ETC BCP56-16T3

BCP56T1 Series
Preferred Devices
NPN Silicon
Epitaxial Transistor
These NPN Silicon Epitaxial transistors are designed for use in
audio amplifier applications. The device is housed in the SOT-223
package, which is designed for medium power surface mount
applications.
• High Current: 1.0 Amp
• The SOT-223 package can be soldered using wave or reflow. The
formed leads absorb thermal stress during soldering, eliminating the
possibility of damage to the die
• Available in 12 mm Tape and Reel
Use BCP56T1 to order the 7 inch/1000 unit reel
Use BCP56T3 to order the 13 inch/4000 unit reel
• PNP Complement is BCP53T1
• Device Marking
BCP56T1–10 = BH
BCP56–10T1 = BH–10
BCP56–16T1 = BH–16
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MEDIUM POWER
NPN SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT
COLLECTOR 2,4
BASE
1
EMITTER
3
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector-Emitter Voltage
VCEO
80
Vdc
Collector-Base Voltage
VCBO
100
Vdc
Emitter-Base Voltage
VEBO
5
Vdc
Collector Current
IC
1
Adc
Total Power Dissipation
@ TA = 25°C (Note 1.)
Derate above 25°C
PD
1.5
12
Watts
mW/°C
–65 to 150
°C
Operating and Storage
Temperature Range
TJ, Tstg
4
Thermal Resistance
Junction-to-Ambient
(surface mounted)
Maximum Temperature for
Soldering Purposes
Time in Solder Bath
BHxxx
2
3
CASE 318E
TO–261AA
STYLE 1
BHxxx = Device Code
xxx
= –10 or –16
ORDERING INFORMATION
THERMAL CHARACTERISTICS
Characteristic
1
MARKING DIAGRAM
Symbol
Max
Unit
RθJA
83.3
°C/W
TL
°C
Sec
260
10
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x
1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.
Device
Package
Shipping
BCP56T1
SOT–223
1000/Tape & Reel
BCP56T3
SOT–223
4000/Tape & Reel
BCP56–10T1
SOT–223
1000/Tape & Reel
BCP56–16T1
SOT–223
1000/Tape & Reel
BCP56–16T3
SOT–223
4000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
 Semiconductor Components Industries, LLC, 2000
September, 2000 – Rev. 2
1
Publication Order Number:
BCP56T1/D
BCP56T1 Series
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristics
Symbol
Min
Typ
Max
Unit
Collector-Base Breakdown Voltage
(IC = 100 µAdc, IE = 0)
V(BR)CBO
100
–
–
Vdc
Collector-Emitter Breakdown Voltage
(IC = 1.0 mAdc, IB = 0)
V(BR)CEO
80
–
–
Vdc
Emitter-Base Breakdown Voltage
(IE = 10 µAdc, IC = 0)
V(BR)EBO
5.0
–
–
Vdc
Collector-Base Cutoff Current
(VCB = 30 Vdc, IE = 0)
ICBO
–
–
100
nAdc
Emitter-Base Cutoff Current
(VEB = 5.0 Vdc, IC = 0)
IEBO
–
–
10
µAdc
25
40
63
100
25
–
–
–
–
–
–
250
160
250
–
OFF CHARACTERISTICS
ON CHARACTERISTICS (Note 2.)
DC Current Gain
(IC = 5.0 mA, VCE = 2.0 V)
(IC = 150 mA, VCE = 2.0 V)
(IC = 500 mA, VCE = 2.0 V)
hFE
All Part Types
BCP56T1
BCP56-10T1
BCP56-16T1
All Types
–
Collector-Emitter Saturation Voltage
(IC = 500 mAdc, IB = 50 mAdc)
VCE(sat)
–
–
0.5
Vdc
Base-Emitter On Voltage
(IC = 500 mAdc, VCE = 2.0 Vdc)
VBE(on)
–
–
1.0
Vdc
fT
–
130
–
MHz
DYNAMIC CHARACTERISTICS
Current-Gain – Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc, f = 35 MHz)
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
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2
BCP56T1 Series
TYPICAL ELECTRICAL CHARACTERISTICS
hFE, DC CURRENT GAIN
1000
TJ = 125°C
TJ = 25°C
100
10
TJ = -55°C
1
10
100
1000
IC, COLLECTOR CURRENT (mA)
1000
80
60
C, CAPACITANCE (pF)
f,
T CURRENTGAIN BANDWIDTH PRODUCT (MHz)
Figure 1. DC Current Gain
100
TJ = 25°C
40
Cibo
20
10
8.0
6.0
10
1.0
10
100
IC, COLLECTOR CURRENT (mA)
Cobo
4.0
0.1
1000
0.2
0.5 1.0 2.0
5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)
1.0
V, VOLTAGE (VOLTS)
0.8
TJ = 25°C
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.5
1.0
2.0
100
5.0
10
20
50
IC, COLLECTOR CURRENT (mA)
200
100
Figure 3. Capacitance
VCE , COLLECTOREMITTER VOLTAGE (VOLTS)
Figure 2. Current-Gain – Bandwidth Product
50
500
1.0
TJ = 25°C
0.8
0.6
IC = 10mA
50
mA
100mA
250mA
500mA
0.4
0.2
0
0.05
Figure 4. “On” Voltages
0.1
0.2
0.5
5.0
10
1.0 2.0
IC, COLLECTOR CURRENT (mA)
20
Figure 5. Collector Saturation Region
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3
50
BCP56T1 Series
INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.15
3.8
0.079
2.0
0.091
2.3
0.248
6.3
0.091
2.3
0.079
2.0
0.059
1.5
0.059
1.5
0.059
1.5
inches
mm
SOT-223
SOT-223 POWER DISSIPATION
collector pad, the power dissipation can be increased.
