49L – WLCSP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 FN 10.3529mg Body Size (mm) 3.085X3.25X0.55 MM SUMMARY The 49ball-WLCSP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY8C21434A-24LKXI) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: DecaTechnoligies Inc. Philippines (Decatech) Package Qualification Report # 140907 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. SUBSTANCES / COMPOUNDS Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) PolybrominatedDiphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-FN49Decatech As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-96110 Rev. *A Page 1 of 4 49L – WLCSP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Purpose Substance Composition Polybenzoxazole1 Dielectric Proprietary Polybenzoxazole2 Dielectric Proprietary CAS Number Weight by mg % weight of substance per Homogenou s material PPM % weight of substance per package Seed Layer Ti Trade Secret Trade Secret 7440-32-6 Seed Layer W 7440-33-7 0.0043 35.4000 419 0.0420 Seed Layer Cu 7440-50-8 0.0074 60.6700 719 0.0720 Interconnect Cu 7440-50-8 0.1488 100.0000 14378 1.4380 Seed Layer Ti 7440-32-6 0.0002 0.1400 20 0.0020 Seed Layer W 7440-33-7 0.0018 1.2500 182 0.0180 Seed Layer Cu 7440-50-8 0.0032 2.1400 311 0.0310 UBM Cu 7440-50-8 0.1450 96.4700 14009 1.4010 Interconnect Sn 7440-31-5 2.8545 95.5000 275700 27.5700 Interconnect Ag 7440-22-4 0.1195 4.0000 11548 1.1550 Interconnect Cu 7440-50-8 0.0149 0.5000 1443 0.1440 Die Circuit Si 7440-21-3 6.5411 100.0000 631772 63.1770 Top Surface Laminate Mark Surface Proprietary Trade Secret 0.3661 100.0000 35365 3.5365 % Total: 100.0000 RDL Seed Layer Copper Under Bump Metallization Solder Ball Package Weight (mg): 0.0762 100.0000 7367 0.7367 0.0695 100.0000 6718 0.6718 0.0004 3.9300 47 0.0050 10.3529 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-96110 Rev. *A Page 2 of 4 49L – WLCSP Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Others Material Cover tape Carrier tape Plastic Reel Shielding bag Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 Cadmiu m PPM < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM PBDE PPM Analysis Report (Note2) - - CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-SBAG-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-96110 Rev. *A Page 3 of 4 49L – WLCSP Pb-Free Package Document History Page Document Title: 49L WLCSP (3.085X3.25X0.55 MM)- PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET Document Number: 001-96110 Rev. ECN No. ** *A 4631775 5123002 Orig. of Change JVP HLR Description of Change New Specification Changed the substances with “------------- “to “Trade Secret Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-96110 Rev. *A Page 4 of 4