AFBR-720XPDZ 10GbE XFP 850 nm 10Gbps Optical Transceiver Data Sheet Description Features The 850 nm XFP transceiver is a high performance, cost effective module for serial optical data communications applications specified for signal rates of 9.9 Gb/s to 10.5 Gb/s. It is compliant to XFP MSA Rev 4.5. The module is designed for multi mode fiber and operates at a nominal wavelength of 850 nm. The transmitter section incorporates Avago Technologies’ 850 nm Vertical Cavity Surface Emitting Laser (VCSEL). The receiver section uses Avago Technologies’ MOVPE grown planar SEDET PIN photodetector for low dark current and excellent responsivity. Integrated Tx and Rx signal conditioners provide high jitter-tolerance for full XFI compliance. The internally ac coupled high speed serial I/O simplifies interfacing to external circuitry. The electrical interface is made using an industry standard 0.8 mm pitch 30-pin right angle connector. Optical connection is made via the duplex LC connector. • RoHS 6/6 Compliance • ���������� Compliant to XFP MSA ��� ���� ��� • Compliant to IEEE 802.3ae 10GBASE-SR for 10GbE, 10.3125 Gb/s • Compliant XFI 10G Serial electrical interface • 3.3V single power supply • Avago Technologies’ 850 nm VCSEL Laser and PIN Photodiode • No reference clock required • LC Duplex optical connector interface conforming to ANSI TIA/EIA604-10 (FOCIS 10) • 1.5W maximum • Link Lengths up to 300 m with 0M3 fiber • 0 to +70 °C case operating temperature range • Superior Thermal and EMI integrity performance to support high port densities • Customizable clip-on heatsink to support a variety of line card environments • IEC 60825-1 Class 1/CDRH Class 1 laser eye safety The product also offers digital diagnostics using the 2wire serial interface defined in the XFP MSA. The product provides real time temperature (module and laser), supply voltage, laser bias current, laser average output power and received input power. The digital diagnostic interface also adds the ability to disable the transmitter (TX_DIS), power down the module, monitor for module faults and monitor for Receiver Loss of Signal (RX_LOS). Transmitter disable, interrupt, power down/reset, receiver loss of signal and module not ready are also hard wired pins on the 30-pin right angle connector. Applications • • • • • Fiber Channel Switches Host Bus Adapter Cards Mass Storage System and Server I/O Ethernet Switches Core Routers Installation The AFBR-720XPDZ can be installed in any XFP port regardless of host equipment operating status. The AFBR720XPDZ is hot-pluggable, allowing the module to be installed while the host system is operating and on-line. Upon insertion, the transceiver housing makes initial contact with the host board XFP cage, mitigating potential damage due to Electro-Static Discharge (ESD). Once fully inserted into the XFP cage, the top surface of the XFP module makes contact with the heatsink through a cutout in the top of the cage ensuring an effective thermal path for module heat. Functional Description Transmitter Section The transmitter section includes a 850 nm VCSEL (Vertical Cavity Surface Emitting Laser) light source, a transmitter driver circuit and a signal conditioner circuit on the TX data inputs. (see Figure 1) Optical connection to the transmitter is provided via a LC connector. The optical output is controlled by an IC that detects the laser output via the monitor photodiode. This IC provides both dc and ac current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over temperature, supply voltage and operating life. TX_DIS Asserting pin 5, TX_DIS, will disable the transmitter optical output. The transmitter output can also be disabled and monitored via the two-wire serial interface. Eye Safety Circuit Under normal operating conditions laser power will be maintained below Class 1 eye-safety limits. Should a catastrophic laser fault occur and optical power become uncontrolled, the micro-controller and laser driver IC will detect the fault, shut down the laser, power down the module and assert