05-08-1849

aaa Z
BGA Package
140-Lead (11.25mm × 9.00mm × 2.72mm)
(Reference LTC DWG # 05-08-1849 Rev B)
A
Y
E
7
e
A2
aaa Z
SEE NOTES
E1
Z
b
PIN 1
A
DETAIL A
B
PIN “A1”
CORNER
C
A1
4
b
ccc Z
D
E
F
b1
MOLD
CAP
D
G
D1
H
SUBSTRATE
J
0.27 – 0.37
// bbb Z
1.95 – 2.05
K
L
DETAIL B
M
N
e
P
Øb (140 PLACES)
ddd M Z X Y
eee M Z
X
PACKAGE TOP VIEW
10
SEE NOTES
DETAIL B
PACKAGE SIDE VIEW
8
7
6
5
4
3
2
1
PACKAGE BOTTOM VIEW
3
3.600
2.800
2.000
1.200
0.000
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
0.400
0.400
1.200
2.000
2.800
3.600
9
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
5.200
0.4 Ø 140x
3.600
2.800
2.000
1.200
0.400
0.000
1.200
2.000
2.800
3.600
4.400
5.200
SUGGESTED PCB LAYOUT
TOP VIEW
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DIMENSIONS
4.400
0.400
3
SYMBOL
A
A1
A2
b
b1
D
E
e
D1
E1
aaa
bbb
ccc
ddd
eee
MIN
2.57
0.35
2.22
0.45
0.35
NOM
2.72
0.40
2.32
0.50
0.40
11.25
9.0
0.80
10.40
7.2
MAX
2.87
0.45
2.42
0.55
0.45
0.15
0.10
0.12
0.15
0.08
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TOTAL NUMBER OF BALLS: 140
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 140 1112 REV B
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