68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 LT 182.4898 mg 167.1409 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 4 Package Weight – Site 5 B1: 170.0300 mg B2: 174.9565 mg B3: 181.4625 mg Package Weight – Site 6 8.0X8.0X1.0mm 192.0681 mg B1: 179.3670 mg B2: 179.2000 mg B3. 177.6643 mg B4. 177.3193 mg B5. 179.4390 mg B6: 166.9125 mg N/A SUMMARY The QFN 68L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: PT UNISEM Batam Package Qualification Report # 072603 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT68-PT UNISEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 1 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material 72.4900 0.5500 0.1300 3.4000 0.0400 0.0200 0.0200 2.0919 0.4185 0.2093 461-58-5 620-92-8 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 0.0140 0.0561 7.6100 2.3400 87.2347 2.7930 2.7930 0.2793 0.5000% 2.0100% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% Package Weight (mg): 182.4898 Cu Si Mg Ni Leadframe External Plating Die Attach 7440-50-8 7440-21-3 7439-95-4 7440-50-8 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret 3101-60-8 % weight of substance per Homogeneous material 99.0700% 0.7500% 0.1800% 97.7000% 1.1500% 0.5700% 0.5700% 75.0000% 15.0000% 7.5000% Substance Composition Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Pd Au Ag Silver Epoxy resin t-Butyl Phenylglycidyl ether Dicyadiamide Hardener Si Au Silica Fused Epoxy Resin1 Phenol Resin Carbon Black CAS Number Weight by mg PPM % weight of substance per package 397228 3014 712 18631 219 110 110 11463 2293 1147 39.7228 0.3014 0.0712 1.8631 0.0219 0.0110 0.0110 1.1463 0.2293 0.1147 76 307 41701 12823 478025 15305 15305 1530 0.0076 0.0307 4.1701 1.2823 47.8025 1.5305 1.5305 0.1530 % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Lead PPM Cover tape Carrier tape Plastic Reel Tray Shielding bag < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 2 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 2: Advanced Semiconductor Engineering Shanghai Package Qualification Report # 084005 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT68ASE Shanghai As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 3 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose of Use Base Material Leadframe Cu Fe Zn P Ni External Plating Die Attach Substance Composition Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Pd Au Ag Silver Acrylic resin Epoxy resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Si Au Pd Silica Fused Epoxy Resin Phenol Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 72.8715 1.7414 0.1121 0.0224 0.9100 0.0400 0.0200 0.0100 0.7546 0.0784 0.0245 0.0490 % weight of substance per Homogeneous material 97.5000% 2.3300% 0.1500% 0.0300% 92.8600% 4.0800% 2.0400% 1.0200% 77.0000% 8.0000% 2.5000% 5.0000% 0.0098 0.0490 0.0049 0.0098 7.6800 1.0395 0.0105 90.4244 8.3590 7.3248 0.5224 Weight by mg 379,404 9,067 584 117 4,738 208 104 52 3,929 408 128 255 % weight of substance per package 37.9404 0.9067 0.0584 0.0117 0.4738 0.0208 0.0104 0.0052 0.3929 0.0408 0.0128 0.0255 1.0000% 51 0.0051 5.0000% 0.5000% 1.0000% 100.0000% 99.0000% 1.0000% 84.8100% 7.8400% 6.8700% 0.4900% 255 26 51 39,986 5,412 55 470,793 43,521 38,136 2,720 0.0255 0.0026 0.0051 3.9986 0.5412 0.0055 47.0793 4.3521 3.8136 0.2720 192.0680 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 4 