HVIGBT R Series CM750HG-130R

< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
CM750HG-130R






IC ··································································· 750A
VCES ·························································· 6500V
1-element in a pack
High Insulated type
LPT-IGBT / Soft Recovery Diode
AlSiC baseplate
APPLICATION
Traction drives, High Reliability Converters / Inverters, DC choppers
OUTLINE DRAWING & CIRCUIT DIAGRAM
January 2013 HVM-1058-C
Dimensions in mm
1
< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
MAXIMUM RATINGS
Symbol
Item
VCES
Collector-emitter voltage
VGES
IC
ICRM
IE
IERM
Ptot
Viso
Ve
Tj
Tjop
Tstg
Gate-emitter voltage
Maximum power dissipation (Note 3)
Isolation voltage
Partial discharge extinction voltage
Junction temperature
Operating junction temperature
Storage temperature
tpsc
Short circuit pulse width
Collector current
Emitter current
(Note 2)
Conditions
VGE = 0V, Tj = +125°C
VGE = 0V, Tj = +25°C
VGE = 0V, Tj = −50°C
VCE = 0V, Tj = 25°C
DC, Tc = 95°C
Pulse (Note 1)
DC
Pulse (Note 1)
Tc = 25°C, IGBT part
RMS, sinusoidal, f = 60Hz, t = 1 min.
RMS, sinusoidal, f = 60Hz, QPD ≤ 10 pC
Ratings
6500
6300
5700
± 20
750
1500
750
1500
10400
10200
5100
−50 ~ +150
−50 ~ +125
−55 ~ +125
10
VCC = 4500V, VCE ≤ VCES, VGE =15V, Tj =125°C
Unit
V
V
A
A
A
A
W
V
V
°C
°C
°C
s
ELECTRICAL CHARACTERISTICS
Symbol
Item
Conditions
Tj = 25°C
Tj = 125°C
ICES
Collector cutoff current
VCE = VCES, VGE = 0V
VGE(th)
IGES
Cies
Coes
Cres
QG
Gate-emitter threshold voltage
Gate leakage current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
VCE = 10 V, IC = 120 mA, Tj = 25°C
VGE = VGES, VCE = 0V, Tj = 25°C
VCEsat
Collector-emitter saturation voltage
td(on)
Turn-on delay time
tr
Turn-on rise time
Eon(10%)
Turn-on switching energy
(Note 5)
Eon
Turn-on switching energy
(Note 6)
td(off)
Turn-off delay time
tf
Turn-off fall time
Eoff(10%)
Turn-off switching energy
(Note 5)
Eoff
Turn-off switching energy
(Note 6)
January 2013 (HVM-1058-C)
VCE = 10 V, VGE = 0 V, f = 100 kHz
Tj = 25°C
VCC = 2800V, IC = 1200A, VGE = ±15V
IC = 1200 A (Note 4)
VGE = 15 V
VCC = 3600 V
IC = 750 A
VGE = ±15 V
RG(on) = 3.3 Ω
Ls = 150 nH
Inductive load
VCC = 3600 V
IC = 750 A
VGE = ±15 V
RG(off) = 33 Ω
Ls = 150 nH
Inductive load
2
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Min
—
—
5.8
−0.5
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Limits
Typ
—
24.0
6.3
—
136.0
8.6
4.0
10.5
3.80
4.80
1.05
1.00
0.18
0.20
3.35
4.10
3.50
4.40
7.60
8.00
0.40
0.45
3.10
4.60
3.40
4.90
Max
24.0
—
6.8
0.5
—
—
—
—
—
5.60
—
1.80
—
0.50
—
—
—
—
—
9.20
—
1.00
—
—
—
—
Unit
mA
V
µA
nF
nF
nF
µC
V
µs
µs
J
J
µs
µs
J
J
< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
ELECTRICAL CHARACTERISTICS (continuation)
Symbol
Item
Conditions
(Note 2)
VEC
Emitter-collector voltage
trr
Reverse recovery time
(Note 2)
Irr
Reverse recovery current
(Note 2)
Qrr
Reverse recovery charge
(Note 2)
Reverse recovery energy
(Note 2)
Erec(10%)
Erec
(Note 5)
Reverse recovery energy
IE = 750 A
VGE = 0 V
(Note 4)
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
VCC = 3600 V
IC = 750 A
VGE = ±15 V
RG(on) = 3.3 Ω
Ls = 150 nH
Inductive load
(Note 2)
(Note 6)
Min
—
—
—
—
—
—
—
—
—
—
—
—
Limits
Typ
3.30
3.40
0.65
0.70
800
900
630
900
0.90
1.70
1.00
1.80
Max
—
4.20
—
—
—
