Packaging Information / Reference Pattern Layout Dimensions ●USPN-4B02 Unit: mm ■Packaging Information 0.95±0.05 0.75±0.05 +0.02 0.38-0.03 1pin INDENT 4 3 (0.4) ■Reference Pattern Layout Dimension Reference metal mask design 0.23 0.18 0.35 0.18 0.5 0.23 0.2±0.05 0.325±0.05 C0 . 07 0.18±0.0 5 1 2 0.35 0.2 0.14 7 0.4 .0 2 .1 C0 C0 0.14 0.115 0.4 0.115 Taping Specifications ●USPN-4B02 Reel +0 180 -3 60 +1 -0 0.2 0.4 0.6 0.8 0.6 0.4 0.2 0.8 Unit: mm 5,000pcs/reel ●Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed ● USPN-4B02 Power Dissipation Power dissipation data for the USPN-4B02 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm 2 in one side) Copper (Cu) traces occupy 50% of the front and 50% of the back. The copper area is divided into four block, one block is 12.5% of total. The USPN-4 package has for terminals. Each terminal connects one copper block in the front and one in the back. Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） 25 85 Power Dissipation Pd（mW） 550 220 Thermal Resistance(℃/W) 181.82 Power Dissipation Pd （mW） Pd vs Ta 600 500 400 300 200 100 0 25 45 65 85 105 Ambient Temperature Ta（℃） 125 USPN-4B02構造図 USPN-4B02 Perspective RoHS対応品 RoHS Compliance ① ② ③ ④ 項 目 材 料 備考 item material Note 封止樹脂 エポキシ樹脂 難燃グレード/Flammability rating Resin Epoxy resin UL94V-0 リードパッド ニッケル Lead pad Nickel 端子処理 Auメッキ Outer pad plating Gold plating ダイアタッチ ダイアタッチフィルム Die attach Die attach film ボンディングワイヤ Au Bonding wire ⑤ シリコンチップ Si Silicon chip 捺印表示 レーザー Marking Laser marking Ver.00