Reflexlichtschranke Reflective Interrupter SFH 9202 Wesentliche Merkmale Features • Optimaler Arbeitsabstand 1 mm bis 5 mm • IR-GaAs-Lumineszenzdiode in Kombination mit einem Si-NPN-Fototransistor • Tageslichtsperrfilter • Geringe Sättigungsspannung • Sender und Empfänger galvanisch getrennt • Lötmethode: IR-Reflow Löten • Vorbehandlung nach JEDEC Level 4 • Optimal operating distance 1 mm to 5 mm • IR-GaAs-emitter in combination with a Silicon NPN phototransistor • Daylight cut-off filter • Low saturation voltage • Emitter and detector electrically isolated • Soldering Methode: IR Reflow Soldering • Preconditioning acc. to JEDEC Level 4 Anwendungen Applications • • • • • • • • Positionsmelder Endabschalter Drehzahlüberwachung Bewegungssensor Position reporting End position switch Speed monitoring Motion transmitter Typ Type Bestellnummer Ordering Code ICE [mA] (IF = 10 mA, VCE = 5 V, d = 1 mm) SFH 9202 Q62702P5039 0.063 … 0.8 SFH 9202-2/3 Q62702P5009 0.063 … 0.2 SFH 9202-3/4 Q62702P5010 0.10 … 0.32 SFH 9202-4/5 Q62702P5472 0.16 … 0.50 SFH 9202-5/6 Q62702P5435 0.25 … 0.80 2004-09-23 1 SFH 9202 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Sperrspannung Reverse voltage VR 5 V Vorwärtsgleichstrom Forward current IF 50 mA Verlustleistung Power dissipation Ptot 80 mW Dauer-Kollektor-Emitter-Sperrspannung Continuous collector-emitter voltage VCE 16 V Kollektor-Emitter-Sperrspannung, (t ≤ 1 min) Collector-emitter voltage, (t ≤ 1 min) VCE 30 Emitter-Kollektor-Sperrspannung Emitter-collector voltage VEC 7 Kollektorstrom Collector current IC 10 mA Verlustleistung Total power dissipation Ptot 100 mW Lagertemperatur Storage temperature range Tstg – 40 … + 100 °C Umgebungstemperatur Ambient temperature range TA – 40 … + 100 Verlustleistung Power dissipation Ptot 150 mW Elektrostatische Entladung Electrostatic discharge ESD 2 KV Umweltbedingungen / Environment conditions 3 K3 acc. to EN 60721-3-3 (IEC 721-3-3) Sender (GaAs-Diode) Emitter (GaAs diode) Empfänger (Si-Fototransistor) Detector (silicon phototransistor) Reflexlichtschranke Light Reflection Switch 2004-09-23 2 SFH 9202 Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Durchlaβspannung Forward voltage IF = 50 mA VF 1.25 (≤ 1.65) V Sperrstrom Reverse current VR = 5 V IR 0.01 (≤ 1) µA Kapazität Capacitance VR = 0 V, f = 1 MHz CO 25 pF Wärmewiderstand1) Thermal resistance1) RthJA 270 K/W Kapazität Capacitance VCE = 5 V, f = 1 MHz CCE 5 pF Kollektor-Emitter-Reststrom Collector-emitter leakage current VCE = 20 V ICEO 1 (≤ 50) nA Fotostrom (Fremdlichtempfindlichkeit) Photocurrent (outside light density) VCE = 5 V, Ev = 1000 Lx IP 1 mA Wärmewiderstand1) Thermal resistance1) RthJA 270 K/W Sender (GaAs-Diode) Emitter (GaAs diode) Empfänger (Si-Fototransistor) Detector (silicon phototransistor) 2004-09-23 3 SFH 9202 Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Kollektor-Emitterstrom Collector-emitter current Kodak neutral white test card, 90% Reflexion IF = 10 mA; VCE = 5 V; d = 1 mm ICE min. ICE max 63 800 µA µA Kollektor-Emitter-Sättigungsspannung Collector-emitter saturation voltage Kodak neutral white test card, 90% Reflexion IF = 10 mA; d = 1 mm; IC = 20 µA VCE sat 0.15 (≤ 0.6) V Reflexlichtschranke Light Reflection Switch 1) Montage auf PC-Board mit > 5 mm2 Padgröβe 1) Mounting on pcb with > 5 mm2 pad size d Reflector with 90% reflexion (Kodak neutral white test card) OHM02257 2004-09-23 4 SFH 9202 Schaltzeiten (TA = 25 °C, VCC = 5 V, IC = 100 µA1), RL = 1 kΩ) Switching Times ΙF RL ΙC VCC Output OHM02258 Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Einschaltzeit Turn-on time tein ton 40 µs Anstiegzeit Rise time tr 30 µs Ausschaltzeit Turn-off time taus toff 45 µs Abfallzeit Fall time