September 1997 PBL 3766, PBL 3766/6 Subscriber Line Interface Circuit Description Key Features The PBL 3766 Subscriber Line Interface Circuit (SLIC) is a monolithic integrated circuit, manufactured in 75 V bipolar technology. The PBL 3766 SLIC facilitates the design of cost effective, high performance on-premises (ONS) analog line interface cards for PABX systems and terminal adapters. Small package size and few required external components result in a miniaturized design. The PBL 3766 programmable, constant current loop feed system can operate with battery supply voltages between -24 V and -58 V. The SLIC incorporates loop current and ring trip detection functions as well as a ring relay driver. The two- to four-wire and four- to two-wire voice frequency (vf) signal conversion, i.e. the hybrid function, is provided by the SLIC in conjunction with either a conventional or a programmable CODEC/filter. The PBL 3766 package is a 22 pin, plastic dual-in-line (batwing) or a 28-pin, plastic j-leaded chip carrier (PLCC). The differences between PBL 3766 and PBL 3766/6 are the specifications for balance, output offset voltage, and insertion loss. • Low cost • Few external components • Programmable, constant current loop feed • Line feed characteristics independent of battery supply variations • -24 V to -58 V battery supply voltage range • Detectors – programmable loop current detector – ring trip detector • Ring relay driver • Hybrid function with conventional or programmable CODEC/filters • Line terminating impedance, complex or real, set by a simple external network or controlled by a programmable CODEC/filter 27/21 HPT 20/15 HPR 21/16 Input/Output Decoder and Control VEE 18/13 12/9 C2 9/7 E0 Two-wire Interface Line Feed Controller and Longitudinal Signal Suppression • Low on-hook power dissipation: 20 mW @ -28 V, 35 mW @ -48 V • Tip-ring open circuit state for subscriber loop power denial • On-hook transmission DET 14/11 RDC 7/4 RSG VBAT 2/1 Loop Current Detector 22/19 VTX 37 19/14 VF Signal Transmission RD L B P 66 GND 3, 6, 10, 17, 24/ 5, 6, 17, 18 P B 4/2 C1 11/8 28/22 VCC 13/10 • Idle noise typ. -83 dBmp, typ. 7 dBrnC 66 TIPX RINGX Ring Trip Detector 23/20 RINGRLY 37 DT 5/3 L Ring Relay Driver 16/12 RSN Figure 1. Block diagram. Pin numbers PLCC/DIP. 4-1 PBL 3766 Absolute Maximum Ratings Parameter Symbol Min Max Unit Temperature and humidity Storage temperature range Operating temperature range Operating junction temperature Storage humidity TStg TCase TJ RH -60 -10 -10 5 +150 +110 +140 95 °C °C °C % RH Power supply, -10 °C < TAmb < 80 °C VCC with respect to GND VEE with respect to GND VBat with respect to GND VCC VEE VBat -0.5 -6.5 -70 6.5 0.5 VEE+0,7 V V V Power dissipation Continuous power dissipation at TAmb ≤ 70 °C Peak power dissipation at TAmb = 70°C, t < 10 ms, trep > 10 sec. PD PDP 1.5 4 W W Relay driver Ring relay supply voltage Ring relay current VRRly IRRly VBat 0 50 V mA Ring trip comparator Input voltage Input current VDT IDT VBat -2 0 2 V mA Digital inputs, outputs (C1, C2, E0, DET) Input voltage Output voltage (DET disabled) Output current (DET enabled) VID VOD IOD 0 0 VCC VCC 5 V V mA VT, VR VT, VR VT, VR VT, VR VBat VBat - 20 VBat - 40 VBat - 70 0.5 5 10 15 V V V V 80 25 mA mA TIPX or RINGX terminals, VBAT = -50 V TIPX or RINGX voltage, continuous, (Note 1) TIPX or RINGX pulse = tω < 10 ms, trep > 10 s (Notes 2, 3) TIPX or RINGX pulse = tω < 1 µs, trep > 10 s (Notes 2, 3) TIP or RING pulse = tω < 250 ns, trep > 10 s (Notes 2, 3) TIPX or RINGX current Active Stand-by ILdc + ILodc ILdc Recommended Operating Conditions Parameter Symbol Min Max Unit Case temperature VCC with respect to ground VEE with respect to ground VBat with respect to ground (Note 4) TCase VCC VEE VBat 0 4.75 -5.25 -58 90 5.25 -4.75 -24 °C V V V Notes 1. With a diode (D2) connected in series with the VBat supply, as shown in figure 11, -70 V may be continuously applied to the TIPX or RINGX lead. 2. These voltage ratings require a diode (D2) to be installed in series with the VBat supply as shown in figure 11. 3. VT and VR are referenced to ground. tω is the pulse width of a rectangular test pulse and trep is the pulse repetition rate. 4. -24 V < VBat < -21 V may be used in applications requiring maximum vf signal amplitudes less than 3 Vpk (8.75 dBm, 600 ohms). 4-2 PBL 3766 Electrical Characteristics 0 °C < TAmb < 70 °C, VCC = +5 V ±5 %, VEE = -5 V ±5 %, VBat = -48 V, RSG = 0 ohm , RDC = 41.7 kohms, RD = ∞, ZL = 600 ohms, CHP = 33 nF, CDC = 1.5 µF unless otherwise specified. Parameter Two-wire port Overload level, VTRO Input impedance, ZTRX Longitudinal impedance, ZLoT, ZLoR Longitudinal current limit, ILoT, ILoR Longitudinal to metallic balance, BLM PBL 3766 PBL 3766/6 Longitudinal to metallic balance, BLME Ref Fig. 2 3 Conditions Min ZL = 600 ohms, 1% THD, Note 1 Note 2 f < 100 Hz active state, C2, C1 = 1, 0 IEEE standard 455-1985 0.2 kHz ≤ f ≤ 3 kHz 3.1 BLME = 20 · log Typ Max Unit VPk 25 20 40 ohm/wire mApk/wire 53 48 58 58 dB dB 53 48 58 58 dB dB 53 48 58 58 dB dB 50 48 55 55 dB dB 55 dB |ELo| |VTR| 0.05kHz ≤ f ≤ 3.4kHz PBL 3766 PBL 3766/6 Longitudinal to four-wire balance, BLFE 3 BLFE = 20 · log |ELo| |VTX| 0.05kHz ≤ f ≤ 3.4kHz PBL 3766 PBL 3766/6 Metallic to longitudinal balance, BMLE 4 BMLE = 20 · log |ETR| |VLo| 0.2kHz ≤ f ≤ 3.4kHz PBL 3766 PBL 3766/6 Four-wire to longitudinal balance, BFLE 4 BFLE = 20 · log |ERX| |VLo| 0.2kHz ≤ f ≤ 3.4kHz , ERX = 0 , ETR source removed 40 C Figure 2. Overload level, VTRO, two-wire port. 1 ωC RL V TRO TIPX 27/21 VTX 19/14 PBL 3766 I Ldc << RL, RL = 600 ohms, RINGX 28/22 1 ωC << 150 ohms, RLR = RLT = 300 ohms, RT = 600 kohms, RRX = 300 kohms E RX RSN 16/12 RRX RT = 600 kohms, RRX = 300 kohms Figure 3. Longitudinal to metallic (BLME) and longitudinal to four-wire (BLFE) balance. RT E LO C TIPX 27/21 RLT V TR RLR VTX 19/14 PBL 3766 RINGX 28/22 RT V TX RSN 16/12 RRX 4-3 PBL 3766 Ref. Fig. Parameter Two-wire return loss, r r = 20 · log RINGX idle voltage, VRi Four-wire transmit port (VTX) Overload level, VTXO 5 Output offset