TRIQUINT T1G6003028-FS

T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Applications
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•
•
•
•
•
Military radar
Civilian radar
Professional and military radio
communications
Test instrumentation
Wideband or narrowband amplifiers
Jammers
Product Features
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•
•
•
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Functional Block Diagram
Frequency: DC to 6 GHz
Output Power (P3dB): 30 W at 6 GHz
Linear Gain: >14 dB at 6 GHz
Operating Voltage: 28 V
Low thermal resistance package
1
2
General Description
The TriQuint T1G6003028-FS is a 30 W (P3dB)
discrete GaN on SiC HEMT which operates
from DC to 6 GHz. The device is constructed
with TriQuint’s proven 0.25 µm process, which
features advanced field plate techniques to
optimize power and efficiency at high drain
bias operating conditions. This optimization
can potentially lower system costs in terms of
fewer amplifier line-ups and lower thermal
management costs.
Lead-free and RoHS compliant
Evaluation Boards are available upon request.
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
Pin Configuration
Pin #
Symbol
1
2
Flange
Vd/RF OUT
Vg/RF IN
Source
Ordering Information
Material No.
Part No.
1080206
T1G6003028-FS
1093989
T1G6003028-FSEVB1
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Description
Packaged part:
Flangeless
5.4-5.9 GHz
Eval. Board
ECCN
EAR99
EAR99
Disclaimer: Subject to change without notice
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Specifications
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Rating
Parameter
Drain to Gate Voltage, Vd – Vg
Drain Voltage, Vd
Gate Voltage, Vg
Drain Current, Id
Gate Current, Ig
Power Dissipation, Pdiss
RF Input Power, CW, T = 25ºC
Channel Temperature, Tch
Mounting Temperature (30 sec)
Storage Temperature
40 V
+40 V
-8 to 0 V
5.5 A
-10 to 10 mA
47.5 W
40 dBm
o
275 C
o
320 C
o
-40 to 150 C
Vd
Idq
Id (Peak Current)
Vg
Channel
Temperature, Tch
Power Dissipation,
Pdiss (CW)
Power Dissipation,
Pdiss (Pulse)
Operation of this device outside the parameter ranges
given above may cause permanent damage. These
are stress ratings only, and functional operation of the
device at these conditions is not implied.
Min Typical Max Units
28
200
2500
-3.6
V
mA
mA
V
o
205
C
30
W
40
W
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Electrical Specifications
Recommended operating conditions apply unless otherwise specified: TA = 25 °C, Vd = 28 V, Idq = 200 mA, Vg = -3.6 V
RF Characteristics
Characteristics
Symbol
Min
Typ
Max
Units
Load Pull Performance at 3.0 GHz (VDS = 28 V, IDQ = 200 mA; Pulse: 100µs, 20%)
Linear Gain
GLIN
15.2
dB
Output Power at 3 dB Gain Compression
P3dB
33.5
W
Drain Efficiency at 3 dB Gain Compression
DE3dB
68.2
%
Power-Added Efficiency at 3 dB Gain Compression
PAE3dB
64.1
%
Gain at 3 dB Compression
G3dB
12.2
dB
Load Pull Performance at 6.0 GHz (VDS = 28 V, IDQ = 200 mA; Pulse: 100µs, 20%)
Linear Gain
GLIN
14.5
dB
Output Power at 3 dB Gain Compression
P3dB
33.0
W
Drain Efficiency at 3 dB Gain Compression
DE3dB
50.0
%
Power-Added Efficiency at 3 dB Gain Compression
PAE3dB
46.5
%
Gain at 3 dB Compression
G3dB
11.5
dB
Performance at 5.60 GHz in the 5.4 to 5.9 GHz Eval. Board (VDS = 28 V, IDQ = 200 mA; Pulse: 100µs, 20%)
Linear Gain
GLIN
12.0
14.0
dB
Output Power at 3 dB Gain Compression
P3dB
22.5
32.5
W
Drain Efficiency at 3 dB Gain Compression
DE3dB
45.0
50.0
%
Gain at 3 dB Compression
G3dB
9.0
11.0
dB
Narrow Band Performance at 5.60 GHz (VDS = 28 V, IDQ = 200 mA, CW at P1dB)
Impedance Mismatch Ruggedness
VSWR
10:1
Note: VSWR testing performed with increasing real impedance value only from reference Z to 10 times reference Z.
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 2 of 13 -
Disclaimer: Subject to change without notice
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Specifications (cont.)
Thermal and Reliability Information
Test Conditions
DC at 85 °C
TCH (°C)
205
ƟJC (°C/W)
4.0
Note: Thermal resistance, ƟJC, measured to bottom of package
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 3 of 13 -
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Load Pull Smith Chart
RF performance that the device typically exhibits when placed in the specified impedance environment. The
impedances are not the impedances of the device, they are the impedances presented to the device via an
RF circuit or load-pull system. The impedances listed follow an optimized trajectory to maintain high power
and high efficiency.
