DATE NAME DRAWN 14-Jul-05 T.Nishimura CHECKED 14-Jul-05 H.Kakiki T.Miyasaka DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Tentative (Under developmemt) Specification (1200A/1200V-2in1 IGBT-Module) Device Name : IGBT-Module Type Name : 2MBI1200U4G-120 Spec. No. : MT5F16507 Fuji Electric Device Technology Co.,Ltd. Matsumoto Factory APPROVAL MT5F16507 1 14 H04-004-007 DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Tentative (Under developmemt) Revised Recor ds Date Classifi cation Ind. Content Applied date Drawn Checked Approved 14-Jul-05 enactment Issued date H.Kakiki T.Miyasaka MT5F16507 2 14 H04-004-006 Type Name : 2MBI1200U4G-120 main emitter main collector DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Tentative (Under developmemt) ／ PKG.No. M248 1. Outline Drawing ( Unit : mm ) 2. Equivalent circuit main collector sense emitter sense collector gate gate sense collector sense emitter main emitter MT5F16507 3 14 H04-004-003 Tentative (Under developmemt) 3.Absolute Maximum Ratings ( at Tc= 25°C unless otherwise specified ） Items Symbols Conditions Maximum Ratings Units Collector-Emitter voltage VCES 1200 V Gate-Emitter voltage VGES ±20 V Collector current Ic Continuous Icp 1ms Tc=25°C 1600 Tc=80°C 1200 Tc=25°C 3200 Tc=80°C 2400 -Ic -Ic pulse A 1200 1ms 2400 1 device 4960 Collector Power Dissipation Pc Junction temperature Tj 150 Storage temperature Tstg -40 ~ +125 Isolation voltage Viso between terminal and copper base *1 Screw Torque *2 AC : 1min. W °C 2500 Mounting 5.75 Main Terminals 10 Sense Terminals 2.5 VAC Nm (*1) All terminals should be connected together when isolation test will be done. Main Terminals 8~10 Nm (M8) Sense Terminals 1.7~2.5 Nm (M4) 4. Electrical characteristics ( at Tj= 25°C unless otherwise specified) Items Symbols Zero gate voltage Collector current ICES Gate-Emitter leakage current IGES Gate-Emitter threshold voltage VGE(th) VCE(sat) Collector-Emitter saturation voltage (main terminal) VCE(sat) (sense terminal) Input capacitance Turn-on Turn-off Cies ton tr toff tf VF Forward on voltage (main terminal) VF (sense terminal) Reverse recovery Lead resistance, terminal-chip * (*) trr Conditions min. VGE = 0V 1.0 mA - - 1600 nA 5.5 6.5 7.5 V Tj= 25°C - 2.20 2.35 Tj=125°C - 2.40 - Tj= 25°C - 1.90 2.05 VGE=±20V VCE = 20V Ic = 1200mA Ic = 1200A Units - VCE = 0V VGE=15V Char acter istics typ. max. - VCE = 1200V V Tj=125°C - 2.10 - VCE=10V,VGE=0V,f=1MHz - 135 - Vcc = 600V - 1.35 - - 0.65 - Rgon = 3.3 Ω - 0.80 - Rgoff = 0.82 Ω Tj= 25°C Tj=125°C - 0.20 1.95 2.05 2.10 - Tj= 25°C - 1.65 1.80 Tj=125°C - 1.75 - - 0.45 - μs - 0.25 - mΩ Ic = 1200A VGE=±15V,Tj=125℃ VGE=0V IF = 1200A IF = 1200A R lead nF μs V Biggest internal terminal resistance among arm. DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. (*2) Recommendable Value : Mounting 4.25~5.75 Nm (M6) MT5F16507 4 14 H04-004-003 Tentative (Under developmemt) 5. Thermal resistance characteristics Items Symbols Thermal resistance(1device) Rth(j-c) Contact Thermal resistance(1device) Rth(c-f) Conditions min. Char acter istics typ. max. IGBT - - 0.025 FWD - - 0.042 with Thermal Compound (*) - 0.006 - Units °C/W * This is the value which is defined mounting on the additional cooling fin with thermal compound. 