voltage, ∆VTX PBL 3766 PBL 3766/6 Output impedance, zTX Frequency response Two-wire to four-wire, g2-4 6 Four-wire to two-wire, g4-2 6 Four-wire to four-wire, g4-4 6 Insertion loss Two-wire to four-wire, G2-4 PBL 3766 PBL 3766/6 Four-wire to two-wire, G4-2 PBL 3766 PBL 3766/6 Four-wire to four-wire, G4-4 6 6 6 TIPX 27/21 RLT E TR RLR TIPX 27/21 30 32 25 -5 0 -43 -48 dB dB dB V V V V 3.1 VPk +40 +55 20 mV mV ohm IRSN = 0 0.3 kHz ≤ f ≤ 3.4 kHz 0.3 kHz ≤ f ≤ 3.4 kHz 0 <5 1000 20 V ohm ratio -0.1 0 +0.1 dB -0.1 0 +0.1 dB -0.1 0 +0.1 dB -0.20 -0.25 0 0 +0.20 +0.25 dB dB -0.20 -0.25 -0.3 0 0 0 +0.20 +0.25 +0.3 dB dB dB 0.3 kHz < f < 3.4 kHz relative to 0 dBu, 1.0 kHz. ERX = 0 V 0.3 kHz < f < 3.4 kHz relative to 0 dBu, 1.0 kHz. EL = 0 V 0.3 kHz < f < 3.4 kHz relative to 0 dBu, 1.0 kHz. EL = 0 V 0 dBm, 1.0 kHz, Note 5 0 dBm, 1.0 kHz, Notes 5, 6 0 dBm, 1.0 kHz, Notes 5, 6 Figure 4. Metallic to longitudinal (BMLE) and four-wire to longitudinal (BFLE) balance. VTX 19/14 RT E RX 1 ωC RSN 16/12 << 150 ohms, RLR = RLT = 300 ohms, RT = 600 kohms, RRX = 300 kohms VTX 19/14 PBL 3766 RINGX 28/22 Unit <5.0 Figure 5. Overload level, VTXO, four-wire transmit port. RL I Ldc Max 0.2 kHz < f < 3.4 kHz PBL 3766 RINGX 28/22 C RT V TXO 1 ωC RSN 16/12 RRX 4-4 25 27 23 Load impedance > 20 kohms, 1% THD, Note 4 RRX EL Typ -40 -55 Four-wire receive port (RSN) RSN dc voltage, VRSN RSN impedance, zRSN RSN current (IRSN) to metallic loop current (IL) gain, αRSN V LO Min |ZTRX + ZL| |ZTRX - ZL| ZTRX ≈ ZL = nom. 600Ω, Note 3 0.2 kHz ≤ f ≤ 0.5 kHz 0.5 kHz ≤ f ≤ 1.0 kHz 1.0 kHz ≤ f ≤ 3.4 kHz active, IL = 0 stand-by, IL = 0 active, IL = 0 stand-by, IL = 0 TIPX idle voltage, VTi C Conditions << RL, RL = 600 ohms, RT = 600 kohms, RRX = 300 kohms PBL 3766 Parameter Ref Fig. Gain tracking Two-wire to four-wire 6 Four-wire to two-wire Conditions Ref. -10 dBm, 1.0 kHz, Note 7 -40 dBm to +7 dBm -55 dBm to -40 dBm Ref. -10 dBm, 1.0 kHz, Note 8 -40 dBm to +7 dBm -55 dBm to -40 dBm 6 Noise Idle channel noise at two-wire (TIPX-RINGX) or four-wire (VTX) port Active state, C2, C1 = 1, 0 2500 IL = RDC + 41700 RDC in ohms Stand-by state, C2, C1 = 1, 1 VBat - 3 IL = RL + 1800 VBat tol. ±5%, TAmb = 25 °C Stand-by state loop current, IL, tolerance range Loop current detector On-hook to off-hook threshold, ILThOff Off-hook to on-hook threshold, ILThOn Detector threshold hysteresis, ∂ILTh Loop current detector conversion factor on-hook to off-hook, KLThOff ±0.03 ±0.03 +0.15 dB dB -0.15 ±0.03 ±0.03 +0.15 dB dB -83 7 -78 12 dBmp dBrnC -65 -54 dB 0.85 · IL IL 1.15 · IL A 0.75·IL IL 1.25·IL A 1 375 ILThOff = KLThOff· + RD 62500 Note 11 1 1 ILThOn = KLThOn· + RD 62500 Note 11 Source resistance, RS = 0 VBat < VDT < 0 V Ring relay driver On-state voltage, VRRly Off state leakage current, IRRly IRRly = 25 mA VBat < VRRly < 0 C RT = 600 kohms, RRX = 300 kohms -0.15 8.0 7.3 0.7 1 Ring trip detector Offset voltage, ∆VDTR Input bias current, IDT Input common mode range, VDT << RL, RL = 600 ohms, Unit RD = ∞, Note 10 RD = ∞, Note 10 Loop current detector conversion factor off-hook to on-hook, KLThOn ωC Max 0.3 kHz ≤ f ≤ 3.4 kHz 0 dBm, 1.0 kHz test signal Battery feed characteristics Loop current in constant current region, IL 1 Typ Note 9 Psophometrical weighting C-message weighting Harmonic distortion Two-wire to four-wire Four-wire to two-wire Figure 6. Frequency response, insertion loss, gain tracking. Min TIPX 27/21 500 mA mA mA 660 455 -25 -300 VBat+1 -100 -0.5 -0.2 V V 25 -2 mV nA V 10 V µA VTX 19/14 RL V TR EL I Ldc PBL 3766 RINGX 28/22 RT E RX V TX RSN 16/12 RRX 4-5 PBL 3766 Parameter Digital inputs (C1, C2, E0) Input low voltage, VIL Input high voltage, VIH Input low current, IIL C1, C2 E0 Input high current, IIH Digital output (DET) Output low voltage, VOL Output high voltage, VOH Internal pull-up resistor DET short circuit current, IODs Power supply rejection ratio, PSRR To two-wire or four-wire port, from VCC, PSRRCC VEE, PSRREE VBat, PSRRBat Power supply currents (relay driver off) VCC current, ICC VEE current, IEE VBat current, IBat VCC current, ICC VEE current, IEE VBat current, IBat VCC current, ICC VEE current, IEE VBat current, IBat Power dissipation Open circuit state total dissipation, POp Stand-by state total dissipation, POnSb Active state total dissipation, POnAct Active state total dissipation, POffAct200 POffAct600 Ref. Fig. Conditions 22-pin plastic DIP, θJP22dip 4-6 Typ 0 2.0 Max Unit 0.8 VCC V V 40 µA µA µA VIL = 0.4 V -200 -100 VIH = 2.4 V IOL = 2 mA, E0 = 0 IOH = -100 µA, E0 = 0 2.7 10 E0 = 1, DET shorted to ground Note 12 50 Hz ≤ f ≤ 4 kHz 4 kHz ≤ f ≤ 50 kHz 50 Hz ≤ f ≤ 4 kHz 4 kHz ≤ f ≤ 50 kHz 50 Hz ≤ f ≤ 4 kHz 4 kHz ≤ f ≤ 50 kHz 30 30 30 12 40 30 0.4 0.6 15 -330 20 V V kohm µA 35 35 35 18 50 35 dB dB dB dB dB dB Open circuit state C2, C1 = 0, 0 On-hook Stand-by state C2, C1 = 1, 1 On-hook Active state C2, C1 = 1, 0 On-hook 1 1 0.5 2 1 0.5 4 2 3 mA mA mA mA mA mA mA mA mA C2, C1 = 0, 0 On-hook (RL = ∞) or off-hook (RL = 0) C2, C1 = 1, 1 On-hook (RL = ∞) C2, C1 = 1, 0 On-hook (RL = ∞) C2, C1 = 1, 0, Note 13 Off-hook, RL = 200 ohm Off-hook, RL = 600 ohm 25 35 mW 35 45 mW 160 220 mW 1.35 1.05 1.50 1.20 W W 160 20 170 °C °C 10 15 °C/W 10 15 °C/W Temperature guard Junction temperature at threshold, TJG Temperature guard hysteresis, ∂TJG Thermal resistance 28-pin PLCC, θJP28plcc Min 145 Junction to terminals 3, 6, 10, 17, 24 connected together, Note 14 Junction to terminals 5, 6, 17, 18 connected together, Note 14 PBL 3766 Notes 1. 2. The overload level is specified at the two-wire port with the signal source at the four-wire receive port. The two-wire impedance is programmable by selection of external component values according to: ZTRX = ZT/|G2-4 · αRSN| where ZTRX = impedance between the TIPX and RINGX terminals ZT = programming network between the VTX and RSN terminals G2-4 = TIPX-RINGX to VTX gain, nominally = 1 αRSN = receive current gain, nominally = -1000 (current defined as positive when flowing into the receive summing node, RSN and when flowing from TIPX to RINGX). 