tf 40 µs 1) IC eingestellt über den Durchlaβstrom der Sendediode, den Reflexionsgrad und den Abstand des Reflektors vom Bauteil (d) 1) IC as a function of the forward current of the emitting diode, the degree of reflection and the distance between reflector and component (d) 2004-09-23 5 SFH 9202 Collector Current ΙC I I Cmax C - = f(d) ------------- Permissible Power Dissipation for Diode and Transistor Ptot = f (TA ) OHO02255 100 Ι C max % Switching Characteristics t = f (RL) TA = 25 °C, IF = 10 mA OHO01367 10 3 OHL00945 160 mW Total power dissipation t Ptot µs t on t off 80 120 Detector 100 60 Emitter 80 40 10 2 60 40 20 Kodak neutral white test card 20 Mirror 0 0 0 1 2 3 4 mm 5 d Max. Permissible Forward Current IF = f (TA) IF 40 60 80 ˚C 100 Transistor Capacitance (typ.) CCE = f (VCE), TA = 25 °C, f = 1 MHz OHO00496 20 C CE 100 20 10 1 0 10 kΩ RL 10 1 TA OHL00986 120 mA 0 pF 10 2 Collector Current IC = f (IF), spacing d to reflector = 1 mm, 90% reflection OHO01324 300 Ι C µA 15 80 200 60 10 40 100 VCE = 5 V 5 20 0 0 20 40 60 80 ˚C 100 TA Forward Voltage (typ.) of the Diode VF = f (T) OHO02256 1.30 VF V 0 -2 10 10 -1 10 0 10 1 V 10 2 V CE Relative Spectral Emission of Emitter (GaAs) Irel = f (λ) and Detector (Si) Srel = f (λ) OHO00786 100 Ι rel S rel % 0 0 4 8 12 16 mA 20 ΙF Output Characteristics (typ.) IC = f (VCE), spacing to reflector: d = 1 mm, 90% reflection, TA = 25 °C 0.6 Ι C mA OHO01326 Ι F = 25 mA 0.5 1.25 80 Ι F = 20 mA Ι F = 20 mA 10 mA 1.20 0.4 60 5 mA Ι F = 15 mA 0.3 1.15 Detector 40 0.2 1.10 20 1.05 0.1 Emitter 1 -40 -20 2004-09-23 0 20 40 60 C T 100 0 700 800 900 1000 nm 1100 λ 6 0 0.1 Ι F = 10 mA Ι F = 5 mA 10 0 10 1 V VCE SFH 9202 Maßzeichnung Package Outlines 6.2 (0.244) (0.4 (0.016) typ.) 6 1 2 3 5 0...0.1 (0...0.004) B 2.1 (0.083) 1.7 (0.067) (0.05 (0.002) typ.) 3.8 (0.150) 2.54 (0.100) Raster (spacing) (1.2 (0.047) typ.) 0.5 (0.020) 0.3 (0.012) Sender/Emitter 4.2 (0.165) 1.27 (0.050) Raster (spacing) A (0.1 (0.004) typ.) 5.8 (0.228) 3.4 (0.134) 3.0 (0.118) (5˚) 0.15 (0.006) 0.13 (0.005) 0.2 M A 4 Chip Positionen 0.1 M B Empfänger/Receiver GPLY0504 Type 1 2 3 4 5 6 SFH 9202 Anode – Emitter Collector – Cathode Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2004-09-23 7 SFH 9202 0.6 (0.024) IR-Reflow Löten IR REflow Soldering 1.2 (0.047) 1.27 (0.050) 1.27 (0.050) Empfohlenes Lötpaddesign Recommended Solder Pad Padgeometrie für verbesserte Wärmeableitung Paddesign for improved Heat dissipation 3.9 (0.154) Cu-Fläche >5 mm 2 Cu-area >5 mm 2 Lötstopplack Solder resist OHPY0030 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2004-09-23 8 SFH 9202 Löthinweise Soldering Conditions Bauform Type SFH 9202 Drypack Level acc. to IPS-stand. 020 Tauch-, Schwalllötung Dip, Wave Soldering Reflowlötung Reflow Soldering Peak Temp. Max. Time in Peak Temp. Max. Time (solderbath) peak zone (package in Peak temp.) Zone 4 n. a. 245 °C – Kolbenlötung Iron Soldering (Iron temp.) 10 sec. n.a. Bitte Verarbeitungshinweise für SMT-Bauelemente beachten! Please observe the handling guidelines for SMT devices! IR-Reflow Lötprofil IR Reflow Soldering Profile (nach IPC 9501) (acc. to IPC 9501) OHLY0597 300 C T 250 240-245 C 10-40 s 200 183 C 120 to 180 s ramp-down rate up to 6 K/s 150 defined for Preconditioning: up to 6 K/s 100 ramp-up rate up to 6 K/s 50 defined for Preconditioning: 2-3 K/s 0 0 50 100 150 200 t 2004-09-23 9 s 2 SFH 9202 Gurtung / Polarität und Lage siehe Dokument: Short Form Katalog: Gurtung und Verpackung - SMT-Bauelemente - Gehäuse:SMT RLS Methode of Taping / Polarity and Orientation see document: Short Form Catalog: Tape and Reel SMT-Components - Package: SMT-RLS Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2004-09-23 10