6. Indication on module Lot.No. Sample.No. Logo of pr oduction 2MBI1200U4G-120 1200A / 1200V Place of manufactur ing (code) 7.Applicable category 8.Storage and transportation notes ・ The module should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75% . ・ Store modules in a place with few temperature changes in order to avoid condensation on the module surface. ・ Avoid exposure to corrosive gases and dust. ・ Avoid excessive external force on the module. ・ Store modules with unprocessed terminals. ・ Do not drop or otherwise shock the modules when transporting. 9. Definitions of switching time 90% ～ ～ 0V 0V V GE L tr r Ir r VCE Vcc RG 0V 0A V CE Ic 10% 10% tr ( i ) V GE Ic Ic ～ ～ 90% tr 90% 10% VCE ～ ～ tf to f f to n 10. Packing and Labeling Display on the packing box - Logo of production - Type name - Lot No - Products quantity in a packing box DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. This specification is applied to IGBT Module named 2MBI1200U4G-120 . MT5F16507 5 14 H04-004-003 Tentative (Under developmemt) 11.Reliability test results Reliability Test Items Test items (Aug.-2001 edition) Mechanical Tests 1 Terminal Strength (Pull test) 2 Mounting Strength 3 Vibration 4 Shock 1 High Temperature Storage 2 Low Temperature Storage 3 Temperature Humidity Storage 4 Unsaturated Pressurized Vapor Environment Tests This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Reference AcceptNumber norms ance EIAJ ED-4701 of sample number Test methods and conditions 5 Temperature Cycle Pull force Test time Screw torque : 40N : 10±1 sec. : 1.8 ~ 2.1 N·m (M4) 4.25 ~ 5.75 N·m (M6) 8.0~ 10.0 N·m (M8) Test time : 10±1 sec. Range of frequency : 10 ~ 500Hz Sweeping time : 15 min. Acceleration : 100m/s 2 Sweeping direction : Each X,Y,Z axis Test time : 6 hr. (2hr./direction) Maximum acceleration : 1000m/s 2 Pulse width : 6.0msec. Direction : Each X,Y,Z axis Test time : 3 times/direction Storage temp. : 125±5 ℃ Test duration : 1000hr. Storage temp. : -40±5 ℃ Test duration : 1000hr. Storage temp. : 85±2 ℃ Relative humidity : 85±5% Test duration : 1000hr. Test temp. : 120±2 ℃ Test humidity : 85±5% Test duration : 96hr. Test temp. : 5 (0:1) 5 (0:1) 5 (0:1) 5 (0:1) Test Method 201 5 (0:1) Test Method 202 5 (0:1) Test Method 103 5 (0:1) 5 (0:1) Test Method 105 5 (0:1) Test Method 307 5 (0:1) Test Method 401 MethodⅠ Test Method 402 MethodⅡ Test Method 403 Reference 1 Condition code B Test Method 404 Condition code A Test code C Test Method 103 Test code E Low temp. -40±5 ℃ High temp. 125 ±5 ℃ Number of cycles RT 5 ~ 35 ℃ : High ~ RT ~ Low ~ RT 1hr. 0.5hr. 1hr. 0.5hr. : 100 cycles Test temp. : Dwell time 6 Thermal Shock High temp. 100 +0 -5 ℃ Method Ⅰ Condition code A +5 -0 Low temp. 0 ℃ Used liquid : Water with ice and boiling water Dipping time : 5 min. par each temp. Transfer time : 10 sec. Number of cycles : 10 cycles DWG.No. Test categories MT5F16507 6 14 H04-004-003 Tentative (Under developmemt) Reliability Test Items Test items (Aug.