3. Higher return loss values can be achieved by adding a reactive component to RT, the two-wire terminating impedance programming resistor, e.g. by dividing RT into two equal halves and connecting a capacitor from the common point to ground. For RT = 600 kohms the capacitance value is approximately 33 pF. 4. The overload level is specified at the four-wire transmit port, VTX, with the signal source at the two-wire port. Note that the gain from the two-wire port to the four-wire transmit port is G2-4 = 1. 5. Fuse resistors RF impact the insertion loss as explained in the text, section Transmission. The specified insertion loss is for RF = 0. 6. The specified insertion loss tolerance does not include errors caused by external components. 7. The level is specified at the two-wire port. 8. The level is specified at the four-wire receive port and referenced to a 600 ohm impedance level. 9. The two-wire idle noise is specified with the port terminated in 600 ohms (RL) and with the four-wire receive port grounded (ERX = 0, see figure 6). The four-wire idle noise at VTX is specified with the two-wire port terminated in 600 ohms (RL). The noise specification is with respect to a 600 ohm impedance level at VTX. The four-wire receive port is grounded (ERX = 0, see figure 6). 10. With the RD terminal left open, the loop current detector on-hook to off-hook threshold is internally set to 8.0 mA and the offhook to on-hook threshold to 7.3 mA. The loop current detection threshold can be set to higher values by connecting a resistor, RD, between terminal RD and VEE (-5 V), as described in section Loop Monitoring Functions. 11. Refer to section Loop Monitoring Functions, Loop Current Detector. 12. Power supply rejection ratio test signal is 100 mVrms (sinusoidal). 13. Line resistor RF = 0 ohm. 14. Junction to ambient thermal resistance will be dependent on external thermal resistance from VBAT terminals to ambient. 4-7 26 TIPX Sense 27 TIPX 28 RINGX RINGX Sense 1 BGND 2 3 VBAT 4 VCC PBL 3766 GND 1 22 RINGX VCC 2 21 TIPX RINGRLY 3 20 DT RSG 4 19 RD VBAT 5 18 VBAT VBAT 6 17 VBAT E0 7 16 HPR RSG 7 23 DT NC 8 22 RD E0 9 21 HPR VBAT 10 20 HPT DET 8 15 HPT 11 19 VTX C2 9 14 VTX C1 10 13 VEE RDC 11 12 RSN C2 12 DET VEE 18 24 VBAT VBAT 17 6 RSN 16 VBAT NC 15 25 NC RDC 14 5 C1 13 RINGRLY Figure 7. Pin configuration, 28-pin plastic leaded chip carrier and 22-pin plastic dual-in-line package, top view. Pin Description PLCC: 28-pin, plastic, j-leaded chip carrier. DIP: 22-pin, dual-in-line (batwing), plastic package. Refer to figure 7. PLCC DIP Symbol 1 - RINGXSense RINGXSense is internally connected to RINGX. RINGXSense is used during manufacturing, but requires no connection in SLIC applications, i.e. leave open. Description 2 1 GND Ground. 3 - VBAT Refer to PLCC, terminal 6 description. 4 2 VCC +5 V power supply. 5 3 RINGRLY Ring relay driver output. Open emitter with grounded collector (npn). Sources 50 mA from ground to a relay coil connected to a negative voltage. Must be protected by external inductive kick-back diode. Positive voltage relay driver can be provided as a metal mask option. Contact factory for availability. 6, 3, 5, 6, VBAT 10, 17, 17, 18 24 Battery supply voltage. Negative with respect to GND. -21 V to -58 V. All VBAT terminals should be connected to printed circuit board traces to provide heatsinking. 7 4 RSG Saturation guard programming resistor, RSG, connects from this terminal to VEE. Leave open for nominal battery voltages from -24 V to -28 V. Connect to VEE for a nominal battery voltage of -48 V. For other battery voltages and for detailed information refer to section Battery Feed. 8 - NC No internal connection. Note 1. 9 7 E0 TTL compatible enable input. Enables the DET output, when set to logic level low and disables the DET output, when set to logic level high. Refer to section Enable Input for detailed information. 10 - VBAT Refer to PLCC, terminal 6 description. 4-8 PBL 3766 PLCC DIP Symbol Description 11 8 DET Detector output. Inputs C1 and C2 select one of the two detectors to be connected to the DET output. A logic low level at the enabled (refer to E0) DET output indicates a triggered detector condition. The DET output is open collector with internal pull-up resistor (approximately 15 kohms) to VCC. 12 13 9 10 C2 C1 C1 and C2 are TTL compatible inputs controlling the SLIC operating states. Refer to section Control inputs for details. 14 11 RDC Dc loop feed is programmed by one resistor connected from this pin to the receive summing node (RSN) A decoupling capacitor, CDC, connected from RDC to GND removes noise and other ac signals from the battery feed control loop. 15 - NC No internal connection. Note 1. 16 12 RSN Receive summing node. 1000 times the current (dc and ac) flowing into this pin equals the metallic (transversal) current flowing from RINGX to TIPX. Programming networks for constant dc loop current, two-wire impedance and receive gain connect to the receive summing node. 17 - VBAT Refer to PLCC, terminal 6 description. 18 13 VEE -5V power supply. 19 14 VTX Transmit vf output. The ac voltage difference between TIPX and RINGX, the ac metallic voltage, is reproduced as an unbalanced GND referenced signal at VTX with a gain of one. The two-wire terminating impedance programming network connects between VTX and RSN. 20 15 HPT Tip side of ac/dc separation capacitor CHP. Other end of CHP connects to pin, HPR. 21 16 HPR Ring side of ac/dc separation capacitor CHP. Other end of CHP capacitor connects to pin, HPT. 22 19 RD Loop current detector programming resistor RD connects from RD to VEE. An optional filter capacitor CD may be connected between terminal RD and ground. With the RD pin left open, the loop current detect threshold is internally set to 8.0 mA. Refer to section Loop monitoring functions for additional information. 23 20 DT DT is the non-inverting ring trip comparator input. The inverting comparator input is internally connected to VEE. With DT more negative than the inverting input, the detector output, DET, is at logic level low, indicating off-hook condition. The ring trip network connects to the DT input. 