28L - TSSOP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 ZZ B1: 108.9600 mg B2: 108.2609 mg Body Size (mil/mm) Package Weight – Site 2 4.4 mm B1: 102.4600 mg B2: 104.0000 mg B3: 102.4601 mg SUMMARY The 28L-TSSOP package is qualified at two assembly sites. Packages from different assembly sites are likely to have different materials composition. However, Cypress guarantees that product ordered with a part number containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meets all requirement of the EU RoHS directive. ASSEMBLY Site 1: Cypress Manufacturing Limited (CML) Package Qualification Report # 042701, 124204 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZZ28-CML As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 1 of 10 28L - TSSOP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold wire with NiPdAu and Hitachi Mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-57-5 85954-11-6 26834-02-6 41.9299 1.1189 0.0605 0.0907 0.1872 0.0098 0.0030 0.1689 % weight of substance per Homogenous material 97.0600% 2.5900% 0.1400% 0.2100% 93.5700% 4.9200% 1.5000% 80.4500% 0.0188 8.9400% 172 0.0172% 0.0094 4.4700% 86 0.0086% 0.0043 2.0500% 40 0.0040% 0.0043 2.0500% 40 0.0040% 0.0043 2.0500% 40 0.0040% 3.2000 1.3100 3.0420 3.0420 100.0000% 100.0000% 5.0000% 5.0000% 29,369 12,023 27,918 27,918 2.9369% 1.2023% 2.7918% 2.7918% 68541-56-0 0.6084 1.0000% 5,584 0.5584% 1309-64-4 60676-86-0 Trade Secret 0.2981 53.2411 0.4900% 87.5100% 2,736 488,630 0.2736% 48.8630% 0.6084 1.0000% 5,584 0.5584% Package Weight (mg): 108.9600 % Total: 100.0000 Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Die Attach Adhesive Methacrylate Acrylate ester Organic peroxide Die Wire Circuit Interconnect Mold Compound Encapsulation Si Au Epoxy resin Phenol resin Brominated epoxy resin Antimony trioxide Silica Others CAS Number Weight by mg 384,819 10,269 555 833 1,717 90 27 1,550 % weight of substance per package 38.4819% 1.0269% 0.0555% 0.0833% 0.1717% 0.0090% 0.0027% 0.1550% PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 2 of 10 28L - TSSOP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Copper wire with NiPdAu and Kyocera mold Compound Material Purpose of Use Leadframe Base Material Lead Finish External Plating 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-21-3 7440-50-8 60676-86-0 Trade Secret Trade Secret 1333-86-4 42.0811 1.0368 0.0302 0.0518 0.1930 0.0035 0.0035 0.1680 % weight of substance per Homogenous material 97.4100 2.4000 0.0700 0.1200 96.5200 1.7400 1.7400 80.0000 0.0189 9.0000 175 0.0175 0.0105 5.0000 97 0.0097 0.0042 2.0000 39 0.0039 0.0042 2.0000 39 0.0039 0.0042 3.2000 0.6109 54.1477 2.0000 100.0000 100.0000 89.0000 39 29,558 5,643 500,157 0.0039 2.9558 0.5643 50.0157 3.0420 5.0000 28,099 2.8099 3.4983 0.1521 5.7500 0.2500 32,314 1,405 3.2314 0.1405 Package Weight (mg): 108.2609 % Total: 100.0000 Substance Composition Cu Fe P Zn Ni Pd Au Ag Proprietary bismaleimide Proprietary polymer Die Attach Adhesive Methacrylate Acrylate ester Organic peroxide Die Wire Circuit Interconnect Mold Compound Encapsulation Si Cu SiO2 Phenol Resin Epoxy Resin Carbon Black CAS Number Weight by mg 388,701 9,577 279 479 1,783 32 32 1,552 % weight of substance per package 38.8701 0.9577 0.0279 0.0479 0.1783 0.0032 0.0032 0.1552 PPM II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Others Material Plastic Tube End Pin End Plug Shielding Bag Lead PPM <2.0 <2.0 <2.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 < 2.0 Cr VI PPM <2.0 <2.0 <2.0 < 2.0 Mercury PPM <2.0 <2.0 <2.0 < 2.0 PBB PPM <0.0005 <0.0005 <0.0005 < 5.0 PBDE PPM <0.0005 <0.0005 <0.0005 < 5.0 Analysis Report (Note2) CoA-PLTB-R CoA-ENDP-R CoA-EPLG-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 3 of 10 28L - TSSOP Pb-Free Package ASSEMBLY Site 2: Orient Semiconductor Electronics Taiwan (OSET) Package Qualification Report # 024701, 053006, 120605 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Pure Sn Lead Finish Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-ZZ28OSET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 4 of 10 28L - TSSOP Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Gold Wire and Pure Sn Lead Finish Material Purpose