INTEGRATED CIRCUITS DATA SHEET PCA159x series 32 kHz watch circuits with frequency adjustment Product specification Supersedes data of September 1993 File under Integrated Circuits, IC16 1997 Apr 21 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series FEATURES GENERAL DESCRIPTION • 32 kHz oscillator frequency The PCA159x series devices are silicon-gate CMOS integrated circuits specially suited for battery-operated, quartz-crystal-controlled clocks, with a bipolar stepping motor. • Low current consumption; typically 1.5 µA, maximum 5 µA • Low minimum supply voltage: 1.1 V • Alarm input • Motor test • Test mode speed-up for fast testing • Quartz frequency electrically programmable and reprogrammable (via EEPROM) • Protected against electrostatic charges. ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION(1) VERSION PCA1593U/10 − chip on film frame carrier (FFC) − PCA1594U/10 − chip on film frame carrier (FFC) − PCA1595U/10 − chip on film frame carrier (FFC) − PCA1596U/10 − chip on film frame carrier (FFC) − PCA1597U/10 − chip on film frame carrier (FFC) − Note 1. Figure 1 and Chapter “Package outlines” show details of standard packages, available for large orders only. Chapter “Chip dimensions and bonding pad locations” shows exact pad locations for other delivery formats. 1997 Apr 21 2 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series PINNING SYMBOL PIN DESCRIPTION OSC OUT 1 oscillator output VSS 2 ground (0 V) ALARM/TEST IN 3 alarm and test input M1 4 motor 1 output M2 5 motor 2 output ALARM OUT 6 alarm output VDD 7 supply voltage OSC IN 8 oscillator input OSC OUT 1 VSS 2 ALARM/TEST IN 3 M1 4 PCA159xP PCA159xT 8 OSC IN 7 V DD 6 ALARM OUT 5 M2 MLB321 Fig.1 Pin configuration, PCA159xP and PCA159xT, (DIP8 and SO8). FUNCTIONAL DESCRIPTION AND TESTING MOTOR TEST Operating mode The alarm input is connected to VDD. In this test mode the motor output period is 125 ms (all types) and the motor pulse width is identical to that of the normal mode. The alarm output periods are also increased by a factor of 128. The alarm modulation is also suppressed. The alarm input (pin 3) is left open-circuit. Motor pulses as shown in Fig.2 are provided at M1 and M2. An output frequency of 256 Hz is provided at pin 3 for test purposes. Alarm mode IC TEST (IC SUPPLIER ONLY) The alarm input is connected to VSS. The alarm signal in accordance with Fig.3 is provided at pin 6. The customer uses this mode during frequency programming. On the negative edge of the first positive pulse (see Fig.7) the IC test is enabled. The motor output is increased by a factor of 1024. The duty factor in this mode is 1 : 1. The alarm mode is disabled. Test mode (see Fig.4) The circuit must be in normal operating mode for at least 10 ms before entering test mode. On the positive edge of the second pulse (corresponding to the first program pulse) the motor test mode is re-selected. The test mode consists of two parts: motor test and IC test. To disable the test mode, pin 3 must be left open-circuit or connected to VSS. M1 VDD V SS tp M2 VDD V SS tp T 2T Fig.2 Motor output waveforms. 1997 Apr 21 3 MLB322 4 0.5 s 8 Hz / 2 kHz VDD V SS Product specification PCA159x series Fig.3 Alarm output waveforms. Philips Semiconductors 4s 32 kHz watch circuits with frequency adjustment 1997 Apr 21 alarm signal B 8 Hz / 2 kHz VDD alarm signal A 1s 1s V SS MLB323 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series 1.4 V 32 kHz OSC OUT V SS 1 8 2 7 PCA159x SERIES alarm normal motor test ALARM M1 3 6 4 5 OSC IN VDD ALARM OUT M2 RM MLB324 Fig.4 Test circuit. The negative edge of the second pulse increases the capacitance by one unit, this occurs on all the subsequent pulses. The frequency can be measured between these increases. This procedure is repeated until the required frequency is obtained. If the adjustment to the frequency is greater than required, the procedure can be restarted with step 2. Frequency trimming Frequency trimming is carried out by electrically programming the oscillator input capacitance to one of 64 values contained within the non-volatile memory. This is accomplished by carrying out the following five steps; Figs 5, 6 and 7 illustrate this procedure. 