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 3: CARSEM Malaysia Package Qualification Report # 101401 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT68CARSEM As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 5 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Base Material Leadframe Cu Fe P Zn Ni External Plating Die Attach Substance Composition Purpose of Use Adhesive Die Wire Silicon Chip Interconnect Mold Compound Encapsulation Pd Au Ag Silver Bismaleimide resin Carbocycllic Acrylate Acrylate Additive Si Au Silica Fused Epoxy Resin1 Phenol Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-50-8 7440-05-3 7440-57-5 7440-22-4 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 Package Weight (mg): Weight by mg % weight of substance per Homogeneous material 62.8280 1.4219 0.0129 0.0579 0.5602 0.0100 0.0200 0.0100 0.3195 0.0135 97.6500% 2.2100% 0.0200% 0.0900% 93.3600% 1.6700% 3.3300% 1.6700% 71.0000% 375898 8507 77 346 3352 60 120 60 1912 81 % weight of substance per package 37.5898 0.8507 0.0077 0.0346 0.3352 0.0060 0.0120 0.0060 0.1912 0.0081 PPM 0.0900 3.0000% 20.0000% 538 0.0538 0.0135 0.0135 1.3300 2.4600 91.8073 2.9394 2.9394 0.2939 3.0000% 3.0000% 100.0000% 100.0000% 93.7000% 3.0000% 3.0000% 0.3000% 81 81 7957 14718 549281 17586 17586 1759 0.0081 0.0081 0.7957 1.4718 54.9281 1.7586 1.7586 0.1759 100.0000 167.1409 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 6 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 4: Cypress Manufacturing Limited (CML) Package Qualification Report # 100401, 114407, 120206,133308, 124702, 141201, (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT68CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 7 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE AND NITTO MOLD COMPOUND Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Gold Palladium SiO2 Crystalline Silica Metal OH Phenol Resin Epoxy Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 7440-05-3 60676-86-0 14808-60-7 Trade Secret Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 74.3345 1.8315 0.0534 0.0916 1.1476 0.0207 0.0207 0.7866 0.2126 % weight of substance per Homogeneo us material 97.4100% 2.4000% 0.0700% 0.1200% 96.5200% 1.7370% 1.7430% 74.0000% 20.0000% 414,427 10,211 298 511 6,398 115 116 4,386 1,185 41.4427% 1.0211% 0.0298% 0.0511% 0.6398% 0.0115% 0.0116% 0.4386% 0.1185% 0.0213 0.0213 0.0213 14.8850 3.1314 0.0316 69.1013 4.1378 2.4827 3.3102 3.3102 0.4138 2.0000% 2.0000% 2.0000% 100.0000% 99.0000% 1.0000% 83.5000% 5.0000% 3.0000% 4.0000% 4.0000% 0.5000% 119 119 119 82,986 17,458 176 385,251 23,069 13,841 18,455 18,455 2,307 0.0119% 0.0119% 0.0119% 8.2986% 1.7458% 0.0176% 38.5251% 2.3069% 1.3841% 1.8455% 1.8455% 0.2307% % Total: 100.0000 Weight by mg 179.3671 PPM % weight of substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 8 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE AND SUMITOMO MOLD COMPOUND Material Lead Frame Lead Finish Die Attach Purpose of Use Base material External Plating Adhesive Substance Composition Circuit Wire Interconnect Mold Compound Encapsulation % weight of substance per Homogeneous material PPM % weight of substance per package Copper 7440-50-8 74.3354 97.4100% 414,818 41.4818% Iron 7439-89-6 1.8315 2.4000% 10,220 1.0220% Phosphorous 7723-14-0 0.0534 0.0700% 298 0.0298% Zinc 7440-66-6 0.0916 0.1200% 511 0.0511% Nickel 