of Use Substance Composition Cu Si Ni Mg Ag Leadframe Base Material Polyimide NBR Bismaleimide Phenol resin Lead Finish External Plating Sn Epoxy resin Die Attach Adhesive Die Wire Circuit Interconnect Metal Ag Si Au Epoxy resin Phenol resin (1) Mold Compound Encapsulation Phenol resin (2) Carbon black Silica Others CAS Number Weight by mg 7440-50-8 7440-21-3 7440-02-0 7439-95-4 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 29.9252 0.2306 1.0109 0.0569 0.3285 % weight of substance per Homogenous material 94.7300% 0.7300% 3.2000% 0.1800% 1.0400% 0.0284 7440-31-5 Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 Trade Secret Package Weight (mg): 292,067 2,251 9,866 555 3,206 % weight of substance per package 29.2067% 0.2251% 0.9866% 0.0555% 0.3206% 0.0900% 277 0.0277% 0.0032 0.0100% 31 0.0031% 0.0032 0.0100% 31 0.0031% 0.0032 0.0100% 31 0.0031% 1.8000 100.0000% 17,568 1.7568% 0.0420 15.0000% 410 0.0410% 0.2310 82.5000% 2,254 0.2254% 0.0070 4.3500 0.6500 2.5000% 100.0000% 100.0000% 68 42,456 6,344 0.0068% 4.2456% 0.6344% 3.1895 5.0000% 31,129 3.1129% 1.5947 2.5000% 15,565 1.5565% 1.5947 2.5000% 15,565 1.5565% 0.1276 57.1558 0.2000% 89.6000% 1,245 557,836 0.1245% 55.7836% 0.1276 0.2000% 1,245 0.1245% % Total: 100.0000 102.4600 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 5 of 10 28L - TSSOP Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Gold Wire and NiPdAu Lead Finish Material Purpose of Use 7440-50-8 7440-21-3 7439-95-4 Trade Secret Trade Secret Trade Secret Trade Secret 7440-22-4 7440-02-0 7440-05-3 7440-57-5 Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 85954-11-6 26834-02-6 Trade Secret 1333-86-4 60676-86-0 30.7786 0.2402 0.0584 % weight of substance per Homogenous material 94.8200% 0.7400% 0.1800% 0.0292 0.0900% 281 0.0281% 0.0097 0.0300% 94 0.0094% 0.0097 0.0300% 94 0.0094% 0.0032 0.0100% 31 0.0031% 1.3309 0.0269 0.0041 0.0090 4.1000% 67.3000% 10.2700% 22.4300% 12,797 259 40 86 1.2797% 0.0259% 0.0040% 0.0086% 0.0194 7.7500% 186 0.0186% 0.0097 3.8800% 93 0.0093% 0.0025 1.0100% 24 0.0024% 0.0097 3.8800% 93 0.0093% 0.0097 3.8800% 93 0.0093% 0.0013 0.5200% 12 0.0012% 0.0038 1.5300% 37 0.0037% 0.1939 3.5600 0.8400 3.0083 2.6673 77.5500% 100.0000% 100.0000% 4.5000% 3.9900% 1,864 34,231 8,077 28,925 25,647 0.1864% 3.4231% 0.8077% 2.8925% 2.5647% 0.8691 1.3000% 8,356 0.8356% 0.1337 60.1717 0.2000% 90.0100% 1,286 578,574 0.1286% 57.8574% Package Weight (mg): 104.0000 % Total: 100.0000 Substance Composition Cu Si Mg Polymide Leadframe Base Material NBR Bismaleimide Phenol resin Lead Finish External Plating Ag Ni Pd Au Acrylic resin Polybutadiene derivative Butadiene copolymer Die Attach Adhesive Epoxy Resin Acrylate Peroxide Additive Die Wire Circuit Interconnect Mold Compound Encapsulation Silver Si Au Epoxy resin Phenol resin Aromatic Phosphate Carbon black Silica CAS Number Weight by mg 295,948 2,310 562 % weight of substance per package 29.5948% 0.2310% 0.0562% PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 6 of 10 28L - TSSOP Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper wire with Pure Sn Lead Finish Material Purpose of Use 7440-50-8 7440-21-3 7440-02-0 7439-95-4 7440-22-4 Trade Secret Trade Secret Trade Secret Trade Secret 29.9252 0.2306 1.0109 0.0569 0.3285 % weight of substance per Homogenous material 94.7300% 0.7300% 3.2000% 0.1800% 1.0400% 0.0284 0.0900% 277 0.0277% 0.0032 0.0100% 31 0.0031% 0.0032 0.0100% 31 0.0031% 0.0032 0.0100% 31 0.0031% Sn 7440-31-5 1.8000 100.0000% 17,568 1.7568% Silver Epoxy resin A 7440-22-4 9003-36-5 Trade Secret Trade Secret Trade Secret Trade Secret 461-58-5 Trade Secret 7440-21-3 7440-50-8 Trade Secret 0.2072 0.0112 74.0000% 4.0000% 2,022 109 0.2022% 0.0109% 0.0168 6.0000% 164 0.0164% 0.0112 4.0000% 109 0.0109% 0.0168 6.0000% 164 0.0164% 0.0140 5.0000% 137 0.0137% 0.0014 0.5000% 14 0.0014% 0.0014 0.5000% 14 0.0014% 4.3500 0.6500 100.0000% 100.0000% 42,456 6,344 4.2456% 0.6344% 3.1895 5.0000% 31,129 3.1129% 29690-82-2 3.1895 5.0000% 31,129 3.1129% 3.1895 5.0000% 31,129 3.1129% 3.1895 5.0000% 31,129 3.1129% 0.1914 44.2702 6.3790 0.1914 0.3000% 69.4000% 10.0000% 0.3000% 1,868 432,073 62,258 1,868 0.1868% 43.2073% 6.2258% 0.1868% % Total: 100.0000 