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This device exhibits low noise figure and high power gain characteristics. This IC is manufactured using our UHSK3 (Ultra High Speed Process) silicon germanium bipolar process. FEATURES • Low current : ICC = 4.3 mA TYP. • Power gain : GP = 22 dB TYP. @ f = 1.0 GHz : GP = 22 dB TYP. @ f = 2.2 GHz • Gain flatness : ΔGP = 0.4 dB TYP. @ f = 1.0 to 2.2 GHz • Noise figure : NF = 4.0 dB TYP. @ f = 1.0 GHz : NF = 4.0 dB TYP. @ f = 2.2 GHz : PO (1 dB) = −7.5 dBm TYP. @ f = 1.0 GHz • High linearity : PO (1 dB) = −9.5 dBm TYP. @ f = 2.2 GHz • Supply voltage : VCC = +3.0 to +3.6 V • Port impedance : input/output 50 Ω APPLICATIONS • IF amplifiers in DBS LNB, other L-band amplifiers, etc. ORDERING INFORMATION Part Number μPC3242TB-E3 Order Number Package μPC3242TB-E3-A 6-pin super minimold (Pb-Free) Marking C3Z Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPC3242TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PU10803EJ01V0DS (1st edition) Date Published March 2010 NS Printed in Japan 2010 μPC3242TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) 2 C3Z 3 1 (Bottom View) 4 3 4 4 3 5 2 5 5 2 6 1 6 6 Pin No. Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC 1 PRODUCT LINE-UP OF 5 V or 3.3 V-BIAS SILICON MMIC WIDE BAND AMPLIFIER (TA = +25°C, VCC = +5.0 V or +3.3 V, ZS = ZL = 50 Ω) Part No. μPC2711TB VCC ICC GP NF PO (sat) PO (1 dB) (V) (mA) (dB) (dB) (dBm) (dBm) +5.0 12.0 13.0 (1.0 GHz) 5.0 (1.0 GHz) ＋1.0 (1.0 GHz) – Package 6-pin super Marking C1G μPC2712TB 12.0 20.0 (1.0 GHz) 4.5 (1.0 GHz) ＋3.0 (1.0 GHz) μPC3215TB 14.0 20.5 (1.5 GHz) 2.3 (1.5 GHz) ＋3.5 (1.5 GHz) ＋1.5 (1.5 GHz) C3H μPC3224TB 9.0 21.5 (1.0 GHz) 4.3 (1.0 GHz) ＋4.0 (1.0 GHz) –3.5 (1.0 GHz) C3K 21.5 (2.2 GHz) 4.3 (2.2 GHz) ＋1.5 (2.2 GHz) –5.5 (2.2 GHz) 22.0 (1.0 GHz) 4.7 (1.0 GHz) –1.0 (1.0 GHz) –6.5 (1.0 GHz) 22.0 (2.2 GHz) 4.6 (2.2 GHz) –3.5 (2.2 GHz) –8.0 (2.2 GHz) 25.0 (1.0 GHz) 4.3 (1.0 GHz) – ＋1.0 (1.0 GHz) 24.5 (2.2 GHz) 4.5 (2.2 GHz) – –4.0 (2.2 GHz) 22.0 (1.0 GHz) 4.0 (1.0 GHz) –0.5 (1.0 GHz) –7.5 (1.0 GHz) 22.0 (2.2 GHz) 4.0 (2.2 GHz) –4.0 (2.2 GHz) –9.5 (2.2 GHz) μPC3227TB μPC3240TB μPC3242TB 4.8 +3.3 13.0 4.3 – Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Data Sheet PU10803EJ01V0DS minimold C1H C3P C3W C3Z μPC3242TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25°C 4.0 V Total Circuit Current ICC TA = +25°C 10 mA Power Dissipation PD TA = +85°C 270 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Power Pin −10 dBm Note TA = +25°C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC +3.0 +3.3 +3.6 V Operating Ambient Temperature TA −40 +25 +85 °C Data Sheet PU10803EJ01V0DS 3 μPC3242TB ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = +3.3 V, ZS = ZL = 50 Ω, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No input signal 3.6 4.3 5.0 mA Power Gain 1 GP1 f = 0.25 GHz, Pin = −40 dBm 19 22 25 dB Power Gain 2 GP2 f = 1.0 GHz, Pin = −40 dBm 19 22 25 Power Gain 3 GP3 f = 1.8 GHz, Pin = −40 dBm 19 22 25 Power Gain 4 GP4 f = 2.2 GHz, Pin = −40 dBm 19 22 25 Gain 1 dB Compression Output Power 1 PO (1 dB) 1 f = 1.0 GHz −10 −7.5 − Gain 1 dB Compression Output Power 2 PO (1 dB) 2 