the hard-wired MOD_NR flag. The TX_FAULT output in the 2-wire serial interface will also be asserted. Heat sink Analog bus RF driver Mon. PIN Conditioner CW driver conditioners Analog signal Optical receptacles TOSA EEPROM Micro controller A/D Power supply control PIN Digital 10 Gb/s electrical I/O Digital low speed bus or signal Analog signal TIA ROSA Signal Conditioner Main housing Figure 1. Transceiver Functional Diagram Electrical connector Laser +3.3V Signal ESA Receiver Section Functional Data I/O The receiver section includes a PIN detector with amplification quantization signal conditioner circuits. (see Figure 1) Optical connection to the receiver is provided via a LC optical connector. Avago Technologies’ AFBR-720XPDZ fiber-optic transceiver is designed to accept industry standard electrical input differential signals. The transceiver provides accoupled, internally terminated data input and output interfaces. Bias resistors and coupling capacitors have been included within the module to reduce the number of components required on the customer’s board. RX_LOS The receiver section contains a loss of signal (RX_LOS) circuit to indicate when the optical input signal power is insufficient for reliable signal detection. A high signal indicates loss of modulated signal, indicating link failure such as a broken fiber or nonfunctional remote transmitter. RX_LOS can also be monitored via the two-wire serial interface (byte 110, bit 1). Electrical Pinout GND RX_LOS 14 17 RD- MOD_NR 13 18 RD+ MOD_ABS 12 19 GND SDA 11 VCC5 20 VCC2 SCL 10 0.1 µF Host +3.3 V 0.1 µF Optional Host +1.8 V 22 µF 0.1 µF 21 P_DOWN/RST VCC3 9 4.7 µH 22 VCC2 VCC3 8 22 µF 23 GND GND 7 4.7 µH 24 REFCLK+ VCC5 6 25 REFCLK- TX_DIS 5 0.1 µF Optional Host -5.2 V 22 µF 26 GND 4.7 µH 27 GND MOD_DESEL 3 0.1 µF 22 µF 28 TD- VEE5 2 29 TD+ GND 1 30 GND VCC3 0.1 µF VCC2 XFP Connector 4.7 µH 0.1 µF VEE5 0.1 µF TOWARD ASIC XFP Module GND Figure 2. MSA recommended power supply filter 15 16 Host Board Optional Host +5 V GND Figure 3. Host PCB XFP Pinout Top View INTERRUPT 4 TOWARD BEZEL Table 1. Electrical Pin Definitions Pin Name Logic Function/Description Notes 1 GND Module Ground 1 2 VEE5 3 Mod-Desel LVTTL-I Module De-select; When held low allows the module to respond to 2wire Serial interface commands 4 Interrupt LVTTL-O Interrupt; Indicates presence of an important condition which can be readover the serial 2-wire interface 5 TX_DIS LVTTL-I Transmitter Disable; Transmitter Laser Source Turned Off 6 VCC5 5 V power supply. Not internally connected. 7 GND Module Ground 8 VCC3 +3.3 V Power Supply 9 VCC3 +3.3 V Power Supply 10 SCL LVTTL-I Two Wire Interface Clock 2 11 SDA LVTTL-I/O Two Wire Interface Data Line 2 12 Mod_Abs LVTTL-O LVTTL-O Mod_Abs Indicates Module is not present. Grounded in the Module 2 13 Mod_NR LVTTL-O Module Not Ready; Indicating Module Operational Fault 2 14 RX_LOS LVTTL-O Receiver Loss Of Signal Indicator 2 15 GND Module Ground 1 16 GND Module Ground 1 17 RD- CML-O Receiver Inverted Data Output 18 RD+ CML-O Receiver Non-Inverted Data Output 19 GND Module Ground 20 VCC2 +1.8 V Power Supply. Not internally connected. 21 P_Down/RST 22 VCC2 +1.8 V Power Supply. Not internally connected. 23 GND Module Ground 1 24 RefCLK+ PECL-I Reference Clock Non-Inverted Input, ac coupled on the host board (Not Used) 3 25 RefCLK- PECL-I Reference Clock Inverted Input, ac coupled on the host board (Not Used) 3 26 GND 27 GND 28 TD- CML-I Transmitter Inverted Data Input 29 TD+ CML-I Transmitter Non-Inverted Data Input 30 GND -5.2 V power supply. Not internally connected. LVTTL-I 1 1 Power down: When high, the module is put into a lower power mode. Serial interface is functional in the low power mode. Reset: The falling edge initiates a complete reset of the module including the serial Interface, equivalent to a power cycle. Module Ground 1 Module Ground 1 Module Ground Notes: 1. Module ground pins Gnd are isolated from the module case and chassis ground within the module. 