-2001 edition) 1 High temperature Reverse Bias Test temp. EnduranceEndurance Tests Tests Test duration 2 High temperature Bias (for gate) Test temp. Test duration : Ta = 125±5 ℃ (Tj ≦ 150 ℃) : VC = VGE = +20V or -20V : Applied DC voltage to G-E VCE = 0V : 1000hr. Test temp. Relative humidity Bias Voltage Bias Method : : : : Test duration ON time OFF time Test temp. : : : : Number of cycles : Bias Voltage Bias Method 3 Temperature Humidity Bias 4 Intermitted Operating Life (Power cycle) ( for IGBT ) Test Method 101 5 (0:1) Test Method 101 5 (0:1) Test Method 102 5 (0:1) 5 (0:1) : Ta = 125±5 ℃ (Tj ≦ 150 ℃) : VC = 0.8×VCES : Applied DC voltage to C-E VGE = 0V : 1000hr. Bias Voltage Bias Method This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Reference AcceptNumber norms ance EIAJ ED-4701 of sample number Test methods and conditions 85±2 oC 85±5% VC = 0.8×VCES Applied DC voltage to C-E VGE = 0V 1000hr. 2 sec. 18 sec. Tj=100±5 deg Tj ≦ 150 ℃, Ta=25±5 ℃ 15000 cycles Condition code C Test Method 106 Failure Criteria Item Electrical characteristic Characteristic Leakage current Symbol - USL×2 USL×2 mA A Gate threshold voltage VGE(th) LSL×0.8 USL×1.2 mA Saturation voltage VCE(sat) - USL×1.2 V - USL×1.2 USL×1.2 V mV - USL×1.2 mV resistance VF VGE or FWD Isolation voltage inspection Unit ICES ±IGES Forward voltage Thermal IGBT Visual Failure criteria Lower limit Upper limit Note VCE VF Viso Broken insulation - - The visual sample - Visual inspection Peeling Plating and the others LSL : Lower specified limit. USL : Upper specified limit. Note : Each parameter measurement read-outs shall be made after stabilizing the components at room ambient for 2 hours minimum, 24 hours maximum after removal from the tests. And in case of the wetting tests, for example, moisture resistance tests, each component shall be made wipe or dry completely before the measurement. DWG.No. Test categories MT5F16507 7 14 H04-004-003 Tentative (Under developmemt) Reliability Test Results Test categories Test items (Aug.-2001 edition) 1 Terminal Strength Mechanical Tests Reference norms EIAJ ED-4701 (Pull test) 2 Mounting Strength Test Method 401 Number Number of test of failure sample sample 5 0 5 0 5 0 5 0 MethodⅠ Test Method 402 MethodⅡ 3 Vibration Test Method 403 Condition code B 4 Shock Test Method 404 Environment Tests 1 High Temperature Storage Test Method 201 5 0 2 Low Temperature Storage Test Method 202 5 0 3 Temperature Humidity Test Method 103 5 * 5 0 Storage Test code C 4 Unsaturated Pressurized Vapor Test Method 103 5 Temperature Cycle Test Method 105 5 0 6 Thermal Shock Test Method 307 5 0 Test code E Method Ⅰ Condition code A 1 High temperature Reverse Bias Test Method 101 5 * 2 High temperature Bias Test Method 101 5 0 Test Method 102 5 * 5 0 ( for gate ) 3 Temperature Humidity Bias Condition code C 4 Intermitted Operating Life Test Method 106 (Power cycling) ( for IGBT ) * under confirmation DWG.No. Endurance Tests This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. Condition code B MT5F16507 8 14 H04-004-003 Tentative (Under developmemt) Collector current vs. Collector-Emitter voltage (typ.) Tj=25℃,sense terminal Collector current vs. Collector-Emitter voltage (typ.) Tj= 125°C, sense terminal 2800 2800 12V VGE=20V 2400 2000 1600 10V 1200 800 12V 2000 1600 10V 1200 800 400 400 8V 8V 0 0.0 1.0 2.0 3.0 4.0 0 0.0 5.0 1.0 Collector-Emitter voltage : VCE [V] 3.0 4.0 5.0 Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) Tj=25℃,sense terminal 2800 10 Tj=125°C Collector - Emitter voltage : VCE [ V ] Tj=25°C 2400 Collector current : Ic [A] 2.0 Collector-Emitter