INTEGRATED CIRCUITS DATA SHEET TDA8579 Dual common-mode rejection differential line receiver Product specification Supersedes data of January 1994 File under Integrated Circuits, IC01 1995 Dec 15 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 FEATURES GENERAL DESCRIPTION • Excellent common-mode rejection, up to high frequencies The TDA8579 is a two channel differential amplifier with 0 dB gain and low distortion. The device has been primarily developed for car radio applications where long connections between signal sources and amplifiers (or boosters) are necessary and where ground noise has to be eliminated. The device is intended to be used to receive line inputs in audio applications that require a high level of common-mode rejection. The device is contained in an 8-pin small outline (SO) or dual in-line (DIP) package. • Elimination of source resistance dependency in the common-mode rejection • Few external components • High supply voltage ripple rejection • Low noise • Low distortion • All pins protected against electrostatic discharge • AC and DC short-circuit safe to ground and VCC • Fast DC settling. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. 5.0 TYP. supply voltage ICC supply current − 11 14 mA Gv voltage gain −0.5 0 +0.5 dB SVRR supply voltage ripple rejection 55 60 − dB Vno noise output voltage − 3.7 5.0 µV Zi input impedance CMRR common-mode rejection ratio Rs = 0 Ω 18 UNIT VCC VCC = 8.5 V 8.5 MAX. V 100 240 − kΩ − 80 − dB ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8579 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TDA8579T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 1995 Dec 15 DESCRIPTION 2 VERSION Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 BLOCK DIAGRAM FUNCTIONAL DESCRIPTION The TDA8579 contains two identical differential amplifiers with a voltage gain of 0 dB. The device is intended to receive line input signals for audio applications. The TDA8579 has a very high level of common-mode rejection and thus eliminates ground noise. The common-mode rejection remains constant up to high frequencies (the amplifier gain is fixed at 0 dB). The inputs have a high input impedance. The output stage is a class AB stage with a low output impedance. For a large common-mode rejection, also at low frequencies, an electrolytic capacitor connected to the negative input is advised. Because the input impedance is relatively high, this results in a large settling time of the DC input voltage. Therefore a quick-charge circuit is included to charge the input capacitor within 0.2 seconds. VCC 8 1 INL 7 OUTL VCC 2 IN 4 TDA8579 6 INR SVRR OUTR 3 5 MBD230 GND All input and output pins are protected against high electrostatic discharge conditions (4000 V, 150 pF, 150 Ω). Fig.1 Block diagram. PINNING SYMBOL PIN DESCRIPTION INL+ 1 positive input left IN− 2 common negative input INR+ 3 SVRR GND 8 V CC 7 OUTL 3 6 OUTR 4 5 GND INL 1 positive input right IN 2 4 half supply voltage INR 5 ground SVRR OUTR 6 output right OUTL 7 output left VCC 8 supply voltage 1995 Dec 15 TDA8579 MBD231 Fig.2 Pin configuration. 3 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 LIMITING VALUES in accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage − 18 V IORM repetitive peak output current − 40 mA Vsc AC and DC short-circuit safe voltage − 18 V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Tj maximum junction temperature − +150 °C operating THERMAL CHARACTERISTICS SYMBOL Rth j-a 1995 Dec 15 PARAMETER VALUE UNIT thermal resistance from junction to ambient in free air TDA8579 (DIP8) 110 K/W TDA8579T (SO8) 160 K/W 4 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 CHARACTERISTICS VCC = 8.5 V; Tamb = 25 °C; f = 1 kHz; measured in test circuit of Fig.3; unless