1. Erasing 4. Writing With VSS = −1.4 V, the generator (pin 3) is taken from −1.4 V to 0 V. The device is now in test mode. Erasure is carried out by increasing VSS to −5.5 V and setting the generator (pin 3) to +1.4 V. The capacitance is fixed by increasing VSS to −5.5 V. 5. Checking writing With VSS = −1.4 V, the generator (pin 3) is taken from −1.4 V to 0 V. The device is in test mode and trimmed capacitance is obtained. The frequency can be checked. 2. Checking erasing/zero With VSS = −1.4 V, the generator (pin 3) is taken from −1.4 V to 0 V. The device is in test mode and minimum capacitance is obtained. Remark 3. Measure/data input The information concerning the capacitive value is obtained from the EEPROM cells and the program register. Therefore the program register must be reset before the frequency can be measured (see steps 1 to 5). Programming can be performed 100 times. On the first 1.4 V pulse (pin 3) the test mode is changed from motor test to IC test. This pulse releases the program register thus allowing the frequency to be programmed. The positive edge of the second pulse switches the IC test mode back to the motor test mode. 1997 Apr 21 5 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series VDD = 0 V 32 kHz generator 1.4 to 5.5 V 1 nF ALARM OSC OUT V SS 1 kΩ ALARM M1 1 8 2 7 PCA159x SERIES 3 6 4 5 OSC IN VDD ALARM OUT (1) M2 V SS (pin 2) MLB326 (1) During programming ALARM OUT is active LOW, so that programming is possible when the alarm transistor is connected to pin 6. Fig.5 Frequency trimming circuit. MLB325 ∆f f (10−6) 60 C i min 40 20 0 C i max −20 −40 0 20 40 60 80 number of data correction pulses Fig.6 Typical frequency characteristic; C1 = 2.8 fF, C0 = 3 pF, CL = 10 pF, f = 32.768 kHz. 1997 Apr 21 6 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment OPERATION CONDITIONS ERASE PCA159x series CHECKING ERASE/ ZERO 0V DATA INPUT CHECKING WRITE WRITE 1.4 V V SS pin 2 5.5 V 1.4 V GEN. pin 3 generator pin 3 0V 1.4 V N= N= N= 1 2 0 TIME T1 T1 T2 T4 T5 T4 T1 T1 T2 T3 T4 T5 T4 T1 T1 T2 MLB327 Fig.7 Frequency trimming signals (VDD = 0 V). Table 1 Frequency trimming timing requirements TIME Reset time 1 SYMBOL MIN. MAX. UNIT T1 1 − ms Reset time 2 T2 5 − ms Data pulse width/gap T3 100 − µs Supply rise/fall time T4 1 − ms WRITE/ERASE time T5 10 − ms 1997 Apr 21 7 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series AVAILABLE TYPES MOTOR OUTPUT SHORT TYPE NUMBER DELIVERY FORMAT(1) PERIOD tT (s) PULSE tP (ms) MINIMUM CURRENT IM (mA) EEPROM ALARM SIGNAL (see Fig.3) 1593 U/10 1 31.25 4.3 yes B 1594 U/10 1 46.8 4.3 yes A 1595 U/10 1 46.8 4.3 yes B 1596 U/10 1 15.6 4.3 yes A 1597 U/10 4 15.6 4.3 yes B Note 1. U/10 = Chip on film frame carrier (FFC). LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT +1.8 −6 V all input voltages except pin 3 VSS VDD V input voltage at pin 3 VSS VDD + 1 V VSS supply voltage VI V3-2 VDD = 0 V; note 1 output short-circuit duration at pins 4, 5 and 6 indefinite Tamb operating ambient temperature −10 +60 °C Tstg storage temperature −30 +125 °C Note 1. Connecting the battery at 1.8 V maximum with reversed polarity does not destroy the circuit, but in this condition a large current flows, which will rapidly discharge the battery. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is advisable to take handling precautions appropriate to handling MOS devices. Advice can be found in “Data Handbook IC16, General, Handling MOS Devices”. 