SEMICONDUCTOR TECHNICAL DATA $! "! ! # !! #! LVQ The MC74LVQ245 is a high performance, non–inverting octal transceiver operating from a 2.7 to 3.6V supply. The MC74LVQ245 is suitable for memory address driving and all TTL level bus oriented transceiver applications. Current drive capability is 12mA at both A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bi–directional transceiver. Transmit (active–HIGH) enables data from A ports to B ports; Receive (active–LOW) enables data from B to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a HIGH Z condition. LOW–VOLTAGE CMOS OCTAL TRANSCEIVER • Designed for 2.7 to 3.6V VCC Operation – Ideal for Low Power/Low Noise Applications • Guaranteed Simultaneous Switching Noise Level and Dynamic Threshold Performance • Guaranteed Skew Specifications DW SUFFIX PLASTIC SOIC CASE 751D–04 20 1 • Guaranteed Incident Wave Switching into 75Ω • Low Static Supply Current (10µA) Substantially Reduces System Power Requirements • Latchup Performance Exceeds 500mA M SUFFIX PLASTIC SOIC EIAJ CASE 967–01 20 1 • ESD Performance: Human Body Model >2000V 20 1 20 Pinout: 20–Lead (Top View) 1 VCC OE B0 B1 B2 B3 B4 B5 B6 B7 20 19 18 17 16 15 14 13 12 11 SD SUFFIX PLASTIC SSOP CASE 940C–03 DT SUFFIX PLASTIC TSSOP CASE 948E–02 PIN NAMES 1 2 3 4 5 6 7 8 9 10 T/R A0 A1 A2 A3 A4 A5 A6 A7 GND Pins Function OE T/R A0–A7 Output Enable Input Transmit/Receive Input Side A 3–State Inputs or 3–State Outputs Side B 3–State Inputs or 3–State Outputs B0–B7 12/95 Motorola, Inc. 1995 1 REV 1 MC74LVQ245 LOGIC DIAGRAM OE 19 T/R 1 A0 2 18 A1 3 17 A2 B5 8 12 A7 B4 7 13 A6 B3 6 14 A5 B2 5 15 A4 B1 4 16 A3 B0 B6 9 11 B7 INPUTS OE T/R OPERATING MODE Non–Inverting L L B Data to A Bus L H A Data to B Bus H X Z H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions are Acceptable; For ICC reasons, Do Not Float Inputs MOTOROLA 2 ECLinPS and ECLinPS Lite DL140 — Rev 3 MC74LVQ245 ABSOLUTE MAXIMUM RATINGS* Symbol Parameter VCC DC Supply Voltage VI Value Condition Unit –0.5 to +7.0 V DC Input Voltage –0.5 ≤ VI ≤ VCC + 0.5V V VO DC Output Voltage –0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State V IIK DC Input Diode Current –20 VI = –0.5V mA +20 VI = VCC + 0.5V mA –20 VO = –0.5V mA +20 VI = VCC + 0.5V mA IOK DC Output Diode Current IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current ±400 mA IGND DC Ground Current ±400 mA TSTG Storage Temperature Range –65 to +150 °C * Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free–Air Temperature ∆V/∆t Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V, VCC = 3.0V Min Typ Max Unit 2.0 3.3 3.6 V 0 VCC V 0 VCC V –40 +85 °C 0 125 mV/ns DC ELECTRICAL CHARACTERISTICS TA = –40°C to +85°C Symbol Characteristic Condition Min 2.0 VIH HIGH Level Input Voltage (Note 1) 2.7V ≤ VCC ≤ 3.6V, VO = 0.1V or VCC – 0.1V VIL LOW Level Input Voltage (Note 1) 2.7V ≤ VCC ≤ 3.6V, VO = 0.1V or VCC – 0.1V VOH HIGH Level Output Voltage VOL LOW Level Output Voltage II Input Leakage Current IOZT Maximum I/O Leakage Current IOLD Minimum Dynamic Output Current (Note 2) IOHD ICC Quiescent Supply Current Max V 0.8 2.7V ≤ VCC ≤ 3.6V; IOH = –50µA VCC – 0.1 VCC = 2.7V; IOH = –12mA 2.2 VCC = 3.0V; IOH = –12mA 2.48 Unit V V 2.7V ≤ VCC ≤ 3.6V; IOL = 50µA 0.1 2.7V ≤ VCC ≤ 3.6V; IOL= 12mA 0.4 2.7V ≤ VCC ≤3.6V; VI= VCC, GND ±1.0 µA VI(OE) = VIL, VIH; VI, VO= VCC, GND ±3 µA VCC = 3.6V; VOLD = 0.8V Max 36 mA VCC = 3.6V; VOHD = 2.0V Min –25 mA 2.7V ≤ VCC ≤3.6V; VI = VCC, GND 10 µA V 1. These values of VI are used to test DC electrical characteristics only. Functional test should use VIH ≥ 2.4V, VIL ≤ 0.5V. 2. Incident wave switching on transmission lines with impedances as low as 75Ω for commercial temperature range is guaranteed. Maximum test duration is 2ms, one output loaded at a time. ECLinPS and ECLinPS Lite DL140 — Rev 3 3 MOTOROLA MC74LVQ245 DYNAMIC SWITCHING CHARACTERISTICS (VCC = 3.3V) TA = +25°C Symbol Characteristic Condition VOLP Dynamic LOW Peak Voltage (Note 1) VOLV Dynamic LOW Valley Voltage (Note 1) VIHD VILD Min Typ Max Unit CL = 50pF, VIH = 3.3V, VIL = 0V 0.6 1.0 V CL = 50pF, VIH = 3.3V, VIL = 0V –0.5 –1.0 V High Level Dynamic Input Voltage (Note 2) Input–Under–Test Switching 0V to Threshold, f=1MHz 1.5 2.0 V Low Level Dynamic Input Voltage (Note 2) Input–Under–Test Switching 3.3V to Threshold, f=1MHz 1.5 0.8 V 1. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW. The remaining output is measured in the LOW state. 