INTEGRATED CIRCUITS DATA SHEET TDA3856 Quasi-split sound processor for all standards Product specification File under Integrated Circuits, IC02 June 1994 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 FEATURES • Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound) • Automatic muting of the AF2 signal (at B/G) by the input level • AM signal processing for L standard and switching over the audio signal • Layout-compatible with TDA3858 (32 pins) and TDA3857 (20 pins). GENERAL DESCRIPTION Separate symmetrical IF inputs for FM or AM sound. Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. VP supply voltage (pin 21) 4.5 5 8.8 UNIT V IP supply current − 60 72 mA Vi IF IF input sensitivity (−3 dB) − 70 100 µV Vo(RMS) audio output signal for FM (B/G) − 1 − V Vo(RMS) audio output signal for AM (L) − 0.6 − V THD total harmonic distortion for FM − 0.5 − % for AM − 1 − % for FM − 68 − dB for AM − 56 − dB S/N (W) weighted signal-to-noise ratio ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA3856 24 shrink DIL plastic SOT234(1) TDA3856T 24 SO plastic SOT137(2) Note 1. SOT234-1; 1996 November 28. 2. SOT137-1; 1996 November 28. June 1994 2 Philips Semiconductors Product specification Quasi-split sound processor for all standards Fig.1 Block diagram (B/G and L). June 1994 3 TDA3856 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 PINNING SYMBOL PIN DESCRIPTION AMIF1 1 AM IF difference input 1 for L standard (32.4 MHz) AMIF2 2 AM IF difference input 2 for L standard (32.4 MHz) CAGC 3 charge capacitor for AGC (FM and AM) CAM 4 charge capacitor for AM AGC MODE 5 3-state input for standard select FM2R1 6 reference circuit for FM2 (5.74 MHz) FM2R2 7 reference circuit for FM2 (5.74 MHz) AF2 8 AF2 output (AF out of 5.74 MHz) AF1 9 AF1 output (AF out of 5.5 MHz or AM) FM1R1 10 reference circuit for FM1 (5.5 MHz) FM1R2 11 reference circuit for FM1 (5.5 MHz) VC-R1 12 reference circuit for the vision carrier (38.9 MHz) VC-R2 13 reference circuit for the vision carrier (38.9 MHz) CAFAM 14 DC decoupling capacitor for AM demodulator (AF-AM) FM1| 15 intercarrier input for FM1 (5.5 MHz) CAF1 16 DC decoupling capacitor for FM1 demodulator (AF1) ICO 17 intercarrier output signal (5.5/5.74 MHz) CAF2 18 DC decoupling capacitor for FM2 demodulator (AF2) FM2I 19 intercarrier input for FM2 (5.74 MHz) GND 20 ground (0 V) VP 21 +5 to +8 V supply voltage CREF 22 charge capacitor for reference voltage FMIF1 23 IF difference input 1 for B/G standard (38.9 MHz) FMIF2 24 IF difference input 2 for B/G standard (38.9 MHz) June 1994 4 Fig.2 Pin configuration. Philips Semiconductors Product specification Quasi-split sound processor for all standards Sound carrier notch filter for an improved intercarrier buzz FUNCTIONAL DESCRIPTION The quasi-split sound processor is suitable for all standards. Dependent on the voltage at pin 5 either FM mode (B/G) or AM mode (L) is selected. The series capacitor Cs in the 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to the formula Cs = CP (fvc/fsc)2 − CP. The result is an improved intercarrier buzz (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. B/G standard (FM mode) Pins 23 and 24 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. Muting With no sound carrier SC2 at pin 19, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV at pin 19, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 23 and 24 generate noise at pin 19, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise at pin 19 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder, when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. Intercarrier buzz fine tuning with 250 kHz square wave video modulation The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. Measurements at the demodulators For all signal-to-noise measurements the generator must meet the following specifications: phase modulation errors < 0.5° for B/W-jumps intercarrier signal-to-noise ratio as measured with ‘TV-demodulator AMF2’ (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with ∆f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±30 kHz the S/N ratio is deteriorated by 4.5 dB. L standard (AM mode) Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1, with AF2 output muted. June 1994 TDA3856 5 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP1 supply voltage (pin 21) − 8.8 V VI voltage (pins 1, 2, 5, 8, 9, 15, 17, 19, 23 and 24) 0 VP V Ptot total power dissipation 0 650 mW Tstg storage