otherwise specified. SYMBOL PARAMETER VCC supply voltage ICC supply current VO DC output voltage tset DC input voltage settling time Gv voltage gain αcs channel separation ∆Gv channel unbalance fL low frequency roll-off fH high frequency roll-off Zi input impedance CONDITIONS note 1 MIN. TYP. MAX. UNIT 5.0 8.5 18 V − 11 14 mA − 4.3 − V − 0.2 − s −0.5 0 +0.5 dB 70 80 − dB − − 0.5 dB −1 dB; note 2 20 − − Hz −1 dB 20 − − kHz 100 240 − kΩ Rs = 5 kΩ Zo output impedance − − 10 Ω Vi(max) maximum input voltage THD = 1% − 2.0 − V Vno noise output voltage Rs = 0 Ω; note 3 − 3.7 5.0 µV VCM(rms) common-mode input voltage (RMS value) − − 1.0 V CMRR common-mode rejection ratio Rs = 5 kΩ 66 70 − dB Rs = 0 Ω; note 4 − 80 − dB SVRR supply voltage ripple rejection note 5 55 65 − dB note 6 − 60 − dB THD total harmonic distortion Vi = 1 V; − 0.02 − % Vi = 1 V; f = 20 Hz to 20 kHz − − 0.1 % Vi = 1 V; RL = 150 Ω − − 1 % THDmax total harmonic distortion at maximum output current Notes 1. The DC output voltage with respect to ground is approximately 0.5VCC. 2. The frequency response is externally fixed by the input coupling capacitors. 3. The noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted). 4. The common-mode rejection ratio is measured at the output with a voltage source 1 V (RMS) in accordance with the test circuit (see Fig.3) while VINL and VINR are short-circuited. Frequencies between 100 Hz and 100 kHz. 5. The ripple rejection is measured at the output, with Rs = 2 kΩ, f = 1 kHz and a ripple amplitude of 2 V (p-p). 6. The ripple rejection is measured at the output, with Rs = 0 to 2 kΩ, f = 100 Hz to 20 kHz and a maximum ripple amplitude of 2 V (p-p). 1995 Dec 15 5 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 8.5 V Rs V INL 100 nF 220 nF 8 2.2 µF 1 5 kΩ 7 OUTL VCC 22 µF V CM 47 µF TDA8579 2 SVRR 4 2.2 µF V INR 6 Rs 220 nF 3 5 5 kΩ OUTR RL RL 10 k Ω 10 k Ω MBD232 Fig.3 Test and application circuit. MBD215 10 1 THD (%) 10 2 10 3 10 10 2 10 3 10 4 f (Hz) Fig.4 Total harmonic distortion as a function of frequency; Vi = 1 V (RMS). 1995 Dec 15 6 10 5 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 MBD216 0 CMR (dB) 20 40 (1) 60 (2) 80 (3) 100 10 10 2 10 3 10 4 f (Hz) 10 5 (1) Rs = 5 kΩ. (2) Rs = 2 kΩ. (3) Rs = 0 kΩ. Fig.5 Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS). MBD213 1 THD (%) 10 1 10 2 10 3 10 10 2 10 3 V i (rms) (mV) Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz. 1995 Dec 15 7 10 4 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 MBD214 40 CMR (dB) 50 60 70 80 90 100 300 500 700 900 1100 V CM (rms) (mV) 1300 Fig.7 Common-mode rejection ratio as a function of common-mode input voltage; f = 1 kHz (Rs = 0 Ω). MBD211 0 CMR (dB) 20 40 (1) (2) (3) 60 80 100 10 10 2 10 3 10 4 f (Hz) (1) C2 = 22 µF. (2) C2 = 47 µF. (3) C2 = 100 µF. Fig.8 Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS). 1995 Dec 15 8 10 5 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 MBD212 30 SVR (dB) 40 50 60 70 10 10 2 10 3 f (Hz) Fig.9 Supply voltage ripple rejection as a function of frequency; Vripple = 2 V (p-p), Rs = 2 kΩ. 1995 Dec 15 9 10 4 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.020 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.10 0.30 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT97-1 050G01 MO-001AN 1995 Dec 15 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-02-04 10 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1995 Dec 15 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 11 o 8 0o Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1995 Dec 15 12 Philips Semiconductors Product specification Dual common-mode rejection differential line receiver TDA8579 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1995 Dec 15 13