2. Open Collector should be pulled up with 4.7 K-10 Kohms to a voltage between 3.15 V and 3.6 V on the host board. 3. RefCLK+/- are internally terminated (50Ω) 2 1 Absolute Maximum Ratings Parameter Symbol Minimum Storage Temperature (non-operating) TS Relative Humidity Typical Maximum Unit Notes -40 +85 °C 1, 2 RH 10 90 % 1 Supply Voltage VCC3 0 3.6 V 1, 2 Low Speed Input Voltage VIN -0.5 VCC+0.5 V 1 Recommended Operating Conditions [4] Parameter Symbol Minimum Case Operating Temperature TC Supply Voltage VCC3 Maximum Unit Notes 0 +70 °C 3 3.135 3.465 V 5 Data Rate Typical 10.3125 Gb/s Transceiver Electrical Characteristics (TC = 0 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Maximum Unit Notes Power Supply Noise Rejection (peak-peak) under 1MHz PSNR Minimum Typical 2% of VCC mV 6 Power Supply Noise Rejection (peak-peak) 1MHz to 10 MHz PSNR 3% of VCC mV 6 Module supply current ICC 430 mA Power Dissipation PDISS 1 1.5 W Low Speed Outputs: MOD_NR, RX_LOS, MOD_ABS, INTERRUPT VOH VOL Host_VCC-0.5 0.0 0.01 Host_VCC+0.3 0.4 V V 7 8 Low Speed Inputs: TX_DIS, MOD_DESEL, P_DOWN/RST VIH VIL 2.0 -0.3 VCC3+0.3 0.8 V V 10 9 Notes: 1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short period of time. See Reliability Data Sheet for specific reliability performance. 2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. 3. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system thermal design. 4. Recommended Operating Conditions are those values for which functional performance and device reliability is implied 5. Vcc condition applies to supply voltage at the XFP module 6. Filter per XFP specification is required on the host board. 7. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IOH(max) = - 2 mA. 8. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IOL(max) = 2 mA. 9. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IIL(max) = 10 µA. 10.4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IIH(max) = - 10 µA. Transmitter Electrical Input Characteristics (TC = 0 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Minimum Differential Input Impedance Zd Termination Mismatch DZM Differential Input Amplitude DVQDO 120 Differential Input Return Loss SDD11 Differential Input Return Loss Typical Maximum Unit Notes W 100 5 % 820 mV peak to peak (1) 20 dB 0.05 to 0.1 GHz SDD11 8 dB 0.1 to 5.5 GHz Differential Input Return Loss SDD11 8 - 20.66 log10(f/5.5) f in GHz dB 5.5 - 12 GHz Common Mode Input Return Loss SCC11 3 dB 0.1 to 15 GHz Differential to Common Mode Conversion SCD11 10 dB 0.1 to 15 GHz Jitter and Eye Mask XFP MSA Compliant Receiver Electrical Output Characteristics Parameter Symbol Differential Input Impedance Zd Termination Mismatch DZM Differential Output Amplitude DC Common Mode Potential Vcm Minimum Typical Maximum Unit W 100 5 % 340 850 mV 0 3.6 V 15 mV Output AC Common Mode Voltage Notes peak to peak (1) RMS Output Rise/Fall time (20% to 80%) tRH, tFH 24 Common mode output return loss SCC22 3 Differential output return loss SDD22 20 dB 0.05 to 0.1 GHz Differential output return loss SDD22 8 dB 0.1 to 5.5 GHz Differential output return loss SDD22 8 - 20.66 log10(f/5.5) f in GHz dB 5.5 - 12 GHz Jitter and Eye Mask Note: 1. The differential input and output amplitudes are per XFP MSA mask at points B’ and C’. ps 0.1 to 15 GHz XFP MSA Compliant Transmitter Optical Characteristics 10 GbE (TC = 0 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Minimum Laser OMA Output Power Pout -4.3 Mean Optical Output Power Pout -7.3 Extinction Ratio ER 3.0 Spectral Width - rms s, rms Center Wavelength λC Transmitter and dispersion penalty Typical Maximum Unit Notes dBm 1, 2, 4 dBm 1, 2, 3, 5 dB 1, 2 0.45 nm RMS 4 860 nm TDP 3.9 dB Transmitter OFF Average Optical Output Power Poff -30 dBm RIN12 (OMA) RIN -128 dB/Hz Optical Eye Mask Compliant with IEEE 802.3ae 10GBASE-SR XFP MSA -1 840 850 1, 2 1 See Fig 4 Receiver Optical Characteristics 10 GbE (TC = 0 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol Minimum Typical Stressed receiver sensitivity (OMA) Receiver sensitivity (OMA) PIN Receiver Reflectance Wavelength λC 840 850 Maximum Unit Notes -7.5 dBm 1 -11.1 dBm 3 -12 dB 1 860 nm Notes: 1. 