Substance Composition Cu Si Ni Mg Ag Leadframe Base Material Polyimide NBR Bismaleimide Phenol resin Lead Finish External Plating Epoxy resin B Diluent A Die Attach Adhesive Diluent B Phenolic Hardener Dicyandiamide Organic peroxide Die Wire Circuit Interconnect Si Cu Epoxy resin A Epoxy,Cresol Novolac Mold Compound Phenol resin Encapsulation Metal Hydroxide Carbon Black Silica Fused Silica Fused Silica,crystalline CAS Number Trade Secret Trade Secret 1333-86-4 60676-86-0 76361-86-9 14808-60-7 Package Weight (mg): Weight by mg 102.4601 292,068 2,251 9,866 555 3,206 % weight of substance per package 29.2068% 0.2251% 0.9866% 0.0555% 0.3206% PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 7 of 10 28L - TSSOP Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tube Others Material Plastic Tube End Pin End Plug Shielding Bag Lead PPM <2.0 <2.0 <2.0 <2.0 Cadmium PPM <2.0 <2.0 <2.0 < 2.0 Cr VI PPM <2.0 <2.0 <2.0 < 2.0 Mercury PPM <2.0 <2.0 <2.0 < 2.0 PBB PPM <0.0005 <0.0005 <0.0005 < 5.0 PBDE PPM <0.0005 <0.0005 <0.0005 < 5.0 Analysis Report (Note2) CoA-PLTB-R CoA-ENDP-R CoA-EPLG-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 8 of 10 28L - TSSOP Pb-Free Package Document History Page Document Title: Document Number: 28L TSSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04255 Rev. ECN No. Orig. of Change ** 390637 YXP *A 401531 GFJ *B 2612843 MAHA *C 3068046 JARG *D 3412074 JARG *E 3645886 UDR *F 3657808 JARG Description of Change New document. Added PMDD on header. Added Pure Sn Lead Finish in Assembly Site 2 under section 1-A. Added natural impurity in note 3 and note 4. Added Assembly site 2 package information. Added qualified indirect materials applicable to assembly site 2 and updated analysis result. Updated Cypress logo. Added % weight of substance per homogeneous material on the material composition tables for assembly sites 1 and 2. Changed CoA-SP28-T to CoA-ZZ28-T. Revised the material composition table for OSE Taiwan’s pure tin lead finish. Added Au weight in assembly site 2’s material composition table for NiPdAu lead finish. Recalculated PPM and % weight of substance per package for assembly site 2’s material composition table (NiPdAu lead finish). Updated and added Lead, Cr +VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials for assembly sites 1 and 2. Changed E-CML to WEB in distribution list. Corrected computation of Material Composition for Assembly Sites 1 and 2 Interchanged Silica and Carbon Black on the Material Composition table of Assembly Site 2 (NiPdAu Finish) Re-align table format for Assembly sites 1 and 2 Material Composition Table Updated Material Composition Tables for Assembly Site 1 – Table B and Assembly Site 2 – Tables B1 and B2 to reflect 4 decimal places on values. Added B3 and B4 on Site 2 with reference QTP # 120406. Changed reference QTP from 120406 to 120605. Change wire on Assembly Site 2: B3 from Au to Cu. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 9 of 10 28L - TSSOP Pb-Free Package Document History Page Document Title: Document Number: 28L TSSOP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04255 Rev. ECN No. Orig. of Change *G 3818165 JARG *H 3931638 UDR *I 4066912 YUM *J 5048322 MRB SLLO Description of Change Removed Material Composition for Assembly Site 4:B4. Copper Wire with NiPdAu finish for TSSOP28 (ZZ28) package is not qualified at OSE. Assembly Site 1: Corrected % weight of substance per package to meet the total of 100.0000% Assembly Site 2-B1 and B2: Corrected % weight of substance per package to meet the total of 100.0000% Assembly Site 2-B3: Changed CAS number of Silica Fused from 7631-86-9 to 76361-86-9 Added B2 on Package Weight – Site 1. Added QTP # 124204 on Assembly Site 1 Package Qualification Reports. Specified Assembly Site 1 B1 Material Composition is using Au Wire with NiPdAu and Hitachi Mold Compound. Added B2 on Assembly Site 1 Material Composition. Added assembly site name in the assembly heading in site 1 and 2. Changed Assembly code to assembly site name in site 1 and 2. Changed CAS # from “---------“ to Trade Secret Removed distribution and posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04255 Rev. *J Page 10 of 10