VISHAY SI4824DY

Si4824DY
Vishay Siliconix
Asymmetric N-Channel, Reduced Qg, Fast Switching MOSFET
VDS (V)
N-Channel 1
30
N-Channel 2
rDS(on) ()
ID (A)
0.040 @ VGS = 10 V
4.7
0.065 @ VGS = 4.5 V
3.7
0.0175 @ VGS = 10 V
9
0.027 @ VGS = 4.5 V
7.3
D1
D2
D2 D2
SO-8
S1
1
8
D1
G1
2
7
D2
S2
3
6
D2
G2
4
5
D2
G1
G2
Top View
S1
S2
N-Channel MOSFET 1
N-Channel MOSFET 2
Parameter
Symbol
N-Channel 1
N-Channel 2
Drain-Source Voltage
VDS
30
30
Gate-Source Voltage
VGS
20
20
4.7
9
TA = 25C
Continuous Drain Current (TJ = 150C)a, b
TA = 70C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a, b
TA = 25C
Maximum Power Dissipationa, b
TA = 70C
Operating Junction and Storage Temperature Range
ID
Unit
V
3.7
7.2
IDM
40
60
IS
1.2
2.0
1.4
2.25
0.9
1.5
TJ, Tstg
–55 to 150
–55 to 150
C
Symbol
Typical
Maximum
Unit
PD
A
W
Parameter
N-Ch 1
t 10 sec
90
Steady State
M i
Maximum
Junction-to-Ambient
J
i
A bi a
N-Ch 2
t 10 sec
125
RthJA
Steady State
55
C/W
80
Notes
a. Surface Mounted on FR4 Board.
b. t 10 sec.
For SPICE model information via the Worldwide Web: http://www.vishay.com/www/product/spice.htm
Document Number: 70800
S-56946—Rev. C, 23-Nov-98
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2-1
Si4824DY
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
VGS(th)
IGSS
VDS = VGS, ID = 250 mA
VDS = 0 V, VGS = "20 V
VDS = 24 V, VGS = 0 V
Z
G
V l
D i Current
C
Zero
Gate
Voltage
Drain
IDSS
VDS = 24 V, VGS = 0 V, TJ = 55C
On-State Drain Currenta
a
D i S
O S
R i
Drain-Source
On-State
Resistance
Forward Transconductancea
Diode Forward Voltagea
ID(on)
VDS w 5 V, VGS = 10 V
N-Ch 1
1.0
N-Ch 2
1.0
V
N-Ch 1
"100
N-Ch 2
"100
N-Ch 1
1
N-Ch 2
1
N-Ch 1
5
N-Ch 2
5
N-Ch 1
20
N-Ch 2
30
VSD
A
mA
A
VGS = 10 V, ID = 4.7 A
N-Ch 1
0.033
0.040
VGS = 10 V, ID = 9 A
N-Ch 2
0.014
0.0175
VGS = 4.5 V, ID = 3.7 A
N-Ch 1
0.048
0.065
VGS = 4.5 V, ID = 7.3 A
N-Ch 2
0.020
0.027
VDS = 15 V, ID = 4.7 A
N-Ch 1
12
VDS = 15 V, ID = 9 A
N-Ch 2
25
IS = 1.2 A, VGS = 0 V
N-Ch 1
0.7
1.2
IS = 2.0 A, VGS = 0 V
N-Ch 2
0.7
1.2
N-Ch 1
6.5
10
N-Ch 2
17.5
27
N-Ch 1
3.0
N-Ch 2
7.5
N-Ch 1
2.5
N-Ch 2
6.5
N-Ch 1
10
20
N-Ch 2
15
30
N-Ch 1
12
20
N-Ch 2
15
30
N-Ch 1
20
35
N-Ch 2
45
70
N-Ch 1
10
20
N-Ch 2
20
35
IF = 1.2 A, di/dt = 100 A/ms
N-Ch 1
40
80
IF = 2.0 A, di/dt = 100 A/ms
N-Ch 2
40
80
rDS(on)
gfs
nA
W
S
V
Dynamicb
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Qg
Qgs
N-Channel 2
VDS = 15 V, VGS = 5 V, ID = 9 A
Qgd
td(on)
tr
N Ch
N-Channel
l1
VDD = 15 V, RL =15 W
ID ^ 1 A,
A VGEN = 10 V,
V RG = 6 W
td(off)
N-Channel 2
VDD = 15 V, RL = 15 W
ID ^ 1 A,
A VGEN = 10 V
V, RG = 6 W
Rise Time
Turn-Off Delay Time
N-Channel
N
Ch
l1
VDS = 15 V
V, VGS = 5 V
V, ID = 4.7
47A
Fall Time
Source-Drain Reverse Recovery Time
tf
trr
nC
C
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. For design aid only; not subject to production testing.
