56L – QFN 6x6x0.6mm (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 LQ B1 : 68.5550 mg B2 : 68.6290 mg Body Size (mil/mm) Package Weight – Site 2 6x6x0.6mm B1 : 66.4354 mg B2 : 66.6532mg SUMMARY The 56L – QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 123801, 134202 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ56CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-82395 Rev. *F Page 1 of 7 56L – QFN 6x6x0.6 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using NiPdAu Leadframe and Gold Wire Material Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg Copper Nickel Silicon Magnesium Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Gold Palladium SiO2 Metal OH Phenol Resin Epoxy Resin Carbon Black Crystalline Silica 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 14808-60-7 35.7000 1.4100 0.3050 0.0850 0.7276 0.0068 0.0068 0.3740 0.1020 0.0068 0.0068 0.0068 7.0448 2.5160 0.0272 17.1392 0.5344 0.7422 0.6472 0.0988 1.0676 Package Weight (mg): 68.5550 % Weight of substance per Homogeneous material 95.2000 % 3.7600 % 0.8133 % 0.2267 % 98.165 % 0.9174 % 0.9174 % 75.3425 % 20.5479 % 1.3699 % 1.3699 % 1.3699 % 100.0000 % 98.9305 % 1.0695 % 84.7242 % 2.6417 % 3.6689 % 3.1993 % 0.4884 % 5.2775 % PPM 520,750 20,567 4,449 1,240 10,613 99 99 5,455 1,488 99 99 99 102,761 36,700 397 250,007 7,795 10,826 9,441 1,441 15,573 % Total: % weight of substance per package 52.0750 % 2.0567 % 0.4449 % 0.1240 % 1.0613 % 0.0099 % 0.0099 % 0.5455 % 0.1488 % 0.0099 % 0.0099 % 0.0099 % 10.2761 % 3.6700 % 0.0397 % 25.0006 % 0.7795 % 1.0826 % 0.9441 % 0.1441 % 1.5573 % 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-82395 Rev. *F Page 2 of 7 56L – QFN 6x6x0.6 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using NiPdAu Leadframe and Copper-Palladium Wire Material Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition CAS Number Cu Ni Si Mg Nickel Palladium Gold Silver Carbocyclic acrylate Bismaleimide resin Acrylate Additive Silicon Copper Palladium SiO2 Metal Hydroxide Phenol Resin Epoxy Resin Carbon Black Crystalline Silica 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 14808-60-7 Package Weight (mg): II. Type Tray Others 35.2155 1.1110 0.2400 0.0490 0.7277 0.0072 0.0069 0.3742 0.1022 0.0070 0.0069 0.0068 7.0447 2.6115 0.0002 17.6285 0.6332 0.8435 0.8430 0.1090 1.0610 68.6290 % Weight of substance per Homogeneous material 96.1765% 3.0342% 0.6555% 0.1338% 98.0992% 0.9706% 0.9302% 75.2766% 20.5592% 1.4082% 1.3881% 1.3679% 100.0000% 99.9923% 0.0077% 83.4754% 2.9984% 3.9942% 3.9918% 0.5161% 5.0241% % weight of substance per package PPM 513,129 16,188 3,497 714 10,603 105 101 5,453 1,489 102 101 99 102,649 38,052 3 256,867 9,226 12,291 12,283 1,588 15,460 % Total: 51.3129% 1.6188% 0.3497% 0.0714% 1.0603% 0.0105% 0.0101% 0.5453% 0.1489% 0.0102% 0.0101% 0.0099% 10.2649% 3.8052% 0.0003% 25.6867% 0.9226% 1.2291% 1.2283% 0.1588% 1.5460% 100.0000 DECLARATION OF PACKAGING / INDIRECT MATERIALS Material Tape & Reel Weight by mg Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-82395 Rev. *F Page 3 of 7 56L – QFN 6x6x0.6 mm (Saw Version) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #123905, #134201 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LQ56ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-82395 Rev. *F Page 4 of 7 56L – QFN 6x6x0.6mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using NiPdAu Leadfinish and Gold Wire Material Material Lead frame Purpose of Use Base Material Frame Plating Frame Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Copper Nickel Silicon 7440-50-8 7440-02-0 7440-21-3 27.1284 0.8460 0.1833 % weight of substance per