DATA SHEET MOS INTEGRATED CIRCUIT µPD4724 RS-232 LINE DRIVER/RECEIVER AT 3.3 V/5 V The µPD4724 is a high breakdown voltage silicon gate CMOS line driver/receiver based on the EIA/TIA-232-E standard. This IC features various functions, such as standby, and incorporates a DC/DC converter that switches boost multiples, enabling operation at both +3.3 V and +5 V single supply voltage. The µPD4724 incorporates three drivers and five receivers, so an RS-232 interface circuit can be easily constructed by connecting five external capacitors. FEATURES • Based on EIA/TIA-232-E (RS-232-C) standard. • Single power supply: +3.3 V or +5 V (selectable with the VCHA pin) • Standby mode: Setting the standby pin to low level switches this IC into the standby mode and makes the driver outputs high-impedance. • Enable mode: When the enable pin is high level during the standby mode, two receivers can operate as inverters without hysteresis width (The other three receivers are fixed to high level). ORDERING INFORMATION Part number µPD4724GS-GJG Package 30-pin plastic shrink SOP (300 mil) Document No. S12201EJ2V0DS00 (2nd edition) (Previous No. IC-3228) Date Published January 1997 N Printed in Japan © 1993 µ PD4724 BLOCK DIAGRAM/PIN CONFIGURATION (TOP VIEW) +10 V C3 C1 + + +3.3 V or +5 V C5 + 1 VDD C4+ 30 2 C1+ GND 29 3 VCC C4– 28 4 C1– VSS 27 5 C5+ 26 STBY 6 GND 25 VCHA 7 C5– + C4 + C2 –10 V 24 EN Note DIN1 8 DIN2 9 DIN3 10 ROUT1 11 300 Ω 300 Ω 300 Ω 23 DOUT1 22 DOUT2 21 DOUT3 20 RIN1 5.5 kΩ ROUT2 12 ROUT3 13 19 RIN2 5.5 kΩ 18 RIN3 5.5 kΩ ROUT4 14 ROUT5 15 17 RIN4 5.5 kΩ 16 RIN5 5.5 kΩ Note The pull-up resistors of the driver inputs are active resistors. Remark 1. VDD and V SS are pins that output the voltage boosted internally. Don't connect these pins to the load. 2. Capacitors with a breakdown voltage of 20 V or higher are recommended for C 1 to C 5. And it is recommended to insert the capacitor that is 0.1 µ F to 1 µ F between V CC and GND. 3. 2 The capacitor C 5 does not have to be connected when the IC is used in 5 V mode (V CHA = L). µ PD4724 TRUTH TABLE Driver STBY D IN D OUT L × Z Standby mode (D/D converter OFF) H L H Space level output H H L Mark level output Remark Receiver RIN STBY EN ROUT Remark R4 to R5 R1 to R3 R4 to R5 R1 to R3 L L × × H H Standby mode1 (D/D converter OFF) L H L × H H Standby mode2 (D/D converter OFF, R4 and R5 operate) L H H × L H Standby mode2 (D/D converter OFF, R4 and R5 operate) H × L H Mark level input H × H L Space level input 3 V and 5 V SwitchingNote V CHA Operation mode L 5 V mode (Double boost) H 3 V mode (Triple boost) H: High level, L: Low level, Z: High-impedance, ×: Don’t care Note Be sure to switch the V CHA pin in standby mode (STBY = L). 3 µ PD4724 ABSOLUTE MAXIMUM RATINGS (T A = +25 °C) Parameter Symbol Ratings Unit Supply Voltage (V CHA = L) V CC –0.5 to +7.0 V Supply Voltage (V CHA = H) V CC –0.5 to +4.5 V Driver Input Voltage D IN –0.5 to V CC + 0.5 V Receiver Input Voltage R IN –30.0 to +30.0 V Control Input Voltage (STBY, V CHA, EN) V IN –0.5 to V CC + 0.5 V Driver Output Voltage DOUT –25.0 to +25.0 Note V Receiver Output Voltage ROUT –0.5 to V CC + 0.5 V Input Current (D IN , STBY, V CHA, EN) I IN ±20.0 mA Operating Temperature TA –40 to +85 °C Storage Temperature T stg –55 to +150 °C Power Dissipation PT 0.5 W Note Pulse width = 1 ms, duty cycle = 10 % MAX. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (V CHA = L, 5 V mode) V CC 4.5 5.0 5.5 V Supply Voltage (V CHA = H, 3 V mode) V CC 3.0 3.3 3.6 V High Level Input Voltage (D IN) V IH 2.0 V CC V Low Level Input Voltage (D IN ) V IL 0 0.8 V High Level Input Voltage (STBY, V CHA , EN) V IH 2.4 V CC V Low Level Input Voltage (STBY, V CHA , EN) V IL 0 0.6 V Receiver Input Voltage R IN –30 +30 V TA –40 +85 °C Note 0.33 4.7 µF Operating Temperature Capacitance of External Capacitor Note If the use of an electrolytic capacitor at low temperature is likely, set the capacitance with sufficient margin, because the capacitance of an electrolytic capacitor is smaller at lower temperatures (0 °C or lower). Care must be taken to minimize the wiring length between the capacitor and this IC. Using capacitors of excellent high frequency characteristics (such as tantalum, multi-layer ceramic capacitors, and aluminum electrolytic capacitors for switching power supplies) is highly recommended. 4 µ PD4724 ELECTRICAL SPECIFICATIONS FOR THE IC AS A WHOLE (T A = –40 to +85 °C and C 1 to C 5 = 1 µ F Unless Otherwise Specified) Parameter Circuit Current Circuit Current Circuit Current at Standby (Standby Mode 1) Circuit Current at Standby (Standby Mode 2) Symbol Test Conditions MIN. TYP. MAX. Unit V CC = +3.3 V, unloaded, RIN pin is open, STBY = H 7.5 15 mA V CC = +5.0 V, unloaded, RIN pin is open, STBY = H 5.5 11 mA VCC = +3.3 V, RL = 3 kΩ(DOUT), DIN = GND, R IN and ROUT pins are open, STBY = H 25 35 mA VCC = +5.0 V, RL = 3 kΩ(DOUT), DIN = GND, R IN and ROUT pins are open, STBY = H 19 28 mA VCC = +3.3 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = L, TA = 25 °C 1 3 µA V CC = +3.3 V, No load, DIN and R IN pins are OPEN, STBY = L, EN = L 5 VCC = +5.0 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = L, TA = 25 °C 2 V CC = +5.0 V, No load, DIN and R IN pins are OPEN, STBY = L, EN = L 10 VCC = +3.3 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = H, TA = 25 °C 1 V CC = +3.3 V, No load, DIN and R IN pins are OPEN, STBY = L, EN = H 5 VCC = +5.0 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = H, TA = 25 °C 2 V CC = +5.0 V, No load, DIN and R IN pins are OPEN, STBY = L, EN = H 10 I CC1 ICC2 µA ICC3 5 µA µA 3 µA µA ICC4 5 µA µA High Level Input Voltage VIH V CC = +3.0 to +5.5 V, STBY, VCHA, and EN pins Low Level Input Voltage VIL V CC = +3.0 to +5.5 V, STBY, VCHA, and EN pins 0.6 V High Level Input Current IIH VCC = +5.5 V, VI = +5.5 V, STBY, VCHA, and EN pins 1 µA Low Level Input Current IIL V CC = +5.5 V, VI = 0 V, STBY, VCHA, and EN pins –1 µA Driver and receiver inputs, VCC = +3.3 V, to GND, f = 1 MHz 10 pF Driver and receiver inputs, VCC = +5.0 V, to GND, f = 1 MHz 10 pF Input Capacitance V 2.4 CIN STBY - V CHA Time tSCH V CC = +3.0 to +5.5 V, STBY ↓ → VCHA Note 1 µs V CHA - STBY Time tCHS V CC = +3.0 to +5.5 V, VCHA → STBY ↑ Note 1 µs STBY - V CC Time tSC V CC = +3.0 to +5.5 V, STBY ↓ → VCC Note 1 µs V CC - STBY Time tCS V CC = +3.0 to +5.5 V, VCC → STBY ↑ Note 1 µs Remark TYP. values are valid only at T A = 25 °C and should be used for reference only. 5 µ PD4724 Note Test points for these parameters 5V 3.3 V STBY 0.6 V 0.6 V 0.6 V 0.6 V 0V tSCH tCHS tSCH tCHS 3.3 V 2.4 V VCHA 0.6 V 0V 5V VCC 4.5 V 3.6 