VISHAY SI9928DY

Si9928DY
Vishay Siliconix
Complimentary 20-V (D-S) MOSFET
VDS (V)
N Ch
N-Channel
l
rDS(on) ()
ID (A)
0.05 @ VGS = 4.5 V
5.0
0.06 @ VGS = 3.0 V
4.2
0.08 @ VGS = 2.7 V
3.6
0.11 @ VGS = –4.5 V
3.4
0.15 @ VGS = –3.0 V
2.9
0.19 @ VGS = –2.7 V
2.6
20
P-Channel
P Ch
l
–20
20
D1
D1
S2
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
G2
G1
Top View
S1
D2
N-Channel MOSFET
D2
P-Channel MOSFET
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
VDS
20
–20
Gate-Source Voltage
VGS
12
12
5.0
3.4
4.0
2.8
IDM
10
10
IS
2.0
–2.0
2.0
2.0
1.3
1.3
Continuous Drain Current (TJ = 150C)a
TA = 25C
TA = 70C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
TA = 25C
Maximum Power Dissipationa
TA = 70C
Operating Junction and Storage Temperature Range
ID
PD
Unit
V
A
W
TJ, Tstg
–55 to 150
C
Symbol
N- or P-Channel
Unit
RthJA
62.5
C/W
Parameter
Maximum Junction-to-Ambienta
Notes
a. Surface Mounted on FR4 Board, t 10 sec.
Document Number: 70143
S-00652—Rev. G, 27-Mar-00
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1
Si9928DY
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
Typa
Max
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Z
G
V l
D i Current
C
Zero
Gate
Voltage
Drain
On-State Drain Currentb
b
D i S
Drain-Source
On-State
O S
Resistance
R i
Forward Transconductanceb
Diode Forward Voltageb
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
VSD
VDS = VGS, ID = 250 mA
N-Ch
0.8
1.2
VDS = VGS, ID = –250 mA
P-Ch
–0.8
–1.1
VDS = 0 V, VGS = "12 V
V
N-Ch
"100
P-Ch
"100
VDS = 16 V, VGS = 0 V
N-Ch
1
VDS = – 16 V, VGS = 0 V
P-Ch
–1
VDS = 10 V, VGS = 0 V, TJ = 70C
N-Ch
5
VDS = –10 V, VGS = 0 V, TJ = 70C
P-Ch
VDS w 5 V, VGS = 4.5 V
N-Ch
10
VDS v –5 V, VGS = –4.5 V
P-Ch
–10
nA
A
mA
–5
A
VGS = 4.5 V, ID = 5.0 A
N-Ch
0.041
0.05
VGS = –4.5 V, ID = –3.2 A
P-Ch
0.087
0.11
VGS = 3.0 V, ID = 3.9 A
N-Ch
0.052
0.06
VGS = –3.0 V, ID = –2.0 A
P-Ch
0.120
0.15
VGS = 2.7 V, ID = 1.0 A
N-Ch
0.060
0.08
VGS = –2.7 V, ID = –1.0 A
P-Ch
0.135
0.19
VDS = 10 V, ID = 5.0 A
N-Ch
13
VDS = –9 V, ID = –3.2 A
P-Ch
8
IS = 5.0 A, VGS = 0 V
N-Ch
0.9
1.2
IS = –2.0 A, VGS = 0 V
P-Ch
–0.9
–1.2
N-Ch
10
20
20
W
S
V
Dynamica
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
Qg
N Ch
N-Channel
l
VDS = 6 V,
V VGS = 4.5
4 5 V,
V ID = 5.0
50A
P-Ch
8
N-Ch
2.6
P-Ch
1.6
N-Ch
3.7
P-Ch
3.5
N-Ch
13
30
22
40
N-Ch
9
40
tr
N Ch
N-Channel
l
VDD = 6 V, RL = 6 W
ID ^ 1 A,
A VGEN = 4.5
4 5 V,
V RG = 6 W
P-Ch
P-Ch
43
80
N-Ch
30
60
td(off)
P-Channel
VDD = –6 V, RL = 6 W
5 V,
V RG = 6 W
ID ^ –1 A
A, VGEN = –4
–4.5
P-Ch
35
70
N-Ch
9
30
P-Ch
20
40
IF = 5.0 A, di/dt = 100 A/ms
N-Ch
100
150
IF = –2.0 A, di/dt = 100 A/ms
P-Ch
75
100
Qgs
P-Channel
VDS = –6 V, VGS = –4.5 V, ID = –3.2 A
Qgd
td(on)
tf
trr
nC
C
ns
Notes
a. For design aid only; not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2%.