f = 2.2 GHz −12.5 −9.5 − Noise Figure 1 NF1 f = 1.0 GHz − 4.0 4.8 Noise Figure 2 NF2 f = 2.2 GHz − 4.0 4.8 Isolation 1 ISL1 f = 1.0 GHz, Pin = −40 dBm 31 36.5 − Isolation 2 ISL2 f = 2.2 GHz, Pin = −40 dBm 34 40.5 − Input Return Loss 1 RLin1 f = 1.0 GHz, Pin = −40 dBm 10 14 − Input Return Loss 2 RLin2 f = 2.2 GHz, Pin = −40 dBm 6 8.5 − Output Return Loss 1 RLout1 f = 1.0 GHz, Pin = −40 dBm 8 11 − Output Return Loss 2 RLout2 f = 2.2 GHz, Pin = −40 dBm 8 11 − dBm dB dB dB dB STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VCC = +3.3 V, ZS = ZL = 50 Ω, unless otherwise specified) Parameter Symbol Test Conditions Reference Value Unit dB Power Gain 5 GP5 f = 2.6 GHz, Pin = −40 dBm 20.5 Power Gain 6 GP6 f = 3.0 GHz, Pin = −40 dBm 19 Gain Flatness ΔGP f = 1.0 to 2.2 GHz, Pin = −40 dBm 0.4 dB dBm Saturated Output Power 1 PO (sat) 1 f = 1.0 GHz, Pin = −15 dBm −0.5 Saturated Output Power 2 PO (sat) 2 f = 2.2 GHz, Pin = −15 dBm −4.0 K factor 1 K1 f = 1.0 GHz, Pin = −40 dBm 2.5 − K factor 2 K2 f = 2.2 GHz, Pin = −40 dBm 3.4 − dBm Output 3rd Order Intercept Point 1 OIP31 f1 = 1 000 MHz, f2 = 1 001 MHz 1.5 Output 3rd Order Intercept Point 2 OIP32 f1 = 2 200 MHz, f2 = 2 201 MHz −0.5 Input 3rd Order Intercept Point 1 IIP31 f1 = 1 000 MHz, f2 = 1 001 MHz −20 Input 3rd Order Intercept Point 2 IIP32 f1 = 2 200 MHz, f2 = 2 201 MHz −22 f1 = 1 000 MHz, f2 = 1 001 MHz, 22 dBc 28.5 dBc 2nd Order Intermodulation Distortion IM2 dBm Pin = −40 dBm/tone 2nd Harmonics 4 2f0 f0 = 1.0 GHz, Pin = −40 dBm Data Sheet PU10803EJ01V0DS μPC3242TB TEST CIRCUIT C4 1 000 pF VCC C3 1 000 pF C1 100 pF IN 6 1 OUT 4 Microstrip Line 2, 3, 5 C2 100 pF Microstrip Line GND ZS = ZL = 50 Ω The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1, C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. Data Sheet PU10803EJ01V0DS 5 μPC3242TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD C 3Z 1 IN Top View 3 2 6 C2 C1 OUT C3 4 5 Mounting direction C4: Feed-through Capacitor (Unit: mm) Notes 1. 30 × 30 × 0.4 mm double sided 35 μ m copper clad COMPONENT LIST Type Value polyimide board. Size 2. Back side: GND pattern 6 C1, C2 Chip Capacitor 100 pF 1608 C3 Chip Capacitor 1 000 pF 1608 C4 Feed-through Capacitor 1 000 pF − 3. Au plated on pattern 4. : Through holes Data Sheet PU10803EJ01V0DS μPC3242TB TYPICAL CHARACTERISTICS (TA = +25°C, VCC = +3.3 V, ZS = ZL = 50 Ω, unless otherwise specified) CURCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 8 6.0 No Input Signal 5.5 VCC = +3.3 V No Input Signal TA = +85°C 5 4 3 +25°C 2 1 0 0 Power Gain GP (dB) Circuit Current ICC (mA) 6 28 27 26 25 24 23 22 21 20 19 18 17 16 15 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 –40 –20 0 20 40 60 80 INPUT RETURN LOSS vs. FREQUENCY 0 Pin = –40 dBm Pin = –40 dBm –5 VCC = +3.6 V +3.3 V +3.0 V VCC = +3.6 V –10 –15 –20 +3.3 V –25 –30 +3.0 V –35 –40 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency f (GHz) Frequency f (GHz) ISOLATION vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY 0 Pin = –40 dBm Pin = –40 dBm Output Return Loss RLout (dB) Isolation ISL (dB) 3.0 POWER GAIN vs. FREQUENCY –20 –25 +3.0 V +3.3 V VCC = +3.6 V –40 –45 –50 0 3.5 Operating Ambient