V 3.3 V 6 tSC tCS 2.4 V 0.6 V tSC tCS 4.5 V 3.6 V µ PD4724 ELECTRICAL SPECIFICATIONS FOR THE DRIVERS (T A = –40 to +85 °C and C 1 to C 5 = 1 µ F) 3 V Mode (V CHA = H, V CC = 3.0 to 3.6 V Unless Otherwise Specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit 0.8 V Low Level Input Voltage V IL High Level Input Voltage V IH Low Level Input Current IIL VCC = +3.6 V, VI = 0 V –25 µA High Level Input Current IIH VCC = +3.6 V, VI = 3.6 V 1.0 µA 2.0 VCC = +3.3 V, RL = ∞, T A = 25 °C Output Voltage VDO Output Short-Circuit Current ISC Slew RateNote 1 SR VCC = +3.3 V, RL = 3 kΩ, TA = Topt. ±5.0 VCC = +3.0 V, RL = 3 kΩ, TA = 25 °C ±5.0 V ±9.5 V ±6.0 V V VCC = +3.3 V, to GND ±40 mA CL = 10 pF, RL = 3 to 7 kΩ 3.0 30 V/µs CL = 2500 pF, RL = 3 to 7 kΩ 3.0 30 V/µs Propagation Delay TimeNote 1 tPHL tPLH RL = 3 kΩ, CL = 2500 pF Output Resistance RO VCC = VDD = VSS = 0 V VOUT = ± 2 V Output Transfer Time in Standby State t DAZ RL = 3 kΩ, CL = 2500 pF,Note 2 4 10 µs Output Transfer Time in Standby State tDZA RL = 3 kΩ, C L = 2500 pF,Note 2 1 3 ms tPRA pF,Note 3 1 3 ms MAX. Unit 0.8 V Power On Output Transfer Time RL = 3 kΩ, C L = 2500 µs 2.5 Ω 300 Remark TYP. values are valid only at T A = 25 °C and should be used for reference only. 5 V Mode (V CHA = L, V CC = 5.0 V ±10 % Unless Otherwise Specified) Parameter Symbol Test Conditions MIN. TYP. Low Level Input Voltage V IL High Level Input Voltage V IH Low Level Input Current IIL VCC = +5.5 V, VI = 0 V –40 µA High Level Input Current IIH VCC = +5.5 V, VI = 5.5 V 1.0 µA 2.0 VCC = +5.0 V, RL = ∞, T A = 25 °C Output Voltage V DO Output Short-Circuit Current ISC Slew Rate Note 1 SR V ±9.7 V VCC = +5.0 V, RL = 3 kΩ, TA = Topt. ±6.0 V VCC = +4.5 V, RL = 3 kΩ, TA = Topt. ±5.0 V VCC = +5.0 V, to GND ±40 mA CL = 10 pF, RL = 3 to 7 kΩ 4.0 30 V/µs CL = 2500 pF, RL = 3 to 7 kΩ 4.0 30 V/µs Propagation Delay Time Note 1 tPHL tPLH RL = 3 kΩ, C L = 2500 pF Output Resistance RO VCC = VDD = VSS = 0 V VOUT = ± 2 V Output Transfer Time in Standby State tDAZ RL = 3 kΩ, CL = 2500 pF,Note 2 4 10 µs Output Transfer Time in Standby State tDZA RL = 3 kΩ, CL = 2500 pF,Note 2 0.5 1 ms Power-On Output Transfer Time tPRA RL = 3 kΩ, CL = 2500 pF,Note 2 0.5 1 ms µs 2 Ω 300 Remark TYP. values are valid only at T A = 25 °C and should be used for reference only. 7 µ PD4724 Note 1 Test points for slew rate, t PHL , and t PLH VCC 2.0 V DIN 0.8 V 0V tPLH tPHL VD0+ +5 V +3 V DOUT +3 V –3 V –3 V –5 V VD0– SR+ Note 2 SR– Test points for t DAZ, and t DZA VCC 2.4 V STBY 0.6 V 0V tDAZ tDZA VD0+ +5 V +5 V High-impedance DOUT VD0– –5 V Driver outputs are indefinite during transition time (t DZA). 8 –5 V µ PD4724 Note 3 Test points for t PRA in 3 V mode 3.3 V 3.0 V VCC 0V tPRA VD0+ +5 V High-impedance DOUT –5 V VD0– Driver outputs are indefinite during transition time (t PRA). Note 4 Test points for t PRA in 5 V mode 5V 4.5 V VCC 0V tPRA VD0+ +5 V High-impedance DOUT –5 V – VD0 Driver outputs are indefinite during transition time (t PRA). 