Packaging Information / Reference Pattern Layout Dimensions ●CL-2025 Unit: mm 1.1±0.05 0.2±0.05 0.2±0.05 1.04 MAX 2.0±0.1 ■Packaging Information ■External Lead ■Reference Pattern Layout Dimension ■Reference metal mask design Taping Specifications ●CL-2025 Reel Unit: mm 3000pcs/reel ●Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed ● CL-2025 Power Dissipation Power dissipation data for the CL-2025 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） 25 85 Power Dissipation Pd（mW） 1000 250 Power Dissipation Pd （mW） Pd vs Ta 1200 1000 800 600 400 200 0 25 45 65 85 105 Ambient TemperatureTa（℃） 125 Thermal Resistance(℃/W) 100.00 CL-2025 構造図 CL-2025 Perspective RoHS対応品 RoHS Compliance 項 目 Item ① ② コイル/Coil ③ ④ (トップコーティング) Overcoating Resin B (Top Coating) 接着樹脂 Adhesive Resin 導体(巻線部) Conductor 端子 Terminal 銅 Copper 鉛フリーはんだメッキ, ニッケル Lead(Pb) free solder plating, Nickel ⑧ 接着剤 エポキシ樹脂 Adhesive Resin Epoxy Resin ⑨ シリコンチップ Silicon Chip リードパッド Lead-Pad ダイアタッチ Die Attach ボンディングワイヤ Bonding Wire 封止樹脂 Resin シリコン Silicon ニッケル, 金 Nickel, Gold Plating エポキシ Epoxy 金 Au エポキシ樹脂 Epoxy Resin ⑤ ⑥ 接着剤 Adhesive Resin ⑦ ⑩ IC コア Core ベース基板 Base Substrate 中間保護膜樹脂A Overcoating Resin A 保護膜樹脂B 材 料 Material フェライト Ferrite BTレジン+エポキシ樹脂 BT Resin + Epoxy Resin エポキシ樹脂 Epoxy Resin ⑪ ⑫ ⑬ 捺印表示 Marking レーザー Laser Marking Ver.01