voltage : VCE [V] Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) VGE=+15V,sense terminal 2000 1600 1200 800 400 8 6 4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Ic=2400A Ic=1200A Ic=600A 2 0 0 4.0 5 10 Collector-Emitter voltage : VCE [V] 15 20 Capacitance vs. Collector-Emitter voltage (typ.) Dynamic Gate charge (typ.) VGE=0V, f= 1MHz, Tj= 25°C Tj= 25°C Collector-Emitter voltage:VCE[V] 1000 Cies 100 Cres 10 Coes 1 25 800 20 VGE VCE 600 15 400 10 200 5 0 10 20 30 0 1000 Collector-Emitter voltage : VCE [V] 2000 3000 4000 5000 0 6000 Gate charge : Qg [ nC ] DWG.No. 0 25 Gate - Emitter voltage : VGE [ V ] 1000 Capacitance : Cies, Coes, Cres [ nF ] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 15V Gate-Emitter voltage:VGE[V] Collector current : Ic [A] 15V Collector current : Ic [A] VGE=20V 2400 MT5F16507 9 14 H04-004-003 Tentative (Under developmemt) Switching time vs. Collector current (typ.) Switching time vs. Gate resistance (typ.) Vcc=600V, VGE=±15V, Rgon=3.3Ω, Rgoff=0.82Ω, Tj= １25°C Vcc=600V, Ic=1200A,VGE=±15V, Tj= １25°C 6.0 Switching time : ton, tr, toff, tf [ us ] Switching time : ton, tr, toff, tf [ us ] 1.8 1.6 1.4 1.2 ton 1.0 toff 0.8 0.6 0.4 tr 0.2 ton 5.0 4.0 3.0 tr toff 2.0 1.0 tf tf 0.0 0.0 0 400 800 1200 1600 0 2000 2 4 10 12 14 16 Switching loss vs. Collector current (typ.) Switching loss vs. Gate resistance (typ.) Vcc=600V, Ic=1200A,VGE=±15V, Tj= １25°C 18 1000 Switching loss : Eon, Eoff, Err [ mJ/pulse ] Switching loss : Eon, Eoff, Err [ mJ/pulse ] 8 Vcc=600V, VGE=±15V, Rgon=3.3Ω, Rgoff=0.82Ω, Tj= １25°C 500 450 Eoff 400 350 300 Eon 250 200 150 Err 100 50 Eon 900 800 700 600 500 Eoff 400 300 200 100 Err 0 0 0 400 800 1200 1600 2000 Collector current : Ic [ A ] , Forward current : IF [ A ] 0 2 4 6 8 10 12 14 16 18 Gate resistance : Rg [ Ω ] Reverse bias safe operating area (max.) ±VGE=15V ,Tj = 125°C / chip 2800 2400 2000 1600 1200 800 400 0 0 200 400 600 800 1000 1200 1400 Collector - Emitter voltage : VCE [ V ] DWG.No. Collector current : Ic [ A ] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 6 Gate resistance : Rg [ Ω ] Collector current : Ic [ A ] MT5F16507 10 14 H04-004-003 Tentative (Under developmemt) Forward current vs. Forward on voltage (typ.) Reverse recovery characteristics (typ.) sense terminal Vcc=600V, VGE=±15V, Rg=3.3Ω, Tj=125℃ 900 Tj=25℃ Tj=125℃ 800 Reverse recovery current : Irr [ A ] Forward current : IF [ A ] 2400 2000 1600 1200 800 400 0 0.0 1.8 Irr 700 1.4 600 1.2 500 1.0 400 0.8 300 trr 1.0 1.5 2.0 2.5 3.0 3.5 0.4 100 0.2 0 400 800 1200 0.0 2000 1600 Forward current : IF [ A ] Forward on voltage : VF [ V ] Transient thermal resistance (max.) 0.100 FWD IGBT 0.010 0.001 0.001 0.010 0.100 1.000 Pulse width : Pw [ sec ] DWG.No. Thermal resistanse : Rth(j-c) [ °C/W ] This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. 0.6 200 0 0.5 1.6 Reverse recovery time : trr [us] 2800 MT5F16507 11 14 H04-004-003 Tentative (Under developmemt) Warnings - This product shall be used within its absolute maximum rating (voltage, current, and temperature). This product may be broken in case of using beyond the ratings. 製品の絶対最大定格（電圧，電流，温度等）の範囲内で御使用下さい。絶対最大定格を超えて使用すると、素子が破壊する 場合があります。 - Connect adequate fuse or protector of circuit between three-phase line and this product to prevent the equipment from causing secondary destruction, such as fire, its spreading, or explosion. 