10GFC 1200-MX-SN-I / IEEE 802.3ae 10GBASE-SR compliant 2. These parameters are interrelated: see IEEE 802.3ae, Clause 52. 3. For information only 4. Trade-offs are available between spectral width, center wavelength and minimum Optical Modulation Amplitude (OMA). See Figure 4A and Optical Modulation Table. 5. The maximum 10GBASE-SR Average Optical Output Power shall be the lesser of the class 1 safety limit as defined by IEEE 802.3ae 52.10.2 or the average receive power maximum defined by IEEE 802.3ae Table 52-9 Note: where X1, X2, X3, Y1, Y2, Y3 = 0.25, 0.40, 0.45, 0.25, 0.28, 0.40 respectively Figure 4. Transmitter Eye Mask Definition Minimum transmit OMA (dBm) -2.5 -2.7 -2.9 -3.1 -3.3 -3.5 -3.7 -3.9 -4.1 -4.3 -4.5 840 0.4 to 0.45 nm 0.35 to 0.4 nm 0.3 to 0.35 nm 0.25 to 0.3 nm 0.2 to 0.25 nm 0.15 to 0.2 nm Up to 0.05 nm 845 850 855 Center wavelength (nm) 860 Figure 4a. Triple tradeoff curve for 10GBASE-S (informative) Optical Modulation RMS Spectral width (nm) Up to 0.05 0.05 to 0.1 0.1 to 0.15 0.15 to 0.2 0.2 to 0.25 0.25 to 0.3 0.3 to 0.35 0.35 to 0.4 0.4 to 0.45 840 to 842 -4.2 -4.2 -4.1 -4.1 -3.9 -3.8 -3.5 -3.2 -2.8 842 to 844 -4.2 -4.2 -4.2 -4.1 -3.9 -3.8 -3.6 -3.3 -2.9 844 to 846 -4.2 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9 846 to 848 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -2.9 848 to 850 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.3 -3.0 850 to 852 -4.3 -4.2 -4.2 -4.1 -4.0 -3.8 -3.6 -3.4 -3.0 852 to 854 -4.3 -4.2 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1 854 to 856 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.4 -3.1 856 to 858 -4.3 -4.3 -4.2 -4.1 -4.0 -3.9 -3.7 -3.5 -3.1 858 to 860 -4.3 -4.3 -4.2 -4.2 -4.1 -3.9 -3.7 -3.5 -3.2 CenterWavelength(nm) Transceiver Timing Characteristics (TC = 0 °C to +70 °C, VCC3 = 3.3 V ± 5%) Parameter Symbol TX_DIS Assert Time Minimum Maximum Unit Notes t_off 10 µs Time from rising edge of TX_DIS to when the optical output falls below 10% of nominal. TX_DIS Negate Time t_on 2 ms Time from falling edge of TX_DIS to when the modulated optical output rises above 90% of nominal. Time to initialize t_init 300 ms From power on or hot plug after meeting power supply specs Interrupt assert delay Interrupt_on 200 ms From occurrence of the condition triggering interrupt Interrupt negate delay Interrupt_off 500 us From clear on read interrupt flags P_Down/ RST assert delay P_Down/RST_on 100 us From Power down initiation P-Down negate delay P_Down/RST_off 300 ms Max delay from negate to completion of power up and reset Mod_NR assert delay Mod_nr_on 1 ms From Occurrence of fault to assertion of Mod_NR Mod_NR negate delay Mod_nr_off 1 ms From Occurrence of signal to negation of Mod_NR Mod_DeSel assert time T_Mod_DeSel 2 ms Maximum delay between assertion of Mod_DeSel and end of module response to 2-wire interface communications 2 ms Maximum delay between de-assertion of Mod_DeSel and proper module response to 2-wire interface communications µs Min length of P-Down assert to initial reset 100 µs From Occurrence of loss of signal to assertion of RX_LOS From Occurrence of presence of signal to negation of RX_LOS Mod_DeSel de-assert T_Mod_Sel time Typical P_Down reset time t_reset RX_LOS Assert delay T_loss_on RX_LOS negate delay T_loss_off 2.3 100 µs Serial ID Clock Rate f_serial_clock 0 400 kHz 10 Host Board Clip Heat Sink Cage Assembly Connector EMI Gasket (not shown) Case Temperature Measurement Point • Bezel Module Figure 5. XFP Assembly Drawing 10 Digital Diagnostic Interface and Serial Identification Transceiver Internal Temperature The 2-wire serial interface is explicitly defined in the XFP MSA Rev 4.0. 2-wire timing specifications and the structure of the memory map are per XFP MSA Rev 2.0. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for diagnostic information providing the opportunity for Predictive Failure Identification, Compliance Prediction, Fault Isolation and Component Monitoring. The upper address space tables are used for less frequently accessed functions such as serial ID, user writeable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as Avago Technologies-specific functions. Temperature is measured on the AFBR-720XPDZ using sensing circuitry mounted on the internal PCB. The measured temperature will generally be cooler than laser junction and warmer than XFP case and can be indirectly correlated to XFP case or laser junction temperature using thermal resistance and capacitance modeling. This measurement can be used to observe drifts in thermal operating point or to detect extreme temperature fluctuations such as a failure in the system thermal control. For more information on correlating internal temperature to case or laser junction contact Avago Technologies. Predictive Failure Identification The diagnostic information allows the host system to identify potential link problems. Once identified, a “fail over” technique can be used to isolate and replace suspect devices before system uptime is impacted. Compliance Prediction The real-time diagnostic parameters can be monitored to alert the system when operating limits are exceeded and compliance cannot be ensured. As an example, the real time average receive optical power can be used to assess the compliance of the cable plant and remote transmitter. Fault Isolation The diagnostic information can allow the host to pinpoint the location of a link problem and accelerate system servicing and minimize downtime. Component Monitoring As part of host system qualification and verification, real time transceiver diagnostic information can be combined with system level monitoring to ensure performance and operating environment are meeting application requirements. Transmitter Laser DC Bias Current Laser bias current is measured using sensing circuitry located on the transmitter laser driver IC. Normal variations in laser bias current are expected to accommodate the impact of changing transceiver temperature and supply voltage operating points. The AFBR-720XPDZ uses a closed loop laser bias feedback circuit to maintain constant optical power. This circuit compensates for normal laser parametric variations in quantum efficiency, forward voltage and lasing threshold due to changing transceiver operating points. Transmitted Average Optical Output Power Variations in average optical power are not expected under normal operation because the AFBR-720XPDZ uses a closed loop laser bias feedback circuit to maintain constant optical power. This circuit compensates for normal laser parametric variations due to changing transceiver operating points. Only under extreme laser bias conditions will significant drifting in transmitted average optical power be observable. Therefore it is recommended Tx average optical power be used for fault isolation, rather than predictive failure purposes. Received Average Optical Input Power Received average optical power measurements are a valuable asset for installers to verify cable plant compliance. Drifts in average power can be observed from the cable plant and remote transmitter for potential predictive failure use. Received average optical power can be used for fault isolation. Auxilliary Monitors In addition to the parameters mentioned above, 3.3V Supply Voltage (AUX1) is also reported as auxilliary parameter 1. 11 Mechanical Specifications Package Dimensions Figure 6a. Module Drawing Figure 6b. Module Drawing 12 Figure 7. XFP host board mechanical layout 13 Application Support Electrostatic Discharge (ESD) An Evaluation Kit and Reference Designs are available to assist in evaluation of the AFBR-720XPDZ. Please contact your local Field Sales representative for availability and ordering details. There are two conditions in which immunity to ESD damage is important. Table 13 documents the ESD immunity to both of these conditions. Regulatory Compliance The transceiver Regulatory Compliance performance is provided in Table 2 as a figure of merit to assist the designer. The overall equipment