Document No.001-88448 Rev. ** ECN # 4064141 Cypress Semiconductor Package Qualification Report QTP# 084005 July 2013 56 QFN and 68 QFN Saw Type (8 x 8 x 1mm) NiPdAu-Ag, MSL3, 260C Reflow ASE-Shanghai CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-88448 Rev. ** ECN # 4064141 PACKAGE QUALIFICATION HISTORY Qual Report 084005 Description of Qualification Purpose Qualify 56L and 68L QFN(8X8X1) Saw Type Pb-Free(NiPdAu-Ag) Package Qualification at ASE Shanghai Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Date Comp Jan 09 Document No.001-88448 Rev. ** ECN # 4064141 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: LT68/ LT56 56L / 68L- Quad Flat No-Lead (QFN) G700L/Sumitomo Mold Compound Alpha Emission Rate : UL-94 N/A Oxygen Rating Index: N/A Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu-Ag Die Backside Preparation M th d/M t lli ti Die Separation Method: Backgrind Die Attach Supplier: Hitachi Die Attach Material: EN4900G Die Attach Method: Epoxy Bond Diagram Designation: 001-48188, 001-48115 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.8mil Thermal Resistance Theta JA °C/W: 13.05 C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-20659 Name/Location of Assembly (prime) facility: ASE-Shanghai (AE) MSL Level 3 Reflow Profile 260C Saw ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R, ASE-G, KYEC Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 8 Document No.001-88448 Rev. ** ECN # 4064141 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 P Ball Shear JESD22-B116A P Bond Pull MIL-STD-883 – Method 2011, P Constructional Analysis Criteria: Meet external and internal characteristics of P Cypress package Die Shear MIL-STD-883, Method 2019 P Dye Penetration test Test to determine the existence and extent of cracks, Criteria: No Package Crack P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V JESD22, Method A114-B P Final Visual JESD22-B101B P Internal Visual MIL-STD-883-2014 P High Accelerated Saturation Test (HAST) 130°C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C P High Temperature Storage 150C, no bias P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker 121°C, 100%RH Precondition: JESD22 Moisture Sensitivity MSL3 P 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Solderability J-STD-002, JESD22-B102 P Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs., 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C P 125C, -55C Thermal Shock P MIL-STD-883C, Method 1011, X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P Document No.001-88448 Rev. ** ECN # 4064141 Reliability Test Data QTP #: 084005 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej ACOUSTIC, MSL3 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 15 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839417 SHANGHAI-AE COMP 15 0 CY7C65640A (7C65642EC) 4820094 610838529 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 10 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 10 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE COMP 10 0 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 10 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE COMP 10 0 4826655 610839411 SHANGHAI-AE COMP 3 0 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE COMP 15 0 STRESS: STRESS: Failure Mechanism BALL SHEAR BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C24994 (8C14994AC) STRESS: DIE SHEAR STRESS: DYE PENTRANT TEST CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 15 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839417 SHANGHAI-AE COMP 15 0 CY7C65640A (7C65642EC) 4820094 610838529 SHANGHAI-AE COMP 15 0 SHANGHAI-AE COMP 9 0 COMP 8 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8C24994 (8C14994AC) STRESS: 4826655 610839411 ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2,200V CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-88448 Rev. ** ECN # 4064141 Reliability Test Data QTP #: 084005 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: FINAL VISUAL CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 1245 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 991 0 CY8C24994 (8C14994AC) 4826655 SHANGHAI-AE COMP 1183 0 STRESS: 610839419 HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND192 HR 30C/60%RH, MSL3 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE 128 80 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE 128 80 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE 128 77 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE 128 80 0 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 5 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 5 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE COMP 5 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE COMP 5 0 CY8C24994 (8C14994AC) 4826655 610839417 SHANGHAI-AE COMP 5 0 CY7C65640A (7C65642EC) 4820094 610838529 SHANGHAI-AE COMP 5 0 STRESS: STRESS: INTERNAL VISUAL PRESSURE COOKER TEST, 121C, 100%RH, PRE COND192 HR 30C/60%RH, MSL3 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE 168 80 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE 168 80 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE 168 80 0 STRESS: PHYSICAL DIMENSIONS CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 30 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 30 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE COMP 30 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE COMP 30 0 CY8C24994 (8C14994AC) 4826655 610839417 SHANGHAI-AE COMP 30 0 CY7C65640A (7C65642EC) 4820094 610838529 SHANGHAI-AE COMP 30 0 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 3 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 3 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE COMP 3 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-88448 Rev. ** ECN # 4064141 Reliability Test Data QTP #: 084005 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE 500 80 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE 500 80 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE 1000 80 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE 500 80 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE 1000 80 0 CY8C24994 (8C14994AC) 4826655 610839419 SHANGHAI-AE 500 80 0 CY8C24994 (8C14994AC) 4826655 610839417 SHANGHAI-AE 500 80 0 CY8C24994 (8C14994AC) 4826655 610839417 SHANGHAI-AE 1000 80 0 CY7C65640A (7C65642EC) 4820094 610838529 SHANGHAI-AE 500 80 0 CY7C65640A (7C65642EC) 4820094 610838529 SHANGHAI-AE 1000 80 0 STRESS: THERMAL SHOCK COND. B – 55C TO 125C CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE 200 80 0 CY8C24994 (8C14994AC) 4826655 610839411 SHANGHAI-AE COMP 15 0 CY8C24994 (8C14994AC) 4826655 610839412 SHANGHAI-AE COMP 15 0 CY7C65640A (7C65642EC) 4803351 610838527 SHANGHAI-AE COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-88448 Rev. ** ECN # 4064141 Document Title: QTP#084005: 56 QFN AND 68 QFN SAW TYPE (8X8X1MM) NIPDAU-AG, MSL3, 260C REFLOW ASE-SHANGHAI Document Number: 001-88448 Rev. ECN Orig. of No. Change ** 4064141 HSTO Description of Change Initial Spec Release Qualification report published on Cypress.com is documented on memo HGA-773 and was transferred to qualification report spec template. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8