万一の不慮の事故で素子が破壊した場合を考慮し、商用電源と本製品の間に適切な容量のヒューズ又はブレーカーを必ず 付けて火災，爆発，延焼等の２次破壊を防いでください。 - Use this product after realizing enough working on environment and considering of product's reliability life. This product may be broken before target life of the system in case of using beyond the product's reliability life. 製品の使用環境を十分に把握し、製品の信頼性寿命が満足できるか検討の上、本製品を適用して下さい。製品の信頼性寿命 を超えて使用した場合、装置の目標寿命より前に素子が破壊する場合があります。 - Use this product within the power cycle curve (Technical Rep.No. : MT5F12959). Power cycle capability is classified to delta-Tj mode which is stated as above and delta-Tc mode. Delta-Tc mode is due to rise and down of case temperature (Tc), and depends on cooling design of equipment which use this product. In application which has such frequent rise and down of Tc, well consideration of product life time is necessary. 本製品は、パワーサイクル寿命カーブ以下で使用下さい(技術資料No.: MT5F12959)。パワーサイクル耐量にはこのΔTjによる 場合の他に、ΔTcによる場合があります。これはケース温度(Tc)の上昇下降による熱ストレスであり、本製品をご使用する際 の放熱設計に依存します。ケース温度の上昇下降が頻繁に起こる場合は、製品寿命に十分留意してご使用下さい。 - Never add mechanical stress to deform the main or control terminal. The deformed terminal may cause poor contact problem. 主端子及び制御端子に応力を与えて変形させないで下さい。 端子の変形により、接触不良などを引き起こす場合があります。 - Use this product with keeping the cooling fin's flatness between screw holes within 100um at 100mm and the roughness within 10um. Also keep the tightening torque within the limits of this specification. Too large convex of cooling fin may cause isolation breakdown and this may lead to a critical accident. On the other hand, too large concave of cooling fin makes gap between this product and the fin bigger, then, thermal conductivity will be worse and over heat destruction may occur. 冷却フィンはネジ取り付け位置間で平坦度を100mmで100um以下、表面の粗さは10um以下にして下さい。 過大な凸反り があったりすると本製品が絶縁破壊を起こし、重大事故に発展する場合があります。また、過大な凹反りやゆがみ等があると、 本製品と冷却フインの間に空隙が生じて放熱が悪くなり、熱破壊に繋がることがあります。 - In case of mounting this product on cooling fin, use thermal compound to secure thermal conductivity. If the thermal compound amount was not enough or its applying method was not suitable, its spreading will not be enough, then, thermal conductivity will be worse and thermal run away destruction may occur. Confirm spreading state of the thermal compound when its applying to this product. (Spreading state of the thermal compound can be confirmed by removing this product after mounting.) 素子を冷却フィンに取り付ける際には、熱伝導を確保するためのコンパウンド等をご使用ください。又、塗布量が不足したり、 塗布方法が不適だったりすると、コンパウンドが十分に素子全体に広がらず、放熱悪化による熱破壊に繋がる事があります。 コンパウンドを塗布する際には、製品全面にコンパウンドが広がっている事を確認してください。 (実装した後に素子を取りはずすとコンパウンドの広がり具合を確認する事が出来ます。) - It shall be confirmed that IGBT's operating locus of the turn-off voltage and current are within the RBSOA specification. This product may be broken if the locus is out of the RBSOA. ターンオフ電圧・電流の動作軌跡がRBSOA仕様内にあることを確認して下さい。RBSOAの範囲を超えて使用すると素子が破壊 する可能性があります。 DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. - If the product had been used in the environment with acid, organic matter, and corrosive gas ( hydrogen sulfide, sulfurous acid gas), the product's performance and appearance can not be ensured easily. 酸・有機物・腐食性ガス（硫化水素，亜硫酸ガス等）を含む環境下で使用された場合、製品機能・外観等の保証はできません。 