7440-02-0 1.1468 96.5200% 6,400 0.6400% Palladium 7440-05-3 0.0206 1.7370% 115 0.0115% Gold 7440-57-5 0.0207 1.7430% 116 0.0116% Ag Carbocyclic Acrylate Bismaleimide Resin Additive 7440-22-4 1.0642 74.0000% 5,939 0.5939% Trade Secret 0.2876 20.0000% 1,605 0.1605% Trade Secret 0.0288 2.0000% 161 0.0161% Trade Secret 0.0288 2.0000% 161 0.0161% Acrylate ester Die CAS Number Weight by mg Trade Secret 0.0288 2.0000% 161 0.0161% Silicon 7440-21-3 20.1341 100.0000% 112,356 11.2356% Gold 7440-57-5 3.3260 99.0000% 18,560 1.8560% Palladium 7440-05-3 0.0336 1.0000% 187 0.0187% SiO2 60676-86-0 67.3640 87.7500% 375,915 37.5915% Phenol Resin Trade Secret 3.8384 5.0000% 21,420 2.1420% Epoxy Resin Trade Secret 5.3738 7.0000% 29,988 2.9988% 1333-86-4 0.1919 0.2500% 1,071 0.1071% % Total: 100.0000% Carbon Black Package Weight (mg): 179.2000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 9 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) USING COPPER WIRE AND NITTO MOLD COMPOUND Material Lead Frame Purpose of Use Base material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Phosphorous Zinc Nickel Palladium Gold Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Silicon Copper SiO2 Crystalline Silica Metal OH Phenol Resin Epoxy Resin Carbon Black CAS Number 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 14808-60-7 Trade Secret Trade Secret Trade Secret 1333-86-4 Package Weight (mg): 74.3345 1.8315 0.0534 0.0916 1.1476 0.0207 0.0207 0.7866 0.2126 % weight of substance per Homogeneo us material 97.4099% 2.4000% 0.0700% 0.1200% 96.5181% 1.7410% 1.7410% 73.9912% 19.9981% 418,399 10,309 301 516 6,459 117 117 4,427 1,197 41.8399% 1.0309% 0.0301% 0.0516% 0.6459% 0.0117% 0.0117% 0.4427% 0.1197% 0.0213 0.0213 0.0213 14.885 1.4602 69.1013 4.1378 2.4827 3.3102 3.3102 0.4138 2.0036% 2.0036% 2.0036% 100.0000% 100.0000% 83.5000% 5.0000% 3.0000% 4.0000% 4.0000% 0.5000% 120 120 120 83,782 8,219 388,943 23,290 13,974 18,632 18,632 2,329 0.0120% 0.0120% 0.0120% 8.3782% 0.8219% 38.8943% 2.3290% 1.3974% 1.8632% 1.8632% 0.2329% % Total: 100.0000 Weight by mg 177.6643 PPM % weight of substance per package Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 10 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B4. MATERIAL COMPOSITION (Note 3) Using Copper Wire and Sumitomo Mold Compound Material Lead Frame Lead Finish Die Attach Purpose of Use Base material External Plating Adhesive Substance Composition CAS Number Weight by mg % weight of substance per Homogeneous material PPM % weight of substance per package Copper 7440-50-8 74.3354 97.4100% 419,048 41.9048% Iron 7439-89-6 1.8315 2.4000% 10,325 1.0325% Phosphorous 7723-14-0 0.0534 0.0700% 301 0.0301% Zinc 7440-66-6 0.0916 0.1200% 516 0.0516% Nickel 7440-02-0 1.1468 96.5239% 6,465 0.6465% Palladium 7440-05-3 0.0206 1.7339% 116 0.0116% Gold 7440-57-5 0.0207 1.7423% 117 0.0117% Ag Carbocyclic Acrylate Bismaleimide Resin Additive 7440-22-4 1.0642 73.9953% 5,999 0.5999% 0.2876 19.9972% 1,621 0.1621% Acrylate ester Trade Secret Trade Secret 0.0288 2.0025% 162 0.0162% Trade Secret 0.0288 2.0025% 162 0.0162% Trade Secret 0.0288 2.0025% 162 0.0162% Die Circuit Silicon 7440-21-3 20.1341 100.0000% 113,501 11.3501% Wire Interconnect Copper 7440-50-8 1.5509 100.0000% 8,743 0.8743% SiO2 Mold Compound Encapsulation 60676-86-0 67.3640 87.7500% 379,748 37.9748% Phenol Resin Trade Secret 