 Ratio
1–V2/V0 Ratio
V3/V0 Ratio
V4/V0 Ratio
Output Resistance (Isource = 4.0 mA)
Output Short Circuit Current
LOGIC INPUTS (EN1, EN2, MODE)
SOFT START CONTROL (SS1,SS2)
Charge Current (Capacitor Voltage = 1.0 V to 4.0 V)
Discharge Current (Capacitor Voltage = 1.0 V)
TOTAL SUPPLY CURRENT
VDD Current
Standby Mode (EN1 = EN2 = 0)
VDD = 6.0 V
VDD = 16 V
VB Current (V0 = 35 V)
NOTE: 1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
100
AVOL, OPEN LOOP VOLTAGE GAIN (dB)
DC, SWITCH OUTPUT DUTY CYCLE
1.0
VDD = 6.0 V
TA = 25°C
0.8
0.6
0.4
0.2
0
1.5
2.0
2.5
3.0
3.5
4.0
80
Gain
60
Phase
40
90
20
120
0
150
– 20
10
4.5
0
VDD = 6.0 V
VComp = 2.5 V
30
RL = Open
TA = 25°C
60
VComp, COMPENSATION VOLTAGE (V)
100
1.0 k
10 k
100 k
f, FREQUENCY (Hz)
Figure 2. Error Amp Open Loop Gain and
Phase versus Frequency
Figure 1. Switch Output Duty Cycle versus
Compensation Voltage
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4
180
1000 k
MC34271
0
2.5
2.2
VA
–15
– 20
VDD = 6.0 V
TA = 25°C
– 25
– 30
0
1.0
2.0
3.0
4.0
FET DRAIN VOLTAGE (V)
0.5
0
2.0
4.0
6.0
8.0
RT = 169 k
No Loading
TA = 25°C
10
12
14
16
0.6
0.2
18
VDD, SUPPLY VOLTAGE (V)
Figure 3. Reference Voltage Change versus
Reference Current
Figure 4. Quiescent Current versus Supply Voltage
0.08
0.04
VDD = 6.0 V
TA = 25°C
0
50
100
150
200
0
2.0
VDD
Sink Saturation
–1.0
VDD = 6.0 V
TA = 25°C
1.5
– 2.0
1.0
Source Saturation
– 3.0
– 4.0
0
15
0.5
30
0
60
45
ID, DRAIN CURRENT (mA)
ISource, SWITCH OUTPUT CURRENT (mA)
Figure 5. FET Drain Voltage versus Sink Current
Figure 6. ELD and DRV1 Switch Output Source
and Sink Saturation versus Current
OSCILLATOR FREQUENCY CHANGE (kHz)
0.30
VDD = 6.0 V
0.25
VOLTAGE VARIATION (V)
1.0
Standby Current
EN1 and EN2 = 0
I, CURRENT DRAW (mA)
0.12
VA
0.20
0.15
0.10
Vref
0.05
0
– 0.05
– 0.10
1.4
EN1 = 1 and EN2 = 0
1.0
5.0
0.16
0
1.5
1.8
0
10
20
30
40
50
60
70
8.0
VDD = 6.0 V
RT = 169 k
6.0
4.0
2.0
0
– 2.0
– 4.0
– 6.0
– 8.0
0
TA, AMBIENT TEMPERATURE (°C)
10
20
30
40
50
60
TA, AMBIENT TEMPERATURE (°C)
Figure 8. Oscillator Frequency Variation
versus Temperature
Figure 7. Vref and VA Variation
versus Temperature
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5
70
T SIN SAT RATION ( )
–10
EN1 and EN2 = 1
2.0
SWITC O T
QUIESCENT CURRENT (mA)
– 5.0
Vsat, SWITCH OUTPUT SOURCE SATURATION (V)
OUTPUT VOLTAGE DROP (mV)
Vref
MC34271
5.0
REFERENCE VOLTAGE (V)
FREQUENCY (kHz)
1000
VDD = 6.0 V
TA = 25°C
100
10
0
100
4.0
VA
3.0
2.0
1.0
0
1000
RT = 169 k
TA = 25°C
Vref
0
1.0
2.0
TIMING RESISTANCE (kΩ, s)
3.0
4.0
5.0
6.0
VDD LEVEL (V)
Figure 10. VA, Vref versus VDD
Figure 9. Frequency versus Timing
OPERATING DESCRIPTION
reference and oscillator, can be activated by either EN1
or EN2.