MT5F16507 12 14 H04-004-003 Tentative (Under developmemt) Warnings - If excessive static electricity is applied to the control terminals, the devices may be broken. Implement some countermeasures against static electricity. 制御端子に過大な静電気が印加された場合、素子が破壊する場合があります。取り扱い時は静電気対策を実施して下さい。 - Never add the excessive mechanical stress to the main or control terminals when the product is applied to equipments. The module structure may be broken. 素子を装置に実装する際に、主端子や制御端子に過大な応力を与えないで下さい。端子構造が破壊する可能性があります。 - In case of insufficient -VGE, erroneous turn-on of IGBT may occur. -VGE shall be set enough value to prevent this malfunction. (Recommended value : -VGE = -15V) 逆バイアスゲート電圧-VGEが不足しますと誤点弧を起こす可能性があります。誤点弧を起こさない為に-VGEは十分な値で 設定して下さい。 （推奨値 : -VGE = -15V) - In case of higher turn-on dv/dt of IGBT, erroneous turn-on of opposite arm IGBT may occur. Use this product in the most suitable drive conditions, such as +VGE, -VGE, RG to prevent the malfunction. ターンオン dv/dt が高いと対抗アームのＩＧＢＴが誤点弧を起こす可能性があります。誤点弧を起こさない為の最適なドライブ 条件（+VGE, -VGE, RG等）でご使用下さい。 DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. - This product may be broken by avalanche in case of VCE beyond maximum rating VCES is applied between C-E terminals. Use this product within its absolute maximum voltage. VCESを超えた電圧が印加された場合、アバランシェを起こして素子破壊する場合があります。VCEは必ず絶対定格の範囲内 でご使用下さい。 MT5F16507 13 14 H04-004-003 Tentative (Under developmemt) Cautions - Fuji Electric Device Technology is constantly making every endeavor to improve the product quality and reliability. However, semiconductor products may rarely happen to fail or malfunction. To prevent accidents causing injury or death, damage to property like by fire, and other social damage resulted from a failure or malfunction of the Fuji Electric Device Technology semiconductor products, take some measures to keep safety such as redundant design, spread-fire-preventive design, and malfunction-protective design. 富士電機デバイステクノロジーは絶えず製品の品質と信頼性の向上に努めています。しかし、半導体製品は故障が発生したり、 誤動作する場合があります。富士電機デバイステクノロジー製半導体製品の故障または誤動作が、結果として人身事故・火災 等による財産に対する損害や社会的な損害を起こさないように冗長設計・延焼防止設計・誤動作防止設計など安全確保 のための手段を講じて下さい。 - The product described in this specification is not designed nor made for being applied to the equipment or systems used under life-threatening situations. When you consider applying the product of this specification to particular used, such as vehicle-mounted units, shipboard equipment, aerospace equipment, medical devices, atomic control systems and submarine relaying equipment or systems, please apply after confirmation of this product to be satisfied about system construction and required reliability. 本仕様書に記載された製品は、人命にかかわるような状況下で使用される機器あるいはシステムに用いられることを 目的として設計・製造されたものではありません。本仕様書の製品を車両機器、船舶、航空宇宙、医療機器、原子力 制御、海底中継機器あるいはシステムなど、特殊用途へのご利用をご検討の際は、システム構成及び要求品質に 満足することをご確認の上、ご利用下さい。 If there is any unclear matter in this specification, please contact Fuji Electric Device Technology Co.,Ltd. DWG.No. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. - The application examples described in this specification only explain typical ones that used the Fuji Electric Device Technology products. This specification never ensure to enforce the industrial property and other rights, nor license the enforcement rights. 本仕様書に記載してある応用例は、富士電機デバイステクノロジー製品を使用した代表的な応用例を説明するものであり、 本仕様書によって工業所有権、その他権利の実施に対する保障または実施権の許諾を行うものではありません。 MT5F16507 14 14 H04-004-003