—
—
—
—
—
—
—
Min
—
—
—
Limits
Typ
—
—
6.0
Max
12.0
22.0
—
Min
7.0
3.0
1.0
—
600
26.0
56.0
—
—
—
Limits
Typ
—
—
—
1.4
—
—
—
15.0
0.18
2.6
Max
22.0
6.0
3.0
—
—
—
—
—
—
—
Unit
V
µs
A
µC
J
J
THERMAL CHARACTERISTICS
Symbol
Rth(j-c)Q
Rth(j-c)D
Rth(c-s)
Item
Thermal resistance
Contact thermal resistance
Conditions
Junction to Case, IGBT part
Junction to Case, FWDi part
Case to heat sink, grease = 1W/m·k, D(c-s) = 100m
Unit
K/kW
K/kW
K/kW
MECHANICAL CHARACTERISTICS
Symbol
Mt
Ms
Mt
m
CTI
da
ds
LP CE
RCC’+EE’
rg
Item
Mounting torque
Mass
Comparative tracking index
Clearance
Creepage distance
Parasitic stray inductance
Internal lead resistance
Internal gate resistance
Conditions
M8 : Main terminals screw
M6 : Mounting screw
M4 : Auxiliary terminals screw
TC = 25°C
TC = 25°C
Note1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Tjopmax rating.
2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
3. Junction temperature (Tj) should not exceed Tjmax rating (150°C).
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
5. Eon(10%) / Eoff(10%) / Erec(10%) are the integral of 0.1VCE x 0.1IC x dt.
6. Definition of all items is according to IEC 60747, unless otherwise specified.
January 2013 (HVM-1058-C)
3
Unit
N·m
N·m
N·m
kg
—
mm
mm
nH
mΩ
Ω
< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
OUTPUT CHARACTERISTICS
(TYPICAL)
TRANSFER CHARACTERISTICS
(TYPICAL)
1500
1500
T j = 12 5°C
VCE = VGE
VGE = 1 5V
1250
1250
VGE = 11V
1000
750
VGE = 10V
500
Coll ector Current [A]
Coll ector Current [A]
VGE = 1 3V
1000
750
500
T j = 12 5°C
250
Tj = 25 °C
250
0
0
0
2
4
6
8
0
Collector - Emitter Voltage [V]
4
8
12
16
Gate - Emi tter Voltage [V]
FREE-WHEEL DIODE FORWARD
CHARACTERISTICS (TYPICAL)
COLLECTOR-EMITTER SATURATION VOLTAGE
CHARACTERISTICS (TYPICAL)
1500
1500
VGE = 15 V
T j = 25 °C
1250
T j = 25°C
1000
T j = 125 °C
750
500
Emi tter Current [A]
Coll ector Current [A]
1250
250
1000
T j = 12 5°C
750
500
250
0
0
0
2
4
6
8
0
Collector-Emitter Saturation Voltage [V]
January 2013 (HVM-1058-C)
1
2
3
4
Emitter-Collector Voltage [V]
4
5
< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
CAPACITANCE CHARACTERISTICS
(TYPICAL)
GATE CHARGE CHARACTERISTICS
(TYPICAL)
1000
20
VCE = 36 00V, IC = 7 50A
Tj = 25 °C
15
Gate-Emitter Voltage [V]
Capa citance [nF]
Ci es
100
10
Co es
Cres
VGE = 0V, Tj = 25 °C
f = 10 0kHz
10
5
0
-5
-10
1
-15
0.1
1
10
100
0
2
Collector-Emitter Voltage [V]
6
8
10
12
Gate Charge [µC]
HALF-BRIDGE SWITCHING ENERGY
CHARACTERISTICS (TYPICAL)
HALF-BRIDGE SWITCHING ENERGY
CHARACTERISTICS (TYPICAL)
12
14
VCC = 360 0V, VGE = ±1 5V
RG( on) = 3.9 Ω, R G(off ) = 33Ω
LS = 15 0nH , T j = 1 25°C
Indu cti ve lo ad
VCC = 36 00 V, I C = 7 50A
VG E = ±1 5V, L S = 1 50n H
Tj = 12 5°C, Ind uctive l oad
10
Eon
10
8
Eoff
6
4
Switching Energies [J]
12
Switching Energies [J]
4
8
6
Eon
4
Er ec
2
2
Erec
0
0
0
250
500
750
1000
1250
0
1500
4
6
Gate resistor [Ohm]
Collector Current [A]
January 2013 (HVM-1058-C)
2
5
8
10
< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
SWITCHING ENERGY
CHARACTERISTICS (TYPICAL)
HALF-BRIDGE SWITCHING TIME
CHARACTERISTICS
(TYPICAL)HALF-BRIDGE
12
10
VCC = 36 00 V, VGE = ± 15V
R G(on) = 3.9Ω, RG( off) = 3 3Ω
L S = 1 50n H, T j = 12 5°C
In ductive l oa d
10
8
Switching Times [µs]
Switching Energies [J]
100
VCC = 36 00 V, I C = 7 50A