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Document Number: 70143
S-00652—Rev. G, 27-Mar-00
Si9928DY
Vishay Siliconix
Output Characteristics
Transfer Characteristics
20
20
VGS = 5.5, 5, 4.5, 4, 3.5 V
16
3V
I D – Drain Current (A)
I D – Drain Current (A)
16
12
8
2.5 V
4
12
8
TC = 125C
25C
4
2V
–55C
1.5 V
0
0
0
1
2
3
4
5
0
0.5
1.0
VDS – Drain-to-Source Voltage (V)
1.5
2.5
3.0
3.5
4.0
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
0.10
2000
0.08
VGS = 2.7 V
1600
VGS = 3 V
C – Capacitance (pF)
r DS(on) – On-Resistance ( Ω )
2.0
0.06
VGS = 4.5 V
0.04
1200
800
Ciss
0.02
400
0
0
Coss
Crss
0
4
8
12
16
20
0
4
6
8
10
12
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
Gate Charge
On-Resistance vs. Junction Temperature
7
2.0
6
VDS = 6 V
ID = 5 A
r DS(on) – On-Resistance ( Ω )
(Normalized)
V GS – Gate-to-Source Voltage (V)
2
5
4
3
2
1.6
VGS = 4.5 V
ID = 5 A
1.2
0.8
0.4
1
0
0
3
6
9
Qg – Total Gate Charge (nC)
Document Number: 70143
S-00652—Rev. G, 27-Mar-00
12
15
0
–50
0
50
100
150
TJ – Junction Temperature (C)
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Si9928DY
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.250
20
ID = 1 A
r DS(on) – On-Resistance ( Ω )
I S – Source Current (A)
TJ = 150C
10
TJ = 25C
0.200
ID = 5 A
0.150
0.100
0.050
0
1
0
0.8
0.4
1.2
1.6
0
2.0
VSD – Source-to-Drain Voltage (V)
1
2
4
5
6
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
1.0
25
20
ID = 250 µA
Power (W)
0.5
V GS(th) Variance (V)
3
0.0
15
10
–0.5
5
–1
–50
0
0
50
100
150
0.01
0.1
1
TJ – Temperature (C)
10
100
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 62.5C/W
0.02
3. TJM – TA = PDMZthJA(t)
Single Pulse
0.01
10–4
10–3
4. Surface Mounted
10–2
10–1
1
10
30
Square Wave Pulse Duration (sec)
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Document Number: 70143
S-00652—Rev. G, 27-Mar-00
Si9928DY
Vishay Siliconix
Output Characteristics
Transfer Characteristics
10
10
VGS = 5, 4 V
3V
8
I D – Drain Current (A)
I D – Drain Current (A)
8
6
4
2
6
4
TC = 125C
2
25C
2, 1 V
–55C
0
0
0
2
4
6
8
10
0
VDS – Drain-to-Source Voltage (V)
0.5
1.0
On-Resistance vs. Drain Current
2.5
3.0
3.5
Capacitance
2000
0.20
1500
VGS = 2.7 V
C – Capacitance (pF)
r DS(on) – On-Resistance ( Ω )
2.0
VGS – Gate-to-Source Voltage (V)
0.25
VGS = 3 V
0.15
VGS = 4.5 V
0.10
1000
Ciss
500
Coss
Crss
0.05
0
0
1
2
3
4
5
6
0
Gate Charge
5
1.6
r DS(on) – On-Resistance ( Ω )
(Normalized)
VDS = 6 V
ID = 3.2 A
4
3
2
1
0
0
2
4
6
Qg – Total Gate Charge (nC)
Document Number: 70143
S-00652—Rev. G, 27-Mar-00
2
4
6
8
10
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
V GS – Gate-to-Source Voltage (V)
1.5
8
10
1.4
On-Resistance vs. Junction Temperature
VGS = 4.5 V
ID = 3.2 A
1.2
1.0
0.8
0.6
–50
0
50
100
150
TJ – Junction Temperature (C)
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Si9928DY
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
10
0.20
r DS(on) – On-Resistance ( Ω )
I S – Source Current (A)
TJ = 150C
TJ = 25C
0.17
ID = 3.2 A
0.14
0.11
0.08
0.05
1
0
0.4
0.8
1.2
1.6
0
2.0
VSD – Source-to-Drain Voltage (V)
Threshold Voltage
6
8
Single Pulse Power
25
20
ID = 250 µA
Power (W)
V GS(th) Variance (V)
4
VGS – Gate-to-Source Voltage (V)
1.0
0.5
2
0.0
15
10
–0.5
5
–1
–50
0
0
50
100
150
10–2
10–1
TJ – Temperature (C)
1
10
30
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 62.5C/W
0.02
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
10–3
10–2
10–1
1
10
30
Square Wave Pulse Duration (sec)
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Document Number: 70143
S-00652—Rev. G, 27-Mar-00