9 µ PD4724 ELECTRICAL SPECIFICATIONS FOR THE RECEIVERS (V CC = 3.0 to 5.5 V, T A = –40 to +85 °C and C 1 to C 5 = 1 µ F Unless Otherwise Specified) Parameter Symbol Test Conditions Low Level Output Voltage V OL1 IOUT = 4 mA MIN. TYP. MAX. Unit 0.4 V High Level Output Voltage VOH1 IOUT = –4 mA Low-Level Output Voltage V OL2 IOUT = 4 mA, STBY = L High Level Output Voltage VOH2 IOUT = –4 mA, STBY = L Propagation Delay Time (STBY = H) tPHL tPLH RIN → ROUT, CL = 150 pF VCC = +3.0 V,Note 1 0.2 µs Propagation Delay Time (STBY = L) tPHL tPLH RIN → ROUT, CL = 150 pF VCC = +3.0 V,Note 2 0.1 µs Propagation Delay Time (STBY = L) tPHA tPAH EN → ROUT, CL = 150 pF VCC = +3.0 V,Note 3 100 300 ns 5.5 7 kΩ 0.5 V Input Resistance RI Input Terminal Release Voltage VIO VCC-0.4 V 0.5 VCC-0.5 3 V V V IH VCC = +3.0 to + 5.5 V 1.7 2.3 2.7 V VIL VCC = +3.0 to + 5.5 V 0.7 1.1 1.7 V VH VCC = +3.0 to + 5.5 V (Hysteresis width) 0.5 1.2 1.8 V Input Threshold Voltage (STBY = L, EN = H) VIH VCC = +3.0 to + 5.5 V 2.7 1.5 VIL VCC = +3.0 to + 5.5 V 1.5 0.7 V Output Transition Time in Standby State tDAH Note 4 0.2 3 µs Output Transition Time in Standby State tDHA VCHA = H (3 V mode), Note 4 0.6 3 ms VCHA = L (5 V mode), Note 4 0.3 1 ms VCHA = H (3 V mode), Note 5 1 3 ms 0.5 1 ms Input Threshold Voltage (STBY = H) Power-On Reset Release Time tPRA VCHA = L (5 V mode), Note 6 Remark TYP. values are valid only at T A = 25 °C and should be used for reference only. Note 1 Test points for t PHL, t PLH +3 V 2.7 V RIN 0V 0.7 V –3 V tPHL tPLH VOH ROUT 2.0 V 0.8 V VOL 10 V µ PD4724 Note 2 Test points for t PHL, t PLH +3 V 2.7 V RIN 0.7 V 0V –3 V tPHL tPLH VOH 2.0 V ROUT 0.8 V VOL Note 3 Test points for t PHA , t PAH VCC 2.4 V EN 0.6 V 0V tPAH tPHA VOH 2.0 V ROUT 0.8 V VOL Note 4 Test points for t DAH, t DHA VCC 2.4 V STBY 0.6 V 0V tDAH tDHA VOH 2.0 V ROUT 0.8 V VOL Receiver outputs are indefinite during transition time (tDHA). 11 µ PD4724 Note 5 Test points for t PRA in 3 V mode 3.3 V 3.0 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (tPRA). Note 6 Test points for t PRA in 5 V mode 5V 4.5 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (tPRA). REFERENCE MATERIAL • IC PACKAGE MANUAL (C10943X) • NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY (IEI-1212) 12 µ PD4724 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document "SMT MANUAL" (C10535E). µ PD4724GS-GJG Soldering process Soldering conditions Symbol Infrared ray reflow Peak package's surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2, Exposure limit*: None IR30-00-2 VPS Peak package's surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2, Exposure limit*: None VP15-00-2 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit*: None WS60-00-1 Partial heating method Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None * Exposure limit before soldering after dry-pack package is opened. Sotrage conditions: 25 °C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method”. 13 µ PD4724 30 PIN PLASTIC SHRINK SOP (300 mil) 30 16 3° +7° –3° detail of lead end 1 15 A H J E K F G I C D N M M NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 14 L B P30GS-65-300B-1 ITEM MILLIMETERS INCHES A 10.11 MAX. 0.398 MAX. B 0.51 MAX. 0.020 MAX. C 0.65 (T.P.) 0.026 (T.P.) D 0.30+0.10 –0.05 0.012+0.004 –0.003 E 0.125 ± 0.075 0.005 ± 0.003 F 2.0 MAX. 0.079 MAX. G 1.7 ± 0.1 0.067 ± 0.004 H 8.1 ± 0.2 0.319 ± 0.008 I 6.1 ± 0.2 0.240 ± 0.008 J 1.0 ± 0.2 0.039+0.009 –0.008 K 0.15+0.10 –0.05 0.006+0.004 –0.002 L 0.5 ± 0.2 0.020+0.008 –0.009 M 0.10 0.004 N 0.10 0.004 µ PD4724 [MEMO] 15 µ PD4724 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 16