24 - VBAT Refer to PLCC, terminal 6 description. 25 - NC No internal connection. Note 1. 26 - TIPXSense TIPXSense is internally connected to TIPX. TIPXSense is used during manufacturing, but requires no connection in SLIC applications, i.e. leave open. 27 28 21 22 TIPX RINGX The TIPX and RINGX pins connect to the tip and ring leads of the two-wire interface via overvoltage protection components and ring relay (and optional test relays). Notes 1. Terminals marked NC are not internally connected to the chip. These terminals may be connected to ground for shielding. 4-9 PBL 3766 Functional Description and Applications Information Transmission General A simplified ac model of the transmission circuits is shown in figure 8. Circuit analysis yields: VTR = VTX + IL · 2RF VTX VRX + ZT ZRX = (1) IL G2-4 = (3) G4-2 = VTX is a ground referenced unity gain version of the ac metallic voltage between the TIPX and RINGX terminals, i.e. VTX = 1 · VTRX. VTR is the ac metallic voltage between tip and ring. is the line open circuit ac metallic voltage. is the ac metallic current. RF is a current limiting resistor in the overvoltage protection network. ZL is the line impedance. ZT determines the SLIC TIPX to RINGX impedance. ZRX controls four- to two-wire gain. VRX is the analog ground referenced receive signal. Two-wire Impedance To calculate ZTR, the impedance presented to the two-wire line by the SLIC including the fuse resistors RF, let VRX = 0. From (1) and (2): ZTR = ZT 1000 + 2RF With ZTR and RF known ZT may be calculated from ZT = 1000 · (ZTR - 2RF) Example: calculate ZT to make the terminating impedance ZTR = 600 ohms in series with 2.16 µF. RF = 40 ohms. Using the expression above ZT = 1000 · (600 + 1 - 2 · 40) jω · 2.16 · 10-6 i.e ZT = 520 kohms in series with 2.16 nF. It is necessary to have a high ohmic resistor in parallel with the capacitor. This gives a DC-feedback loop, for low 4-10 VTX VTR =- VRX VTX ZT · ZRX ZL ZT/1000 + 2RF + ZL =- VRX ZT · ZRX RTX + VRX =0 ZB (EL = 0) ZRX · ZT 2ZL = ZL + 2RF ZL = ZL + 2RF 1 + jω · RL · CL 1 + jω · (RL + 2RF) · CL A network consisting of RB1 in series with the parallel combination of RB and CB has the same form as the required balance network, ZB. Basic algebra yields: RB1 = RTX · RL RB = RTX · CB = = 17.6 kohms RL + 2RF 2RF = 2353 ohms RL + 2RF (RL + 2RF)2 · CL = 0.62 µF RTX · 2RF Longitudinal Impedance In the active state, a feedback loop counteracts longitudinal voltages at the two-wire port by injecting longitudinal currents in opposing phase. Therefore longitudinal disturbances will appear as longitudinal currents and the TIPX and RINGX terminals will experience very small longitudinal voltage excursions, well within the SLIC common mode range. This is accomplished by comparing the instantaneous two-wire longitudinal voltage to an internal reference voltage, VBat/2. As shown below, the SLIC appears as 20 ohms to ground per wire to longitudinal disturbances. It should be noted, that longitudinal currents may exceed the dc loop current without disturbing the vf transmission. From figure 10 the longitudinal impedance can be calculated: VLo = ILo RLo = 20 ohms 1000 where VLo is the longitudinal voltage Substituting the four-wire to four-wire gain expression, G4-4, for VRX/VTX yields the formula for a balanced network: ZB = -RTx· = RTX · ZL + 2RF ZT/1000 + 2RF + ZL Hybrid Function The PBL 3766 SLIC forms a particularly flexible and compact line interface when used with programmable CODEC/filters. The programmable CODEC/filters allows for system controller adjustment of hybrid balance to accommodate different line impedances without change of hardware. It also permits the system controller to adjust transmit and receive gains as well as terminating impedance. Refer to programmable CODEC/filter data sheets for design information. The hybrid function in an implementation utilizing the uncommitted amplifier in a conventional CODEC/filter combination is shown in figure 9. Via impedance ZB a current proportional to VRX is injected into the summing node of the combination CODEC/filter amplifier. As can be seen from the expression for the four-wire to four-wire gain a voltage proportional to VRX is returned to VTX. This voltage is converted by RTX to a current into the same summing node. These currents can be made to cancel by letting: VTX ZB = {ZL = ZTR} = RTX· = {G4-2 = -1} = RTX· ZT/1000 + 2RF Four-wire to Four-wire gain The four-wire to four-wire gain, G4-4, is derived from (1), (2) and (3) with EL = 0: G4-4 = series with 2.16 µF (CL), RF = 40 ohms, RTX = 20 kohms, G4-2 = -1. Calculate ZB. Using the ZB formula above: ZT/1000 = VTR Four-wire to Two-wire gain The four-wire to two-wire gain, G4-2, is derived from (1), (2) and (3) with EL = 0: 1000 where IL Two-wire to Four-wire gain The two-wire to four-wire gain, G2-4, is obtained from (1) and (2) with VRX = 0: (2) VTR = EL - IL · ZL EL frequency which ensures stability and reduces noise. VRX VTX = RTX· ZRX ZT/1000+2RF+ZL · ZT ZL + 2RF Example: ZTR = ZL = 600 ohms (RL) in ILo is the longitudinal current RLo = 20 kohms sets the longitudinal impedance PBL 3766 TIPX TIP + 27/21 IL RF ZL ZTR VTR - 1 19/14 + + RHP 2 - RF 1 VTX IL RINGX RING VTX 21/16 HPR + EL - 20/15 CHP - + RHP 2 HPT ZT 28/22 - Z RX 16/12 RSN + VRX I L /1000 - PBL 3766 Figure 8. Simplified ac transmission circuit. RFB 19/14 RTX VTX - + PBL 3766 ZT Combination CODEC/Filter ZB Z RX 16/12 VT V RX RSN Figure 9. Hybrid function. I Lo TIPX 27/21 VLo I Lo 1 R VLo + VBat /2 R Lo = 20 kohms + R 1 I V Lo Lo RINGX 28/22 - 1 VLo I Lo /1000 VBat /2 I Lo PBL 3766 Figure 10. Longitudinal feedback loop. 4-11 PBL 3766 RFB CHP -5V RRT R1 HPT 20/15 RD 22/19 DT 23/20 RD CRT R2 RF -48V Tip Ring RF K1 G K2 Note 6 21/16 19/14 18/13 U2 HPR RTX VTX VEE RB RT + 16/12 RSN U3 K1 A K2 U1 TIPX VBAT CTISP RINGX CRC CTC To other line D2 interfaces D3 D1 PTC RBat CBat Note 1 Note 5 RSG -48V -5V Ringing (-48V +90VRMS ) KR 28/22 GND 2/1 VCC 4/2 +5V RINGRLY 5/3 VBAT Notes 2 & 3 RSG 7/4 RRX RDC 27/21 14/11 13/10 12/9 11/8 9/7 Note 4 CODEC/Filter + RDC CDC C1 U1 C2 DET E0 N/C Digital Interface Notes 1. The relay coil may be connected to a negative voltage, down to the VBat limit. For VBat = -48 V relay coils with voltage ratings from 5 V to 48 V may be used. 2. The plastic leaded chip carrier terminals 3, 6, 10, 17 and 24 shall all be connected to the VBat supply trace to provide heat sinking. 