VG E = ±1 5V, L S = 1 50n H
Tj = 12 5°C, Ind uctive l oad
6
Eoff
4
t d( off)
td( on)
1
tf
0.1
2
tr
0
0
10
20
30
40
0.01
50
100
Gate resistor [Ohm]
REVERSE BIAS SAFE OPERATING AREA
(RBSOA)
10000
2500
VCC  45 00 V, VGE = ± 15V
Tj = 1 25°C, R G(off ) = 33Ω
1000
tr r
0.1
100
Coll ector Current [A]
Ir r
10
2000
Reverse Recovery Current [A]
Reverse Recovery Time [µs]
VCC = 36 00 V, VGE = ± 15V
RG(on) = 3.9Ω, LS = 150 nH
Tj = 12 5°C , Ind uctive l oad
1
1000
1000
0
10000
0
Emitter Current [A]
January 2013 (HVM-1058-C)
1500
500
10
100
10000
Collector Current [A]
FREE-WHEEL DIODE REVERSE RECOVERY
CHARACTERISTICS (TYPICAL)
100
1000
2000
4000
6000
Collector-Emitter Voltage [V]
6
8000
< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
PERFORMANCE CURVES
SHORT CIRCUIT
SAFE OPERATING AREA (SCSOA)
FREE-WHEEL DIODE REVERSE RECOVERY
SAFE OPERATING AREA (RRSOA)
10
2500
VCC  45 00V, VGE = ±1 5V
T j = 1 25°C, R G(on) = 3.9Ω, RG( off) = 3 3Ω
VCC  45 00 V, di/d t < 4 .5 kA/µs
Tj = 1 25°C
2000
Reverse Recovery Current [A]
Coll ector Current [kA]
8
6
4
2
1500
1000
500
0
0
0
2000
4000
6000
8000
0
Collector-Emitter Voltage [V]
2000
4000
6000
8000
Emitter-Collector Voltage [V]
TRANSIENT THERMAL IMPEDANCE
CHARACTERISTICS
Normalized Transient Thermal impedance
1.2
R th(j-c )Q = 12 .0 K/kW
R th(j-c )R = 22.0K/kW
1
Z
(t ) 
th( j  c )
n
 R 1 exp
i 1
0.8
0.6
1
3
0.4680
4
0.2905
ti [sec] :
0.0001
0.0131
0.0878
0.6247
10
Time [s]
January 2013 (HVM-1058-C)

2
0.2360
0
0.1

1
0.0055
0.2
0.01
 t 
 


i 

Ri [K/kW] :
0.4
0.001


i

7
< HVIGBT MODULES >
CM750HG-130R
HIGH POWER SWITCHING USE
INSULATED TYPE
4th-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors
may lead to personal injury, fire or property damage. Remember to give due consideration to safety when
making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi
semiconductor product best suited to the customer’s application; they do not convey any license under any
intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any
third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
•All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are subject
to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It
is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized
Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product
listed herein.
The information described here may contain technical inaccuracies or typographical errors. Mitsubishi
Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Mitsubishi Electric Corporation by various means,
including the Mitsubishi Semiconductor home page (http://www. MitsubishiElectric.com/).
•When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before making
a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or systems
for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
•The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or
in part these materials.
•If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other than
the approved destination.
Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of
destination is prohibited.
•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor
for further details on these materials or the products contained therein.
© 2013 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
January 2013 (HVM-1058-C)
8