STMICROELECTRONICS STTH3R04

STTH3R04
Ultrafast recovery diode
Features
■
Negligible switching losses
■
Low forward and reverse recovery times
■
High junction temperature
A
K
DO-15
DO-201AD
STTH3R04Q
STTH3R04
Band indicates cathode side.
Description
The STTH3R04 series uses ST's new 400 V
planar Pt doping technology. The STTH3R04 is
specially suited for switching mode base drive and
transistor circuits.
Packaged in axial and surface mount packages,
this device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection.
May 2008
SMB
STTH3R04U
Table 1.
Rev 1
SMC
STTH3R04S
Device summary
IF(AV)
3A
VRRM
400 V
Tj (max)
175 °C
VF (typ)
0.9 V
trr (typ)
18 ns
1/10
www.st.com
Characteristics
1
STTH3R04
Characteristics
Table 2.
Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
400
V
3.0
A
60
A
-65 to +175
°C
175
°C
Repetitive peak reverse voltage
VRRM
Average forward current, δ = 0.5
IF(AV)
DO-15
Tlead = 70 °C
DO-201AD
Tlead = 80 °C
SMB
Tlead = 70 °C
SMC
Tlead = 100 °C
IFSM
Surge non repetitive forward current tp = 10 ms Sinusoidal
Tstg
Storage temperature range
Maximum operating junction temperature(1)
Tj
1. On infinite heatsink with 10 mm lead length
Table 3.
Thermal parameters
Symbol
Rth(j-l)
Parameter
Junction to lead
Value
Lead length = 10 mm
on infinite heatsink
DO-15
25
DO-201AD
22
SMB
25
SMC
17
Unit
°C/W
Rth(j-l)
Table 4.
Symbol
IR(1)
Junction to lead
Static electrical characteristics
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Min
Typ
Forward voltage drop
Tj = 100 °C
µA
5
50
1.5
IF = 3.0 A
Tj = 150 °C
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
To evaluate the conduction losses use the following equation:
P = 0.9 x IF(AV) + 0.083 x IF2(RMS)
2/10
Unit
5
VR = VRRM
Tj = 25 °C
VF(2)
Max
1.0
1.25
0.9
1.15
V
STTH3R04
Characteristics
Table 5.
Dynamic characteristics (Tj = 25 °C unless otherwise stated)
Symbol
Test conditions
Parameter
trr
tfr
VFP
Typ
Max
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25 °C
Reverse recovery time
IRM
Min
Unit
35
ns
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25 °C
18
25
Reverse recovery current
IF = 3.0 A, dIF/dt = -200 A/µs,
VR = 320 V, Tj = 125 °C
4
5.5
A
Forward recovery time
IF = 3.0 A
dIF/dt = 100 A/µs
VFR = 1.1 x VFmax, Tj = 25 °C
75
ns
Forward recovery voltage
IF = 3.0 A
Figure 1.
Conduction losses versus
average forward current
Figure 2.
P(W)
4.5
δ=0.05
δ=0.1
δ=0.2
dIF/dt = 100 A/µs
δ=0.5
4.0
45
3.5
40
Forward voltage drop versus
forward current
TJ=150°C
(Maximum values)
35
3.0
V
IFM(A)
50
δ=1
2.5
30
2.5
25
2.0
TJ=150°C
(Typical values)
20
1.5
15
T
1.0
TJ=25°C
(Maximum values)
10
0.5
δ=tp/T
IF(AV)(A)
5
tp
0.0
VFM(V)
0
0.0
0.5
Figure 3.
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
Figure 4.
Relative variation of thermal
impedance junction to lead versus
pulse duration, DO-15 (epoxy FR4,
copper thickness = 35 µm)
0.8
1.2
1.6
2.0
2.4
2.8
3.2
Relative variation of thermal
impedance junction to ambient
versus pulse duration, DO-201AD
(epoxy FR4, copper
thickness = 35 µm)
Zth(j-a) /Rth(j-a)
Zth(j-l)/Rth(j-l)
1.0
1.0
DO-15
Lleads=10mm
0.9
DO-201AD
Lleads=10mm
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.1
0.4
0.2
Single pulse
0.0
1.E-01
0.1
tP(s)
Single pulse
tP(s)
0.0
1.E+00
1.E+01
1.E+02
1.E+03
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
3/10
Characteristics
Figure 5.
STTH3R04
Figure 6.
Relative variation of thermal
impedance junction to ambient
versus pulse duration, SMB (epoxy
FR4, copper thickness = 35 µm)
Zth(j-a) /Rth(j-a)
Zth(j-a) /Rth(j-a)
1.0
1.0
SMB
SCu=1cm²
0.9
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
0.1
tP(s)
Single pulse
0.0
Figure 7.
SMC
SCu=1cm²
0.9
0.8
1.E-01
Relative variation of thermal
impedance junction to ambient
versus pulse duration, SMC
1.E+00
1.E+01
1.E+02
1.E+03
Junction capacitance versus
reverse voltage applied
(typical values)
Single pulse
0.0
1.E-01
Figure 8.
