28L TSSOP PB-FREE Package Material Declaration Datasheet.pdf

28L - TSSOP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
ZZ
B1: 108.9600 mg
B2: 108.2609 mg
Body Size (mil/mm)
Package Weight – Site 2
4.4 mm
B1: 102.4600 mg
B2: 104.0000 mg
B3: 102.4601 mg
SUMMARY
The 28L-TSSOP package is qualified at two assembly sites. Packages from different assembly sites
are likely to have different materials composition. However, Cypress guarantees that product ordered
with a part number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all
requirement of the EU RoHS directive.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 042701, 124204 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZZ28-CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 1 of 10
28L - TSSOP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold wire with NiPdAu and Hitachi Mold Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-57-5
85954-11-6
26834-02-6
41.9299
1.1189
0.0605
0.0907
0.1872
0.0098
0.0030
0.1689
% weight of
substance per
Homogenous
material
97.0600%
2.5900%
0.1400%
0.2100%
93.5700%
4.9200%
1.5000%
80.4500%
0.0188
8.9400%
172
0.0172%
0.0094
4.4700%
86
0.0086%
0.0043
2.0500%
40
0.0040%
0.0043
2.0500%
40
0.0040%
0.0043
2.0500%
40
0.0040%
3.2000
1.3100
3.0420
3.0420
100.0000%
100.0000%
5.0000%
5.0000%
29,369
12,023
27,918
27,918
2.9369%
1.2023%
2.7918%
2.7918%
68541-56-0
0.6084
1.0000%
5,584
0.5584%
1309-64-4
60676-86-0
Trade
Secret
0.2981
53.2411
0.4900%
87.5100%
2,736
488,630
0.2736%
48.8630%
0.6084
1.0000%
5,584
0.5584%
Package Weight (mg):
108.9600
% Total:
100.0000
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary polymer
Die Attach
Adhesive
Methacrylate
Acrylate ester
Organic peroxide
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Si
Au
Epoxy resin
Phenol resin
Brominated epoxy
resin
Antimony trioxide
Silica
Others
CAS
Number
Weight by
mg
384,819
10,269
555
833
1,717
90
27
1,550
% weight of
substance
per
package
38.4819%
1.0269%
0.0555%
0.0833%
0.1717%
0.0090%
0.0027%
0.1550%
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 2 of 10
28L - TSSOP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper wire with NiPdAu and Kyocera mold Compound
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-50-8
60676-86-0
Trade
Secret
Trade
Secret
1333-86-4
42.0811
1.0368
0.0302
0.0518
0.1930
0.0035
0.0035
0.1680
% weight of
substance per
Homogenous
material
97.4100
2.4000
0.0700
0.1200
96.5200
1.7400
1.7400
80.0000
0.0189
9.0000
175
0.0175
0.0105
5.0000
97
0.0097
0.0042
2.0000
39
0.0039
0.0042
2.0000
39
0.0039
0.0042
3.2000
0.6109
54.1477
2.0000
100.0000
100.0000
89.0000
39
29,558
5,643
500,157
0.0039
2.9558
0.5643
50.0157
3.0420
5.0000
28,099
2.8099
3.4983
0.1521
5.7500
0.2500
32,314
1,405
3.2314
0.1405
Package Weight (mg):
108.2609
% Total:
100.0000
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary polymer
Die Attach
Adhesive
Methacrylate
Acrylate ester
Organic peroxide
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Si
Cu
SiO2
Phenol Resin
Epoxy Resin
Carbon Black
CAS
Number
Weight by
mg
388,701
9,577
279
479
1,783
32
32
1,552
% weight of
substance
per
package
38.8701
0.9577
0.0279
0.0479
0.1783
0.0032
0.0032
0.1552
PPM
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 3 of 10
28L - TSSOP
Pb-Free Package
ASSEMBLY Site 2: Orient Semiconductor Electronics Taiwan (OSET)
Package Qualification Report # 024701, 053006, 120605 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Pure Sn Lead Finish
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZZ28OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 4 of 10
28L - TSSOP
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold Wire and Pure Sn Lead Finish
Material
Purpose of
Use
Substance
Composition
Cu
Si
Ni
Mg
Ag
Leadframe
Base Material
Polyimide
NBR
Bismaleimide
Phenol resin
Lead Finish
External
Plating
Sn
Epoxy resin
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Metal
Ag
Si
Au
Epoxy resin
Phenol resin (1)
Mold
Compound
