05-08-1858

LGA Package
32-Lead (15mm × 11.25mm × 4.38mm)
(Reference LTC DWG # 05-08-1858 Rev A)
SEE NOTES
DETAIL A
4.28 – 4.48
8
aaa Z
7
7
6
5
4
3
2
1
PAD 1
A
PAD “A1”
CORNER
B
4
C
D
E
15.00
BSC
12.70
BSC
MOLD
CAP
F
G
SUBSTRATE
H
0.33 – 0.43
3.95 – 4.05
J
Z
bbb Z
DETAIL B
K
L
X
aaa Z
11.25
BSC
Y
DETAIL B
PACKAGE TOP VIEW
0.630 ±0.025 Ø 32x
4.445
3.175
1.905
0.635
0.635
1.905
3.175
1.27
BSC
PADS
SEE NOTES
3
PACKAGE BOTTOM VIEW
0.630 ±0.025 Ø 32x
eee S X Y
4.445
8.89
BSC
eee S X Y
DETAIL c
DETAIL A
6.350
5.080
DETAIL C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
LAND DESIGNATION PER JESD MO-222
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
0.000
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 32
7
5.080
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 32 (1858) 0113 REV A
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