STMICROELECTRONICS STPS2150_08

STPS2150
Power Schottky rectifier
Features
■
Negligible switching losses
■
Low forward voltage drop for higher efficiency
and extented battery life
■
Low thermal resistance
■
Surface mount miniature package
■
Avalanche capability specified
A
A
K
K
Description
150 V power Schottky rectifiers are suited for
switch mode power supplies on up to 24 V rails
and high frequency converters.
STPS2150
A
K
Packaged in SMA, SMA low profile, and axial, this
device is intended for use in consumer and
computer applications like TV, STB, PC and DVD
where low drop forward voltage is required to
reduce power dissipation.
SMAflat
(JEDEC DO-221AC)
STPS2150AF
Table 1.
September 2008
DO-15
SMA
(JEDEC DO-214AC)
STPS2150A
Rev 6
Device summary
IF(AV)
2A
VRRM
150 V
Tj (max)
175 °C
VF(max)
0.67 V
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9
Characteristics
STPS2150
1
Characteristics
Table 2.
Absolute Ratings (limiting values)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IF(AV)
Average forward current
IFSM
Surge non repetitive forward
current
PARM
Repetitive peak avalanche power
Tstg
1.
TL = 145 °C δ = 0.5
DO-15
TL = 130 °C δ = 0.5
SMA, SMAflat
DO-15
Unit
150
V
2
A
75
tp = 10 ms sinusoidal
2400
W
-65 to + 175
°C
175
°C
Maximum operating junction temperature(1)
<
Table 3.
1
-------------------------Rth ( j – a )
condition to avoid thermal runaway for a diode on its own heatsink
Thermal resistance
Symbol
Rth(j-l)
Table 4.
Parameter
SMA, SMAflat
20
DO-15
30
Unit
°C/W
Lead length = 10 mm
Static electrical characteristics
Parameter
Reverse leakage current
Tests conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF (2)
Value
Junction to lead
Symbol
IR (1)
A
150
tp = 1 µs Tj = 25 °C
Storage temperature range
Tj
dPtot
--------------dTj
SMA, SMAflat
Value
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 2 A
Min.
Typ
Max.
Unit
0.5
1.5
µA
0.5
1.5
mA
0.78
0.82
0.62
0.67
0.86
0.89
0.70
0.75
V
IF = 4 A
1. tp = 5 ms, δ < 2%
2. tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.04 IF2(RMS)
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STPS2150
Characteristics
Figure 1.
Average forward power
dissipation versus average
forward current
Figure 2.
Average forward current versus
ambient temperature (δ = 0.5)
IF(AV)(A)
PF(AV)(W)
1.6
δ = 0.2
δ = 0.1
2.2
δ = 0.5
SMA / SMAflat
Rth(j-a)=Rth(j-l)
2.0
δ = 0.05
1.4
1.8
1.2
DO-15
Rth(j-a)=100°C/W
1.6
δ=1
1.4
1.0
1.2
0.8
1.0
0.6
0.8
0.4
0.6
T
T
Rth(j-a)=200°C/W
0.4
0.2
IF(AV)(A)
δ=tp/T
0.0
δ=tp/T
0.2
tp
tp
Tamb(°C)
0.0
0.0
0.2
Figure 3.
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(1µs)
50
75
100
125
150
175
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
Figure 5.
0
10
1
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values, DO-15)
50
Figure 6.
75
100
125
150
Non repetitive surge peak forward
current versus overload duration
(maximum values, SMA)
IM(A)
IM(A)
10
10
SMA
DO-15
9
9
8
8
7
7
Ta=25°C
6
6
Ta=75°C
5
4
Ta=25°C
5
Ta=75°C
4
Ta=125°C
3
3
Ta=125°C
2
1
2
IM
1
t(s)
t
δ =0.5
1.E-02
t(s)
t
δ =0.5
0
1.E-03
IM
1.E-01
1.E+00
0
1.E-03
1.E-02
1.E-01
1.E+00
3/9
Characteristics
Figure 7.
STPS2150
Non repetitive surge peak forward
current versus overload duration
(maximum values, SMAflat)
Figure 8.
IM(A)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-15)
Zth(j-a)/Rth(j-a)
6
1.0
SMAflat
DO-15
0.9
5
0.8
0.7
4
Ta=25°C
0.6
3
0.5
Ta=75°C
0.4
2
0.3
Ta=125°C
0.2
1
IM
t(s)
t
δ =0.5
0
1.E-03
1.E-01
1.E+00
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMAflat)
Zth(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.0
1.0
SMAflat
SMA
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.1
tp(s)
0.0
1.E-02
Figure 9.