temperature −25 +150 °C Tamb operating ambient temperature 0 +70 °C VESD electrostatic handling (note 1) all pins except pins 1, 2, 23 and 24 ±500 − V pins 1, 2, 23 and 24 +400 − V −500 − V Note to the Limiting Values 1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. CHARACTERISTICS VP = 5 V and Tamb = +25 °C; measurements taken in Fig.3 with fvc = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to 10% residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = 50 kHz, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage (pin 21) 4.5 5 8.8 V IP supply current (pin 21) 48 60 72 mA 2.8 − VP V IF source control (pin 5) V5 input voltage in order to obtain standards B/G (FM) with automatic muting I5 pin 5 connected pin 5 open-circuit − 2.8 − V B/G (FM) without muting pin 5 connected or alternative measure: 22 kΩ to GND 1.3 − 2.3 V L (AM sound) pin 5 connected 0 − 0.8 V V5 = VP − − 100 µA V5 = 0 V − − −300 µA − − 100 Ω input current IF input not activated (pins 1-2 or 23-24) RI input resistance VI DC input voltage (pins 1, 2 or 23, 24) LOW set internally − − 0.1 V α12-13 crosstalk attenuation of IF input switch note 1 50 56 − dB IF amplifier (pins 1-2 or 23-24) RI input resistance 1.8 2.2 − kΩ CI input capacitance − 2.0 2.6 pF June 1994 6 Philips Semiconductors Product specification Quasi-split sound processor for all standards SYMBOL PARAMETER CONDITIONS TDA3856 MIN. − TYP. MAX. 1.75 − UNIT VI DC potential, voltage (pins 1, 2, 23, 24) V Vi IF (RMS) maximum input signal (RMS value) Vo = +1 dB 70 100 − mV input signal sensitivity B/G standard (RMS value, pins 32-24) −3 dB intercarrier signal reduction at pin 17 − 70 100 µV input signal sensitivity L standard (RMS value, pins 1-2) −3 dB intercarrier signal reduction at pin 9 − 70 100 µV V3 voltage for gain control (pin 3) 1.7 − 2.6 V ∆Gv IF gain control 60 63 − dB B IF bandwidth −3 dB 50 70 − MHz fo = 38.9 MHz − 270 − mV − 4 − kΩ Resonance amplifier (pins 12-13) Vo (p-p) vision carrier amplitude (peak-to-peak value) R12-13 operating resistance L inductance C capacitance QL Q-factor of resonant circuit V12, 13 DC voltage (pins 12 and 13) Figs 3 and 5 Qo = 90 − 0.247 − µH − 68 − pF − 40 − − VP− 1 − V 71 95 mV Intercarrier mixer output (pin 17) Vo (RMS) output signal for 5.5 MHz (RMS value) output signal for 5.74 MHz (RMS value) B IF bandwidth 125 32 43 56 mV −1 dB 6 8.5 − MHz −3 dB 7 10 − MHz VVID/V17 residual video AM on intercarrier note 2 − 3 10 % VVC(RMS) residual vision carrier (RMS value) 1st/2nd harmonic (38.9/77.8 MHz) − 0.5 1 mV R17 output resistance (emitter follower) 1 mA emitter current − 30 − Ω Io allowable AC output current (pin 17) − − ±0.7 mA I17 allowable DC output current V17 DC voltage − − −2 mA LC-circuit at pin 12, 13 adjusted to minimum video content at pin 17 1.5 1.75 2.0 V −3 dB AF signal − 300 450 µV maximum input signal (RMS value) 200 − − mV R15, 19 input resistance 450 560 700 Ω − 0 − V 0.8 1.2 1.7 mV 4 7 12 dB Limiting amplifiers (pins 15 and 19) Vi (RMS) minimum input signal (RMS value) V15, 19 DC voltage Vi (RMS) level detector threshold for no muting (RMS value, pin 19) ∆Vi hysteresis of level detector June 1994 only 5.74 MHz channel 7 Philips Semiconductors Product specification Quasi-split sound processor for all standards SYMBOL PARAMETER CONDITIONS TDA3856 MIN. TYP. MAX. UNIT FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (RMS) = 10 mV (fmod = 1 kHz, deviation ∆f = ±50 kHz) at pins 15 and 19 without ceramic filters, Rs = 50 Ω. De-emphasis 50 µs and V5 = VP (B/G standard). QL-factor = 11 for resonant circuits at pins 6-7 and 10-11 (including IC). VIC (RMS) intercarrier signals (RMS values, pins 6-7 and 10-11) − 100 − mV V DC voltage (pins 6, 7, 10 and 11) − 1.8 − V Vo(RMS) AF output signals (RMS values, pins 8 and 9) 0.84 0.95 1.07 V ∆Vo difference of AF signals between channels (pins 8 and 9) − − 1 dB R8, 9 output resistance 75 100 130 Ω V8, 9 DC voltage I8, 9(M) allowed AC current of emitter output (peak value) I8, 9 maximum allowed DC output current note 3 1.8 2.1 2.4 V − − ±1.5 mA − − −2 mA THD total harmonic distortion − 0.5 1.0 % Vo(RMS) AF output signal (RMS value) THD = 1.5% 1.25 − − V αAM AM suppression 1 kHz; m = 0.3 48 54 − dB S/N(W) weighted signal-to-noise ratio CCIR468-3 64 68 − dB B AF bandwidth (−3 dB) lower limit − − 20 Hz upper limit 100 − − kHz αCR crosstalk attenuation (pins 9-8) 60 70 − dB V16, 18 DC voltage (pins 16 and 18) − 1.8 − V AM demodulator V5 = 0 V (AM