LGA Package 32-Lead (15mm × 11.25mm × 4.38mm) (Reference LTC DWG # 05-08-1858 Rev A) SEE NOTES DETAIL A 4.28 – 4.48 8 aaa Z 7 7 6 5 4 3 2 1 PAD 1 A PAD “A1” CORNER B 4 C D E 15.00 BSC 12.70 BSC MOLD CAP F G SUBSTRATE H 0.33 – 0.43 3.95 – 4.05 J Z bbb Z DETAIL B K L X aaa Z 11.25 BSC Y DETAIL B PACKAGE TOP VIEW 0.630 ±0.025 Ø 32x 4.445 3.175 1.905 0.635 0.635 1.905 3.175 1.27 BSC PADS SEE NOTES 3 PACKAGE BOTTOM VIEW 0.630 ±0.025 Ø 32x eee S X Y 4.445 8.89 BSC eee S X Y DETAIL c DETAIL A 6.350 5.080 DETAIL C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 LAND DESIGNATION PER JESD MO-222 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 0.000 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 32 7 5.080 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 6.350 SUGGESTED PCB LAYOUT TOP VIEW SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 32 (1858) 0113 REV A