Although the power dissipation can almost be doubled with
this method, area is taken up on the printed circuit board
which can defeat the purpose of using surface mount
technology. A graph of RθJA versus collector pad area is
shown in Figure 6.
The power dissipation of the SOT-223 is a function of the
collector pad size. This can vary from the minimum pad
size for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the SOT-223 package, PD can be calculated as
follows:
R
JA , Thermal Resistance, Junction
to Ambient (C/W)
PD =
160
Board Material = 0.0625″
G10/FR4, 2 oz Copper
140
TJ(max) – TA
TA = 25°C
0.8 Watts
° 120
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 1.5 watts.
1.25 Watts*
1.5 Watts
100
θ
80
0.0
PD = 150°C – 25°C = 1.5 watts
83.3°C/W
*Mounted on the DPAK footprint
0.2
0.4
0.6
A, Area (square inches)
0.8
1.0
Figure 6. Thermal Resistance versus Collector
Pad Area for the SOT-223 Package (Typical)
The 83.3°C/W for the SOT-223 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 1.5 watts.
There are other alternatives to achieving higher power
dissipation from the SOT-223 package. One is to increase
the area of the collector pad. By increasing the area of the
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
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4
BCP56T1 Series
SOLDER STENCIL GUIDELINES
or stainless steel with a typical thickness of 0.008 inches.
Prior to placing surface mount components onto a printed
The stencil opening size for the SOT-223 package should
circuit board, solder paste must be applied to the pads. A
be the same as the pad size on the printed circuit board, i.e.,
solder stencil is required to screen the optimum amount of
a 1:1 registration.
solder paste onto the footprint. The stencil is made of brass
SOLDERING PRECAUTIONS
• The soldering temperature and time should not exceed
The melting temperature of solder is higher than the rated
260°C for more than 10 seconds.
temperature of the device. When the entire device is heated
• When shifting from preheating to soldering, the
to a high temperature, failure to complete soldering within
maximum temperature gradient should be 5°C or less.
a short time could result in device failure. Therefore, the
• After soldering has been completed, the device should
following items should always be observed in order to
be allowed to cool naturally for at least three minutes.
minimize the thermal stress to which the devices are
Gradual cooling should be used as the use of forced
subjected.
cooling will increase the temperature gradient and
• Always preheat the device.
result in latent failure due to mechanical stress.
• The delta temperature between the preheat and
• Mechanical stress or shock should not be applied
soldering should be 100°C or less.*
during cooling
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
* Soldering a device without preheating can cause
temperature ratings as shown on the data sheet. When
excessive thermal shock and stress which can result in
using infrared heating with the reflow soldering
damage to the device.
method, the difference should be a maximum of 10°C.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
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5
BCP56T1 Series
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
STEP 5
STEP 6 STEP 7
STEP 4
HEATING
VENT COOLING
HEATING
ZONES 3 & 6 ZONES 4 & 7
205° TO
SPIKE"
SOAK"
219°C
170°C
PEAK AT
SOLDER
160°C
JOINT
150°C
100°C
140°C
100°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TMAX
TIME (3 TO 7 MINUTES TOTAL)
Figure 7. Typical Solder Heating Profile
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BCP56T1 Series
PACKAGE DIMENSIONS
SOT–223
(TO–261AA)
PLASTIC PACKAGE
CASE 318E–04
ISSUE H
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
S
1
2
3
B
D
L
G
J
C
0.08 (0003)
H
M
K
INCHES
DIM MIN
MAX
A
0.249
0.263
B
0.130
0.145
C
0.060
0.068
D
0.024
0.035
F
0.115
0.126
G
0.087
0.094
H 0.0008 0.0040
J
0.009
0.014
K
0.060
0.078
L
0.033
0.041
M
0
10 S
0.264
0.287
STYLE 1:
PIN 1.
2.
3.
4.
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7
BASE
COLLECTOR
EMITTER
COLLECTOR
MILLIMETERS
MIN
MAX
6.30
6.70
3.30
3.70
1.50
1.75
0.60
0.89
2.90
3.20
2.20
2.40
0.020
0.100
0.24
0.35
1.50
2.00
0.85
1.05
0
10 6.70
7.30
BCP56T1 Series
Thermal Clad is a trademark of the Bergquist Company
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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BCP56T1/D