2. Number of data inputs is defined as “n” switching, “n–1” inputs switching 0V to 3.3V. AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500Ω) Limits TA = +25°C VCC = 3.0V to 3.6V Symbol Parameter TA = –40°C to +85°C VCC = 2.7V VCC = 3.0V to 3.6V VCC = 2.7V Min Typ Max Min Typ Max Min Max Max Unit tPLH tPHL Propagation Delay Input to Output 2.0 2.0 7.0 7.0 10.0 10.0 2.0 2.0 8.0 8.0 11.5 11.5 2.0 2.0 10.5 10.5 12.5 12.5 ns tPZH tPZL Output Enable Time to High and Low Level 2.5 2.5 8.0 8.5 11.5 13.0 2.5 2.5 9.5 11.0 13.5 15.0 2.5 2.5 13.0 13.5 15.0 16.5 ns tPHZ tPLZ Output Disable Time From High and Low Level 1.0 1.0 8.5 8.5 12.5 12.5 1.0 1.0 10.5 10.5 14.0 15.0 1.0 1.0 14.0 14.0 15.0 17.0 ns tOSHL Output–to–Output Skew 1.0 1.5 1.0 1.5 1.5 ns tOSLH (Note 1) 1.0 1.5 1.0 1.5 1.5 1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit 10MHz, VCC = 3.3V, VI = 0V or VCC 27 pF CPD Power Dissipation Capacitance CIN Input Capacitance VCC = Open, VI = 0V or VCC 4.5 pF CI/O Input/Output Capacitance VCC = 3.3V, VI = 0V or VCC 15 pF MOTOROLA 4 ECLinPS and ECLinPS Lite DL140 — Rev 3 MC74LVQ245 VCC An, Bn 50% VCC 50% VCC 0V tPLH tPHL VOH 50% VCC Bn, An 50% VCC VOL WAVEFORM 1 – PROPAGATION DELAYS tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns VCC 50% VCC OE, T/R 50% VCC 0V tPHZ tPZH VCC VOH – 0.3V 50% VCC An, Bn tPZL tPLZ 50% VCC An, Bn VOL + 0.3V GND WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns Figure 1. AC Waveforms VCC 2 • VCC PULSE GENERATOR R1 DUT CL RT TEST OPEN RL SWITCH tPLH, tPHL Open tPZL, tPLZ 2 • VCC Open Collector/Drain tPLH and tPHL 2 • VCC tPZH, tPHZ Open CL = 50pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) Figure 2. Test Circuit ECLinPS and ECLinPS Lite DL140 — Rev 3 5 MOTOROLA MC74LVQ245 OUTLINE DIMENSIONS DW SUFFIX PLASTIC SOIC PACKAGE CASE 751D–04 ISSUE E –A – 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 1 –B – P 10 PL A B 0.010 (0.25) B M M 10 D 20 PL J 0.010 (0.25) M T S S DIM A B C D F G J K M P R F R X 45° C –T G 18 PL M SEATING – PLANE K MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0° 7° 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0° 7° 0.395 0.415 0.010 0.029 M SUFFIX PLASTIC SOIC EIAJ PACKAGE CASE 967–01 ISSUE O 20 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE M_ L 10 1 DETAIL P Z D e VIEW P A c A1 b 0.13 (0.005) MOTOROLA M 0.10 (0.004) 6 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.032 ECLinPS and ECLinPS Lite DL140 — Rev 3 MC74LVQ245 OUTLINE DIMENSIONS SD SUFFIX PLASTIC SSOP PACKAGE CASE 940C–03 ISSUE B 20X K REF 0.12 (0.005) T U M V S S 0.25 (0.010) N 20 L/2 11 M N B L ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ F PIN 1 IDENT 1 10 DETAIL E K –U– A –V– 0.20 (0.008) M J T U S NOTES: 13 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 14 CONTROLLING DIMENSION: MILLIMETER. 15 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 16 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 17 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION. 18 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 19 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. J1 DIM A B C D F G H J J1 K K1 L M K1 SECTION N–N 0.076 (0.003) –T– –W– C SEATING PLANE D G DETAIL E H 20X 0.15 (0.006) T U K REF M T U S V ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S K K1 2X L/2 20 11 J J1 B L –U– PIN 1 IDENT SECTION N–N 1 10 0.25 (0.010) N 0.15 (0.006) T U S NOTES: 6 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 9 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 10 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 12 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. M A –V– N F DETAIL E –W– C D G INCHES MIN MAX 0.278 0.288 0.205 0.212 0.068 0.078 0.002 0.008 0.024 0.037 0.026 BSC 0.023 0.030 0.003 0.008 0.003 0.006 0.010 0.015 0.010 0.013 0.301 0.311 0_ 8_ DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948E–02 ISSUE A 0.10 (0.004) S MILLIMETERS MIN MAX 7.07 7.33 5.20 5.38 1.73 1.99 0.05 0.21 0.63 0.95 0.65 BSC 0.59 0.75 0.09 0.20 0.09 0.16 0.25 0.38 0.25 0.33 7.65 7.90 0_ 8_ H DETAIL E 0.100 (0.004) –T– SEATING DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 1.20 ––– 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 0.047 ––– 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ PLANE ECLinPS and ECLinPS Lite DL140 — Rev 3 7 MOTOROLA MC74LVQ245 Motorola reserves the right to make changes without further notice to any products herein. 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