Packaging Information / Reference Pattern Layout Dimensions ●USP-10B03 ■Packaging Information Unit: mm 2.15±0.05 2.5±0.05 1.0±0.05 1.0±0.05 1PIN INDENT (0.6) (0.5) 0.9±0.05 0.4±0.05 (0.05) 2 3 4 9 10 8 7 (0.65) (0.05) 6 5 0.3±0.05 ■Reference Pattern Layout Dimension 0.25±0.05 0.2±0.05 (0.05) 1.25±0.05 (0.3) 1 1.05 0.325 0.35 0.3 1.25 0.2 0.4 0.35 0.2 0.4 0.325 0.35 Note : reference metal mask design Taping Specifications ●USP-10B03 Reel 11.4±1.0 Unit: mm 9.0±0.3 2±0.5 Φ13±0.2 (1.5) 3,000pcs/reel ●Taping Specifications direction of feed (2.8) 8.0±0.2 3.5±0.05 1.75±0.1 R Type : Standard feed ●USP-10B03 Power Dissipation Power dissipation data for the USP-10B03 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. Condition: Mount on a board Ambient: Natural convection 2.5 Lead (Pb) free 40 x 40 mm (1600 mm2 in one side) Inner two metal layers, no large metal area 1.4 Soldering: Board Dimensions: Board Structure: 40.0 in the front and back. 1st Inner Metal Layer about 50% 40.0 Copper Area: 2nd Inner Metal Layer about 50% Material: Thickness: Through-hole: 28.9 Each Heatsink back metal is connected to the inner layers respectively. Glass Epoxy (FR-4) 1.6 mm 28.9 4 x 0.8 Diameter Evaluation Board (Unit: mm) Power Dissipation vs. Ambient temperature Board Mount ( Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) 25 500 85 200 Thermal Resistance (℃/W） 200.00 Pd-Ta特性グラフ Pd vs. Ta 600 Power Dissipation Pd（mW） 許容損失Pd（mW） 2. 500 400 300 200 100 0 25 45 65 85 Ambient周囲温度Ta（℃） Temperature Ta（℃） 105 125 USP-10B03構造図 USP-10B03 Perspective RoHS対応品 RoHS Compliance 項 目 Item ① ② 材 料 Material 備考 Note 封止樹脂 Resin エポキシ樹脂 難燃グレード/Flammability rating UL94V-0 リードパッド Lead pad ニッケル 端子処理 Outer pad plating Epoxy resin Nickel Auメッキ Gold plating ダイアタッチ Die attach エポキシ ④ はんだ Solder 鉛フリーはんだ Pb-free solder ⑤ ボンディングワイヤ Bonding wire Au ⑥ シリコンチップ Silicon chip Si ⑦ コイル Coil セラミック コイル電極 Ni 下地めっき + Snめっき Coil-Electrode Ni pre-plating + Sn plating ③ ⑧ 捺印表示 Marking Epoxy Ceramic レーザー Laser marking Ver.01