Single pulse
0.1
0.2
tp(s)
Single pulse
0.1
0.0
tp(s)
Single pulse
0.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 11. Reverse leakage current versus
reverse voltage applied
(typical values)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 12. Junction capacitance versus
reverse voltage applied
(typical values)
IR(µA)
C(pF)
1.E+04
1000
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
1.E+03
Tj=125°C
1.E+02
Tj=100°C
1.E+01
100
Tj=75°C
Tj=50°C
1.E+00
Tj=25°C
1.E-01
VR(V)
VR(V)
10
1.E-02
0
4/9
25
50
75
100
125
150
1
10
100
1000
STPS2150
Characteristics
Figure 13. Forward voltage drop versus
forward current (maximum values,
low level)
Figure 14. Forward voltage drop versus
forward current (maximum values,
high level)
IFM(A)
IFM(A)
2.0
100
1.8
Tj=125°C
(maximum values)
Tj=125°C
(Maximum values)
1.6
1.4
Tj=125°C
(typical values)
Tj=25°C
(Maximum values)
1.2
Tj=25°C
(maximum values)
Tj=125°C
(Typical values)
1.0
10
0.8
0.6
0.4
0.2
VFM(V)
VFM(V)
1
0.0
0.0
0.2
0.4
0.6
0.8
1.0
0.0
1.2
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMAflat)
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead - epoxy printed
circuit board FR4, copper
thickness = 35 µm (SMA)
Rth(j-a)(°C/W)
Rth(j-a)(°C/W)
200
140
SMAflat
SMA
180
120
160
100
140
120
80
100
60
80
60
40
40
SCu(cm²)
20
SCu(cm²)
20
0
0
0
1
2
3
4
5
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Figure 17. Thermal resistance versus lead length (DO-15)
Rth(°C/W)
120
Rth(j-a)
100
80
60
Rth(j-I)
40
20
Lleads(mm)
0
5
10
15
20
25
5/9
Package information
2
STPS2150
Package information
●
Epoxy meets UL94, V0.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 5.
SMA package dimensions
Dimensions
E1
REF.
D
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.094
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
E
A1
A2
C
L
b
Figure 18. SMA footprint dimensions in Figure 19. Marking information
millimeters (inches)
1.4
2.63
1.4
(0.055)
(0.103)
(0.055)
Cathode bar (unidirectional devices only )
1.64
(0.064)
5.43
(0.214)
6/9
e3
x x x
z y ww
e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
STPS2150
Package information
Table 6.
SMAflat dimensions
Dimensions
Ref.
A
L 2x
L1 2x
E E1
L
L2 2x
b
Inches
Min. Typ. Max.
Min.
A
0.90
1.10
0.035
0.043
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.95
0.088
0.116
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
c
D
Millimeters
Typ.
L1
0.50
0.019
L2
0.50
0.019
Max.
Figure 20. SMAflat footprint dimensions Figure 21. Marking information
optimized for SMAflat(1)
5.52
(0.217)
Cathode bar (unidirectional devices only )
1.52
(0.060)
3.12
(0.123)
1.20
(0.047)
e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
e3
x x x
z y ww
1.20
(0.047)
millimeters
(inches)
1. SMA footprint may also be used.
Table 7.
DO-15 package dimensions
Dimensions
C
A
D
B
C
REF.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
6.05
6.75
0.238 0.266
B
2.95
3.53
0.116 0.139
C
26
31
1.024 1.220
D
0.71
0.88
0.028 0.035
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Ordering information
3
Ordering information
Table 8.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS2150A
2150
SMA
0.068 g
5000
Tape and reel
STPS2150
STPS2150
DO-15
0.4 g
2000
Ammopack
STPS2150RL
STPS2150
DO-15
0.4 g
5000
Tape and reel
STPS2150AF
F2150
SMAflat
0.035 g
1000
Tape and reel
Revision history
Table 9.
8/9
STPS2150
Document revision history
Date
Revision
Description of changes
Jul-2003
3A
Aug-2004
4
SMA package dimensions update. Reference A1 max. changed
from 2.70mm (0.106) to 2.03mm (0.080).
31-May-2006
5
Reformatted to current standard. Added ECOPACK statement.
Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10.
18-Sep-2008
6
Reformatted to current standard. Added SMAflat package. Removed
IF(RMS) from Table 2.
Last update.
STPS2150
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