3. The dual-in line package terminals 5, 6, 17 and 18 shall all be connected to the VBat supply trace to provide heat sinking. 4. The plastic leaded chip carrier terminals 8, 15 and 25 are not internally connected to the chip. These terminals may be connected to ground to provide shielding. 5. It may be desirable to include a PTC or other type of short circuit protection for the ringing generator. 6. The ground terminals of the secondary protection should be connected to the ground terminal of the SLIC, and to the common ground on the Printed Board Assembly with a track as short and wide as possible, preferable a groundplane. SLIC (Subscriber Line Interface Circuit). PBL 3766 Combination CODEC/filter, e.g. U2 TP3054 (or programmable CODEC/filter, e.g. SLAC) Secordary protection (e g Texas U3 Instruments TISP PBL1) Ring relay, 2C contacts. Note 1 KR D1, D2 Diode, e.g. 1N4454 Diode, e.g. 1N4004 D3 Line resistor, 40 Ω RF 1% match, e.g. Ericsson Components PBR 51XX Resistor, 150 kΩ, 5%, 1/4 W R1 Resistor, 2 MΩ, 5%, 1/4 W R2 Resistor, 17.8 kΩ, %, 1/4 W RB Resistor, 5.1 Ω, 5%, 1/4 W RBat Optional. Refer to paragraph RD “Loop Current Detector”. Resistor, 41.2 kΩ, 5%, 1/4 W RDC Resistor, 24.3 kΩ, 1%, 1/4 W RFB Resistor, 261 kΩ, 1%, 1/4 W RRX Resistor, 150 Ω, 5%, 2 W RRT Resistor, 0 Ω (for VBat = -48V) RSG Resistor, 523 kΩ, 1%, 1/4 W RT Resistor, 20.0 kΩ, 1%, 1/4 W RTX Capacitor, 0.47 µF, 20%, 100 V CBat Capacitor, 1.5 µF, 20%, 10 V CDC Capacitor, 0.033 µF, 20%, 100V CHP Capacitor, 0.39 µF, 20%, 100 V CRT CTC, CRC Capacitor, 2200 pF, 20%, 100 V Capacitor, 220 nF, 20%, 100 V CTISP Figure 11. Single channel subscriber line interface with PBL 3766 and a combination CODEC/filter. Capacitors CTC and CRC The capacitors designated CTC and CRC in figure 11, connected between TIPX and ground as well as between RINGX and ground, are recommended as an addition to the overvoltage protection network. Very fast transients, appearing on tip and ring, may pass by the diode and SCR clamps in the overvoltage protection network, before these devices have had time to activate and could damage the SLIC. CTC and CRC short such very fast transients to ground. The recommended value for CTC and CRC is 2200 pF. Higher capacitance values may be used, but care must be taken to prevent degradation of either longitudinal balance or return loss. CTC and CRC contribute a metallic impedance of 1/(π·f·CTC) ≈ 4-12 1/(π·f·CRC), a TIPX to ground impedance of 1/(2·π·f·CTC) and a RINGX to ground impedance of 1/(2·π·f·CRC). Ac - Dc Separation Capacitor, CHP The high pass filter capacitor connected between terminals HPT and HPR provides the separation between circuits sensing tip-ring dc conditions and circuits processing ac signals. A CHP value of 33 nF will position the low end frequency response 3dB break point at 12 Hz (f3dB) according to f3dB = 1/(2π·RHP·CHP) where RHP ≈ 400 kΩ. Battery Feed Overview The PBL 3766 SLIC synthesizes a constant current feed system. The block dia- gram in figure 12 shows the PBL 3766 active state battery feed system. The magnitude of the constant current is set by a programming resistor, RDC. To permit the line drive amplifiers to operate without vf signal distortion even on high resistance or open circuit loops, a saturation guard circuit limits the loop voltage, when the tip to ring dc voltage approaches the available battery supply voltage. The saturation guard function allows the PBL 3766 to transmit and receive vf signals with the telephone onhook. Figure 13 shows an example of PBL 3766 active state battery feed. With the SLIC set to the stand-by state, most of the circuit is disabled, including the line drive amplifiers, to conserve power. PBL 3766 A 2 x 900 ohm resistive feed substitutes for the active state constant current feed. The following paragraphs describe the PBL 3766 battery feed system in detail. saturation guard becomes active, VSGRef, can be calculated from VSGRef = 12.5 + 25000 + RSG where In the active state C1 = 0 and C2 = 1. In this operating state tip to ring voltages VTRdc less than VSGRef, cause the block titled saturation guard in figure 12 to be disabled, i.e. its output is equal to zero. For this case circuit analysis yields: RSG is a resistor connected between terminal RSG and VEE (-5 V). 2500 RDC + 41700 = battery supply voltage -3 V = voltage drop across internal transistors 5·105 Case 1: SLIC in the Active State VTRdc < VSGRef ILdc = VBat VSGRef is in volts for RSG in ohms RSG = open circuit yields VSGRef = 12.5 V RSG = 0 ohm yields VSGRef = 32.5 V The loop voltage, VTRdc, as a function of the loop resistance, RL, for VTRdc > VSGRef is described by 1800 Ω = feed resistance (900 Ω on the tip side, 900 Ω on the ring side) PBL 3766 Power Dissipation and Derating The tip to ring short circuit total power dissipation, PShTot, is PShTot = ILSh · (|VBat| - ILSh · 2RF) + POnAct where ILSh = 2500/(41700 + RDC) is the short circuit loop current POnAct is the active state on-hook dissipa16.66 + 5.00·105/(25000 + RSG) · RL tion, typically 160 mW VBat = -48V where RL + (RDC + 41700) / 600 The permissible maximum device ILdc = the constant loop current. ILdc is in from which the open loop voltage (IL = 0) dissipation is 1.5 W. The maximum amperes for RDC in ohms. is calculated to allowable junction temperature is 140 °C RDC = the programming resistance, in 5.00·105 for normal reliability requirements and ohms, which sets the constant loop VTRdc = 16.66 + 110 °C for extreme reliability requirements. 