mode) input signals at pins 1-2: SC = 32.4 MHz; fmod = 1 kHz; m = 0.8; Vi AM (RMS) = 10 mV Vo (RMS) AF output signal at pin 9 (RMS value) 530 600 675 mV R9 output resistance (pin 9) 75 100 130 Ω Io (M) maximum AC output current (peak value) − − ±1.5 mA I9 maximum DC output current − − −2 mA V9 DC voltage 1.8 2.1 2.4 V note 3 THD total harmonic distortion Fig.4 − 1 2 % S/N(W) weighted signal-to-noise ratio CCIR468-3 50 56 − dB B AF bandwidth (−3 dB) lower limit − − 20 Hz upper limit 100 − − kHz − 2 − V V14 June 1994 DC voltage (pin 14) 8 Philips Semiconductors Product specification Quasi-split sound processor for all standards SYMBOL PARAMETER CONDITIONS TDA3856 MIN. TYP. MAX. UNIT AF signal switches input signals: AM carrier into pin 1, 2 see part AM demodulator FM intercarrier into pin 15 see part FM demodulator no signal in pin 19 (AF2) the output signals are related to the signals described in the demodulator parts. Vo/Vomute AF2 mute attenuation (pin 8) B/G mode; V5 = VP 70 − − dB VoAM/VoFM AF1 FM signal (pin 9) attenuation of unwanted FM signal L mode; V5 = 0; FM: modulated; AM: unmodulated 70 − − dB VoFM/VoAM AF1 AM signal (pin 9) attenuation of unwanted AM signal B/G mode; V5 = VP; FM: unmodulated; AM: modulated 70 − − dB dV8, 9 DC jump at the AF outputs switching to FM or AM sound or Mute − 5 25 mV AF performance for FM operation (standard B/G) input signals: B/G IF input signal (pin 23, 24) unmodulated sound carriers different video modulation (100%) the output signals are related to the signals described in the demodulator parts. (S+N)/N(W) weighted signal-to-noise ratio CCIR468-3; de-emphasis 50 µs black picture fi = 5.5 MHz 59 63 − dB 2T/20T pulses with white bar fi = 5.5 MHz 57 61 − dB 6 kHz sine wave, B/W-modulated fi = 5.5 MHz 52 56 − dB 250 kHz square wave, B/W-modulated fi = 5.5 MHz 50 54 − dB black picture fi = 5.742 MHz 57 61 − dB 2T/20T pulses with white bar fi = 5.742 MHz 55 59 − dB 6 kHz sine wave, B/W-modulated fi = 5.742 MHz 50 54 − dB 250 kHz square wave, B/W-modulated fi = 5.742 MHz 48 52 − dB 30 40 − dB Ripple rejection of the AF outputs (B/G and L standard) RR ripple rejection Vripple on VP / Vripple on Vout VR(p-p) = 200 mV; fR = 70 Hz Notes to the characteristics 1. Crosstalk attenuation of IF input switch, measured at R12-13 = 470 Ω (instead of LC circuit); input signal Vi (RMS) = 20 mV (pins 23-24). AGC voltage V3 set to a value to achieve Vo (RMS) = 20 mV (pins 12-13). After switching (V5 = 0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens). 2. Spurious intercarrier AM: m = (A − B)/A 3. (A = signal at sync; B = signal with 100% picture modulation). For larger current: RL > 2.2 kΩ (pin 8 or 9 to GND) in order to increase the bias current of the output emitter follower. June 1994 9 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used). June 1994 10 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 Fig.4 Total harmonic distortion (THD) as function of audio frequency at AM standard (V5 = 0). (1) simple resonant circuit (2) resonant circuit with CP = 68 pF Cs = CP (fVC/fSC)2 − CP Cs = 27 pF (see Fig.3) Fig.5 Frequency response of the 38.9 MHz reference circuit. June 1994 11 Philips Semiconductors Product specification Quasi-split sound processor for all standards APPLICATION INFORMATION Fig.6 Internal circuits (continued in Fig.7). June 1994 12 TDA3856 Philips Semiconductors Product specification Quasi-split sound processor for all standards Fig.7 Internal circuits (continued from Fig.6). June 1994 13 TDA3856 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 PACKAGE OUTLINES SDIP24: plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 ME seating plane D A2 A A1 L c e Z b1 (e 1) w M MH b 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 22.3 21.4 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT234-1 June 1994 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 13 24 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.419 0.043 0.050 0.055 0.394 0.016 inches 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013AD June 1994 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 15 Philips Semiconductors Product specification Quasi-split sound processor for all standards Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. SDIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. June 1994 TDA3856 16 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3856 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1994 17