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
1.E+00
1.E+01
1.E+02
1.E+03
Reverse recovery charges versus
dIF/dt (typical values)
QRR(nC)
C(pF)
100
tP(s)
IF= 3 A
VR=320 V
90
80
70
Tj=125 °C
60
10
50
40
30
Tj=25 °C
20
10
VR(V)
1
1
Figure 9.
100
dIF/dt(A/µs)
0
10
100
1000
Reverse recovery time versus
dIF/dt (typical values)
10
1000
Figure 10. Peak reverse recovery current
versus dIF/dt (typical values)
tRR(ns)
8
IF= 3 A
VR=320 V
90
100
IRM(A)
IF= 3 A
VR=320 V
7
80
6
70
5
60
Tj=125 °C
4
50
Tj=125 °C
40
3
30
Tj=25 °C
2
Tj=25 °C
20
1
10
0
0
10
4/10
dIF/dt(A/µs)
dIF/dt(A/µs)
100
1000
10
100
1000
STTH3R04
Characteristics
Figure 11. Relative variations of dynamic
parameters versus junction
temperature
Figure 12. Transient peak forward voltage
versus dIF/dt (typical values)
VFp(V)
QRR; IRM [T j] / Q RR; IRM [T j=125°C]
25
1.4
IF=3 A
Tj=125 °C
IF= 3 A
VR=320 V
1.2
20
1.0
IRM
15
0.8
QRR
0.6
10
0.4
5
0.2
T j(°C)
dIF/dt(A/µs)
0
0.0
25
50
75
100
125
Figure 13. Forward recovery time versus
dIF/dt (typical values)
130
0
150
50
100
150
200
250
300
350
400
450
500
Figure 14. Thermal resistance versus
lead length, DO-15
Rth(j-a) (°C/W)
tFR(ns)
120
DO-15
IF=3 A
Tj=125 °C
120
110
100
100
90
80
80
70
60
60
50
40
40
30
20
20
10
Lleads(mm)
dIF/dt(A/µs)
0
0
0
50
100
150
200
250
300
350
400
450
0.0
500
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 16. Thermal resistance versus lead
Figure 15. Thermal resistance junction to
length, DO-201AD
ambient versus copper surface
under each lead, DO-201AD (epoxy
FR4, copper thickness = 35 µm)
Rth(j-a) (°C/W)
100
80
DO-201AD
Rth(°C/W)
DO-201AD
90
70
Rth(j-a)
80
60
70
50
60
40
50
40
30
Rth(j-l)
30
20
20
10
10
SCu(cm²)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Lleads(mm)
0
0
3.5
4.0
4.5
5.0
5
10
15
20
25
5/10
Package information
STTH3R04
Figure 17. Thermal resistance junction to ambient versus copper surface under
each lead, SMB, SMC (epoxy FR4, copper thickness = 35 µm)
Rth(j-a) (°C/W)
120
100
SMB
80
60
SMC
40
20
SCU(cm²)
0
0.0
2
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 6.
DO201AD dimensions
Dimensions
Ref.
Millimeters
Min.
B
E
Min.
Max.
B
A
Note 1
Max.
Inches
E
Note 1
A
B
9.50
25.40
0.374
1.000
ØD
Note 2
ØC
C
5.30
0.209
D
1.30
0.051
E
1.25
0.049
Notes
6/10
1 - The lead diameter ø D is not
controlled over zone E
2 - The minimum length which must stay
straight between the right angles after
bending is 0.59"(15mm)
STTH3R04
Package information
Table 7.
DO-15 dimensions
Dimensions
C
Ref.
C
A
D
B
Table 8.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
6.05
6.75
0.238
0.266
B
2.95
3.53
0.116
0.139
C
26
31
1.024
1.220
D
0.71
0.88
0.028
0.035
SMB dimensions
Dimensions
Ref.
Millimeters
Inches
E1
D
E
A1
A2
C
L
b
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
Figure 18. Footprint, dimensions in mm (inches)
1.62
2.60
(0.064) (0.102)
1.62
(0.064)
2.18
(0.086)
5.84
(0.300)
7/10
Package information
Table 9.
STTH3R04
SMC dimensions
Dimensions
Ref.
Millimeters
E1
D
E
A1
A2
C
E2
L
b
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.20
0.114
0.126
c
0.15
0.40
0.006
0.016
D
5.55
6.25
0.218
0.246
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
L
0.75
1.50
0.030
0.059
Figure 19. Footprint, dimensions in mm (inches)
1.54
(0.061)
5.11
(0.201)
1.54
(0.061)
3.14
(0.124)
8.19
(0.322)
8/10
Inches
STTH3R04
3
Ordering information
Ordering information
Table 10.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STTH3R04
STTH3R04
DO-201AD
1.16 g
600
Ammopack
STTH3R04RL
STTH3R04
DO-201AD
1.16g
1900
Tape and reel
STTH3R04Q
STTH3R04Q
DO-15
0.4 g
1000
Ammopack
STTH3R04QRL
STTH3R04Q
DO-15
0.4 g
6000
Tape and reel
STTH3R04S
R4S
SMC
0.243 g
2500
Tape and reel
STTH3R04U
3R4U
SMB
0.12 g
2500
Tape and reel
Revision history
Table 11.
Document revision history
Date
Revision
30-May-2008
1
Description of changes
First issue
9/10
STTH3R04
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10/10