Encapsulation
Phenol resin (2)
Carbon black
Silica
Others
CAS
Number
Weight by
mg
7440-50-8
7440-21-3
7440-02-0
7439-95-4
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
29.9252
0.2306
1.0109
0.0569
0.3285
% weight of
substance per
Homogenous
material
94.7300%
0.7300%
3.2000%
0.1800%
1.0400%
0.0284
7440-31-5
Trade
Secret
Trade
Secret
7440-22-4
7440-21-3
7440-57-5
Trade
Secret
Trade
Secret
Trade
Secret
1333-86-4
60676-86-0
Trade
Secret
Package Weight (mg):
292,067
2,251
9,866
555
3,206
% weight of
substance
per
package
29.2067%
0.2251%
0.9866%
0.0555%
0.3206%
0.0900%
277
0.0277%
0.0032
0.0100%
31
0.0031%
0.0032
0.0100%
31
0.0031%
0.0032
0.0100%
31
0.0031%
1.8000
100.0000%
17,568
1.7568%
0.0420
15.0000%
410
0.0410%
0.2310
82.5000%
2,254
0.2254%
0.0070
4.3500
0.6500
2.5000%
100.0000%
100.0000%
68
42,456
6,344
0.0068%
4.2456%
0.6344%
3.1895
5.0000%
31,129
3.1129%
1.5947
2.5000%
15,565
1.5565%
1.5947
2.5000%
15,565
1.5565%
0.1276
57.1558
0.2000%
89.6000%
1,245
557,836
0.1245%
55.7836%
0.1276
0.2000%
1,245
0.1245%
% Total:
100.0000
102.4600
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 5 of 10
28L - TSSOP
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Gold Wire and NiPdAu Lead Finish
Material
Purpose of
Use
7440-50-8
7440-21-3
7439-95-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-22-4
7440-02-0
7440-05-3
7440-57-5
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-22-4
7440-21-3
7440-57-5
85954-11-6
26834-02-6
Trade
Secret
1333-86-4
60676-86-0
30.7786
0.2402
0.0584
% weight of
substance per
Homogenous
material
94.8200%
0.7400%
0.1800%
0.0292
0.0900%
281
0.0281%
0.0097
0.0300%
94
0.0094%
0.0097
0.0300%
94
0.0094%
0.0032
0.0100%
31
0.0031%
1.3309
0.0269
0.0041
0.0090
4.1000%
67.3000%
10.2700%
22.4300%
12,797
259
40
86
1.2797%
0.0259%
0.0040%
0.0086%
0.0194
7.7500%
186
0.0186%
0.0097
3.8800%
93
0.0093%
0.0025
1.0100%
24
0.0024%
0.0097
3.8800%
93
0.0093%
0.0097
3.8800%
93
0.0093%
0.0013
0.5200%
12
0.0012%
0.0038
1.5300%
37
0.0037%
0.1939
3.5600
0.8400
3.0083
2.6673
77.5500%
100.0000%
100.0000%
4.5000%
3.9900%
1,864
34,231
8,077
28,925
25,647
0.1864%
3.4231%
0.8077%
2.8925%
2.5647%
0.8691
1.3000%
8,356
0.8356%
0.1337
60.1717
0.2000%
90.0100%
1,286
578,574
0.1286%
57.8574%
Package Weight (mg):
104.0000
% Total:
100.0000
Substance
Composition
Cu
Si
Mg
Polymide
Leadframe
Base Material
NBR
Bismaleimide
Phenol resin
Lead Finish
External Plating
Ag
Ni
Pd
Au
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Die Attach
Adhesive
Epoxy Resin
Acrylate
Peroxide
Additive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Silver
Si
Au
Epoxy resin
Phenol resin
Aromatic
Phosphate
Carbon black
Silica
CAS
Number
Weight by
mg
295,948
2,310
562
% weight of
substance
per
package
29.5948%
0.2310%
0.0562%
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 6 of 10
28L - TSSOP
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper wire with Pure Sn Lead Finish
Material
Purpose of
Use
7440-50-8
7440-21-3
7440-02-0
7439-95-4
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
29.9252
0.2306
1.0109
0.0569
0.3285
% weight of
substance per
Homogenous
material
94.7300%
0.7300%
3.2000%
0.1800%
1.0400%
0.0284
0.0900%
277
0.0277%
0.0032
0.0100%
31
0.0031%
0.0032
0.0100%
31
0.0031%
0.0032
0.0100%
31
0.0031%
Sn
7440-31-5
1.8000
100.0000%
17,568
1.7568%
Silver
Epoxy resin A
7440-22-4
9003-36-5
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
461-58-5
Trade
Secret
7440-21-3
7440-50-8
Trade
Secret
0.2072
0.0112
74.0000%
4.0000%
2,022
109
0.2022%
0.0109%
0.0168
6.0000%
164
0.0164%
0.0112
4.0000%
109
0.0109%
0.0168
6.0000%
164
0.0164%
0.0140
5.0000%
137
0.0137%
0.0014
0.5000%
14
0.0014%
0.0014
0.5000%
14
0.0014%
4.3500
0.6500
100.0000%
100.0000%
42,456
6,344
4.2456%
0.6344%
3.1895
5.0000%
31,129
3.1129%
29690-82-2
3.1895
5.0000%
31,129
3.1129%
3.1895
5.0000%
31,129
3.1129%
3.1895
5.0000%
31,129
3.1129%
0.1914
44.2702
6.3790
0.1914
0.3000%
69.4000%
10.0000%
0.3000%
1,868
432,073
62,258
1,868
0.1868%
