STB270N04 STB270N04-1 - STP270N04 N-CHANNEL 40V - 2.1mΩ - 160A - TO-220 - D2PAK - I2PAK STripFET™ Power MOSFET General features Type VDSS RDS(on) ID PTOT STB270N04-1 40V <2.9mΩ 120A 330W STB270N04 40V <2.5mΩ 160A 330W STP270N04 40V <2.9mΩ 120A 330W ■ 100% avalanche tested ■ Standard threshold drive 3 12 3 1 2 I²PAK TO-220 3 1 Description D²PAK This N-Channel enhancement mode MOSFET is the latest refinement of STMicroelectronic unique “Single Feature Size™“ strip-based process with less critical aligment steps and therefore a remarkable manufacturing reproducibility. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and low gate charge. Internal schematic diagram Applications ■ High current, switching application ■ Automotive Order codes Sales Type Marking Package Packaging STB270N04-1 B270N04 I²PAK TUBE STB270N04 B270N04 D²PAK TAPE & REEL STP270N04 P270N04 TO-220 TUBE February 2006 Rev3 1/14 www.st.com 14 Electrical ratings 1 STB270N04-1 - STB270N04 - STP270N04 Electrical ratings Table 1. Absolute maximum ratings Value Symbol Parameter Unit TO-220/I²PAK D²PAK VDS Drain-Source Voltage (V GS = 0) VGS Gate-Source Voltage ID(1) Drain Current (continuous) at T C = 25°C 120 160 A ID(1) Drain Current (continuous) at T C=100°C 120 160 A Drain Current (pulsed) 480 640 A IDM (2) PTOT 40 V ± 20 V Total Dissipation at T C = 25°C 330 W Derating Factor 2.2 W/°C dv/dt(3) Peak Diode Recovery voltage slope 3.5 V/ns EAS(4) Single Pulse Avalanche Energy 1 J TJ Operating Junction Temperature Storage Temperature -55 to 175 °C Tstg 1. Current limited by package 2. Pulse width limited by safe operating area 3. ISD ≤120A, di/dt ≤200A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX 4. Starting Tj=25°C, Id =80A, Vdd=32V Table 2. Thermal data Value Symbol Parameter Unit TO-220/I²PAK Rthj-case Thermal resistance junction-case Max Rthj-pcb(1) Thermal resistance Junction-pcb Max 0.45 °C/W -- 35 °C/W Rthj-a Thermal resistance junction-ambient Max 62.5 -- °C/W Tl Maximum lead temperature for soldering purpose (for 10 sec, 1.6mm from case) 300 -- °C 1. When mounted on 1inch² FR-4 board, 2 oz Cu. 2/14 D²PAK Rev3 STB270N04-1 - STB270N04 - STP270N04 2 Electrical characteristics Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol V(BR)DSS On/off states Parameter Drain-Source Breakdown Voltage Test Condictions Min. ID = 250µA, VGS= 0 Typ. Max. Unit 40 V IDSS VDS = Max Rating, Zero Gate Voltage Drain VDS = MaxRating Current (VGS = 0) @125°C 10 100 µA µA IGSS Gate Body Leakage Current (VDS = 0) ±200 nA 4 V VGS = ±20V VGS(th) Gate Threshold Voltage VDS= VGS, ID = 250µA RDS(on) Static Drain-Source On Resistance Table 4. VGS= 10V, ID= 80A 2 TO-220 I²PAK 2.5 2.9 mΩ D²PAK 2.1 2.5 mΩ Typ. Max. Unit Dynamic Symbol Parameter gfs (1) Forward Transconductance VDS =15V, ID = 80A 200 S Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS =25V, f=1 MHz, VGS=0 7400 1800 47 pF pF pF Ciss Coss Crss Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Condictions VDD=20V, ID = 160A VGS =10V (see Figure 2) Min. 110 27 25 150 nC nC nC 1. Pulsed: pulse duration=300µs, duty cycle 1.5% Rev3 3/14 Electrical characteristics Table 5. Symbol td(on) tr td(off) tf Table 6. Symbol STB270N04-1 - STB270N04 - STP270N04 Switching times Parameter Test Condictions VDD =20 V, ID= 80A, Turn-on Delay Time Rise Time RG=4.7Ω, VGS=10V (see Figure 14) VDD =20 V, ID= 80A, Turn-off Delay Time Fall Time RG=4.7Ω, VGS=10V (see Figure 14) Parameter Test Condictions 22 180 ns ns 110 45 ns ns D²PAK 160 A TO-220 I²PAK 120 A D²PAK 640 A TO-220 I²PAK 480 A 1.5 V Source-drain Current (pulsed) VSD(2) Forward on Voltage ISD=80A, VGS=0 Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD=160A, di/dt = 100A/µs, VDD=32V, Tj=150°C 1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300µs, duty cycle 1.5% 4/14 Unit Unit ISDM(1) IRRM Max. Max Source-drain Current Qrr Typ. Source drain diode ISD trr Min. Rev3 Min Typ. 70 225 3.2 ns nC A STB270N04-1 - STB270N04 - STP270N04 Electrical characteristics 2.1 Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Static drain-source on resistance Figure 6. Normalized BVDSS vs temperature Rev3 5/14 Electrical characteristics STB270N04-1 - STB270N04 - STP270N04 Figure 7. Gate charge vs gate-source voltage Figure 8. Figure 9. Normalized gate threshold voltage vs temperature Figure 10. Normalized on resistance vs temperature Figure 11. Source-drain diode forward characteristics 6/14 Capacitance variations Rev3 STB270N04-1 - STB270N04 - STP270N04 3 Test circuit Test circuit Figure 12. Switching times test circuit for resistive load Figure 13. Gate charge test circuit Figure 14. Test circuit for inductive load Figure 15. Unclamped Inductive load test switching and diode recovery times circuit Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform Rev3 7/14 Package mechanical data 4 STB270N04-1 - STB270N04 - STP270N04 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 8/14 Rev3 STB270N04-1 - STB270N04 - STP270N04 Package mechanical data TO-220 MECHANICAL DATA DIM. mm. MIN. inch TYP MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 0.154 0.645 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 Rev3 9/14 Package mechanical data STB270N04-1 - STB270N04 - STP270N04 TO-262 (I2PAK) MECHANICAL DATA mm. inch DIM. MIN. 10/14 MAX. MIN. A 4.40 TYP 4.60 0.173 TYP. 0.181 MAX. A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.034 b1 1.14 1.70 0.044 0.066 c 0.49 0.70 0.019 0.027 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 E 10 10.40 0.393 0.410 L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L2 1.27 1.40 0.050 0.055 Rev3 STB270N04-1 - STB270N04 - STP270N04 Package mechanical data D2PAK MECHANICAL DATA TO-247 MECHANICAL DATA mm. inch DIM. MIN. TYP MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067 C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 10.4 0.393 D1 E 8 0.315 10 E1 8.5 0.334 G 4.88 5.28 0.192 0.208 L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068 M 2.4 3.2 0.094 R 0.126 0.015 0º 4º 3 V2 0.4 1 Rev3 11/14 Packaging mechanical data 5 STB270N04-1 - STB270N04 - STP270N04 Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 MAX. B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 0.933 0.956 * on sales type 12/14 Rev3 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STB270N04-1 - STB270N04 - STP270N04 6 Revision history Revision history Table 7. Document revision history Date Revision Changes 07-Oct-2005 1 Initial release. 10-Nov-2005 2 Preliminary version 09-Feb-2006 3 Complete datasheet Rev3 13/14 STB270N04-1 - STB270N04 - STP270N04 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 14/14 Rev3