TD62308APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308APG,TD62308AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62308APG/AFG is a non−inverting transistor array which is comprised of four NPN darlington output stages and PNP input stages. This device is low−level input active driver and is suitable for operation with 5-V TTL, 5-V CMOS and 5-V Microprocessor which have sink current output drivers. Application include relay, hammer, lamp and stepping motor drivers. The suffix (G) appended to the part number represents a Lead (Pb)-Free product. Features TD62308APG TD62308AFG • Output current (single output): 1.5 A (max) • High sustaining voltage output: • Output clamp diodes • Input compatible with TTL and 5 V CMOS • Low level active inputs • Standard supply voltage • Two VCC terminals VCC1, VCC2 (separated) • GND and SUB terminal = Heat sink • Package type-APG: DIP-16 pin • Package type-AFG: HSOP-16 pin 50 V (min) Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.) Pin Assignment (top view) TD62308APG Heat sink & GND COM O4 I4 I3 O3 COM 16 15 14 13 12 11 10 9 1 VCC1 2 O1 3 I1 4 5 6 I2 7 O2 8 VCC2 Heat sink & GND TD62308AFG COM O4 I4 NC 16 15 14 13 1 VCC1 2 O1 3 I1 4 NC Heat sink & GND Heat sink & GND NC I3 O3 COM 12 11 10 9 5 NC 6 I2 7 O2 8 VCC2 1 2006-06-13 TD62308APG/AFG Schematics (each driver) 4kΩ 2 kΩ VCC COMMON Output 8.2 k Ω 1.1 kΩ 600 Ω Input GND Note: The input and output parasitic diodes cannot be used as clamp diodes. Precautions for Using (1) This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. (2) If a TD62308APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin so as to absorb the counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings. Toshiba recommends that zener diodes be connected between the diodes (pins 9 and 16) and the secondary power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again, please adhere to the device’s absolute maximum ratings. Absolute Maximum Ratings (Ta = 25°C) Characteristics Supply voltage Output sustaining voltage Output current Symbol Rating Unit VCC −0.5 to 10 V VCE (SUS) −0.5 to 50 V IOUT 1.5 A/ch Input current IIN −10 mA Input voltage VIN −0.5 to 30 V Clamp diode reverse voltage VR 50 V Clamp diode forward current IF 1.5 A APG Power dissipation PD AFG 1.47/2.7 (Note 1) W 0.9/1.4 (Note 2) Operating temperature Topr −40 to 85 °C Storage temperature Tstg −55 to 150 °C Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%) 2 2006-06-13 TD62308APG/AFG Recommended Operating Conditions (Ta = −40 to 85°C) Symbol Test Condition Min Typ. Max Unit VCC ⎯ 4.5 ⎯ 5.5 V VCE (SUS) ⎯ 0 ⎯ 50 V Characteristics Supply voltage Output sustaining voltage DC1 circuit, Ta = 25°C Tpw = 25 ms 4 circuits Ta = 85°C Tj = 120°C APG Output current IOUT AFG 0 ⎯ 1250 Duty = 10% 0 ⎯ 1250 Duty = 50% 0 ⎯ 700 Duty = 10% 0 ⎯ 1250 Duty = 50% 0 ⎯ 390 mA/ch VIN ⎯ 0 ⎯ 25 Output ON VIN (ON) ⎯ 0 ⎯ VCC −3.6 Output OFF VIN (OFF) ⎯ VCC −1.0 ⎯ VCC Clamp diode reverse voltage VR ⎯ ⎯ ⎯ 50 V Clamp diode forward current IF ⎯ ⎯ ⎯ 1.25 A Input voltage APG Power dissipation PD AFG Ta = 85°C (Note 1) ⎯ ⎯ 1.4 Ta = 85°C (Note 2) ⎯ ⎯ 0.7 Min Typ. Max VCE = 50 V, Ta = 25°C ⎯ ⎯ 50 VCE = 50 V, Ta = 85°C ⎯ ⎯ 100 IOUT = 1.25 A ⎯ ⎯ 1.8 IOUT = 0.75 A ⎯ ⎯ 1.3 V V W Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%) Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%) Electrical Characteristics (Ta = 25°C) Symbol Test Circuit ICEX 1 VCE (sat) 3 High level VIH ⎯ ⎯ VCC −1.6 ⎯ 25 Low level VIL ⎯ ⎯ ⎯ ⎯ VCC −3.6 High level IIH ⎯ ⎯ ⎯ ⎯ 10 µA Low level Characteristics Output leakage current Output saturation voltage Test Condition Input voltage Input current µA V V IIL ⎯ ⎯ −0.05 −0.36 mA Clamp diode reverse current IR 4 VR = 50 V, Ta = 25°C ⎯ ⎯ 50 µA Clamp diode forward voltage VF 5 IF = 1.25 A ⎯ 1.5 2.0 V Output ON ICC (ON) Output OFF ICC (OFF) Supply current 2 ⎯ Unit VCC = 5.5 V, VIN = 0 V ⎯ 8.5 12.5 mA/ch VCC = 5.5 V, VIN = VCC ⎯ ⎯ 1.0 µA Turn-ON delay tON 6 CL = 15 pF, VOUT = 50 V, RL = 40 Ω ⎯ 0.2 ⎯ µs Turn-OFF delay tOFF 6 CL = 15 pF, VOUT = 35 V, RL = 40 Ω ⎯ 5.0 ⎯ µs 3 2006-06-13 TD62308APG/AFG Test Circuit 1. ICEX 2. ICC VCC 3. VCE (sat) VCC ICEX IIN VCC Open ICC IOUT Open Open VCE VIN 4. IR VIL VCE (sat) 5. VF VCC VCC VF IR VR Open IF Open 6. tON, tOFF Input VCC Open RL Pulse generator (Note 1) Input Output VIN (Note 1) tf tr VOUT 90% 50% 90% 50% 10% VIH = 5 V 10% 50 µs CL = 15 pF (Note 2) tON tOFF VOH Output 50% 50% VOL Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: CL includes probe and jig capacitance 4 2006-06-13 TD62308APG/AFG VOUT – VIN 30 VOUT – VIN 30 Ta = 25°C (typ.) VCC = 5.0 V IOUT = 0.9 A (V) Output voltage VOUT Output voltage VOUT (V) IOUT = 0.9 A 20 5.0 VCC = 4.5 V 5.5 10 0 0 2 4 Input voltage VIN 20 25 Ta = −40°C 10 0 0 6 2 (V) 4 Input voltage IOUT – VCE (sat) (1) DIP-16 pin type-AP On PCB (50 × 50 × 1.6 mm Cu 50%) (1) PD (W) VCC = 5 V (mA) (V) 3.0 (typ.) VIN = 0 V 1.0 2.4 (2) DIP-16 pin type-AP free air (3) Type-F, AF free air (60 × 30 × 1.6 mm Cu 30%) 1.8 Power dissipation Output current IOUT VIN 6 PD – Ta 1.5 Ta = 85°C 0.5 25 −40 0 0 85 0.5 1.0 1.5 Output saturation voltage 1.2 (3) (4) 0.6 0 0 2.0 (4) PFP-16 pin free air (2) VIN (V) 40 80 120 Ambient temperature IOUT – Duty cycle Ta (°C) IOUT – Duty cycle 1500 1500 n=1 (mA) n=3 n=2 n=4 Output current IOUT Output current IOUT (mA) n=1 1200 900 600 TD62308APG 300 Ta = 25°C 1200 n=4 20 n=3 n=2 900 600 TD62308APG 300 VCC = 5.5 V n-ch ON 0 0 200 160 Ta = 85°C VCC = 5.5 V n-ch ON 40 Duty cycle 60 80 0 0 100 (%) 20 40 Duty cycle 5 60 80 100 (%) 2006-06-13 TD62308APG/AFG IOUT – Duty cycle IOUT – Duty cycle 1500 1500 n=3 n=4 900 (mA) n=2 Output current IOUT Output current IOUT (mA) n=1 1200 600 TD62308AFG 300 Ta = 25°C 1200 n=2 900 20 n=3 n=4 600 TD62308AFG 300 VCC = 5.5 V n-ch ON 0 0 n=1 Ta = 85°C VCC = 5.5 V n-ch ON 40 Duty Cycle 60 80 0 0 100 (%) 20 40 Duty Cycle 6 60 80 100 (%) 2006-06-13 TD62308APG/AFG Package Dimensions Weight: 1.11 g (typ.) 7 2006-06-13 TD62308APG/AFG Package Dimensions Weight: 0.50 g (typ.) 8 2006-06-13 TD62308APG/AFG Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 9 2006-06-13 TD62308APG/AFG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 10 2006-06-13 TD62308APG/AFG About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux RESTRICTIONS ON PRODUCT USE 060116EBA • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C • The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E 11 2006-06-13