STMICROELECTRONICS AM82731-003

AM82731-003
RF & MICROWAVE TRANSISTORS
S-BAND RADAR APPLICATIONS
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REFRACTORY/GOLD METALLIZATION
EMITTER SITE BALLASTED
10:1 VSWR CAPABILITY
LOW THERMAL RESISTANCE
INPUT/OUTPUT IMPEDANCE MATCHING
OVERLAY GEOMETRY
METAL/CERAMIC HERMETIC PACKAGE
POUT = 3.0 W. MIN. WITH 5.7 dB GAIN
BANDWIDTH = 400 MHz
.400 x .400 2NLFL (S042)
hermetically sealed
BRANDING
82731-3
ORDER CODE
AM 82731-003
PIN CONNECTION
DESCRIPTION
The AM82731-003 device is a medium power silicon
bipolar NPN transistor specifically designed for SBand radar pulsed driver applications.
This device is capable of operation over a wide range
of pulse widths, duty cycles, and temperatures and
can withstand a 10:1 output VSWR. Low RF thermal
resistance, refractory/gold metallization, and automatic wire bonding techniques ensure high reliability
and product consistency.
The AM82731-003 is supplied in the hermetic metal/ceramic package with internal input/output impedance matching circuitry, and is intended for military
and other high reliability applications.
1. Collector
2. Base
3. Emitter
4. Base
ABSOLUTE MAXIMUM RATINGS (T case = 25°C)
Symbol
PDISS
IC
VCC
TJ
T STG
Parameter
Value
Unit
23
W
Device Current*
0.9
A
Collector-Supply Voltage*
34
V
Junction Temperature (Pulsed RF Operation)
250
°C
− 65 to +200
°C
6.5
°C/W
Power Dissipation*
(TC ≤ 100°C)
Storage Temperature
THERMAL DATA
RTH(j-c)
Junction-Case Thermal Resistance
*Applies only to rated RF amplifier operation
August 1992
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AM82731-003
ELECTRICAL SPECIFICATIONS (T case = 25 ° C)
STATIC
Value
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
BV CBO
IC = 2mA
IE = 0mA
50
—
—
V
BV EBO
IE = 1mA
IC = 0mA
3.5
—
—
V
BV CER
IC = 2mA
RBE = 10Ω
50
—
—
V
—
—
2.0
mA
IC = 200mA
10
—
—
—
Test Conditions
Min.
Typ.
Max.
Unit
ICES
VCE = 30V
hFE
VCE = 5V
DYNAMIC
Value
Symbol
POUT
ηC
f = 2.7 — 3.1GHz
PIN = 0.8W
VCC = 30V
3.0
4.0
—
W
f = 2.7 — 3.1GHz
PIN = 0.8W
VCC = 30V
27
37
—
%
GPB
f = 2.7 — 3.1GHz
PIN = 0.8W
VCC = 30V
5.7
7.0
—
dB
Note:
Pulse W idth
Duty Cycle
=
=
100 µ S
10%
TYPICAL PERFORMANCE
TYPICAL BROADBAND
PERFORMANCE
PEAK POWER
OUTPUT
(W)
1.0
0.8
0.6
COLLECTOR
EFFICIENCY
(%)
2/4
0.6
0.8
1.0
AM82731-003
IMPEDANCE DATA
TYPICAL INPUT
IMPEDANCES
ZIN
TYPICAL COLLECTOR
LOAD IMPEDANCES
ZCL
FREQ.
ZIN(Ω)
ZCL(Ω)
L = 2.7 GHz
11.5 + j 14.0
22.5 + j 5.5
• = 2.9 GHz
M = 3.1 GHz
11.5 + j 12.5
19.5 + j 5.0
10.0 + j 15.5
14.5 + j 2.0
• = 3.3 GHz
H = 3.5 GHz
11.0 + j 19.0
14.5 − j 2.0
11.0 + j 20.5
17.5 − j 3.5
PIN = 0.8W
VCC = 30 V
Normalized at 50 ohms
TEST CIRCUIT
All dimensions are in inches.
Substrate material: .025 thick Al2O3 (Er = 9.6)
C1
C2
C3
: 100 pF Microwave Chip Capacitor
: 100 pF Microwave Chip Capacitor
(Note: Capacitor is mounted on its thin side)
: 1500 pF, RF Feedthru
C4
L1
L2
L3
:
:
:
:
100 µF, Electrolytic Capacitor
No. 32 Wire, 0.500 Inch Long
Printed RF Choke
Printed RF Choke
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AM82731-003
PACKAGE MECHANICAL DATA
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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