VISHAY SI7806DN

Si7806DN
New Product
Vishay Siliconix
N-Channel 30-V (D-S) Fast Switching MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (W)
ID (A)
0.011 @ VGS = 10 V
14.4
0.0175 @ VGS = 4.5 V
12.6
D TrenchFETr Power MOSFET
D PWM Optimized
D New Low Thermal Resistance PowerPAKt
Package with Low 1.07-mm Profile
APPLICATIONS
D DC/DC Converters
– Secondary Synchronous Rectifier
– High-Side MOSFET in Synchronous Buck
PowerPAKt 1212-8
D
S
3.30 mm
3.30 mm
1
S
2
S
3
G
G
4
D
8
D
7
D
6
S
D
5
N-Channel MOSFET
Bottom View
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
TA = 70_C
Pulsed Drain Current
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
9.2
11.6
7.4
A
3.2
1.3
A
3.8
1.5
2.0
0.8
IDM
Continuous Source Current (Diode Conduction)a
V
14.4
ID
Unit
40
TJ, Tstg
W
_C
–55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Case (Drain)
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
24
33
65
81
1.9
2.4
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71869
S-20805—Rev. A, 17-Jun-02
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Si7806DN
New Product
Vishay Siliconix
MOSFET SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
1.0
IGSS
Typ
Max
Unit
3
V
VDS = 0 V, VGS = "20 V
"100
nA
VDS = 24 V, VGS = 0 V
1
VDS = 24 V, VGS = 0 V, TJ = 55_C
5
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS w 5 V, VGS = 10 V
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
m
mA
40
A
VGS = 10 V, ID = 14.4 A
0.009
0.011
VGS = 4.5 V, ID = 12.6 A
0.0145
0.0175
gfs
VDS = 15 V, ID = 14.4 A
34
VSD
IS = 3.2 A, VGS = 0 V
0.77
1.2
Qg
VDS = 15 V, VGS = 4.5 V, ID = 14.4 A
8.5
11
19
24
VDS = 15 V, VGS = 10 V, ID = 14.4 A
3.6
W
S
V
Dynamicb
Total Gate Charge
Qgt
nC
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
3.0
Rg
2
td(on)
8
15
12
20
25
40
10
20
35
70
Gate-Resistance
Turn-On Delay Time
Rise Time
tr
Turn-Off Delay Time
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = 3.2 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
40
40
35
35
VGS = 10 thru 4 V
30
I D – Drain Current (A)
I D – Drain Current (A)
30
25
20
15
10
25
20
15
TC = 125_C
10
3V
5
5
0
0.0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS – Drain-to-Source Voltage (V)
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2
3.5
4.0
25_C
0.5
1.0
1.5
2.0
–55_C
2.5
3.0
3.5
4.0
VGS – Gate-to-Source Voltage (V)
Document Number: 71869
S-20805—Rev. A, 17-Jun-02
Si7806DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
1400
0.025
C – Capacitance (pF)
r DS(on) – On-Resistance ( W )
1200
Ciss
0.020
VGS = 4.5 V
0.015
VGS = 10 V
0.010
1000
800
600
Coss
400
0.005
Crss
200
0.000
0
0
5
10
15
20
25
30
35
40
0
5
15
20
25
30
VDS – Drain-to-Source Voltage (V)
ID – Drain Current (A)
Gate Charge
On-Resistance vs. Junction Temperature
1.8
10
VDS = 15 V
ID = A
8
r DS(on) – On-Resistance (W)
(Normalized)
V GS – Gate-to-Source Voltage (V)
10
6
4
2
VGS = 10 V
ID = 14.4 A
1.6
1.4
1.2
1.0
0.8
0
0
4
8
12
16
0.6
–50
20
–25
0
Qg – Total Gate Charge (nC)
25
50
75
100
125
150
TJ – Junction Temperature (_C)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.025
50
r DS(on) – On-Resistance ( W )
I S – Source Current (A)
ID = 14.4 A
TJ = 150_C
10
TJ = 25_C
1
0.0
0.020
ID = 5 A
0.015
0.010
0.005
0.000
0.2
0.4
0.6
0.8
1.0
VSD – Source-to-Drain Voltage (V)
Document Number: 71869
S-20805—Rev. A, 17-Jun-02
1.2
0
2
4
6
8
10
VGS – Gate-to-Source Voltage (V)
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Si7806DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power, Juncion-To-Ambient
0.6
50
ID = 250 mA
0.4
40
Power (W)
V GS(th) Variance (V)
0.2
–0.0
–0.2
30
20
–0.4
–0.6
10
–0.8
–1.0
–50
0
–25
0
25
50
75
100
125
150
0.01
0.1
1
TJ – Temperature (_C)
10
100
600
Time (sec)
Safe Operating Area
100
rDS(on) Limited
IDM Limited
P(t) = 0.0001
I D – Drain Current (A)
10
P(t) = 0.001
1
ID(on)
Limited
P(t) = 0.01
P(t) = 0.1
P(t) = 1
0.1
TC = 25_C
Single Pulse
P(t) = 10
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 65_C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
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4
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71869
S-20805—Rev. A, 17-Jun-02
Si7806DN
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10–4
Document Number: 71869
S-20805—Rev. A, 17-Jun-02
10–3
10–2
Square Wave Pulse Duration (sec)
10–1
1
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