STP16NE06L STP16NE06L/FP N - CHANNEL ENHANCEMENT MODE SINGLE FEATURE SIZE POWER MOSFET TARGET DATA TYPE V DSS R DS(on) ID ST P16NE06L ST P16NE06LFP 60 V 60 V < 0.12 Ω < 0.12 Ω 16 A 11 A ■ ■ ■ ■ ■ ■ TYPICAL RDS(on) = 0.09 Ω AVALANCHE RUGGED TECHNOLOGY 100% AVALANCHE TESTED 175oC OPERATING TEMPERATURE HIGH dV/dt CAPABILITY APPLICATION ORIENTED CHARACTERIZATION 1 DESCRIPTION This Power Mosfet is the latest development of SGS-THOMSON unique ”Single Feature Size” process whereby a single body is implanted on a strip layout structure. The resulting transistor shows extremely high packing density for low onresistance, rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility. 2 3 3 1 TO-220 2 TO-220FP INTERNAL SCHEMATIC DIAGRAM APPLICATIONS ■ DC MOTOR CONTROL ■ DC-DC & DC-AC CONVERTERS ■ SYNCHRONOUS RECTIFICATION ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value ST P16NE06L V DS Drain-source Voltage (V GS = 0) V DGR Drain- gate Voltage (R GS = 20 kΩ) V GS Gate-source Voltage Un it STP16NE06LF P 60 o V 60 V ± 15 V ID Drain Current (continuous) at T c = 25 C 16 11 A ID Drain Current (continuous) at T c = 100 C o 10 7 A Drain Current (pulsed) 64 64 A IDM (•) o Total Dissipation at T c = 25 C 60 30 W Derating F actor 0.4 0.2 W/ C V ISO Insulation W ithstand Voltage (DC) dV/dt Peak Diode Recovery voltage slope P t ot T stg Tj Storage Temperature Max. O perating Junction Temperature (•) Pulse width limited by safe operating area October 1997 2000 6 o V V/ns -65 to 175 o C 175 o C ( 1) ISD ≤ 16 A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX 1/7 STP16NE06L/FP THERMAL DATA R t hj-ca se Thermal Resistance Junction-case R t hj- amb R thc- si nk Tl Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose Max T O-220 T O-220F P 2.5 5 62.5 0.5 300 o C/W o C/W C/W o C o AVALANCHE CHARACTERISTICS Symb ol Max Valu e Unit I AR Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max, δ < 1%) Parameter 16 A E AS Single Pulse Avalanche Energy o (starting Tj = 25 C, ID = I AR , V DD = 25 V) 80 mJ ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF Symb ol V (BR)DSS Parameter Drain-source Breakdown Voltage Test Cond ition s I D = 250 µA VGS = 0 I DSS V DS = Max Rating Zero Gate Voltage Drain Current (V GS = 0) V DS = Max Rating I GSS Gate-body Leakage Current (V DS = 0) Min. Typ . Max. 60 Un it V T c = 125 o C V GS = ± 15V 1 10 µA µA æ 100 nA ON (∗) Symb ol Parameter Test Cond ition s V GS(th) Gate T hreshold Voltage V DS = VGS ID = 250 µA R DS( on) Static Drain-source On Resistance V GS = 5V V GS = 10V ID = 8 A ID = 8 A ID(o n) On State Drain Current V DS > I D(on) x R DS(on) max V GS = 10 V Min. Typ . Max. Un it 2 3 4 V 0.090 0.12 Ω 16 A DYNAMIC Symb ol g fs (∗) C iss C oss C rss 2/7 Parameter Test Cond ition s Forward Transconductance V DS > I D(on) x R DS(on) max Input Capacitance Output Capacitance Reverse Transfer Capacitance V DS = 25 V f = 1 MHz I D =8 A VGS = 0 Min. Typ . Max. Un it 6 S 800 100 50 pF pF pF STP16NE06L/FP ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON Symb ol Parameter Test Cond ition s t d(on) tr Turn-on T ime Rise Time V DD = 30 V R G =4.7 W Qg Q gs Q gd Total Gate Charge Gate-Source Charge Gate-Drain Charge V DD = 40 V Min. Typ . Max. ID = 16 A Un it ns ns ID = 8 A V GS = 5V V GS = 5 V nC nC nC SWITCHING OFF Symb ol t r(Vof f) tf tc Parameter Off-voltage Rise Time Fall T ime Cross-over T ime Test Cond ition s Min. Typ . Max. Un it ns ns ns V DD = 48 V I D = 16 A R G =4.7 Ω VGS = 5 V SOURCE DRAIN DIODE Symb ol Parameter Test Cond ition s I SD I SDM (•) Source-drain Current Source-drain Current (pulsed) V SD (∗) Forward O n Voltage I SD = 16 A Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current I SD = 16 A V DD = 30 V t rr Q rr I RRM Min. Typ . Max. Un it A A V GS = 0 di/dt = 100 A/µs o Tj = 150 C 1.5 V ns µC A (∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (•) Pulse width limited by safe operating area 3/7 STP16NE06L/FP Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 4: Gate Charge test Circuit Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 4/7 STP16NE06L/FP TO-220 MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 D1 0.107 1.27 0.050 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067 G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 14.0 0.511 0.551 L2 16.4 L4 0.645 13.0 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154 DIA. 3.75 3.85 0.147 0.151 D1 C D A E L5 H2 G G1 F1 L2 F2 F Dia. L5 L9 L7 L6 L4 P011C 5/7 STP16NE06L/FP TO-220FP MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 B D A E L3 L3 L6 F F1 L7 F2 H G G1 ¯ 1 2 3 L2 6/7 L4 STP16NE06L/FP Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. 1997 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada- China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A . .. 7/7