Temperature TA (°C) –15 –35 4.0 Supply Voltage VCC (V) –10 –30 4.5 2.0 4.0 0 –5 5.0 2.5 –40°C Input Return Loss RLin (dB) Circuit Current ICC (mA) 7 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 –5 –10 –15 VCC = +3.0 V –20 –25 +3.3 V +3.6 V –30 –35 –40 0 Frequency f (GHz) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10803EJ01V0DS 7 μPC3242TB 28 27 Pin = –40 dBm 26 25 TA = –40°C 24 23 22 21 20 +25°C +85°C 19 18 17 16 15 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT RETURN LOSS vs. FREQUENCY 0 –30 +25°C –35 0 Pin = –40 dBm –20 –25 TA = +85°C –35 –40 +25°C –40°C –5 –10 TA = +85°C –15 –20 –25 +25°C –40°C –30 –35 –40 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 10 5 5 0 +3.3 V –10 –15 –20 –25 +3.0 V Output Power Pout (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER VCC = +3.6 V 0 –5 VCC = +3.6 V –10 +3.0 V –15 –20 +3.3 V –25 f = 1.0 GHz –30 –50 –45 –40 –35 –30 –25 –20 –15 –10 f = 2.2 GHz –30 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 8 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency f (GHz) 10 –5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) Isolation ISL (dB) –25 ISOLATION vs. FREQUENCY –15 –50 0 –40°C –20 Frequency f (GHz) –10 –45 –15 Frequency f (GHz) Pin = –40 dBm –30 –10 –40 0 0 –5 TA = +85°C Pin = –40 dBm –5 Input Return Loss RLin (dB) Power Gain GP (dB) POWER GAIN vs. FREQUENCY Data Sheet PU10803EJ01V0DS μPC3242TB OUTPUT POWER vs. INPUT POWER 10 10 5 5 Output Power Pout (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER 0 –5 TA = –40°C –10 –15 +25°C +85°C –20 0 –5 TA = –40°C –10 –15 +25°C –20 +85°C –25 –25 f = 1.0 GHz –30 –50 –45 –40 –35 –30 –25 –20 –15 –10 f = 2.2 GHz –30 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) Input Power Pin (dBm) NOISE FIGURE vs. FREQUENCY 5.5 5.0 5.0 Noise Figure NF (dB) Noise Figure NF (dB) NOISE FIGURE vs. FREQUENCY 5.5 VCC = +3.0 V 4.5 4.0 3.5 +3.6 V +3.3 V TA = +85°C 4.5 4.0 +25°C 3.5 3.0 3.0 –40°C 2.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 2.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) K FACTOR vs. FREQUENCY 10.0 9.0 Pin = –40 dBm 8.0 K Factor K 7.0 6.0 VCC = +3.0 V 5.0 4.0 +3.6 V 3.0 2.0 +3.3 V 1.0 0.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10803EJ01V0DS 9 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 VCC = +3.3 V –70 f1 = 1 000 MHz –80 f2 = 1 001 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 VCC = +3.6 V –70 f1 = 1 000 MHz –80 f2 = 1 001 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 VCC = +3.0 V –70 f1 = 1 000 MHz –80 f2 = 1 001 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) μPC3242TB OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 IM3 –40 –50 –60 VCC = +3.0 V –70 f1 = 2 200 MHz –80 f2 = 2 201 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 IM3 –40 –50 –60 VCC = +3.3 V –70 f1 = 2 200 MHz –80 f2 = 2 201 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 VCC = +3.6 V –70 f1 = 2 200 MHz –80 f2 = 2 201 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Remark The graphs indicate nominal characteristics. 