3.8384 5.0000% 21,638 2.1638% Epoxy Resin Trade Secret 5.3738 7.0000% 30,293 3.0293% Carbon Black 1333-86-4 0.1919 0.2500% 1,082 0.1082% % Total: 100.0000% Package Weight (mg): 177.3913 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 11 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B5. MATERIAL COMPOSITION (Note 3) Using Copper Palladium Wire and Sumitomo Mold Compound Material Leadframe Lead Finish Purpose of Use Base Material External Plating Die Attach Die Adhesive Circuit Wire Interconnect Mold Compound Encapsulation % weight of substance per Homogeneous 7440-50-8 55.0560 97.4100% 306,822 0.3068 Fe 7439-89-6 1.3560 2.4000% 7,560 0.0075 P 7723-14-0 0.0400 0.0700% 220 0.0002 Zn 7440-66-6 0.0680 0.1200% 378 0.0003 Ni 7440-02-0 0.8490 96.5200% 4,734 0.0047 Pd 7440-05-3 0.0150 1.7370% 85 0.0001 Au 7440-57-5 0.0150 1.7430% 85 0.0001 Ag Carbocyclic Acrylate Bismaleimide Resin Additive Acrylate ester Si Cu Pd SiO2 Phenol Resin Epoxy Resin Carbon Black 7440-22-4 1.0970 74.0000% 6,113 0.0061 0.2960 20.0000% 1,652 0.0016 0.0300 0.0300 0.0300 20.7520 2.9010 0.0290 85.0080 4.8440 6.7810 0.2420 2.0000% 2.0000% 2.0000% 100.0000% 99.0000% 1.0000% 87.7500% 5.0000% 7.0000% 0.2500% 165 165 165 115,650 16,169 163 473,738 26,994 37,791 1,350 0.0001 0.0001 0.0001 0.1156 0.0161 0.0001 0.4737 0.0270 0.0377 0.0013 CAS Number Cu Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret Package Weight (mg): 179.4390 PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N %Weight of Substance per package Weight by mg Substance Composition Page 12 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B6 MATERIAL COMPOSITION (Note 3) Using Copper Palladium Wire and Nitto Mold Compound Material Leadframe Lead Finish Purpose of Use Substance Composition Base Material External Plating Die Attach Die Adhesive Circuit Wire Interconnect Mold Compound Encapsulation CAS Number Weight by mg % weight of substance per Homogeneo us %Weight of Substance per package PPM Cu 7440-50-8 53.9175 97.4102% 323,029 32.3029% Fe 7439-89-6 1.3120 2.3703% 7,860 0.7860% P 7723-14-0 0.0743 0.1342% 445 0.0445% Zn 7440-66-6 0.0472 0.0853% 283 0.0283% Nickel 7440-02-0 0.2584 99.8840% 1,548 0.1548% Palladium 7440-05-3 0.0002 0.0773% 1 0.0001% Gold 7440-57-5 0.0001 0.0387% 1 0.0001% Silver Carbocyclic acrylate Bismaleimide resin Acrylate Additive Silicon Copper Palladium SiO2 Metal Hydroxide Phenol Resin Epoxy Resin Carbon Black Crystalline 7440-22-4 0.6420 73.7931% 3,846 0.3846% Trade Secret 0.1815 20.8621% 1,087 0.1087% Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 7440-05-3 60676-86-0 Trade Secret Trade Secret Trade Secret 1333-86-4 Trade Secret 0.0180 0.0170 0.0115 16.6843 3.0524 0.0001 81.0200 4.1084 2.6998 2.5452 0.1054 0.2172 2.0690% 1.9540% 1.3218% 100.0000% 99.9967% 0.0033% 89.3314% 4.5299% 2.9768% 2.8063% 0.1162% 0.2395% 108 102 69 99,958 18,287 1 485,404 24,614 16,175 15,249 631 1,301 0.0108% 0.0102% 0.0069% 9.9958% 1.8287% 0.0001% 48.5404% 2.4614% 1.6175% 1.5249% 0.0631% 0.1301% Package Weight (mg): 166.9125 % Total: 100.0000% II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Material Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <0.0005 <5.0 <5.0 PBDE PPM <5.0 <5.0 <0.0005 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 13 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 111816, 114906, 133309, 124301 