STPS2150 Power Schottky rectifier Features ■ Negligible switching losses ■ Low forward voltage drop for higher efficiency and extented battery life ■ Low thermal resistance ■ Surface mount miniature package ■ Avalanche capability specified A A K K Description 150 V power Schottky rectifiers are suited for switch mode power supplies on up to 24 V rails and high frequency converters. STPS2150 A K Packaged in SMA, SMA low profile, and axial, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. SMAflat (JEDEC DO-221AC) STPS2150AF Table 1. September 2008 DO-15 SMA (JEDEC DO-214AC) STPS2150A Rev 6 Device summary IF(AV) 2A VRRM 150 V Tj (max) 175 °C VF(max) 0.67 V 1/9 www.st.com 9 Characteristics STPS2150 1 Characteristics Table 2. Absolute Ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current PARM Repetitive peak avalanche power Tstg 1. TL = 145 °C δ = 0.5 DO-15 TL = 130 °C δ = 0.5 SMA, SMAflat DO-15 Unit 150 V 2 A 75 tp = 10 ms sinusoidal 2400 W -65 to + 175 °C 175 °C Maximum operating junction temperature(1) < Table 3. 1 -------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink Thermal resistance Symbol Rth(j-l) Table 4. Parameter SMA, SMAflat 20 DO-15 30 Unit °C/W Lead length = 10 mm Static electrical characteristics Parameter Reverse leakage current Tests conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF (2) Value Junction to lead Symbol IR (1) A 150 tp = 1 µs Tj = 25 °C Storage temperature range Tj dPtot --------------dTj SMA, SMAflat Value Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 2 A Min. Typ Max. Unit 0.5 1.5 µA 0.5 1.5 mA 0.78 0.82 0.62 0.67 0.86 0.89 0.70 0.75 V IF = 4 A 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.04 IF2(RMS) 2/9 STPS2150 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 1.6 δ = 0.2 δ = 0.1 2.2 δ = 0.5 SMA / SMAflat Rth(j-a)=Rth(j-l) 2.0 δ = 0.05 1.4 1.8 1.2 DO-15 Rth(j-a)=100°C/W 1.6 δ=1 1.4 1.0 1.2 0.8 1.0 0.6 0.8 0.4 0.6 T T Rth(j-a)=200°C/W 0.4 0.2 IF(AV)(A) δ=tp/T 0.0 δ=tp/T 0.2 tp tp Tamb(°C) 0.0 0.0 0.2 Figure 3. 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 0 10 1 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values, DO-15) 50 Figure 6. 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values, SMA) IM(A) IM(A) 10 10 SMA DO-15 9 9 8 8 7 7 Ta=25°C 6 6 Ta=75°C 5 4 Ta=25°C 5 Ta=75°C 4 Ta=125°C 3 3 Ta=125°C 2 1 2 IM 1 t(s) t δ =0.5 1.E-02 t(s) t δ =0.5 0 1.E-03 IM 1.E-01 1.E+00 0 1.E-03 1.E-02 1.E-01 1.E+00 3/9 Characteristics Figure 7. STPS2150 Non repetitive surge peak forward current versus overload duration (maximum values, SMAflat) Figure 8. IM(A) Relative variation of thermal impedance junction to ambient versus pulse duration (DO-15) Zth(j-a)/Rth(j-a) 6 1.0 SMAflat DO-15 0.9 5 0.8 0.7 4 Ta=25°C 0.6 3 0.5 Ta=75°C 0.4 2 0.3 Ta=125°C 0.2 1 IM t(s) t δ =0.5 0 1.E-03 1.E-01 1.E+00 Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (SMAflat) Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 SMAflat SMA 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.1 tp(s) 0.0 1.E-02 Figure 9. Single pulse 0.1 0.2 tp(s) Single pulse 0.1 0.0 tp(s) Single pulse 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 11. Reverse leakage current versus reverse voltage applied (typical values) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 12. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1.E+04 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1.E+03 Tj=125°C 1.E+02 Tj=100°C 1.E+01 100 Tj=75°C Tj=50°C 1.E+00 Tj=25°C 1.E-01 VR(V) VR(V) 10 1.E-02 0 4/9 25 50 75 100 125 150 1 10 100 1000 STPS2150 Characteristics Figure 13. Forward voltage drop versus forward current (maximum values, low level) Figure 14. Forward voltage drop versus forward current (maximum values, high level) IFM(A) IFM(A) 2.0 100 1.8 Tj=125°C (maximum values) Tj=125°C (Maximum values) 1.6 1.4 Tj=125°C (typical values) Tj=25°C (Maximum values) 1.2 Tj=25°C (maximum values) Tj=125°C (Typical values) 1.0 10 0.8 0.6 0.4 0.2 VFM(V) VFM(V) 1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 0.0 1.2 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Figure 16. Thermal resistance junction to ambient versus copper surface under each lead - epoxy printed circuit board FR4, copper thickness = 35 µm (SMAflat) Figure 15. Thermal resistance junction to ambient versus copper surface under each lead - epoxy printed circuit board FR4, copper thickness = 35 µm (SMA) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 200 140 SMAflat SMA 180 120 160 100 140 120 80 100 60 80 60 40 40 SCu(cm²) 20 SCu(cm²) 20 0 0 0 1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Figure 17. Thermal resistance versus lead length (DO-15) Rth(°C/W) 120 Rth(j-a) 100 80 60 Rth(j-I) 40 20 Lleads(mm) 0 5 10 15 20 25 5/9 Package information 2 STPS2150 Package information ● Epoxy meets UL94, V0. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 5. SMA package dimensions Dimensions E1 REF. D Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 18. SMA footprint dimensions in Figure 19. Marking information millimeters (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) Cathode bar (unidirectional devices only ) 1.64 (0.064) 5.43 (0.214) 6/9 e3 x x x z y ww e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week STPS2150 Package information Table 6. SMAflat dimensions Dimensions Ref. A L 2x L1 2x E E1 L L2 2x b Inches Min. Typ. Max. Min. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 c D Millimeters Typ. L1 0.50 0.019 L2 0.50 0.019 Max. Figure 20. SMAflat footprint dimensions Figure 21. Marking information optimized for SMAflat(1) 5.52 (0.217) Cathode bar (unidirectional devices only ) 1.52 (0.060) 3.12 (0.123) 1.20 (0.047) e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week e3 x x x z y ww 1.20 (0.047) millimeters (inches) 1. SMA footprint may also be used. Table 7. DO-15 package dimensions Dimensions C A D B C REF. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 7/9 Ordering information 3 Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2150A 2150 SMA 0.068 g 5000 Tape and reel STPS2150 STPS2150 DO-15 0.4 g 2000 Ammopack STPS2150RL STPS2150 DO-15 0.4 g 5000 Tape and reel STPS2150AF F2150 SMAflat 0.035 g 1000 Tape and reel Revision history Table 9. 8/9 STPS2150 Document revision history Date Revision Description of changes Jul-2003 3A Aug-2004 4 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106) to 2.03mm (0.080). 31-May-2006 5 Reformatted to current standard. Added ECOPACK statement. Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10. 18-Sep-2008 6 Reformatted to current standard. Added SMAflat package. Removed IF(RMS) from Table 2. Last update. 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