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Document Number: 70800
S-56946—Rev. C, 23-Nov-98
Si4824DY
Vishay Siliconix
Output Characteristics
Transfer Characteristics
40
40
TC = –55C
VGS = 10 thru 6 V
I D – Drain Current (A)
I D – Drain Current (A)
25C
30
5V
20
4V
10
2V
30
125C
20
10
3V
0
0
0
1
2
3
4
0
1
VDS – Drain-to-Source Voltage (V)
2
5
6
7
Capacitance
On-Resistance vs. Drain Current
1200
1000
0.08
Ciss
C – Capacitance (pF)
r DS(on) – On-Resistance ( )
4
VGS – Gate-to-Source Voltage (V)
0.10
VGS = 4.5 V
0.06
VGS = 10 V
0.04
0.02
800
600
400
Coss
Crss
200
0
0
0
10
20
30
40
0
6
Gate Charge
10
1.55
r DS(on) – On-Resistance ( )
(Normalized)
VDS = 15 V
ID = 4.7 A
8
6
4
2
0
0
3
6
9
Qg – Total Gate Charge (nC)
Document Number: 70800
S-56946—Rev. C, 23-Nov-98
12
18
24
30
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
V GS – Gate-to-Source Voltage (V)
3
12
1.35
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 4.7 A
1.15
0.95
0.75
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (C)
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Si4824DY
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
40
0.10
0.08
r DS(on) – On-Resistance ( W )
I S – Source Current (A)
TJ = 150C
10
TJ = 25C
ID = 4.7 A
0.06
0.04
0.02
0
1
0.4
0
0.8
0
1.6
1.2
VSD – Source-to-Drain Voltage (V)
2
4
6
8
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
0.45
30
0.25
ID = 250 mA
18
Power (W)
V GS(th) Variance (V)
24
0.05
–0.15
–0.35
12
–0.55
6
–0.75
–0.95
–50
0
–25
0
25
50
75
100
125
150
0.01
0.10
1
TJ – Temperature (C)
10
100
600
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Notes:
0.05
PDM
0.02
0.01
t1
Single Pulse
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 125C/W
3. TJM – TA = PDMZthJA(t)
4. Surface Mounted
0.001
10–4
10–3
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
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2-4
Document Number: 70800
S-56946—Rev. C, 23-Nov-98
Si4824DY
Vishay Siliconix
Output Characteristics
Transfer Characteristics
60
60
50
VGS = 10 thru 5 V
I D – Drain Current (A)
I D – Drain Current (A)
50
40
30
4V
20
10
40
30
20
TC = 125C
10
2V
25C
–55C
3V
0
0
0
1
2
3
4
0
1
2
3
4
5
6
VGS – Gate-to-Source Voltage (V)
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
0.040
3000
C – Capacitance (pF)
r DS(on) – On-Resistance ( )
0.035
0.030
0.025
VGS = 4.5 V
0.020
VGS = 10 V
2300
Ciss
1600
900
Coss
0.015
Crss
0.01
200
0
10
20
30
40
50
60
0
6
Gate Charge
1.55
1.45
8
r DS(on) – On-Resistance ( )
(Normalized)
V GS – Gate-to-Source Voltage (V)
VDS = 15 V
ID = 9 A
6
4
2
0
0
4
8
12
16
20
24
Qg – Total Gate Charge (nC)
Document Number: 70800
S-56946—Rev. C, 23-Nov-98
18
24
30
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
10
12
28
32
1.35
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 9 A
1.25
1.15
1.05
0.95
0.85
0.75
–50
–25
0
25
50
75
100
125
150
TJ – Junction Temperature (C)
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2-5
Si4824DY
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
60
0.04
r DS(on) – On-Resistance ( W )
I S – Source Current (A)
TJ = 150C
TJ = 25C
10
0.03
ID = 4.7 A
0.02
0.01
0
1
0.4
0
0.8
0
1.6
1.2
VSD – Source-to-Drain Voltage (V)
2
6
8
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
0.50
50
0.25
40
ID = 250 mA
0.00
Power (W)
V GS(th) Variance (V)
4
–0.25
30
20
–0.50
10
–0.75
–1
–50
0
–25
0
25
50
75
100
125
150
0.01
0.10
1
TJ – Temperature (C)
10
100
600
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
Notes:
0.02
PDM
t1
0.01
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 80C/W
Single Pulse
3. TJM – TA = PDMZthJA(t)
4. Surface Mounted
0.001
10–4
10–3
10–2
10–1
1
10
100
600
Square Wave Pulse Duration (sec)
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2-6
Document Number: 70800
S-56946—Rev. C, 23-Nov-98