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT68ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 14 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) USING GOLD WIRE Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Zinc Phosphorus Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Gold Ion Impurities Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Package Weight (mg): 76.8582 1.8938 0.1184 0.0395 1.0194 0.0476 0.0130 1.4070 0.1508 % weight of substance per Homogeneous material 97.4000% 2.4000% 0.1500% 0.0500% 94.3900% 4.4100% 1.2000% 70.0000% 7.5000% 0.1859 0.0704 0.1508 0.0201 0.0251 7.3000 0.9999 0.0001 3.6000 2.4000 5.2800 0.4000 68.3200 Weight by (mg) 170.3000 451310 11121 695 232 5986 280 76 8262 885 % weight of substance per package 45.1311% 1.1121% 0.0695% 0.0232% 0.5986% 0.0280% 0.0076% 0.8262% 0.0885% 9.2500% 1092 0.1092% 3.5000% 7.5000% 1.0000% 1.2500% 100.0000% 99.9900% 0.0100% 4.5000% 3.0000% 6.6000% 0.5000% 85.4000% 413 885 118 148 42866 5871 1 21139 14093 31004 2349 401174 0.0413% 0.0885% 0.0118% 0.0148% 4.2866% 0.5871% 0.0001% 2.1139% 1.4093% 3.1004% 0.2349% 40.1174% PPM % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 15 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper Wire Material Lead Frame Purpose of Use Base material Lead Finish Die Attach External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition Copper Iron Zinc Phosphorus Nickel Palladium Gold Silver Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Copper Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Silica Fused CAS Number 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 91.5593 2.3055 0.1506 0.0847 1.2157 0.0568 0.0155 1.1410 0.1223 0.1508 % weight of substance per Homogeneous material 97.3000% 2.4500% 0.1600% 0.0900% 94.3880% 4.4120% 1.2000% 70.0000% 7.5000% 9.2500% 523,322 13,177 861 484 6,949 325 88 6,522 699 862 % weight of substance per package 52.3322 1.3177 0.0861 0.0484 0.6949 0.0325 0.0088 0.6522 0.0699 0.0862 0.0571 3.5000% 326 0.0326 0.1223 0.0163 0.0204 13.9000 0.4200 2.8629 1.9068 4.1989 0.3181 54.3315 7.5000% 1.0000% 1.2500% 100.0000% 100.0000% 4.5000% 3.0000% 6.6000% 0.5000% 85.4000% 699 93 116 79,447 2,400 16,363 10,909 24,000 1,818 310,540 0.0699 0.0093 0.0116 7.9447 0.2400 1.6363 1.0909 2.4000 0.1818 31.0540 % Total: 100.0000 Weight by (mg) Package Weight (mg): 174.9565 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 16 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper Palladium Wire Material Leadframe Lead Finish Purpose of Use Base Material External Plating Die Attach Die Adhesive Circuit Wire Interconnect Mold Compound Encapsulation Copper 7440-50-8 84.0450 % weight of substance per Homogeneous material 97.5000 463,154 46.3154 Iron 7439-89-6 2.0257 2.3500 11,163 1.1163 Phosphorus 7723-14-0 0.0259 0.0300 143 0.0143 Zinc 7440-66-6 0.1034 0.1200 570 0.0570 Tin 7440-31-5 2.8000 100.0000 15,430 1.5430 Silver 7440-22-4 0.9800 75.0000 5,401 0.5401 Acrylic Resin Polybutadiene derivative Butadiene copolymer Acrylate Trade Secret 0.1050 5.5050 579 0.0579 Trade Secret 0.1295 10.0000 714 0.0714 Trade Secret 0.0490 3.0000 270 0.0270 Trade Secret 0.1050 5.5050 579 0.0579 Peroxide Substance Composition CAS Number Weight by (mg) % weight of substance per package PPM Trade Secret 0.0140 0.9900 77 0.0077 Silicon 7440-21-3 8.5800 100.0000 47,282 4.7282 Copper 7440-50-8 1.1998 99.9800 