STPS10170C High voltage power Schottky rectifier Main product characteristics A1 K IF(AV) 2x5A VRRM 170 V Tj 175° C VF (typ) 0.69 V A2 Features and benefits ■ High junction temperature capability ■ Good trade-off between leakage current and forward voltage drop ■ Low leakage current ■ Avalanche capability specified A2 A2 A1 K TO-220AB STPS10170CT I PAK STPS10170CR K K Description A1 K 2 A2 A2 Dual centre tab Schottky rectifier designed for high frequency switch mode power supplies. A1 DPAK STPS10170CB A1 D2PAK STPS10170CG Order codes July 2006 Part Number Marking STPS10170CT STPS10170CT STPS10170CG STPS10170CG STPS10170CG-TR STPS10170CG STPS10170CR STPS10170CR STPS10170CB PS10170CB STPS10170CB-TR PS10170CB Rev 1 1/10 www.st.com Characteristics STPS10170C 1 Characteristics Table 1. Absolute ratings (limiting values per diode, Tamb = 25° C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 170 V IF(RMS) RMS forward current 10 A IF(AV) Average forward current, δ = 0.5 Tc = 155° C IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal PARM Relative peak avalanche power Tj = 25° C Tstg Tj dV/dt Table 2. 5 Total package 10 A Parameter Rth(c) Coupling °C 175 °C 10 000 V/µs Value Unit 4 Total 2.4 °C/W 0.7 Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C Min. Typ VR = VRRM Max. Unit 10 µA 10 mA 0.92 IF = 5 A 0.69 0.75 V 1 IF = 10 A 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.02 x IF2(RMS) 2/10 -65 to + 175 Thermal parameters Per diode VF(2) W thermal runaway condition for a diode on its own heatsink Junction to case IR(1) 3100 Critical rate of rise of reverse voltage Rth(j-c) Symbol A Maximum operating junction temperature(1) Symbol Table 3. 75 tp = 1µs Storage temperature range dP tot 1 --------------- < -------------------------dT j R th ( j – a ) 1. Per diode 0.79 0.85 STPS10170C Figure 1. Characteristics Conduction losses versus average Figure 2. forward current (per diode) PF(AV)(W) Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV)(A) 5 6.0 5.5 δ=0.5 δ=0.2 δ=0.1 Rth(j-a)=Rth(j-c) 5.0 4 4.5 δ=0.05 4.0 δ=1 3 3.5 3.0 Rth(j-a)=15°C/W 2.5 2 2.0 1.5 T 1 T 1.0 δ=tp/T IF(AV)(A) 0 0 1 Figure 3. 2 0.5 tp δ=tp/T tp Tamb (°C) 0.0 3 4 5 0 6 Normalized avalanche power derating versus pulse duration 25 Figure 4. PARM(tp) PARM(1µs) 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 0.001 0.01 0.1 Figure 5. 80 Tj(°C) tp(µs) 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) 50 Figure 6. 75 100 125 150 Relative variation of thermal impedance, junction to case versus pulse duration Zth(j-c)/Rth(j-c) IM(A) 1.0 Single pulse TO-220AB DPAK I²PAK D²PAK 70 60 50 TC=50°C 40 TC=75°C 30 20 TC=125°C IM 10 t δ =0.5 0 1.E-03 t(s) tp(s) 0.1 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 3/10 Characteristics Figure 7. STPS10170C Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. IR(µA) 1.E+05 Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C 1.E+04 Tj=175°C 1.E+03 Tj=150°C 1.E+02 Tj=125°C 100 1.E+01 Tj=75°C 1.E+00 1.E-01 Tj=25°C 0 25 Figure 9. 100.0 VR(V) VR(V) 1.E-02 50 75 10 100 125 150 175 Forward voltage drop versus forward current (per diode) 1 10 100 1000 Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm - DPAK) Rth( -a) (°C/W) IFM(A) 100 DPAK 90 90.0 80 80.0 70 70.0 Tj=125°C (Maximum values) 60.0 60 50.0 j 50 40.0 Tj=125°C (Typical values) 40 30.0 30 Tj=25°C (Maximum values) 20.0 20 10.0 10 VFM(V) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 SCU(cm²) 0 0 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm - D2PAK) 80 Rth(j-a) (°C/W) D²PAK 70 60 50 40 30 20 10 SCU(cm²) 0 0 4/10 5 10 15 20 25 30 35 40 5 10 15 20 25 30 35 40 STPS10170C 2 Package dimensions Package dimensions Epoxy meets UL94, V0 Table 4. T0-220AB dimensions Dimensions Ref. A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 M G1 E G Inches Min. Max. Min. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 L2 F Millimeters Max. 10.40 0.393 0.409 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/10 Package dimensions Table 5. STPS10170C I2PAK dimensions Dimensions Ref. c2 L2 D L1 A1 b1 L b e e1 6/10 c Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 A E Millimeters STPS10170C Package dimensions Table 6. DPAK dimensions Dimensions Ref. E C2 L2 Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 D B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 R H L4 A1 B R G Inches Min. A B2 Millimeters C A2 0.60 MIN. L2 V2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 12. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 7/10 Package dimensions Table 7. STPS10170C D2PAK dimensions Dimensions Ref. E C2 D L3 A1 B2 R C B Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A L2 Millimeters G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STPS10170C 3 Ordering information Ordering information Part number Marking Package Weight Base qty Delivery mode STPS10170CT STPS10170CT TO-220AB 2.23 g 50 Tube STPS10170CG STPS10170CG D PAK 1.48 g 50 Tube STPS10170CG-TR STPS10170CG D2PAK 1.48 g 1000 Tape and reel STPS10170CB PS10170CB DPAK 0.3 g 75 Tube STPS10170CB-TR PS10170CB DPAK 0.3 g 2500 Tape and reel 1.49 g 50 Tube STPS10170CR 4 2 STPS10170CR 2 I PAK Revision history Date Revision 13-Jul-2006 1 Description of changes First issue. 9/10 STPS10170C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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