Homogenous material 96.2000 3.0000 0.6500 Magnesium 7439-95-4 0.0423 0.1500 637 0.0637 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret 14808-60-7 0.6790 0.0175 0.0035 0.1284 0.1284 0.0642 97.0000 2.5000 0.5000 12.0000 12.0000 6.0000 10,223 263 53 1,933 1,933 967 1.0223 0.0263 0.0053 0.1933 0.1933 0.0967 Trade Secret 0.7490 70.0000 11,277 1.1277 7440-21-3 7440-57-5 Trade Secret Trade secret Trade secret Trade secret 1333-86-4 60676-86-0 76361-86-9 3.8000 1.8498 0.0002 0.9240 0.9240 1.6170 0.1232 24.0240 3.0800 100.0000 99.9900 0.0100 2.9985 2.9985 5.2474 0.3998 77.9610 9.9950 57,212 27,850 3 13,911 13,911 24,345 1,855 361,466 46,372 5.7212 2.7850 0.0003 1.3911 1.3911 2.4345 0.1855 36.1466 4.6372 14808-60-7 0.1232 0.3998 1,855 0.1855 Substance Composition Nickel Palladium Gold Phenol Resin Epoxy Resin SiO2 Filler (Meta)Acrylic Copolymer Silicon Gold Ion Impurities Epoxy Resin-A Epoxy Resin-B Phenol Resin Carbon Black Silica fused Silica fused Silica, crystalline CAS Number Package Weight (mg): Weight by mg 66.4354 PPM % weight of Substance per package 408,437 12,737 2,760 40.8437 1.2737 0.2760 % Total: Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-82395 Rev. *F Page 5 of 7 100.0000 56L – QFN 6x6x0.6mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Pure Sn Leadfinish and Copper-Palladium Wire Material Purpose of Use Material Lead frame Base Material Frame Plating Die Attach Frame Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Copper Iron Phosphorus 7440-50-8 7439-89-6 7723-14-0 27.4950 0.6627 0.0085 % weight of substance per Homogenous material 97.5000 2.3500 0.0300 Zinc 7440-66-6 0.0338 0.8000 0.1284 0.1200 100.0000 12.0000 508 12,007 1,927 0.1284 12.0000 1,927 0.0642 6.0000 964 0.7490 70.0000 11,241 3.6700 1.0898 0.0002 2.5400 1.9100 0.1232 27.250 100.0000 99.9800 0.0200 7.0000 5.0000 0.3998 87.6000 55,080 16,356 2 38,181 28,636 1,432 409,014 Substance Composition Tin Phenol Resin Novolac Epoxy Resin Amorphous Silica (Meta)Acrylic Copolymer Silicon Copper Palladium Epoxy Resin-A Phenol Resin Carbon Black Silica fused CAS Number 7440-31-5 Trade Secret Trade Secret 68611-44-9 Trade Secret 7440-21-3 7440-50-8 7440-05-3 Trade secret Trade secret 1333-86-4 60676-86-0 Package Weight (mg): III. Type Tray Others 66.6532 % weight of Substance per package PPM 412,652 9,946 127 41.2652 0.9946 0.0127 0.0508 % Total: 1.2007 0.1927 0.1927 0.0964 1.1241 5.5080 1.6356 0.0002 3.8181 2.8636 0.1432 40.9014 100.0000 DECLARATION OF PACKAGING / INDIRECT MATERIALS Material Tape & Reel Weight by mg Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-82395 Rev. *F Page 6 of 7 56L – QFN 6x6x0.6mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: Rev. 56L - QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-82395 ** *A *B *C ECN No. Orig. of Change 3727483 AWP 3326303 JSO 3812343 JSO 4066937 YUM *D 4159219 AWP *E 4174512 JVP *F 4906523 MRB DCON Description of Change New specification. Added Assembly Site 2 for Au Wire. Added CuPd wire. Added assembly site name in the assembly heading in site 1 and 2. Changed Assembly code to Assembly site name in site 1 and 2. Updated the table of Site 1: - Added B1: on 68.5550 mg - Added B2 : 68.6920 mg - Added QTP # 134202 - Added the B2 Table : Copper-Palladium wire Added Package Weight for Site 2 : - B2 : 66.6532mg Updated Site 2 : - Remove Reference QTP#123802 for Pure Cu wire - Added Reference QTP# 134201 for CuPd wire - Remove data from Table B2 from Site 2 with Pure Cu wire and replace with CuPd wire Changed from CAS # “-------------“to Trade Secret on Assembly site 1_B1 Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-82395 Rev. *F Page 7 of 7