6,612 0.6612 Palladium 7440-05-3 0.0002 0.0200 1 0.0001 Epoxy Resin Trade Secret 6.5040 7.0000 35,842 3.5842 Phenol Resin Trade Secret 4.8780 5.0000 26,882 2.6882 Carbon Black 1333-86-4 0.2439 0.3000 1,344 0.1344 Silica Fused 60676-86-0 69.6741 87.7000 383,959 38.3959 % Total 100.0000 Package Weight (mg): 181.4625 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 17 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Cover tape Carrier tape Plastic Reel Tray Lead PPM <20.0 <5.0 < 5.0 < 5.0 Cadmium PPM <20.0 <5.0 < 5.0 < 5.0 Cr VI PPM <20.0 <5.0 < 5.0 < 5.0 Mercury PPM <20.0 <10.0 < 10.0 < 10.0 PBB PPM <20.0 <50.0 <50.0 <50.0 Shielding bag <2 .0 <2.0 <2.0 <2.0 <5.0 Material PBDE PPM <20.0 <45.0 <45.0 <45.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 18 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: Rev. 68L - QFN 8X8X1.0MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-17657 ** *A ECN No. Orig. of Change 1362383 EBZ 2600097 DPT *B *C *D DCON 3040449 HLR 3113486 MLA 3247365 JARG *E 3414374 HLR *F 3485534 CMG *G 3533023 COPI *H 3599270 JARG *I 4052508 YUM *J 4101977 JVP *K *L 4375459 MLA 4370018 AWP Description of Change Initial spec release. Added Assembly site 2 and change package thickness from 0.9 to 1.0mm per POD#001-09618. Update spec title to 68L – QFN 8X8X1.0 mm (Saw Version) PB- Free Package PMDD Changed CML to WEB in distribution list. Removed tube type on Indirect Material table. Add assembly site 3. Added Assembly Site 4 – CML RA Change category from Quality Standard to PMDD Category Updated the material composition table to reflect 4 decimal places on values. Added Package Weight Site 4 – B2 Added QTP# 114407 on Assembly Site 4 Added B2 material composition on Assembly Site 4 Added Assembly Site 5 – Autoline RA Copper wire qualification. Reference QTP # 120206. Added Assembly Site 6 - ASE Assembled (Assembly Sites 2 and 3) from Spec 001-08151 in reference to QTPs 111816 and 114906 which reflects 8x8x1.0mm package dimension Updated the material composition table for Assembly Site 6 – B1 to reflect four decimal places on values. Added assembly site name in the Assembly heading in site 1, 2, 3, 4 and 5. Changed assembly code to assembly site name in site 1, 2, 3, 4 and 5. Consolidate material composition in one assembly site. 1. CML 2. ASET Added Package weight in Assembly Site 4 (B5) and Assembly Site 5 (B3). Added Section B5 for Copper Palladium and Sumitomo Mold Compound for Assy Site 4, CML, QTP# 133308. Added Section B3 for Copper Palladium for Assy Site 5 , ASET) QTP# 133309 Added QTP 124301 reference to site #5. Added QTP 124702 & QTP 141201 reference to site #4 for copper Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 19 of 20 68L – QFN 8X8X1.0 mm (Saw Version) Pb-Free Package Document History Page Document Title: Document Number: Rev. 68L - QFN 8X8X1.0MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-17657 ECN No. Orig. of Change *M 4563328 HLR *N 5007155 HLR DCON Description of Change palladium wire & Nitto epoxy molding compound materials. Changed total weight of assembly site 2 from 192.0681 to 192.0680 mg. Changed total weight of Assembly Site 5.B1 Material Composition from 170.0300 to 170.3000 mg. Changed the substances with “------------- and Proprietary “to “Trade Secret”. Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-17657 Rev. *N Page 20 of 20