Test Conditions: VDS = 28 V, IDQ = 200 mA
Test Signal: Pulse Width = 100 µsec, Duty Cycle = 20%
Load-Pull Data at 3 GHz
Load-Pull Data at 4 GHz
Load-Pull Data at 5 GHz
Load-Pull Data at 6 GHz
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 4 of 13 -
Disclaimer: Subject to change without notice
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Typical Performance (cont.)
Performance is measured at DUT reference plane
T1G6003028-FS Gain DEff. and PAE vs. Pout
T1G6003028-FS Gain DEff. and PAE vs. Pout
2000MHz, 100µs 20%, VDS = 28V IDQ = 200mA
1000MHz, 100us 20%, Vds = 28V Idq = 200mA
ZS = 3.92 + j1.97 Ω
ZL = 7.67 + j5.39 Ω
22
ZS = 2.03 - j2.16 Ω
70
21
ZL = 6.30 + j2.80 Ω
60
60
23
50
22
40
21
30
Gain
DEff.
PAE
20
19
18
30
32
34
36
38
40
42
20
50
19
40
18
30
Gain
DEff.
PAE
17
10
16
0
46
44
20
15
30
32
34
36
40
10
42
0
46
44
Pout [dBm]
T1G6003028-FS Gain DEff. and PAE vs. Pout
T1G6003028-FS Gain DEff. and PAE vs. Pout
16
ZS = 6.37 - j13.01 Ω
70
15
ZL = 4.99 - j4.31 Ω
60
70
ZL = 5.78 - j2.51 Ω
60
15
50
14
40
13
30
11
10
30
32
34
36
38
40
42
20
44
14
50
13
40
12
30
Gain
DEff.
PAE
11
10
10
0
46
9
32
34
36
38
Pout [dBm]
70
17
ZS = 11.89 - j0.35 Ω
70
16
ZL = 6.31 - j12.07 Ω
60
60
50
13
40
12
30
Gain
DEff.
PAE
11
10
32
34
36
38
40
42
20
10
44
0
46
© 2012 TriQuint Semiconductor, Inc.
80
15
50
14
40
13
30
Gain
DEff.
PAE
12
11
10
30
Pout [dBm]
Data Sheet: Rev B 09/12/2012
6000MHz, 100µs 20%, VDS = 28V IDQ = 200mA
18
14
9
30
0
48
46
32
34
36
38
40
42
20
DEff. & PAE [%]
15
ZL = 7.11 - j7.54 Ω
44
80
DEff. & PAE [%]
ZS = 18.23 - j11.79 Ω
42
10
T1G6003028-FS Gain DEff. and PAE vs. Pout
Gain [dB]
5000MHz, 100µs 20%, VDS = 28V IDQ = 200mA
16
40
20
Pout [dBm]
T1G6003028-FS Gain DEff. and PAE vs. Pout
17
80
DEff. & PAE [%]
ZS = 3.92 - j6.85 Ω
16
DEff. & PAE [%]
17
17
Gain
DEff.
PAE
4000MHz, 100µs 20%, VDS = 28V IDQ = 200mA
80
Gain [dB]
3000MHz, 100µs 20%, VDS = 28V IDQ = 200mA
12
Gain [dB]
38
20
Pout [dBm]
18
Gain [dB]
70
24
80
DEff. & PAE [%]
23
DEff. & PAE [%]
Gain [dB]
25
80
Gain [dB]
26
10
44
0
46
Pout [dBm]
- 5 of 13 -
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Performance over Temperature: Gain, Efficiency and Output Power
Performance measured in TriQuint’s 5.4 GHz to 5.9 GHz Evaluation Board at 3 dB compression.
T1G6003028-FS Gain vs. Temp.
T1G6003028-FS Power vs. Temp.
VDS = 28 V, IDQ = 200 mA; Pulse: 100 µs, 20%
V DS = 28 V, IDQ = 200 mA; Pulse: 100 µs, 20%
T1G6003028-FS Drain Eff. vs. Temp.
T1G6003028-FS PAE vs. Temp.
