TSC TESDB5V0A

TESDB5V0A
5V, 2-Channels ESD Protection Array
Small Signal Diode
SOT-143
A
F
I
E
Features
J
B
—Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
—Meet IEC61000-4-4 (EFT) rating. 40A (5/50ns)
K
—Protects two directional I/O lines
—Working Voltage : 5V
H
D
C
—Pb free version, RoHS compliant, and Halogen free
Unit (mm)
Dimensions
Mechanical Data
G
Unit (inch)
Min
Max
Min
Max
A
2.800
3.040
0.110
0.120
—Terminal: Matte tin plated, lead free.
B
1.200
1.400
0.047
0.055
—High temperature soldering guaranteed: 260°C/10s
C
0.760
0.940
0.030
0.037
—Molding Compound Flammability Rating : UL 94V-0
D
0.300
0.510
0.012
0.020
—Weight : 10mg (approximately)
E
2.100
2.640
0.083
0.104
—Marking Code : SL3
F
0.013
0.015
0.001
0.001
—Case :SOT-143 package, molded plastic
G
0.080
0.200
0.003
0.008
Applications
H
0.400
0.600
0.016
0.024
—USB Power & Data Line Protection
I
0.750
1.070
0.030
0.042
—I2C Bus Protection
—Video Line Protection
J
2.100
2.640
0.083
0.104
0.2 (BSC)
K
0.008(BSC)
—Microcontroller Input Protectionrs
—T1/E1 secondary IC side Protection
Pin Configutation & PAD Layout
—ISDN S/T Interface
—WAN/LAN Equipment
VCC
4
—Ethernet 10BaseT
IO#2
3
1.4
1.92
Ordering Information
2.20
Part No.
Package
Packing
TESDB5V0A
SOT-143
3K / 7" Reel
1.72
Packing Code Marking
RBG
SL3
1
GND
Maximum Ratings and Electrical Characteristics
2
IO#2
1.2
Rating at 25°C ambient temperature unless otherwise specified.
1.0
Unit : mm
Maximum Ratings
Symbol
Value
Units
Peak Pulse Power (tp=8/20μs waveform)
PPP
200
W
Peak Pulse Current (tp = 8/20μs)
IPP
10
A
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
±15
± 8
KV
Type Number
Junction Temperature Range
TJ
Storage Temperature Range
TSTG
.
.
-55 to + 150
°C
-55 to + 150
°C
.
.
Electrical Characteristics
Type Number
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
Junction Capacitance
I R=
V R=
IPP=
IPP=
1mA
5V
1A
3A
VR=0V, f=1.0MHz
Max
5
Symbol
VRWM
Min
-
V(BR)
6
-
V
IR
-
5
9.8
17
uA
Vc
CJ
3 (Typ.)
Units
V
V
pF
Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
Version : B11
TESDB5V0A
5V, 2-Channels ESD Protection Array
Small Signal Diode
Rating and Characteristic Curves
FIG 2. Pulse Waveform
FIG 1. Admissible Power Dissipation Curve
120
110
100
Waveform Parameters:
tr = 8μs, td = 20μs
90
Percent of IPP
Power Rating (%)
100
80
80
70
e-1
60
60
50
40
40
30
td=Ipp/2
20
20
10
0
0
0
20
40
60
80
100
120
140
160
0
180
5
10
15
20
25
30
Time (us)
FIG 4. Typical Junction Capacitance
FIG 3. Clamping Voltage vs. Peak Pulse Current
5
25
Normalized Capacitance
Clamping Voltage (V)
30
20
15
10
Waveform Parameters:
tr = 8μs, td = 20μs
5
4
3
2
1
f = 1.0MHz
0
0
0
1
2
3
4
5
6
7
8
9
Peak Pulse Current (A)
10
11
12
0
1
2
3
4
5
Reverse Voltage (V)
Version : B11
TESDB5V0A
5V, 2-Channels ESD Protection Array
Small Signal Diode
Applications Information
—Designed for the protect two data lines from transient over-voltages by clamping them to afixed reference.
—Data lines are connected at pins 2 and 3.
—The negative reference (REF1) is connected at pin1 and which should be connected directly to a ground plane on the board for best
results.
—The positive reference (REF2) is connected at pin 4.
4
1
3
2
Pin
Definition
2, 3
I/O Lines
1
Ground
4
VCC
Typical Application
RJ45
Schematic Diagram for Gigabit Ethernet ESD Protection
To
Protected
Device
IO#1
IO#2
To
Protected
Device
IO#1
IO#2
VCC
VCC
10KΩ
—Data Line and Power Supply Protection Using VCC
—Data Line Protection with Bias and Power Supply Isolation Resistor
To
Protected
Device
IO#1
IO#2
NC
—Data Line Protection Using Internal ESD Diode
Version : B11
TESDB5V0A
5V, 2-Channels ESD Protection Array
Small Signal Diode
Carrier & Reel specification
TSC label
Item
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
10 Pitches Cumulative
Tolerance on Tape
±2.0mm ( ±0.008")
P0
D
P1
T
E
Symbol
Dimension(mm)
Carrier depth
K
1.22 Max.
Sprocket hole
D
1.50 +0.10
Reel outside diameter
A
180 ± 1
Reel inner diameter
D1
50 Min.
Feed hole width
D2
13.0 ± 0.5
Sprocke hole position
E
1.75 ±0.10
Sprocke hole pitch
P0
4.00 ±0.10
Embossment center
P1
2.00 ±0.10
Overall tape thickness
T
0.6 Max.
Tape width
W
8.30 Max.
Reel width
W1
14.4 Max.
F
K0
W
BB0
0
B1
D'
Top
Cover Tape
See Note1
K
For Components
2.0mm X 1.2mm
and Larger
A0
Center Lines
of Cavity
Embossment
For Machine Reference
Only
Including Draft and RADLL
Concentric Around B 0
W1
A
D2
Direction of Feed
D1
Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10 o within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : B11