Circuit #1 has an ELD output which may be used to drive
an LCD or backlight. Its output frequency is the oscillator
frequency divided by 1024.
The MC34271 is a monolithic, fixed frequency power
switching regulator specifically designed for dc to dc
converter and battery powered applications. This device
operates as a fixed frequency, voltage mode regulator
containing all the active functions required to directly
implement step–up, step–down and voltage inverting
converters with a minimum number of external components.
Potential markets include battery powered, handheld,
automotive, computer, industrial and cost sensitive
consumer products. A description of each section is given
below with the representative block diagram shown in
Figure 11.
Error Amplifiers and Reference
Each error amplifier is provided with access to both
inverting and noninverting inputs, and the output. The Error
Amplifiers’ Common Mode Input Range is 0 to 2.5 V. The
amplifiers have a minimum dc voltage gain of 60 dB. The
1.25 V reference has an accuracy of ± 4.0% at room
temperature.
External loop compensation is required for converter
stability. A simple low–pass filter is formed by connecting
a resistive divider from the output to the error amplifier
inverting input, and a series resistor–capacitor from the error
amplifier output also to the to the inverting input. The step
down converter is easiest to compensate for stability. The
step–up and voltage inverting configurations, when
operated as continuous conduction boost or flyback
converters, are more difficult to compensate, and may
require a lower loop design bandwidth.
Oscillator
The oscillator frequency is programmed by resistor RT.
The charge to discharge ratio is controlled to yield a 95%
maximum duty cycle at the switch outputs. During the fall
time of the internal sawtooth waveform, the oscillator
generates an internal blanking pulse that holds the inverting
input of the AND gates high, disabling the output switching
MOSFETs. The internal sawtooth waveform has a nominal
peak voltage of 3.3 V and a valley voltage of 1.7 V.
Pulse Width Modulators
MOSFET Switch Outputs
Both pulse width modulators consist of a comparator with
the oscillator ramp voltage applied to the noninverting input,
while the error amplifier output is applied to the inverting
input. A third input to the comparator has a 0.5 mA typical
current source that can be used to implement soft start.
Output switch conduction is initiated when the ramp
waveform is discharged to the valley voltage. As the ramp
voltage increases to a voltage that exceeds the error
amplifier output, the latch resets, terminating output
MOSFET conduction for the duration of the oscillator ramp.
This PWM/latch combination prevents multiple output
pulses during a given oscillator cycle.
Each PWM circuit is enabled by a logic input. When
disabled, the entire block is turned off, drawing only leakage
current from the power source. Shared circuits, like the
The output MOSFETs are designed to switch a maximum
of 60 V, with a peak drain current capability of 500 mA. In
circuit #1 an additional DRV1 output is provided for
interfacing with an external MOSFET.The gates of the
MOSFETs are held low when the circuit is disabled.
Auxiliary Output Voltages
Output voltages V0 through V4 are provided for use as
references or bias voltages. V0 is the circuit #2 output
voltage, when an internal FET switch is activated. The other
auxiliary output voltages are proportional to VB. The
amplifiers for V1 and V2 are powered from V0, while the
amplifiers for V3 and V4 are powered from VDD.