10 Data Sheet PU10803EJ01V0DS Input Power Pin (1 tone) (dBm) Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 TA = +25°C –70 f1 = 1 000 MHz –80 f2 = 1 001 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 TA = +85°C –70 f1 = 1 000 MHz –80 f2 = 1 001 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 TA = –40°C –70 f1 = 1 000 MHz –80 f2 = 1 001 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) Output Power Pout (1 tone) (dBm) 3rd Order Intermodulation Distortion IM3 (1 tone) (dBm) μPC3242TB OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 TA = –40°C –70 f1 = 2 200 MHz –80 f2 = 2 201 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 TA = +25°C –70 f1 = 2 200 MHz –80 f2 = 2 201 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 30 20 10 0 Pout –10 –20 –30 –40 IM3 –50 –60 TA = +85°C –70 f1 = 2 200 MHz –80 f2 = 2 201 MHz –90 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10803EJ01V0DS 11 20 10 0 –10 Pout –20 IM2 –30 –40 –50 VCC = +3.0 V f1 = 1 000 MHz f2 = 1 001 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 –60 2nd Order Intermodulation Distortion IM2 (dBc) OUTPUT POWER, IM2 vs. INPUT POWER IM2 vs. INPUT POWER 50 45 40 30 25 20 15 10 5 0 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) 20 10 0 Pout –20 IM2 –30 –40 –50 VCC = +3.3 V f1 = 1 000 MHz f2 = 1 001 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 –60 2nd Order Intermodulation Distortion IM2 (dBc) OUTPUT POWER, IM2 vs. INPUT POWER –10 IM2 vs. INPUT POWER 50 45 40 30 25 20 15 10 5 0 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM2 vs. INPUT POWER 20 10 0 Pout –20 –30 IM2 –40 –50 VCC = +3.6 V f1 = 1 000 MHz f2 = 1 001 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 –60 IM2 vs. INPUT POWER 50 45 40 VCC = +3.6 V f1 = 1 000 MHz f2 = 1 001 MHz 35 30 25 20 15 10 5 0 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) Input Power Pin (1 tone) (dBm) Remark The graphs indicate nominal characteristics. 12 VCC = +3.3 V f1 = 1 000 MHz f2 = 1 001 MHz 35 Input Power Pin (1 tone) (dBm) –10 VCC = +3.0 V f1 = 1 000 MHz f2 = 1 001 MHz 35 Input Power Pin (1 tone) (dBm) 2nd Order Intermodulation Distortion IM2 (dBc) Output Power Pout (1 tone) (dBm) 2nd Order Intermodulation Distortion IM2 (2 tone) (dBm) Output Power Pout (1 tone) (dBm) 2nd Order Intermodulation Distortion IM2 (2 tone) (dBm) Output Power Pout (1 tone) (dBm) 2nd Order Intermodulation Distortion IM2 (2 tone) (dBm) μPC3242TB Data Sheet PU10803EJ01V0DS 20 10 0 –10 Pout –20 IM2 –30 –40 –50 TA = –40°C f1 = 1 000 MHz f2 = 1 001 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 –60 2nd Order Intermodulation Distortion IM2 (dBc) OUTPUT POWER, IM2 vs. INPUT POWER IM2 vs. INPUT POWER 50 45 40 30 25 20 15 10 5 0 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) 20 10 0 Pout –20 IM2 –30 –40 –50 TA = +25°C f1 = 1 000 MHz f2 = 1 001 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 –60 2nd Order Intermodulation Distortion IM2 (dBc) OUTPUT POWER, IM2 vs. INPUT POWER –10 IM2 vs. INPUT POWER 50 45 40 30 25 20 15 10 5 0 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) OUTPUT POWER, IM2 vs. INPUT POWER 20 10 0 Pout –20 –30 TA = +25°C f1 = 1 000 MHz f2 = 1 001 MHz 35 Input Power Pin (1 tone) (dBm) –10 TA = –40°C f1 = 1 000 MHz f2 = 1 001 MHz 35 Input Power Pin (1 tone) (dBm) IM2 –40 –50 TA = +85°C f1 = 1 000 MHz f2 = 1 001 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 –60 2nd Order Intermodulation Distortion IM2 (dBc) Output Power Pout (1 tone) (dBm) 2nd Order Intermodulation Distortion IM2 (2 tone) (dBm) Output Power Pout (1 tone) (dBm) 2nd Order Intermodulation Distortion IM2 (2 tone) (dBm) Output Power Pout (1 tone) (dBm) 2nd Order Intermodulation Distortion IM2 (2 tone) (dBm) μPC3242TB IM2 vs. INPUT POWER 50 45 40 TA = +85°C f1 = 1 000 MHz f2 = 1 001 MHz 35 30 25 20 15 10 5 0 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (1 tone) (dBm) Input Power Pin (1 tone) (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10803EJ01V0DS 13 OUTPUT POWER, 2f0 vs. INPUT POWER OUTPUT POWER, 2f0 vs. INPUT POWER 20 20 10 10 Output Power Pout (dBm) 2nd Harmonics 2f0 (dBm) Output Power Pout (dBm) 2nd Harmonics 2f0 (dBm) μPC3242TB 0 –10 Pout –20 –30 2f0 –40 –50 VCC = +3.0 V f = 1 000 MHz –60 –20 –30 2f0 –40 –50 TA = –40°C f = 1 000 MHz Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER, 2f0 vs. INPUT POWER OUTPUT POWER, 2f0 vs. INPUT POWER 20 20 10 10 0 –10 Pout –20 –30 2f0 –40 –50 VCC = +3.3 V f = 1 000 MHz –60 0 –10 Pout –20 –30 2f0 –40 –50 TA = +25°C f = 1 000 MHz –60 –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) OUTPUT POWER, 2f0 vs. INPUT POWER OUTPUT POWER, 2f0 vs. INPUT POWER 20 20 10 10 0 Output Power Pout (dBm) 2nd Harmonics 2f0 (dBm) Input Power Pin (dBm) Pout –10 –20 –30 2f0 –40 –50 –60 VCC = +3.6 V f = 1 000 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 0 –10 Pout –20 –30 2f0 –40 –50 –60 TA = +85°C f = 1 000 MHz –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 14 Pout –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Output Power Pout (dBm) 2nd Harmonics 2f0 (dBm) Output Power Pout (dBm) 2nd Harmonics 2f0 (dBm) –10 –60 –70 –55 –50 –45 –40 –35 –30 –25 –20 –15 –10 Output Power Pout (dBm) 2nd Harmonics 2f0 (dBm) 0 Data Sheet PU10803EJ01V0DS μPC3242TB S-PARAMETERS (TA = +25°C, VCC = 3.3 V, Pin = −40 dBm) S11−FREQUENCY 1 : 1 000 MHz 2 : 2 200 MHz 47.35 Ω 70.96 Ω 16.60 Ω 41.34 Ω 86.47 Ω 70.37 Ω –7.39 Ω 28.59 Ω 1 2 START : 100 MHz STOP : 5 100 MHz S22−FREQUENCY 1 : 1 000 MHz 2 : 2 200 MHz 1 2 START : 100 MHz STOP : 5 100 MHz Remarks 1. Measured on the test circuit of evaluation board. 2. The graphs indicate nominal characteristics. Data Sheet PU10803EJ01V0DS 15 μPC3242TB S-PARAMETERS S-parameters and noise parameters are provided on our Web site in a format (S2P) that enables the direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. Click here to download S-parameters. [RF and Microwave] → [Device Parameters] URL http://www.necel.com/microwave/en/ 16 Data Sheet PU10803EJ01V0DS μPC3242TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 Data Sheet PU10803EJ01V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.1 MIN. 0.9±0.1 2.0+0.15 –0.20 1.25±0.1 17 μPC3242TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to the VCC line. (4) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 18 Data Sheet PU10803EJ01V0DS HS350 μPC3242TB • The information in this document is current as of March, 2010. 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