25000 + RSG current magnitude. The junction temperature is calculated For RSG = open circuit, the on-hook tip When the desired constant loop current from to ring dc voltage is 16.7 V, which is is known, RDC is calculated from TJ = PShTot · (θJP + θPA) + TAmb, TJ < 140 °C compatible with VBat in the -24 V to -28 V 2500 where - 41700 RDC = range. ILdc For RSG = 0 ohm, the on-hook tip to ring θ = θ = θJP22dip is the thermal JP JP28plcc dc voltage is 36.7 V, which is compatible Capacitor CDC, connected between the resistance from junction to all VBAT RDC terminal and ground, removes noise with VBat in the -42 V to -58 V range. terminals, typically 10 °C/W θPA is the For intermediate battery voltage values, thermal resistance from all VBAT terminals and vf signals from the battery feed VBat, RSG can be calculated from control loop. CDC is calculated according to ambient. The θPA value will be dependto 5.00·105 ent on line-card thermal design. RSG = - 25000 TAmb is the ambient temperature in °C. 1 1 1 VTRdc -16.66 · + CDC = 2π · fDC 41700 RDC Loop Monitoring Functions where where RSG is in ohms for VTRdc in volts Overview fDC = 5 Hz VTRdc is the open loop tip to ring The PBL 3766 SLIC contains detectors for voltage.Let VTRdc = |VBat| - 8 V to allow RDC = constant current programming loop current and ring trip. These two distortion free transmission of a 3.1 Vpk vf detectors report their status via the shared resistance in ohms signal in the on-hook mode. The 8 V DET output. A triggered detector is CDC = filter capacitor in farads margin may be reduced if a vf signal of indicated by a logic low level at the DET Case 2: SLIC in the Active State less than 3.1 Vpk is to be transmitted in output. The detector to be connected to VTRdc > VSGRef the on-hook mode. the DET output is selected via the control interface C1 and C2. Refer to section In the active state C1 = 0 and C2 = 1. Case 3: SLIC in the Stand-by State Control Inputs for a description of the When the tip to ring dc voltage In the stand-by state C1 = 1 and C2 = 1. control interface. Enable input E0 sets the approaches the VBat supply voltage, the With the SLIC operating in the stand-by, DET output to either active or high impedsaturation guard block shown in figure 12 power saving state the tip and ring drive ance state. is engaged and will limit the two-wire amplifiers are disconnected and a voltage to a small additional increase Loop Current Detector resistive battery feed is engaged. The beyond the saturation guard threshold, The loop current detector is connected to loop current can be calculated from VSGref. This leaves a sufficient voltage the DET output in the stand-by (C2, C1 = VBat - 3 V margin to the VBat supply to maintain 1, 1) and the active (C2, C1 = 1, 0) states. ILdc ≈ distortion free vf transmission through the RL + 1800 Ω Refer to figure 14. line drive amplifiers. The saturation guard The loop current value, I LThOff, at which where feature makes on-hook transmission the loop current detector changes from = loop current ILdc possible in the active state. indicating on-hook to indicating off-hook is The tip to ring voltage at which the RL = loop resistance internally programmed to 8.0 mA. VTRdc = 4-13 PBL 3766 The internally set loop current detector threshold, ILThOn, for the off-hook to onhook transition is 7.3 mA. An external resistor, RD, may be connected from terminal RD to VEE to increase the loop current detector thresholds. When the desired on-hook to off-hook loop current threshold, ILThOff, is known, the RD value is calculated from Ring Trip Detector Ring trip detection is accomplished by monitoring the two-wire line for presence of dc current while ringing is applied. When the subscriber goes off-hook during ringing, dc loop current starts to flow. The SLIC ring trip comparator detects this current flow via an interface network. The DT comparator input is connected to pin 1 23/20. The other comparator input is RD = internally connected to VEE. The result of ILThOff /500 - 1/62500 the comparison is presented at the DET where RD is in ohms for ILThOff in amperes output with logic low level indicating offhook. The ring trip comparator is The off-hook to on-hook loop current automatically connected to the DET detector threshold, ILThOn, for the selected output, when the SLIC control inputs are RD value is calculated from set to the ringing state (C2, C1 = 0, 1). 1 1 + ILThOn = KLThOn · When off-hook during ringing is detected, RD 62500 the line card or system controller will where proceed to disconnect the ringing source ILThOn is in amperes for RD in ohms. (software ringtrip) by re-setting the control input logic states. Alternatively, the DET ILThOn > 7.3 mA, KLThOn = 455 V output may be monitored by circuits on The on-hook to off-hook loop current the line card, which perform the ringtrip detector threshold, ILThOff, for a specific RD function (hardware ringtrip). value is calculated from The ringing source may be balanced or 1 1 unbalanced, superimposed on the VBat ILThOff = KLThOff · + supply voltage. A ring relay, energized by RD 62500 the SLIC ring relay driver, connects the where ringing source to tip and ring. For unbalILThOff is in amperes for RD in ohms. anced ringing systems the loop current ILThOff > 8.0 mA, KLThOff = 500 V sensing resistor, RRT, is placed in series with the return lead to ground. With a lower voltage battery it may be Figures 15 and 16 show examples of desirable to decrease the loop current detector thresholds. For more information unbalanced and balanced ringing systems. For either ringing system the on this issue, please contact the factory. ringtrip detection function is based on a During dial pulsing the loop current polarity change at the inputs of the ringtrip detector is aided by a speed-up circuit, acting on the RDC output at loop closures. comparator. In the unbalanced case the dc voltage The speed-up circuit will charge the CDC drop across resistor RRT is zero, as long capacitor at a more rapid rate than that set as the telephone remains on-hook. With by the (CDC· RDC· 41700)/(RDC+ 41700) time constant, resulting in the loop current the telephone off-hook during