design will determine the certification level. The first condition is static discharge to the transceiver during handling such as when the transceiver is inserted into the transceiver port. To protect the transceiver, it is important to use normal ESD handling precautions including the use of grounded wrist straps, work benches, and floor mats in ESD controlled areas. The ESD sensitivity of the AFBR-720XPDZ is compatible with typical industry production environments. The second condition is static discharge to the exterior of the host equipment chassis after installation. To the extent that the duplex LC optical interface is exposed to the outside of the host equipment chassis, it may be subject to system-level ESD requirements. The ESD performance of the AFBR-720XPDZ exceeds typical industry standards. Regulatory Compliance Feature Test Method Performance Electrostatic Discharge (ESD) to the electrical pins of the XFP module MIL-STD-883 Method 3015 500 Volts to the high speed pins, 2000 Volts to the low speed pins Electrostatic Discharge (ESD) to the Duplex LC Receptacle Variation of IEC 61000-4-2 Typically, no damage occurs with 25 kV when the duplex LC connector receptacle is contacted. Electrostatic Discharge (ESD) to the Optical Connector GR1089 8 KV on the electrical faceplate with device inserted into a panel. Electrostatic Discharge (ESD) to the Optical Connector IEC6100-4-2 Air discharge of 15 kV(min) contact to connector w/o damage Electromagnetic Interference (EMI) FCC Class B CENELEC EN55022 Class B (CISPR 22A) VCCI Class 1 System margins are dependent on customer board and chassis design. Immunity Variation of IEC 61000-4-3 No bit error at 10V/m, 10MHz to 1G w/o chassis enclosure Laser Eye Safety and Equipment Type Testing US FDA CDRH AEL Class 1 US21 CFR, Subchapter J per Paragraphs 1002.10 and 1002.12. CDRH certification # 9720151-072 TUV certification # R72071411 (IEC) EN60825-1: 1994 + A11+A2 (IEC) EN60825-2: 1994 + A1 (IEC) EN60950: 1992 + A1 + A2 + A3 + A4 + A11 Component Recognition 14 Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment UL file # E173874 Immunity Caution The transceivers have a shielded design to provide excellent immunity to radio-frequency electromagnetic fields which may be present in some operating environments. The AFBR-720XPDZ contains no user serviceable parts. Tampering with or modifying the performance of the AFBR-720XPDZ will result in voided product warranty. It may also result in improper operation of the AFBR720XPDZ circuitry, and possible overstress of the laser source. Device degradation or product failure may result. Connection of the AFBR-720XPDZ to a non-approved optical source, operating above the recommended absolute maximum conditions may be considered an act of modifying or manufacturing a laser product. The person(s) performing such an act is required by law to recertify and reidentify the laser product under the provisions of U.S. 21 CFR (Subchapter J) and the TUV. Electromagnetic Interference (EMI) Most equipment designs using the AFBR-720XPDZ are subject to the requirements of the FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. The metal housing and shielded design of the AFBR-720XPDZ minimizes EMI and provides excellent EMI performance. Eye Safety The AFBR-720XPDZ transceivers provide Class 1 eye safety by design. Avago Technologies has tested the transceiver design for regulatory compliance, under normal operating conditions and under single fault conditions. See Table 2. Flammability The AFBR-720XPDZ is compliant to UL 94V-0. Ordering Information Please contact your local field sales engineer or one of Avago Technologies franchised distributors for ordering information. For technical information, please visit Avago Technologies’ WEB page at www.avagotech.com or contact Avago Technologies Semiconductor Products Customer Response Center at 1-800-235-0312. For information related to XFP MSA documentation visit www. xfpmsa.org For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0438EN - August 17, 2007