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MC34271
Figure 11. Representative Block Diagram Electroluminescent Backlight Configuration
SW1
Circuit #1 Bias Supply
32
EL
Panel
1
Q
÷N
ELD
9
VDD
÷2
OSC
31 Sync
Mode
10
D2
Vref
1.25 V
27
Q
R
En
2
3
FB1
DAC
S2 19
ÎÎ
ÎÎ
VDD
4 Comp1
SS1
5
VB
18
S
Ref1
Brightness
VDD
11
30 RT
169 k
“On/Off”
S1 6
R
VDD
8 Drv1
7
S
Î
Î
EN1
26
D1
En
DS1
VDD2
Circuit #2
Bias Supply
Ref2
VB
6.0 V to 30 V
VB
23
22 FB2
Comp2
21 SS2
20
17
V0
V0
16
DS2
V1
V1
24
15
V2
V2
25 EN2
14
VA
28
VDD2
V3
BIAS
V3
13
VDD2
V4
Gnd
29
V4
12
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7
LCD
Display
MC34271
Figure 12. Auxiliary Supply Configuration
12 V
SW1
Circuit #1 Bias Supply
32
D1
En
DS1
1
EN1
26
ÎÎ
Î
Î
VDD
Q
S1 6
R
÷N
ELD
9
8 Drv1
VDD
÷2
OSC
31 Sync
169 k
2
3
12 V
10
D2
Vref
1.25 V
LCD
Contrast
DAC
18
S
Ref1
R
En
FB1
S2 19
Q
Î
ÎÎ
VDD
4 Comp1
SS1
5
VB
VDD
5.0 V to 16 V
11
Mode
30 RT
27
– 27 V
7
S
VDD2
Circuit #2
Bias Supply
Ref2
23
22 FB2
Comp2
21 SS2
20
VB
VB
6.0 V to 30 V
17
V0
V0
16
DS2
V1
V1
24
15
25 EN2
V2
V2
14
VA
28
VDD2
V3
BIAS
V3
13
VDD2
V4
Gnd
29
V4
12
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LCD
Display
MC34271
Figure 13. EL PANEL Drive Circuit
Vin 6.0 V
+
MC34271
10 µF
0.22 µF
200 V
MR856
8
2.2 M
SW1
Circuit #1 Bias Supply
32
D1
En
ÎÎ
Î
EN1
26
VDD
8 Drv1
÷2
9.1 k
160 k
Q
R
÷N
9
VDD
10 k
MMBT2907
4T
#36
5
120T
1 #36
15 k
EL
PANEL
7 MPSA44
120T
#36
2
0.1
µF
MR856
1.0 k
11
Mode
10
MTP3055EL
10
D2
18
S
R
2.2 k
S2 19
Q
Î
ÎÎ
Î
VDD
3 FB1
4 Comp1
SS1
0.1 µF 5
1.0 k
4
400 Hz
ELD
4.3 M 15 pF
22 k
4T
#36
6
S1 6
30 RT
Vref
Vref
1.25 V
0.1 27
µF
2 Ref1
8.25 k
7
S
OSC
31 Sync
3
VDD2
Circuit #2
Bias Supply
DS1
1
DAC
1.0 k
VB
8.2 k
Ref2
23
22 FB2
Comp2
21 SS2
20
VB
VB
17
V0
V0
16
DS2
V1
V1
24
15
25 EN2
V2
V2
14
VA
28
VDD2
V3
BIAS
V3
13
VDD2
V4
Gnd
29
V4
12
NOTES::1. Transformer information TDK Core # PC40EEM12.7/13.7–Z
Bobbin # BEPC–10–118G 2 mil gap. LP = 1.6 µhy.
2. EL PANEL: DUREL 3/SL ORANGE
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9
LCD
Display
MC34271
PACKAGE DIMENSIONS
QFP–32
FB SUFFIX
CASE 873–01
ISSUE A
L
24
17
B
DETAIL A
32
D
S
H A–B
V
M
L
0.20 (0.008)
–B–
–A–
0.20 (0.008) M C A–B
0.05 (0.002) A–B
S
D
S
16
S
25
B
1
P
B
9
8
–D–
–A–,–B–,–D–
A
0.20 (0.008) M C A–B
0.05 (0.002) A–B
S
D
S
S
D
S
DETAIL A
S
0.20 (0.008)
H A–B
M
F
BASE METAL
DETAIL C
M
J
C E
–H–
–C–
DATUM
PLANE
0.01 (0.004)
SEATING
PLANE
H
M
G
N
D
0.20 (0.008)
M
C A–B
S
D
S
SECTION B–B
VIEW ROTATED 90° CLOCKWISE
U
T
R
–H–
DATUM
PLANE
K
X
DETAIL C
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
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10
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
X
MILLIMETERS
MIN
MAX
6.95
7.10
6.95
7.10
1.40
1.60
0.273 0.373
1.30
1.50
0.273
–
0.80 BSC
–
0.20
0.119 0.197
0.33
0.57
5.6 REF
6°
8°
0.119 0.135
0.40 BSC
5°
10°
0.15
0.25
8.85
9.15
0.15
0.25
5°
11°
8.85
9.15
1.0 REF
INCHES
MIN
MAX
0.274 0.280
0.274 0.280
0.055 0.063
0.010 0.015
0.051 0.059
–
0.010
0.031 BSC
0.008
–
0.005 0.008
0.013 0.022
0.220 REF
8°
6°
0.005 0.005
0.016 BSC
10°
5°
0.006 0.010
0.348 0.360
0.006 0.010
11°
5°
0.348 0.360
0.039 REF
MC34271
Notes
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11
MC34271
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MC34271/D