ringing, dc loop current will flow, causing a voltage reaching the detector threshold value drop across RRT. The RRT voltage is faster and therefore minimizing dial pulse applied to the comparator input DT via distortion. resistor R1. R2 shifts the voltage level to Loop Current Detector - Filter Capacitor be compatible with the inverting input VEE reference voltage. CRT removes part of To increase the loop current detector the ac component of the ringing signal. noise immunity, a filter capacitor may be The inverting comparator input is added from terminal RD to ground. A biased at VEE, which is more negative suggested value for CD is than DT when the telephone is on-hook RD + 62500 and is more positive than DT when the CD = 2π · (RD · 62500) · f3dB telephone goes off-hook during ringing. Complete removal of the ringing signal where ac component at the DT input is not CD is in farads for RD in ohms f3dB = 500 Hz necessary. Some residual ac component at the DT input may, under certain Note that CD may not be required if the operating conditions, cause the DET DET output is software filtered. 4-14 output to toggle between the on-hook and off-hook states at the ringing frequency. However, with the telephone off-hook, the DET output will be at logic low level for more than half the time. Therefore, by sampling the DET output, a software routine can discriminate between on-hook and off-hook through examination of the duty cycle. Full removal of the ringing frequency from the DT input, while maintaining ringtrip within required time limits (approximately < 100 ms), usually mandates a second order filter rather than the first order shown in figure 15. The software approach minimizes the number of line card components. In the balanced ringing system shown in figure 16, RRT1 and RRT2 are the ringing feed and loop current sensing resistors. With the telephone on-hook, no dc loop current flows to cause a dc voltage drop across resistor RRT1. Voltage divider R1, R2 and R3 biases the ringtrip comparator input DT to be more positive than VEE during on-hook. With the telephone offhook during ringing dc loop current will flow, causing a voltage drop across resistor RRT1, which will make comparator input DT more negative than VEE. This will set the DET output to logic low level, indicating ringtrip condition. Capacitors C1 and C2 filter the ringing voltage at the comparator input. With component values according to figure 16, 20 Hz ringing will be attenuated by 20 dB and 30 Hz ringing will be attenuated by 23 dB before reaching the DT input. Relay Driver The PBL 3766 SLIC incorporates a ring relay driver designed as open emitter with grounded collector (npn) having a current sourcing capability of 50 mA. The relay coil must be connected to a negative voltage ≤ |VBat|. An external inductive kickback clamp diode must be employed to protect the drive transistor. Control Inputs Overview The PBL 3766 SLIC has two TTL compatible control inputs, C1 and C2. A decoder in the SLIC interprets the control input conditions and sets up the commanded operating state. Open Circuit State (C2, C1 = 0, 0) In the Open Circuit State the TIPX and RINGX line drive amplifiers as well as other circuit blocks are powered down. PBL 3766 TIPX I Ldc 27/21 + VTR RL RINGX -2.5 V GND - 14/11 VTR 1 41.7 kΩ I Ldc + Comp Figure 12. Battery feed (C2, C1 = 1, 0; active state). 5·105 VSGRef = 12.5 + RSG + 25 kΩ VSG = -7.50 – C DC VBat 28/22 VSG Ref RSG RDC VTR > VSG Ref 1 VTR < VSG Ref 0 RDC 7/4 0.6 R SG VSG Saturation Guard V EE I Ldc 1000 16/12 RSN PBL 3766 3.0·105 RSG + 25 kΩ I L (mA) RDC = 21.0 kohms 40 RDC = 41.2 kohms 30 RDC = 82.5 kohms 20 10 0 Figure 13. PBL 3766 loop feed examples. 500 0 1000 R L (ohms) RSG = 0 ohms 1500 2000 VBat = -58 V to -42 V Ring trip Comparator I LTIPX TIPX RINGX 27/21 28/22 I LTIPX - I LRINGX 2 K + 62.5 kΩ VEE PBL 3766 RD = 1 , ILThOff /KLThOff - 1/62500 MUX 11/8 9/7 DET E0 1.25V 22/19 18/13 RD ILThOff = 8.0 mA for RD → ∞ For ILThOff > 8.0 mA: C1 C2 VCC 2-Wire Interface I LRINGX Figure 14. Loop current detector. On-hook to off-hook loop current threshold, ILThOff : 13/10 12/9 Input Decoder CD VEE RD -5V KLThOff = 500 V (includes factor K) 4-15 PBL 3766 This causes the SLIC to present a high impedance to the line. Power dissipation is at a minimum. No detectors are active. Ringing State (C2, C1 = 0, 1) The ring relay driver, RINGRLY, is activated and the ring trip comparator is connected to the detector out-put, DET. The TIPX and RINGX terminals are in the high impedance state and signal transmission is inhibited. Active State (C2, C1 = 1, 0) TIPX is the terminal closest to ground potential and sources loop current, while RINGX is the more negative terminal and sinks loop current. Vf signal transmission is normal. The loop current detector is activated and connected to the DET output. Stand-By State (C2, C1 = 1, 1) In the stand-by state the line drive amplifiers are disconnected. The loop feed is converted to resistive form according to IL ≈ VBat - 3 V RL + 1800 Ω where IL = loop current (A) VBat = battery supply voltage (V) RL = loop resistance (ohm) The short circuit loop current (ILSh) for VBat = -48V is then limited to ILSh ≈ 25.0 mA. The loop current detector is activated in the stand-by state and is gated to the DET output. Table 1 summarizes the above description of the control inputs. CRT RRT R1 DT 23/20 DR R2 + To DET - VEE TIP PBL 3766 E RG KR Figure 15. Example ring trip network, unbalanced ringing. VBat RING Note: Ericsson Components unbalanced ring trip network PBA 3310 contains a two-pole filter. E RG+ RRT1 150Ω DT R1 150kΩ RRT2 150Ω R2 150kΩ C1 470nF 23/20 DR C2 470nF R3 3.1MΩ + To DET - VEE E RG-48V -48V TIPX TIP RF1 RF2 RING KR 27/21 Protection RINGX 28/22 PBL 3766 Figure 16. Example ring trip network, balanced ringing. 4-16 PBL 3766 Enable Input (E0) dissipators, when transients are clamped TTL compatible enable input E0 controls and of being fuses, when the line is exposed to a power cross. Ericsson the function of the DET output. E0, when set to logic level low, enables Components AB offers a series of thick the DET output, which is a collector output film resistors networks (e g PBR 51-series and PBR 53-series) designed for this with internal pull-up resistor (approx. application. 