1997 Apr 21 8 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series CHARACTERISTICS VDD = 0 V; VSS = −1.4 V; fosc = 32.768 kHz; Tamb = 25 °C; crystal: RS = 20 kΩ; C1 = 2 to 3 fF; CL = 10 pF; C0 = 3 pF; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VSS1 supply voltage operating −1.1 − −1.8 V VSS2 supply voltage starting −1.2 − − V VSS3 supply voltage programming −5.4 −5.5 −5.6 V IDD supply current RL = ∞ − 1.5 5.0 µA Motor output (pins 4 and 5) tT period note 1 1.0 − 60.0 s tP pulse width note 1 3.9 − 62.5 ms IM current into load RM = 200 Ω; VSS = −1.2 V 4.3 − − mA Ro output impedance RM = 200 Ω − 50 − Ω Alarm output (pin 6) output waveforms see Fig.3 Isink sink current R = 10 Ω; VSS = −5.5 V − 200 − µA Isource source current R = 1 Ω; VSS = −1.2 V 0.3 1.0 − mA − − 70 ms − 2 − µA − 50 − µA Alarm test input (pin 3) td input delay time II input current note 2 VSS = −5.5 V Oscillator (pins 1 and 8) Rp polarization resistance 3 10 30 MΩ Co output capacitance (pin 1) − 24 − pF Ci input capacitance data pulses (pin 8) − 9 − pF ∆Ci input capacitance steps − 0.25 − pF ∆f/f frequency stability n = 0; note 3 ∆VSS = 100 mV; n = 20 − 0.6 × 10− − 6 tret data retention time Tamb = −10 to +60 °C Notes 1. See Chapter “Available types” for the typical values. 2. These are average values for the 256 Hz output with 1 : 1 duty factor. 3. Number of data correction pulses (n). 1997 Apr 21 9 − 10 − years Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series CHIP DIMENSIONS AND BONDING PAD LOCATIONS y M1 M2 TEST/ ALARM IN 1.93 mm PCA159xU SERIES ALARM OUT VDD V SS 0 OSC IN OSC OUT 0 x 1.35 mm MLB328 mm2. Chip area: 2.61 Bonding pad dimensions: 110 µm × 110 µm. Fig.8 Bonding pad locations, PCA159xU series; 8 terminals. Table 2 Bonding pad locations (dimensions in µm) All x/y coordinates are referenced to bottom left pad (OSC IN), see Fig.8. PAD x y OSC OUT 1006 0 VSS 1006 220 TEST/ALARM IN 1006 1111 M1 1006 1296 M2 0 1296 ALARM OUT 0 651 VDD 0 376 OSC IN chip corner (max. value) 1997 Apr 21 0 0 −202 −225 10 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series APPLICATION INFORMATION 1.4 V 32 kHz ALARM OSC OUT V SS ALARM M1 alarm 1 8 2 7 PCA159x SERIES 3 6 4 5 alarm switch OSC IN VDD ALARM OUT M2 (1) M normal MLB320 V SS (pin 2) (1) The emitter of the transistor must be connected to VSS, except when used as a replacement for the PCA158X series where it must be connected to pin 3; in this event the base of the alarm transistor must be connected via a 1 kΩ series resistor. Fig.9 Typical application circuit diagram. 1997 Apr 21 11 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1997 Apr 21 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 12 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series SO8: plastic small outline package; 8 leads (straight); body width 3.9 mm D SOT96-2 E A X c HE v M A Z 8 5 Q A2 pin 1 index L 1 4 bp e detail X w M 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A2 bp c D (1) E (2) e HE L Q v w Z (1) mm 1.45 1.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.4 6.2 1.2 0.7 0.6 0.25 0.25 0.7 0.3 inches 0.057 0.049 0.019 0.0100 0.20 0.014 0.0075 0.19 0.16 0.15 0.050 0.028 0.024 0.01 0.01 0.028 0.012 0.252 0.047 0.244 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 95-02-04 97-05-22 SOT96-2 1997 Apr 21 EUROPEAN PROJECTION 13 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. SOLDERING Introduction Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: DIP • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied 1997 Apr 21 14 Philips Semiconductors Product specification 32 kHz watch circuits with frequency adjustment PCA159x series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Apr 21 15 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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