43.2073%
6.2258%
0.1868%
% Total:
100.0000
Substance
Composition
Cu
Si
Ni
Mg
Ag
Leadframe
Base Material
Polyimide
NBR
Bismaleimide
Phenol resin
Lead Finish
External
Plating
Epoxy resin B
Diluent A
Die Attach
Adhesive
Diluent B
Phenolic Hardener
Dicyandiamide
Organic peroxide
Die
Wire
Circuit
Interconnect
Si
Cu
Epoxy resin A
Epoxy,Cresol
Novolac
Mold
Compound
Phenol resin
Encapsulation
Metal Hydroxide
Carbon Black
Silica Fused
Silica Fused
Silica,crystalline
CAS
Number
Trade
Secret
Trade
Secret
1333-86-4
60676-86-0
76361-86-9
14808-60-7
Package Weight (mg):
Weight by
mg
102.4601
292,068
2,251
9,866
555
3,206
% weight of
substance
per
package
29.2068%
0.2251%
0.9866%
0.0555%
0.3206%
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 7 of 10
28L - TSSOP
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 8 of 10
28L - TSSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
28L TSSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04255
Rev. ECN No. Orig. of
Change
**
390637
YXP
*A
401531
GFJ
*B
2612843 MAHA
*C
3068046 JARG
*D
3412074 JARG
*E
3645886 UDR
*F
3657808 JARG
Description of Change
New document.
Added PMDD on header. Added Pure Sn Lead Finish
in Assembly Site 2 under section 1-A. Added natural
impurity in note 3 and note 4. Added Assembly site 2
package information. Added qualified indirect
materials applicable to assembly site 2 and updated
analysis result.
Updated Cypress logo.
Added % weight of substance per homogeneous
material on the material composition tables for
assembly sites 1 and 2.
Changed CoA-SP28-T to CoA-ZZ28-T.
Revised the material composition table for OSE
Taiwan’s pure tin lead finish.
Added Au weight in assembly site 2’s material
composition table for NiPdAu lead finish.
Recalculated PPM and % weight of substance per
package for assembly site 2’s material composition
table (NiPdAu lead finish).
Updated and added Lead, Cr +VI, PBB and PBDE on
the Declaration of Packaging/Indirect Materials for
assembly sites 1 and 2.
Changed E-CML to WEB in distribution list.
Corrected computation of Material Composition for
Assembly Sites 1 and 2
Interchanged Silica and Carbon Black on the Material
Composition table of Assembly Site 2 (NiPdAu Finish)
Re-align table format for Assembly sites 1 and 2
Material Composition Table
Updated Material Composition Tables for Assembly
Site 1 – Table B and Assembly Site 2 – Tables B1
and B2 to reflect 4 decimal places on values.
Added B3 and B4 on Site 2 with reference QTP #
120406.
Changed reference QTP from 120406 to 120605.
Change wire on Assembly Site 2: B3 from Au to Cu.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 9 of 10
28L - TSSOP
Pb-Free Package
Document History Page
Document Title:
Document Number:
28L TSSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04255
Rev. ECN No. Orig. of
Change
*G
3818165 JARG
*H
3931638 UDR
*I
4066912 YUM
*J
5048322 MRB
SLLO
Description of Change
Removed Material Composition for Assembly Site
4:B4. Copper Wire with NiPdAu finish for TSSOP28
(ZZ28) package is not qualified at OSE.
Assembly Site 1: Corrected % weight of substance
per package to meet the total of 100.0000%
Assembly Site 2-B1 and B2: Corrected % weight of
substance per package to meet the total of
100.0000%
Assembly Site 2-B3: Changed CAS number of Silica
Fused from 7631-86-9 to 76361-86-9
Added B2 on Package Weight – Site 1.
Added QTP # 124204 on Assembly Site 1 Package
Qualification Reports.
Specified Assembly Site 1 B1 Material Composition is
using Au Wire with NiPdAu and Hitachi Mold
Compound.
Added B2 on Assembly Site 1 Material Composition.
Added assembly site name in the assembly heading
in site 1 and 2.
Changed Assembly code to assembly site name in
site 1 and 2.
Changed CAS # from “---------“ to Trade Secret
Removed distribution and posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a
natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-04255 Rev. *J
Page 10 of 10
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