15 kohms) to VCC. A DET output at logic Also devices with a build in resetable level low indicates triggered detector fuse function is offered (e g PBR 52condition (loop current above threshold series) including positive temperature current or telephone off-hook during coefficient (PTC) resistors, working as ringing). A DET output at logic level high resetable fuses, in series with thick film indicates a non triggered detector resistors. Note that it is important to condition. E0, when set to logic level high disables always use PTC's in series with resistors the DET output; i.e. it appears as a resist- not sensitive to temperature, as the PTC will act as a capacitance for fast or connected to VCC. Table 2 summarizes the above descrip- transients and therefore the ability to protect the SLIC will be reduced. tion of the enable input. If there is a risk for overvoltages on the Overvoltage Protection VBat terminal on the SLIC, then this terminal should also be protected. The PBL 3766 SLIC must be protected against overvoltages and power crosses. Overtemperature Protection Refer to Maximum Ratings, TIPX and A ring lead to ground short circuit fault RINGX terminals for maximum allowable condition, as well as other improper continuous and transient voltages, that operating modes, may cause excessive may be applied to the SLIC. The circuit shown in figure 11 utilizes series resistors SLIC power dissipation. If junction temperature increases beyond 160 °C, (RF, RF) together with a programmable the temperature guard will trigger, causing overvoltage protector (e g Texas Instrument TISP PBL1), serving as a secondary the SLIC to be set to a high impedance state. In this high impedance state power protection. dissipation is reduced and the junction The protection network in figure 11 is designed to meet requirements in CCITT temperature will return to a safe value. Once below 140 °C junction temperature K20, Table 1. The TISP PBL1 is a dual the SLIC is returned back to its normal forward-conducting buffered p-gate overvoltage protector. The protector gate operating mode and will remain in that state assuming the fault condition has references the protection (clamping) voltage to negative supply voltage (i e the been removed. Table 1. PBL 3766 operating states battery voltage, V ). As the protection Power-up Sequence The voltage at pin VBAT sets the substrate voltage, which must at all times be kept more negative than the voltage at any other terminal. This is to maintain correct junction isolation between devices on the chip. To prevent possible latch-up, the correct power-up sequence is to connect ground and VBat, then other supply voltages and signal leads. Should the VBat supply voltage be absent, a diode with a 2 A current rating, connected with its cathode to VEE and anode to VBat, ensures the presence of the most negative supply voltage at the VBAT terminals. The VBat voltage should not be applied at a faster rate than ∂VBat/∂t = 4 V/µsec or with a time constant formed by a 5.1 ohm resistor in series with the VBAT pin and a 0.47 microfarad capacitor from the VBAT pin to ground. One resistor may be shared by several SLICs. Printed Circuit Board Layout Care in PCB layout is essential for proper function. The components connecting to the RSN input should be placed in close proximity to that pin, such that no interference is injected into the RSN terminal. A ground plane surrounding the RSN pin is advisable. The CHP capacitor should be placed close to terminals HPT and HPR to avoid un-wanted disturbances. Bat voltage will track the negative supply voltage the overvoltage stress on the SLIC is minimised. Positive overvoltages are clamped to ground by an internal diode. Negative overvoltages are initially clamped close to the SLIC negative supply rail voltage. If sufficient current is available from the overvoltage, then the protector will crowbar into a low voltage on-state condition, clamping the over-voltage close to ground. A gate decoupling capacitor, CTISP is needed to carry enough charge to supply a high enough current to quickly turn on the thyristor in the protector. Without the capacitor even the low inductance in the track to the VBat supply will limit the current and delay the activation of the thyristor clamp. The fuse resistors RF serve the dual purposes of being non-destructive energy State number C2 C1 SLIC operating state Active detector DET Output Note 1. 1 2 3 4 0 0 1 1 0 1 0 1 Open circuit Ringing Active Stand-by No active detector Ring trip detector Loop curr. detector Loop curr. detector Logic level high Ring trip status Loop current status Loop current status Note 1. E0 = 0, i.e. the DET output is enabled. A logic low level at the DET output indicates a triggered detector. Table 2. Enable input E0 Enable state E0 DET output status Active detector 1 0 Active 2 1 High impedance Note 2. Loop current or ring trip detector Note 1. None Notes 1. Detector selected according to Table 1. 2. In the high impedance state the DET output appears as a 15 kohms resistor to VCC 4-17 PBL 3766 Ordering Information Package Temp. Range Part No. Plastic DIP 22 pin 0 °C to 70 °C PBL 3766N Plastic DIP 22 pin 0 °C to 70 °C PBL 3766/6N PLCC 28 pin 0 °C to 70 °C PBL 3766QN PLCC 28 pin 0 °C to 70 °C PBL 3766/6QN Information given in this data sheet is believed to be accurate and reliable. However no responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Components AB. These products are sold only according to Ericsson Components AB' general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice. 1522-PBL 3766 Uen Rev. B © Ericsson Components AB September 1997 This product is an original Ericsson product protected by US, European and other patents. Ericsson Components AB S-164 81 Kista-Stockholm, Sweden Telephone: (08) 757 50 00 4-18