VDS = 28 V, IDQ = 200 mA; Pulse: 100 µs, 20%
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
V DS = 28 V, IDQ = 200 mA; Pulse: 100 µs, 20%
- 6 of 13 -
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Evaluation Board Performance: 5.4 to 5.9 GHz
Output Power and Gain at 3 dB Compression
VDS = 28 V, IDQ = 200 mA; Pulse: 100 µsec, 20%
20.00
50.00
Power (W)
Gain (dB)
18.00
40.00
16.00
35.00
14.00
30.00
12.00
25.00
10.00
20.00
8.00
15.00
6.00
10.00
4.00
5.00
5.40
5.50
5.60
5.70
Frequency (GHz)
5.80
Gain (dB)
Output Power (W)
45.00
2.00
5.90
Drain Efficiency and Power Added Efficiency at 3 dB Compression
VDS = 28 V, IDQ = 200 mA; Pulse: 100 µsec, 20%
55
Drain Eff. (%)
PAE (%)
Efficiency (%)
50
45
40
35
5.40
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
5.50
5.60
5.70
Frequency (GHz)
- 7 of 13 -
5.80
5.90
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Application Circuit
Bias-up Procedure
Bias-down Procedure
Vg set to -5.0V
Turn off RF signal
Turn off Vd and wait 1 second to allow drain
capacitor dissipation
Vd set to 28 V
Adjust Vg more positive until quiescent Id is 200 mA.
This will be ~ Vg = -3.6 V typical
Apply RF signal
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
Turn off Vg
- 8 of 13 -
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Applications Information
Evaluation Board Layout
Top RF layer is 0.020” thick Rogers RO4350B, ɛr = 3.48.
The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerances.
Bill of Materials
Reference Des.
Value
Qty
Manufacturer
Part Number
C1
C2
L1, L2
C3, C4, C6, C7, C8
C5
R1
R2
R3
R4
C9, C10
C11, C12
C13, C14
C15
C16
L3
0.3 pF
0.2 pF
8.8 NH
3 pF
0.4 pF
97.6 Ohms
4.7 Ohms
330 Ohms
50 Ohms
220 pF
2200 pF
22000 pF
220 uF
1.0 uF
48 Ohm
1
1
2
5
1
1
1
1
1
2
2
2
1
1
1
ATC
ATC
COILCRAFT
ATC
ATC
Venkel
Newark
Newark
ATC
AVX
Vitramon
Vitramon
United Chemi-Con
Allied
Ferrite, Laird Tech.
ATC600S0R3
ATC600S0R2
1606-8
ATC600S3R0
ATC600S0R5
CR0604-16w-97R6FT
37C0064
TNPW1206330RBT9ET1-E3
CRCW120651R0FKEA
AVX06035C22KAT2A
VJ1206Y222KXA
VJ1206Y223KXA
EMVY500ADA221MJA0G
541-1231
28F0121-0SR-10
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 9 of 13 -
Disclaimer: Subject to change without notice
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
PIN Description
Pin
Symbol
Description
1
Vd/ RF OUT
Drain voltage/ RF Output matched to 50 ohms; see Application Circuit on
page 8 as an example.
2
Vg/RF IN
3
Flange
Gate voltage/ RF Input matched to 50 ohms; see Application Circuit on
page 8 as an example
Source connected to ground; see Application Circuit on page 8 as an
example.
The T1G6003028-FS will be marked with the “3028” designator and a lot code marked below the part designator.
The “YY” represents the last two digits of the year the part was manufactured, the “WW” is the work week, and the
“ZZZ” is an auto-generated number.
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 10 of 13 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Mechanical Information
Package Information and Dimensions
All dimensions are in millimeters.
This package is lead-free/RoHS-compliant. The plating material on the leads is NiAu. It is compatible with both
lead-free (maximum 260 °C reflow temperature) and tin-lead (maximum 245 °C reflow temperature) soldering
processes.
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 11 of 13 -
Disclaimer: Subject to change without notice
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Product Compliance Information
ESD Information
Solderability
Compatible with the latest version of J-STD-020,
J
Lead free solder, 260° C
ESD Rating:
Value:
Test:
Standard:
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain
Hazardous Substances in Electrical and
Electronic Equipment).
Class 1A
≥ 250 V
Human Body Model (HBM)
JEDEC Standard JESD22
JESD22-A114
MSL Rating
Level 3 at +260 °C convection reflow
The part is rated
ated Moisture Sensitivity Level 3 at 260°C per
JEDEC standard IPC/JEDEC J-STD-020.
020.
This product also has the following attributes:
• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C15H12Br402) Free
• PFOS Free
• SVHC Free
ECCN
US Department of Commerce EAR99
Recommended Soldering Temperature Profile
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 12 of 13 -
Disclaimer: Subject to change without notice
®
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T1G6003028-FS
30W, 28V, DC – 6 GHz, GaN RF Power Transistor
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Web: www.triquint.com
Email: [email protected]
Tel:
Fax:
+1.972.994.8465
+1.972.994.8504
For technical questions and application information:
Email: [email protected]
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the
information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information
contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the
entire risk associated with such information is entirely with the user. All information contained herein is subject to
change without notice. Customers should obtain and verify the latest relevant information before placing orders for
TriQuint products. The information contained herein or any use of such information does not grant, explicitly or
implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to
such information itself or anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe
personal injury or death.
Data Sheet: Rev B 09/12/2012
© 2012 TriQuint Semiconductor, Inc.
- 13 of 13 -
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