48-TFBGA (8 X 10 mm) Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BA 210.9900 mg 8 x 10 mm N/A Body Size (mil/mm) Package Weight – Site 2 SUMMARY The 48-TFBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 044501, 021801, 021113 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 9,9996 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05127 Rev.*D Page 1 of 4 48-TFBGA (8 X 10 mm) Non Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Substance Composition CAS Number Weight by mg SiO2 60676-86-0 Acrylic 29690-82-2 6.4980 Epoxy 68541-56-0 Bisphenol Triazol Cu 13676-54-5 25722-66-1 7440-50-8 5.1984 9.7470 11.3715 23.6527 Ni 7440-02-0 Au Br Sn Pb Ag Epoxy Resin Functionalized Ester Diester Si Au Silica Fused Epoxy Resin Phenolic Resin Silica Mixed Siloxanes Brominated Resin Silica Quartz Carbon Black Silica Cristobalite Antimony Trioxide 7440-57-5 7726-95-6 7440-31-5 7439-92-1 7440-22-4 ---------------------------------------------------------7440-21-3 7440-57-5 60676-86-0 --------------------------------------7631-86-9 --------------------------------------14808-60-7 1333-86-4 14464-46-1 1309-64-4 Package Weight (mg): 7.1478 0.9747 0.3249 0.0650 3.5910 2.1090 23.8527 1.7149 1.7149 3.8975 27.3500 2.1700 55.7270 9.9513 3.9805 3.9805 1.5922 1.5922 0.7961 0.3981 0.7961 0.7961 210.9900 % weight of substance per Homogenous material 11.0000% 10.0000% 8.0000% 15.0000% 17.5000% 36.4000% 1.5000% 0.5000% 0.1000% 63.0000% 37.0000% 76.5000% 5.5000% 5.5000% 12.5000% 100.0000% 100.0000% 70.0000% 12.5000% 5.0000% 5.0000% 2.0000% 2.0000% 1.0000% 0.5000% 1.0000% 1.0000% PPM 33,877 % weight of substance per package 3.3877% 30,798 3.0798% 24,638 46,197 53,896 112,104 2.4638% 4.6197% 5.3896% 11.2104% 4,620 1,540 308 17,020 9,996 113,051 8,128 8,128 18,472 129,627 10,285 264,122 47,165 18,866 18,866 7,546 7,546 3,773 1,887 3,773 3,773 0.4620% 0.1540% 0.0308% 1.7020% 0.9996% 11.3051% 0.8128% 0.8128% 1.8472% 12.9627% 1.0285% 26.4122% 4.7165% 1.8866% 1.8866% 0.7546% 0.7546% 0.3773% 0.1887% 0.3773% 0.3773% % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05127 Rev.*D Page 2 of 4 48-TFBGA (8 X 10 mm) Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 --------- PBDE PPM <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 ----------- Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05127 Rev.*D Page 3 of 4 48-TFBGA (8 X 10 mm) Non Pb-Free Package Document History Page Document Title: DATASHEET Document Number: 48-TFBGA 8X10MM NON PB-FREE PACKAGE MATERIAL DECLARATION 001-05127 Rev. ECN No. Orig. of Description of Change Change ** 400641 GFJ New Specification *A 2569014 HLR Changed Cypress Logo. Added % weight of substance per Homogenous Material and % weight of substance per package on the Material Composition table. Completed the RoHS Substances namely; Lead Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. Added CAS No. of Bromine. Added the Weight and PPM of Silica Quartz. *B 2760908 HLR Changed CAS number of Gold. *C 3368656 HLR Updated the material composition table to reflect 4 decimal places on values. *D 4032141 YUM Added assembly site name in the Assembly heading. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05127 Rev.*D Page 4 of 4